The present invention relates generally to sealing components, and more particularly to the electrical bonding of components in a manner that provides for a low electrical resistance pathway between components utilizing only a localized portion of the components.
Many applications, including aerospace applications, have requirements that a low resistance pathway exist between interfacing components. This is especially true in explosive environments. These requirements are instituted to reduce the potential for an electrical short to ground between the components that could result in the generation of an electrical arc in the explosive environment.
Achieving a low resistance electrical bond provides protection for two classes of electromagnetic phenomena that can cause functional upsets in equipment, cause structural damage due to damage from concentrated energy absorption, or be potentially hazardous to personnel. Different regulatory requirements govern different equipment depending upon the application in which the equipment is used. For example, two classes of electrical bonding are applicable to composite structures; Class R and Class S. Class R electrical bonding pertains to equipment containing electrical circuits which may produce radio frequencies, either desired or undesired, and requires that the equipment be designed such that a continuous low impedance bonding path is formed from the equipment, enclosure, or housing to an aircraft structure. Class R electrical bonding also requires that this be accomplished through clean metal-to-metal, prepared metal-to-composite, or composite-to-composite contact of mounting plates, racks, brackets, or other component mating surface(s). Class S electrical bonding applies to all conductive components of an aircraft that are subject to frictional charging and do not otherwise have a bonding requirements, and states that they shall be bonded to the aircraft structure with a total path resistance of 1 ohm or less. Class R electrical bonding states that the bonding paths shall be accomplished through mechanical contact of components and shall be configured to include the minimum number of interfaces consistent with accepted design practice for that type of equipment.
Previously, one method of achieving the low resistance bonding requirement was to use the entire split line between interfacing components. A fillet of sealant was applied around the entire interface between the components and one or more bonding straps were attached to the assembled components to provide a path to ground. However, this method of achieving low resistance bonding added weight to the component assembly as a result of the sealant and fasteners used for the bonding strap(s). Additionally, the method introduced complexity into the manufacture and repair of the components as the entire interface between the components was used to achieve a solid and durable bond.
A low resistance pathway includes a flexible member, a surface interfacing the flexible member, a sealing feature, and a fastener. The sealing feature forms an interior edge of at least one of the flexible member and the surface. The fastener compresses the flexible member to contact the surface.
In another aspect, a housing assembly includes a first component, a second component, and a low resistance pathway. The second component and the first component are configured to interface along a split line. Together the first component and the second component form the low resistance pathway along a portion of the split line. The low resistance pathway is sealed from a remainder of the first component and the second component.
As will be described subsequently, the invention includes a low resistance pathway comprising portions of a first component and a second component. Low resistance pathway includes a flexible member such as a tab, which is held in contact with an interface surface of the adjacent component by a fastener to achieve a low bonding resistance therebetween. In the embodiment described, a portion of low resistance pathway is isolated from the remainder of assembly by one or more sealing feature(s) such as a groove. The groove is filled with sealant along its length to create a seal between the bonding interface and the remainder of first and second components. Sealing feature(s) and sealant seal low resistance pathway from environmental factors that could cause corrosion which would increase the resistance of the low resistance pathway between the first and second components. Low resistance pathway is additionally sealed from the environment surrounding assembly using a fillet of sealant extending along the edge(s) of low resistance pathway. Thus, low resistance pathway provides a localized bonding interface with low resistance between first component and second component. Isolating the low resistance pathway to a localized portion of the first and second component reduces costs by eliminating the need for larger amounts of sealant and one or more fasteners for a bonding strap associated with the prior art. Additionally, low resistance pathway can reduce the costs associated with manufacture and repair of assembly.
In the embodiment shown in
As shown in
Similar to first component 14, sleeve 22 extends from second component 16. Sleeve 22 extends circumferentially around second component 16 and projects axially outward therefrom. Sleeve 22 is sized to fit over the outer circumference of first component 14 when first component 14 and second component 16 are assembled.
In the embodiment shown, sleeve 22 has multiple apertures 20B spaced therearound. When second component 16 is assembled on first component 14, apertures 20A and 20B are aligned and receive fasteners (not shown) therein to secure first component 14 to second component 16.
When assembled, portions of first component 14 and second component 16 (and mounting flange 18 and sleeve 22) interface and abut one another along split line 12. In the embodiment shown, split line 12 comprises surfaces of mounting flange 18 and sleeve 22. Although not shown in
As shown in
By utilizing localized low resistance pathway 24, the weight and cost of the assembly 10 can be reduced by eliminating the need for larger amounts of sealant and one or more fasteners associated with the prior art. Additionally, low resistance pathway 24 can reduce the costs associated with manufacture and repair of assembly 10.
Second component 16 has multiple apertures 20B spaced therearound. Similarly, first component 14 has multiple apertures 20A spaced therearound. When second component 16 is assembled on first component 14, (as shown in
In the embodiment shown, low resistance pathway 24 is disposed at the outer circumference of assembly 10. In other embodiments, low resistance pathway 24 can be disposed at other locations along split line 12 such as an inner circumference. As shown in
Sealing feature 28 comprises a machined groove that extends uninterrupted from a first edge of low resistance pathway 24 to a second edge of low resistance pathway 24. Sealing feature 28 allows sealant 26 to be disposed along an internal edge of low resistance pathway 24. As previously discussed sealing feature 28 is filled with sealant as shown in
Sealing feature 28 is disposed below an inner portion of tab 30. Tab 30 comprises a thin flexible member with reduced stiffness compared to other portions of mounting flange 18 (
As shown in
While the invention has been described with reference to an exemplary embodiment(s), it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment(s) disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
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The European Search Report mailed Oct. 28, 2013 for European Application No. 13150150.4. |
Number | Date | Country | |
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20130220668 A1 | Aug 2013 | US |