This application relates generally to micromachines and nanomachines and more specifically to devices providing low-friction rotational and translational interfaces for micromachine and nanomachine contacts.
Micromachines and nanomachines are poised to solve mechanical problems at the molecular and atomic level. Such machines may solve problems in environments were other devices, such as electronic devices, fail. For example, microscale mechanical memories may be of use in environments, such as space, in which semiconductor based devices have high fault rates due to high-energy cosmic radiation. Further, microscale mechanical machines may be of surgical use, reaching areas of the body not otherwise accessible or manipulable by traditional surgical tools and techniques.
At small scale, for example in the hundreds and tens of micron range and below, mechanical elements exhibit problematic behavior that either 1) does not arise or 2) is of little consequence at relatively larger scale. For example, meshed gears in macroscale machines do not tend to exhibit problems due to stiction, which is the sticking and fusing of different elements or portions of elements into a union. However, at smaller scale, such problems can arise.
Lithographic techniques have been deployed to make relatively small mechanical devices, for example, relatively small gears etched from silicon wafers. However, such relatively small silicon gears have a tendency to stick and fuse to each other. If such gears are in mechanical motion when stiction between the gears occurs, the gears may gall each other or worse tear each other apart.
Lubricants have been applied to relatively small mechanical interfaces in an attempt to limit friction, stiction, and galling. However, like solid bits of matter of relatively small scale, liquids at relatively small scale also exhibit problematic behavior that would be of little consequence at relatively larger scale. For example, surface tension causes relatively small quantities of liquid to form small droplets that tend not to flow across a surface, thus limiting a lubricant's effectiveness.
Consequently, new microscale and nanoscale devices are sought which provide for improved performance.
In accordance with the invention low-friction moving interfaces in micromachines and nanomachines include low-friction sliding interfaces. In one aspect of the invention, a device has first and second members in sliding contact. Each the members has a maximum dimension of about 100 μm or less between any two points and one of the first and second members is formed of diamond. In another aspect of the invention, a device has a toothed member and a tooth-engaging member in meshing contact. Both the toothed member and tooth-engaging member have dimension of about 100 μm or less between any two points and one of the toothed member and tooth-engaging member is formed of diamond.
A further understanding of the nature and advantages of the present invention may be realized by reference to the remaining portions of the specification and the drawings.
Introduction
The following description sets forth embodiments of low-friction moving interfaces in micromachines and nanomachines according to the invention. Embodiments of the invention can be applied to sliding and/or meshing mechanical contacts.
Diamond is a very slippery crystal. Diamond in mechanical contact with crystals such as diamond itself or silicon exhibits relatively low-frictional heating and has a tendency not to fuse with itself or silicon. Further, the flash temperature of diamond-silicon interfaces is relatively high. The flash temperature is that at which bodies in frictional contact tend to gall each other. The flash temperature of various interfaces can be estimated by taking into account, for example, the speed at which surfaces move with respect to each other and the forces at the interface. For example, see “Tribology and Mechanics of Magnetic Storage Devices,” publisher Springer, pp. 366-411, by Bhushan in which a general formalism is developed to calculate flash temperatures.
Described below are various embodiments where two members engage each other in different ways, referred to as sliding contact and meshing contact. These types of interaction will be defined below in connection with the specific embodiments. In these embodiments, both of the members may be diamond or one of the members may be diamond with the other being, for example, silicon, quartz, a III-V material such as gallium arsenide, and the like. While substances such as silicon and gallium arsenide are of limited mechanical use at macroscale dimensions (e.g. greater than 1 millimeter) due to their fragility, such substances suffer less from fragility at relatively smaller scales, (e.g. 100 μm). At such small scales, each of the aforementioned materials in such contact with diamond provides for devices that have relatively low friction and are relatively mechanically sound. Further, each of the aforementioned materials has a relatively high flash temperature in sliding contact with diamond, for example, as high as 900° C. and above. Thus at normal operating temperature, (e.g., 300° C.) such materials tend not to gall each other.
Embodiments Having Sliding Contact
A “sliding contact” is defined herein as a first member that is in dynamic frictional contact with a second member, such that the first member and second member have surfaces that are in smooth continuous contact.
First member 215 and second member 250 may each be a single or multicrystalline structure. For example, first member 215 may be a single diamond crystal or a polycrystalline diamond.
The first and second members may be fabricated using a variety of techniques. For example, a member comprising silicon may be etched from a silicon wafer using known lithographic techniques or may be cut from a silicon wafer using cutting and sweeping techniques discussed in the above referenced U.S. patent application for “Nanomachining Method and Apparatus,” Attorney Docket No. 020921-001430US. Alternatively, a member comprising silicon may be formed by lapping techniques such as those discussed in the above referenced U.S. patent application for “Methods and Apparatus for Nanolapping,” Attorney Docket No. 020921-001450US. Each of these fabrication techniques is similarly applicable to diamond members, quartz members, and the like. Those of skill in the art will know of other useful fabrication techniques.
First member 215 may be coated into the aperture of another device such as a disk. A first member so positioned is commonly referred to as a bushing. For example, a first member comprising diamond may be coated into an aperture in a silicon disk. A first member so positioned may be formed, for example, by first forming a diamond-like carbon layer in the aperture and second growing a diamond onto the diamond-like carbon layer. Diamond-like carbon may be coated into an aperture via a vacuum arc process or via ion-beam techniques and grown using plasma-enhanced chemical vapor deposition. Those of skill in the art will know other useful coating processes for diamond-like carbon. Diamond can also subsequently be grown onto the diamond-like carbon in a diamond-anvil cell or other high-pressure device.
According to a specific embodiment of the invention, each of the first and second members has a maximum dimension of about 100 μm or less between any two points. According to another embodiment, each of the first and second members has a maximum dimension of about 5 μm or less between any two points.
For consistency and clarity, a particular coordinate system will be shown and referred to.
First and second members 315 and 350 may have a variety of rotational degrees of motion with respect to each other, for example, member 350 may rotate relative to member 315 about the z-axis, the x-axis, or any axis laying between the z and x-axes.
According to a specific embodiment of the invention, each of the members has a maximum dimension of about 100 μm or less between any two points. According to another embodiment, each of the members each has a maximum dimension of about 5 μm or less between any two points. First and second members 410 and 420 may be fabricated by a variety of processes such as those described above for the fabrication of mechanical device 200 shown in
Mechanical devices having components (e.g., diamond plate and silicon slotted member) providing low-friction translational contact are deployable for a variety of tasks. For example, mechanical device 400 may be of use as a fluid pump. The low-friction moving interface can drag a fluid between ends of the slot, thus providing pumping. Further, such a device, made of say diamond and silicon or diamond and diamond, provides for tremendous translational rates. For example, a diamond plate in a silicon slot of the dimension discussed above may be turned at millions or more revolutions per second prior to reaching the flash temperature.
Each of devices 200, 300, and 400 may be bearing type devices, wherein one of the members provide support, guidance, and reduces the friction of motion between the other member and moving or fixed machine parts (not pictured in
Embodiments Having Meshing Contact
A “meshing contact” is defined herein as a “toothed member” being in frictional contact with a “tooth-engaging member,” such that the toothed member meshes with the tooth-engaging member to transmit motion or to change direction or speed.
While rack 550 is shown to have teeth that extend beyond the region where the gear and rack mesh, the teeth may extend a lesser amount, for example, the teeth may be limited to the region where the gear and rack mesh.
According to a specific embodiment of the invention, each of the gear and rack has a maximum dimension of about 100 μm or less between any two points. According to another embodiment, each of the gear and rack has a maximum dimension of about 5 μm or less between any two points. Gears and racks made of materials such as those discussed may be fabricated by a variety of processes such as those described above for the fabrication of mechanical device 200 shown in
Both the gear and/or rack shown in
While the above is a complete description of specific embodiments of the invention, various modifications, alternative constructions, and equivalents by be used. For example, diamond-silicon, diamond-diamond, and the like may be variously configured while still providing low stiction, low galling, and relatively high flash temperature devices. For example, device 200 may have a first member 215 that has a trench instead of an aperture in which the second member is in sliding contact. Further, diamond-silicon, diamond-diamond, and the like meshing interfaces may include, for example, gear on gear interfaces in addition to gear on rack/worm gear interfaces. Therefore, the above description should not be taken as limiting the scope of the invention a defined by the claims
This application is a continuation application of U.S. application Ser. No. 10/925,866 filed Aug. 24, 2004, which is a continuation application of U.S. application Ser. No. 10/094,149 filed Mar. 7, 2002, which claims priority from the following provisional application, the entire disclosures of which are incorporated by reference in their entirety for all purposes: U.S. Application No. 60/287,677, filed Apr. 30, 2001 by Victor B. Kley for “Scanning Probe Microscopy and Nanomachining.” The following six U.S. patent applications, were filed concurrently with U.S. application Ser. No. 10/094,149 and the disclosure of each other application is incorporated by reference in its entirety for all purposes: U.S. patent application Ser. No. 10/093,842, filed Mar. 7, 2002 by Victor B. Kley for “Nanomachining Method and Apparatus”; U.S. patent application Ser. No. 10/094,411, filed Mar. 7, 2002 by Victor B. Kley for “Methods and Apparatus for Nanolapping”; The following U.S. patents are incorporated by reference in their entirety for all purposes: U.S. Pat. No. 6,144,028, issued Nov. 7, 2000 to Victor B. Kley for “Scanning Probe Microscope Assembly and Method for Making Confocal, Spectrophotometric, Near-Field, and Scanning Probe Measurements and Associated Images;” U.S. Pat. No. 6,252,226, issued Jun. 26, 2001 to Victor B. Kley for “Nanometer Scale Data Storage Device and Associated Positioning System;” U.S. Pat. No. 6,337,479, issued Jan. 8, 2002 to Victor B. Kley for “Object Inspection and/or Modification System and Method;” and U.S. Pat. No. 6,339,217, issued Jan. 15, 2002 to Victor B. Kley for “Scanning Probe Microscope Assembly and Method for Making Confocal, Spectrophotometric, Near-Field, and Scanning Probe Measurements and Associated Images.” U.S. Pat. No. 6,752,008, issued Jun. 22, 2004 by Victor B. Kley for “Method and Apparatus for Scanning in Scanning Probe Microscopy and Presenting Results”; U.S. Pat. No. 6,787,768, issued Sep. 7, 2004 by Victor B. Kley and Robert T. LoBianco for “Method and Apparatus for Tool and Tip Design for Nanomachining and Measurement”. U.S. Pat. No. 6,802,646, issued Oct. 12, 2004 by Victor B. Kley for “Low Friction Moving Interfaces in Micromachines and Nanomachines”; and U.S. Pat. No. 6,923,044, issued Aug. 2, 2005 by Victor B. Kley for “Active Cantilever for Nanomachining and Metrology”; The disclosure of the following published PCT application is incorporated by reference in its entirety for all purposes: WO 01/03157 (International Publication Date: Jan. 11, 2001) based on PCT Application No. PCT/US00/18041, filed Jun. 30, 2000 by Victor B. Kley for “Object Inspection and/or Modification System and Method.”
Number | Date | Country | |
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60287677 | Apr 2001 | US |
Number | Date | Country | |
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Parent | 10925866 | Aug 2004 | US |
Child | 11342061 | Jan 2006 | US |
Parent | 10094149 | Mar 2002 | US |
Child | 10925866 | Aug 2004 | US |