Claims
- 1. A method for removing soldering flux .Iadd.alone .Iaddend.or .Iadd.with .Iaddend.other residues from a printed wiring board, comprising
- (a) contacting the board with an aqueous flux removing solution comprising from about 0.1 to 15 percent by weight of a flux removing composition comprising alkaline salts, at least one organic adjuvant and a hydrotrope to maintain said adjuvant in solution, said solution having a pH of from about 10 to 13;
- (b) allowing the contact to continue for sufficient time to emulsify and remove .Iadd.the .Iaddend.soldering flux .[.or.]. .Iadd.and the other .Iaddend.residues .Iadd.if present.Iaddend.; and
- (c) removing the combined composition and .Iadd.the .Iaddend.soldering flux .[.or.]. .Iadd.and the .Iaddend.other residues from the board.
- 2. The method of claim 1 wherein said solution has an adequate reserve of titratable alkalinity, at least equivalent to from about 0.2 to 4.5 percent caustic potash when titrated to the colorless phenolphthalein end point.
- 3. The method of claim 1 or 2 wherein said solution has a pH of less than 12.
- 4. The method of claim 3 wherein said solution has a pH of 10.5 to 10.9.
- 5. The method of claim 1 wherein said hydrotrope is an alkali metal salt of a monocarboxylic acid having a carbon chain length of between C.sub.7 -C.sub.13.
- 6. The method of claim 5 wherein said hydrotrope comprises an alkali metal salt of octanoic or nonanoic acid.
- 7. The method of claim 5 wherein the flux removing composition comprises from .[.abut.]. .Iadd.about .Iaddend.60 to .Iadd.98 .Iaddend.percent by weight of said alkaline salts, up to .Iadd.25 .Iaddend.percent by weight of said organic adjuvant and from 0.1 to 15 percent by weight of said hydrotrope.
- 8. The method of claim 1, 2 or 5 wherein said alkaline salts are selected from the sodium or potassium carbonates, bicarbonates, ortho phosphates, complex phosphates, silicates, citrates or mixtures thereof.
- 9. The method of claim 8 wherein said alkaline salts are selected from the sodium or potassium carbonates and mixtures of said carbonates with sodium or potassium bicarbonates.
- 10. The method of claims 1, 2 or 5 wherein said flux removing solution contains from about 0.6 to 15 percent by weight of said composition.
- 11. The method of claim 1 wherein said organic adjuvant is selected from surfactants, anti-foam agents and mixtures thereof.
- 12. The method of claim 11 wherein said surfactant is selected from alkoxylated fatty alcohols, polycarboxylated ethylene oxide condensates of fatty alcohols, and mixtures thereof.
- 13. The method of claim 1 wherein the contact is carried out at a temperature of from about room temperature to about 180.degree. F. and for a period of from about 1 to 10 minutes.
- 14. The method of claim 1 wherein said flux removing composition further comprises a silicate corrosion inhibitor.
- 15. The method of claim 1 or 5 wherein said aqueous flux removing solution is formed by adding an aqueous concentrate of said flux removing composition to water, said aqueous concentrate comprising about 5 to about 45 wt. % of said flux removing composition.
- 16. The method of claim 15 wherein said aqueous concentrate contains from about 10 to 20 wt. % of said flux removing composition.
- 17. The method of claim 15 wherein said hydrotrope comprises an alkali metal salt of octanoic or nonanoic acid.
- 18. The method of claim 15 wherein the flux removing composition comprises from about 60 to 98 percent by weight of said alkaline salts, up to 25 percent by weight of said organic adjuvant and from 0.1 to 15 percent by weight of said hydrotrope.
- 19. The method of claim 15 wherein said alkaline salts are selected from the sodium or potassium carbonates, bicarbonates, ortho phosphates, complex phosphates, silicates, citrates or mixtures thereof.
- 20. The method of claim 15 wherein said alkaline salts are selected from the sodium or potassium carbonates and mixtures of said carbonates with sodium or potassium bicarbonates.
- 21. The method of claim 1 wherein said cleaning solution is contacted with said boards in the form of a spray.
- 22. The method of claim 1 wherein said cleaning solution is contacted with said boards in the form of a bath in which said boards are immersed.
Parent Case Info
This application is a continuation-in-part of U.S. Ser. No. 07/731,512, filed Jul. 17, 1991 and now abandoned.
US Referenced Citations (33)
Continuation in Parts (1)
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Date |
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Parent |
731512 |
Jul 1991 |
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Reissues (1)
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896379 |
Jun 1992 |
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