The present disclosure relates to a method and apparatus for generating a voltage that can be used as a reference in a system such as an integrated circuit.
A voltage reference is typically provided by electronic circuitry that provides at an output of the circuitry a constant voltage that does not fluctuate even when there are variations in temperature or the power supply that might normally or otherwise cause fluctuations in the voltage. As a result, the hope is that the voltage reference can provide a point of reference even as conditions in the system can vary. Voltage references can be used in power supply voltage regulators, analog-to-digital converters, digital-to-analog converters as well as many other measurement and control systems. Generally, a voltage reference can be created by balancing a voltage that increases with temperature increases with a voltage that decreases with temperature increases.
A voltage that is proportional to absolute temperature (PTAT) increases with temperature increases and is known as a PTAT voltage. A voltage that is complementary to absolute temperature (CTAT) can decrease with temperature decreases and is known as a CTAT voltage. A voltage reference can be based on a bandgap principle where a transistor base-emitter voltage, which is intrinsically complementary to absolute temperature, CTAT, is added to a voltage which is proportional to absolute temperature, PTAT. If the two voltage components are well balanced the compound voltage is at a first order compensated against temperature variations. The problem with traditional voltage references is related to instability of the reference over time. This instability is known as drift and is mainly attributed to the CTAT voltage component. This has an absolute magnitude and is dependent on many process parameters.
There is therefore a continued desire for a stable voltage reference that has reduced drift characteristics.
These and other problems are addressed by a voltage reference provided in accordance with the present teaching which reduces drift by combining a zener diode with a CTAT component. The zener diode output has an intrinsic PTAT form which when combined with a CTAT component, generated by a negative base emitter voltage difference resultant from combining multiple bipolar transistors operating at different collector current densities, can provide a compound voltage which is at a first order compensated against temperature variations. By using a zener diode, which provides a very stable voltage as an output, it is possible to generate a voltage reference that has very low drift characteristics.
Embodiments which are provided to assist with an understanding of the present teaching will now be described, by way of example, with reference to the accompanying drawings, in which:
The present teaching provides a low drift voltage references formed from a compound voltage resultant from combining a PTAT component with a CTAT component. The PTAT component is desirably generated by biasing a zener diode with bias current. As a result the output of the zener diode has a PTAT form that will increase with increases in absolute temperature. To compensate for this increase in the output of the zener diode with increases in temperature, the present teaching combines this PTAT component with a CTAT component. The CTAT component is generated by a negative base emitter voltage difference resultant from combining multiple bipolar transistors operating at different collector current densities. It is known that the base emitter voltage difference between two such transistors has a PTAT form, BUT what is provided by the present teaching is an inverted or negative base emitter voltage difference which has a CTAT form.
This high performance PTAT voltage component is combined with multiple negative base-emitter voltage difference blocks or cells, 3 to 4, which provide a CTAT voltage component of the circuit. By combining the PTAT voltage contribution from the zener diode with the CTAT voltage contribution from the multiple negative base-emitter voltage difference (−ΔVbe) blocks, the circuit provides at an output, ref, a stable voltage reference which is to a first order temperature insensitive. As the CTAT component is provided by a differential between the output of two or more circuit elements, the CTAT component does not have an absolute magnitude and is therefore very stable over time and temperature.
One implementation of how such a base-emitter voltage difference may be generated is shown in
Here k is Boltzmann's constant, T is absolute temperature in K, and q is the electron charge.
According to equation (1) the voltage difference from the nodes “a” and “b” in
Similarly to
In the circuit of
As shown in
Using such a configuration it will be evident that across MP1, source to drain, a voltage of the form of four base-emitter voltage differences (ΔVbe) is developed (one from QP3 to QP2, one from QN1 to QN4, one from QN2 to QN4, one from QN3 to QN6).
While a ΔVbe is inherently of a PTAT form, by providing an inverted ΔVbe it has a CTAT form and can therefore be considered a CTAT component of the overall circuit. It will be appreciated that each of the CTAT components provided by the −ΔVbe circuitry and the PTAT component provided by the buried zener have an associated temperature coefficient, TC. The overall reference voltage temperature coefficient is a combination of the two. Given the fact that a typical voltage for a buried zener voltage at ambient temperature is ˜5.3V, it will be appreciated that a scaling of this reference voltage temperature coefficient is optimally achieved by modifying the scalar value of the CTAT components.
In one exemplary aspect, the reference voltage temperature coefficient can be adjusted digitally via a Digital to Analog Converter (DAC). One way to adjust temperature coefficient is to add or subtract a digitally controlled current in the cell of
In a similar fashion, different combinations of −ΔVbe cells can be used to generate an appropriate negative PTAT voltage in order to compensate for the temperature variation of the buried zener diode.
A circuit according to
The necessary supply voltage for a voltage reference circuit such as shown in
It will be appreciated that a circuit such as that described with reference to
In other configurations the reference voltage can be scaled up or down using a divider or amplifier. It is understandable that the reference voltage according to the present disclosure can used with or without die temperature control. If the die temperature is controlled a very stable voltage against temperature variation can be achieved. It will be appreciated that such an arrangement may require provision of a larger supply current to heat the die.
It will be appreciated that circuits provided in accordance with the present teaching provide a number of advantages including:
It is however not intended to limit the present teaching to any one set of advantages or features as modifications can be made without departing from the spirit and or scope of the present teaching.
The systems, apparatus, and methods of providing a voltage reference are described above with reference to certain embodiments. A skilled artisan will, however, appreciate that the principles and advantages of the embodiments can be used for any other circuits, apparatus, or methods with a need for a temperature insensitive output.
Additionally, while the −ΔVbe voltages have been described with reference to the use of specific types of bipolar transistors any other suitable transistor or transistors capable of providing base-emitter voltages could equally be used within the context of the present teaching. It is envisaged that each single described transistor may be implemented as a plurality of transistors, the base-emitters of which would be connected in parallel. For example, where circuits in accordance with the present teaching are implemented in a CMOS process, each transistor may be implemented as a plurality of bipolar substrate transistors each of unit area, and the areas of the transistors in each of the arms would be determined by the number of bipolar substrate transistors of unit area connected with their respective base-emitters in parallel.
In general, where the circuits according to the present teaching are implemented in a CMOS process, the transistors will be bipolar substrate transistors, and the collectors of the transistors will be held at ground, although the collectors of the transistors may be held at a reference voltage other than ground.
Such circuits and cells can be provided as systems, apparatus, and/or methods that can be implemented in various electronic devices. Examples of the electronic devices can include, but are not limited to, consumer electronic products, parts of the consumer electronic products, electronic test equipment, wireless communications infrastructure, etc. Examples of the electronic devices can also include circuits of optical networks or other communication networks, and disk driver circuits. The consumer electronic products can include, but are not limited to, measurement instruments, medical devices, wireless devices, a mobile phone (for example, a smart phone), cellular base stations, a telephone, a television, a computer monitor, a computer, a hand-held computer, a tablet computer, a personal digital assistant (PDA), a microwave, a refrigerator, a stereo system, a cassette recorder or player, a DVD player, a CD player, a digital video recorder (DVR), a VCR, an MP3 player, a radio, a camcorder, a camera, a digital camera, a portable memory chip, a washer, a dryer, a washer/dryer, a copier, a facsimile machine, a scanner, a multi-functional peripheral device, a wrist watch, a clock, etc. Further, the electronic device can include unfinished products.
Unless the context clearly requires otherwise, throughout the description and the claims, the words “comprise,” “comprising,” “include,” “including,” and the like are to be construed in an inclusive sense, as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to.” The words “coupled” or “connected”, as generally used herein, refer to two or more elements that may be either directly connected, or connected by way of one or more intermediate elements. Additionally, the words “herein,” “above,” “below,” and words of similar import, when used in this application, shall refer to this application as a whole and not to any particular portions of this application. Where the context permits, words in the Detailed Description using the singular or plural number may also include the plural or singular number, respectively. The words “or” in reference to a list of two or more items, is intended to cover all of the following interpretations of the word: any of the items in the list, all of the items in the list, and any combination of the items in the list. All numerical values provided herein are intended to include similar values within a measurement error.
The teachings of the inventions provided herein can be applied to other systems, not necessarily the systems described above. The elements and acts of the various embodiments described above can be combined to provide further embodiments. The act of the methods discussed herein can be performed in any order as appropriate. Moreover, the acts of the methods discussed herein can be performed serially or in parallel, as appropriate.
While certain embodiments of the inventions have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the disclosure. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms. Furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the disclosure. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the disclosure. Accordingly, the scope of the present inventions is defined by reference to the claims.
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