This invention relates to voltage regulators, and more particularly to programmable voltage regulators.
Semiconductor processing improvements have increased the density and number of transistors and other devices that can be integrated together onto a single silicon integrated circuit die. These large systems-on-a-chip (SoC) often include some analog functions as well as many digital functions. However, the digital systems can be noisy as digital circuits switch between high and low states. Since analog circuits have a theoretically infinite number of states or voltage levels, while digital has just two states, analog systems are inherently more sensitive to noise.
Traditionally, analog systems were segregated from digital systems. However, with higher levels of integration and single-chip systems, analog systems must share a silicon substrate with noisy digital systems. Typically separate power supplies are used for digital and analog circuits on the same chip. The analog power supply, AVDD, is separate from the digital power supply VDD on the mixed-signal chip. The power-supply voltage levels for AVDD and VDD may be different, and AVDD is carefully designed to be as noise-free as possible.
A low-dropout (LDO) voltage regulator may be used to generate AVDD from VDD. Traditionally, LDO voltage regulators were external to the mixed-signal chip, allowing for better noise isolation. Also, the exact AVDD voltage level could be determined by a ratio of precision resistors. The precision resistors could be discrete external resistors, or could be trimmed during manufacture, such as by a laser trimming a resistor line, or by fuses. The voltage regulator could be on-chip, with the precision resistors off-chip.
Such trimming of resistors or blowing of fuses could be done on a larger SoC that includes the voltage regulator, but adding fuses to the process, or adding the step of laser trimming can significantly increase manufacturing costs and is thus undesirable. Once the resistance values are chosen, they may be irreversible as there may be no way to add back portions of a laser-trimmed resistor or to re-connect a blown fuse.
What is desired is a low-dropout voltage regulator that is integrated with analog and digital functions on a mixed-signal SoC. A LDO voltage regulator that has an adjustable output voltage by adjusting resistance values is desirable. An on-chip voltage regulator with software-programmable resistance values is desirable. Interpolation of adjacent resistance values is desirable to more precisely define resistance and output-voltage values. A high-precision user-programmable on-chip voltage regulator is desirable.
The present invention relates to an improvement in programmable voltage regulators. The following description is presented to enable one of ordinary skill in the art to make and use the invention as provided in the context of a particular application and its requirements. Various modifications to the preferred embodiment will be apparent to those with skill in the art, and the general principles defined herein may be applied to other embodiments. Therefore, the present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
External power is applied to chip 18 and routed to Vin of voltage regulator 10. External power could be from an external power supply that generates a 5-volt or 3-volt power voltage or some other voltage. One or more external ground pins (not shown) connect to one or more internal ground buses to sink currents in analog circuits 12 and digital circuits 14. Voltage regulator 10 and registers 16 may also connect to an internal ground bus.
Voltage regulator 10 compares Vin to its Vout, which is AVDD, to regulate AVDD. Variations on AVDD due to temperature, loading, or other factors can be detected by this comparison and compensated for by voltage regulator 10.
Voltage regulator 10 has a precise voltage generator such as a bandgap voltage regulator and compares this reference voltage to a feedback voltage. The feedback voltage is divided from Vout (AVDD) using on-chip resistors. The exact values of these on-chip resistors are programmable. Registers 16 are programmed through digital circuits 14, such as by a user, software, driver, operating system or Basic Input Output System (BIOS) programming values into register 16. For example, during manufacturing test, different values can be programmed into registers 16 until the desired value is obtained that produce the target value of AVDD.
An external power-supply voltage Vin is applied to the source of p-channel regulator transistor 30 and also powers op amp 40. The well or substrate terminal (not shown) of regulator transistor 30 is also connected to Vin. The drain of regulator transistor 30 is regulated voltage Vout, which can be the analog supply AVDD (
Op amp 40 compares its inputs and generates an output voltage as a function of the voltage difference on its inputs. The output voltage from op amp 40 drives the gate of regulator transistor 30. The gate-to-source voltage Vgs of regulator transistor 30 is varied to vary the effective source-to-drain resistance of regulator transistor 30, which determines Vout. Regulator transistor 30 operates primarily in the linear region rather than in the saturated region, depending on Vin and Vout.
Voltage generator 38 is a bandgap or other precision on-chip voltage regulator that generates a reference voltage Vref that is applied to the inverting (−) input of op amp 40. The non-inverting (+) input of op amp 40 receives a feedback voltage Vfb that is a divided voltage from Vout. Vfb is the midpoint node between variable resistors 32, 34 connected in series between Vout and ground.
As Vout rises, Vfb also rises. When Vfb rises above Vref, op amp 40 increases the gate voltage on regulator transistor 30, which reduces the absolute value of Vgs, reducing the current drive and increasing the channel resistance of regulator transistor 30. The higher resistance of regulator transistor 30 lowers Vout, compensating for the rise in Vout that initiated the feedback loop response. Thus feedback acts to regulate Vout. The value of Vout is set by Vref=Vfb, and Vfb is set by the ratio of variable resistors 32, 34. Thus:
Vout=Vref*(R32+R34)/R34
The precise values of variable resistors 32, 34 are set by programming registers 16 of
Feedback voltage Vfb is a divided voltage between Vout and ground. The precise resistance values between Vout and Vfb, and between Vfb and ground, are determined by X register 120 and Y register 122, which act as registers 16 of
In the example shown in
For example, when AY0 is 1 and AY1:3 are all 0, switch 70 is closed and switches 71, 72, 73 are open. Then feedback voltage Vfb is taken through switch 70 from between resistors 60, 61. When AY2 is 1 and AY0:1 and AY3 are all 0, switch 72 is closed and switches 70, 71, 73 are open. Then feedback voltage Vfb is taken through switch 70 from between resistors 62, 63. This setting of AY2=1 produces a higher Vfb and lower Vout than does the setting of AY0=1.
X register 120 has four bits AX3:0 which turn on one or more of n-channel select transistors 50, 51, 52, 53, respectively, to connect one or more of pull-down resistors 54, 55, 56, 57 to node VN. These four bits are inverted by inverters 28 to drive the gates of p-channel select transistors 20, 21, 22, 23, respectively, which connect resistors 24, 25, 26, 27 to node VP.
For example, when AX0=1 and AX1:3 are all zero, n-channel select transistor 53 turns on to connect resistor 57 between node VN and ground. Other select transistors 50, 51, 52 are turned off, so only resistor 57 conducts current from node VN to ground. P-channel select transistor 23 is turned on to connect resistor 27 between Vout and VP, while p-channel select transistors 20, 21, 22 are all off. Only resistor 27 conducts current between Vout and VP.
When Y register 122 has AY1=1 and other bits=0, only switch 71 is closed. Vfb is between resistors 61, 62. The total resistance between Vout and Vfb (variable resistor 32 of
X register and decoder 126 outputs N control signals AX0 . . . AX(N−2), AX(N−1) that control N p-channel select transistors 53, 52, 51, . . . 50 that selectively connect one or more of resistors 57, 56, 55, . . . 54 between node VN and ground. The N control signals AX0 . . . AX(N−2), AX(N−1) also control N n-channel select transistors 23, 22, 21, . . . 20 that selectively connect one or more of resistors 27, 26, 25, . . . 24 between Vout and node VP.
Select resistors 57, 56, 55, . . . 54 can each have a different value, such as 132K, 119K, 107K, 98K ohms, etc. Select resistors 27, 26, 25, . . . 24 can also each have a different value, such as 155K, 169K, 180K, 189K ohms, etc.
Y register and decoder 124 outputs J signals AY0 . . . AY(J−2), AY(J−1) that control J switches 70, 71, . . . 73 that selectively connects feedback node Vfb to one node within the series of resistors 60, 61, . . . 64. There are J+1 resistors 60, 61, . . . 64 between nodes VP and VN. These J+1 resistors 60, 61, . . . 64 can have equal values, such as each one being 1.6 K-ohms.
The total resistance of variable resistor 32 is the sum of all selected resistors in series between node Vfb and Vout, while the total resistance of variable resistor 34 is the sum of all selected resistors in series between node Vfb and ground. This assumes only one of the X control signals and only 1 of the Y control signals are active. When more than one X control signal is active, the total resistive can be found by the parallel combination of select resistors and the series resistors down to node Vfb. Kirchoff's laws or various equations may be used for finding the equivalent resistances of these more complex resistor networks.
For example, when AX0=1 and AY0=1, and all other control signals are 0, the resistance of variable resistor 32 between Vout and Vfb is the sum of resistors 27, 64, 63, 62, . . . 61, or 155K+1.6K*(J−1) ohms. The resistance of variable resistor 34 between Vfb and ground is the sum of resistor 57 and resistor 60, or 132K+1.6K ohms.
Y register and decoder 124 can have a decoder so that fewer register bits need to be stored to be decoded to J control signals. When only 1 of the control signals can be high at a time, J=2U, where U is the number of register bits. For example, 3 register bits can be decoded to 8 control signals. X register and decoder 126 can also use encoded register bits in a similar manner.
The Vout produces is intermediate to what would be produced if only AY1 or only AY2 were selected. Thus an intermediate Vout is produced about midway between the two values produced by one-hot Y encoding when two adjacent Y values are active. This provides for higher voltage precision. The tap for Vfb is effectively taken from the middle of resistors 62 as the arrow shows.
The drain of n-channel regulator transistor 31 receives input voltage Vin, while the source is the output node generating Vout. N-channel regulator transistor 31 is a source follower.
As Vout rises, Vfb also rises. When Vfb rises above Vref, op amp 40 decreases the gate voltage on regulator transistor 31, which reduces the value of Vgs, reducing the current drive and increasing the channel resistance of n-channel regulator transistor 31. The higher resistance of regulator transistor 31 lowers Vout, compensating for the rise in Vout that initiated the feedback loop response. Thus feedback acts to regulate Vout. The value of Vout is set by Vref=Vfb, and Vfb is set by the ratio of variable resistors 32, 34 as described earlier.
Several other embodiments are contemplated by the inventors. For example the resistance values of select and other resistors may vary in different patterns. Multiple control bits could be active at once, rather than just one-hot encoding, and several resistors could be enabled in parallel as well as in series. Capacitors and other filter elements may be added. Switches could be n-channel transistors, p-channel transistors, or transmission gates with parallel n-channel and p-channel transistors.
Additional components may be added at various nodes, such as resistors, capacitors, inductors, transistors, etc., and parasitic components may also be present. Enabling and disabling the circuit could be accomplished with additional transistors or in other ways. Pass-gate transistors or transmission gates could be added for isolation.
Inversions may be added, or extra buffering. The final sizes of transistors and capacitors may be selected after circuit simulation or field testing. Metal-mask options or other programmable components may be used to select the final capacitor, resistor, or transistor sizes.
When a p-channel (PMOS) output transistor is used for regulator transistor 30, a low-dropout (LDO) voltage regulator may be obtained with excellent frequency characteristics. Miller compensation may be provided or just using a coupling capacitor for pole compensation. Output and power-supply noise may be filtered out or otherwise compensated for. However, p-channel transistor tend to have lower current drive per unit size than n-channel transistors, so an NMOS source-follower may be desirable for some applications requiring higher current drive. While an operational amplifier (op amp) has been described, other kinds of comparators could be used, such as non-amplifying compare buffers. Many kinds of encodings could be used for the registers to reduce a number of bits stored, or fully decoded bits may be stored in the registers that correspond to the control bits. While separate X and Y registers have been shown, these could be one register, and one encoding could be decoded to generate control bits for both X and Y switches. De-glitching or other circuits could be added to prevent changes in register bits from propagating to the resistor network in a way that could cause glitches. Various combinations are also possible. The programmable registers may be implemented as flip-flops, latches, read-only memory (ROM), EEPROM, flash memory, SRAM, etc.
The circuit designer may choose the resistors to have a ratio that produces the desired reference voltages. While Complementary-Metal-Oxide-Semiconductor (CMOS) transistors have been described, other transistor technologies and variations may be substituted, and materials other than silicon may be used, such as Galium-Arsinide (GaAs) and other variations.
While positive currents have been described, currents may be negative or positive, as electrons or holes may be considered the carrier in some cases. Charging and discharging may be interchangeable terms when referring to carriers of opposite polarity. Currents may flow in the reverse direction.
The generated power supply Vout may be less than 2.0 volts, such as 1.8 volts, 1.5 volts, 1.2 volts, or 1.0 volts, rather than the 2.6-3.7 volts shown in
While the term “bandgap” has been used, this is something of a misnomer, since the base-emitter voltage of the PNP transistor provides the reference voltage, rather than a bandgap. However, the term bandgap is nevertheless widely used for these circuits.
The background of the invention section may contain background information about the problem or environment of the invention rather than describe prior art by others. Thus inclusion of material in the background section is not an admission of prior art by the Applicant.
Any methods or processes described herein are machine-implemented or computer-implemented and are intended to be performed by machine, computer, or other device and are not intended to be performed solely by humans without such machine assistance. Tangible results generated may include reports or other machine-generated displays on display devices such as computer monitors, projection devices, audio-generating devices, and related media devices, and may include hardcopy printouts that are also machine-generated. Computer control of other machines is another a tangible result.
Any advantages and benefits described may not apply to all embodiments of the invention. When the word “means” is recited in a claim element, Applicant intends for the claim element to fall under 35 USC Sect. 112, paragraph 6. Often a label of one or more words precedes the word “means”. The word or words preceding the word “means” is a label intended to ease referencing of claim elements and is not intended to convey a structural limitation. Such means-plus-function claims are intended to cover not only the structures described herein for performing the function and their structural equivalents, but also equivalent structures. For example, although a nail and a screw have different structures, they are equivalent structures since they both perform the function of fastening. Claims that do not use the word “means” are not intended to fall under 35 USC Sect. 112, paragraph 6. Signals are typically electronic signals, but may be optical signals such as can be carried over a fiber optic line.
The foregoing description of the embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. It is intended that the scope of the invention be limited not by this detailed description, but rather by the claims appended hereto.
Number | Name | Date | Kind |
---|---|---|---|
3612220 | Hall et al. | Oct 1971 | A |
6005374 | Tasdighi | Dec 1999 | A |
6949971 | Jang | Sep 2005 | B2 |
7205827 | Leung et al. | Apr 2007 | B2 |