Patent Grant
6846184
The present invention generally relates to interconnection devices used in high speed electronics systems, and more particularly to a high data rate electrical contact adapted for use in connector systems subject to high speed data transmission.
High density integrated circuit (IC) packages that house Large Scale Integration/Very Large Scale Integration type semiconductor devices are well known. Input/output pins for such IC packages are often arranged in such a dense pattern (sometimes more than two hundred closely spaced contacts) that direct soldering of the IC package to a substrate; such as a printed wiring or circuit board (PCB) creates several significant problems related to inspection and correction of any resulting soldering faults.
Land grid array (LGA) connectors are known for interconnecting IC packages to PCB's. LGA's typically do not require soldering procedures during engagement with the PCB. Prior art LGA assemblies are also known which include an insulative housing and a plurality of resilient electrical contacts received in passageways formed in the housing. The resilient electrical contacts typically have exposed portions at the upper and lower surfaces of the insulative housing for engaging contact pads. When an IC package is accurately positioned in overlying aligned engagement with the conductive input/output contacts of a typical IC package, a normal force is applied to the exposed portions of each resilient electrical contact to electrically and mechanically engage the respective contact pads.
The resilient electrical contacts associated with prior art LGA's have had a variety of shapes and electrical properties. A commonly used form of resilient electrical contact includes two free ends connected by a curved portion which provides for the storage of elastic energy during engagement with the IC package and PCB. Prior art resilient electrical contacts are usually a single metal structure in the form of a spring to provide the required elastic response during service while also serving as a conductive element for electrical connection. They often also include a metallic shield for enhanced electrical properties. Typically, a combination of barrier metal and noble metal platings are applied to the surface of the spring for corrosion prevention and for electrical contact enhancement. It is often the case that these platings are not of sufficient thickness for electrical conduction along the surface of the spring.
Examples of such prior art resilient conductive contacts may be found in U.S. Pat. Nos.: 6,477,058; 6,471,524; 6,464,511; 6,439,897; 6,439,894; 6,416,330; 6,375,473: 6,338,629; 6,313,523; 6,302,702: 6,299,460; 6,299,457; 6,264,476; 6,224,392; 6,183,269; 6,183,267; 6,174,174; 6,174,172; 6,079,987; 6,074,219; 6,042,388; 6,033,233; 6,032,356; 5,967,798; 5,919,050; 5,806,181; 5,791,914; 5,772,451; 5,727,954; 5,718,040; 5,663,654; 5,540,593; 5,519,201; 5,473,510; 5,462,440; 5,428,191; 5,388,998; 5,388,997; 5,366,380; 5,362,241; 5,334,029; 5,299,939; 5,273,438; 5,248,262; 5,237,743; 5,232,372; 5,214,563; 5,213,513; 5,211,566; 5,207,585; 5,192,213; 5,184,962; 5,174,763;5,167,512; RE34,084; 5,139,427; 5,061,191; 5,035,628; 5,030,109; 5,007,842; 4,961,709; 4,922,376; 4,838,815; 4,820,376; 4,810,213; 4,707,657; 4,620,761; 4,508,405; 4,203,203; 4,029,375; 3,934,959; 3,795,884; 3,513,434; 3,317,885; 2,153,177, which patents are hereby incorporated herein by reference.
A problem in the art exists in that a good material for the construction of a spring, such as a high strength steel, is not a very good electrical conductor. On the other hand, a good electrical conductor, such as a copper alloy or precious metal, is often not a good spring material. In addition, the need for sufficient contact forces to be provided by the spring very often dictates its shape and size. The optimization of these parameters very often results in less than optimal electrical performance.
In particular, the characteristic impedance of the electrical contact is often moved toward undesirable levels as a result of the physical design of the spring, necessitating the use of a shielding material. It is desirable to have a controlled characteristic impedance of the signal from the IC to the printed circuit board without discontinuity, since the close proximity of the electrical contacts often results in cross-talk at a higher data rates. This cross-talk problem may also be alleviated by connecting alternate contacts to ground so as to provide an electrical reference, but at the expense of achievable interconnection density. It is therefore desirable to provide a connector assembly between the IC and a PCB which has a controlled impedance, exhibits wave guide properties with low electrical resistance, provides a short electrical length with high density, and is reliable.
There is a need for a more simplified resilient conductive contact which incorporates the seemingly opposing requirements of good spring properties, high conductivity, and enhanced signal transmission performance. Therefore, an improved electrical contact for use in an LGA socket or electrical connector is needed which can overcome the drawbacks of conventional electrical contacts.
The present invention provides a low inductance electrical contact comprising at least two transmission-coil sections each comprising at least two tightly wound turns. One or more active-coil sections are integral with, and positioned between the transmission-coil sections so as to provide (i) electrical signal communication between the at least two transmission-coil sections, and (ii) resilient spring characteristics. Advantageously, transmission-coil sections are over coated with a conductive noble metal, e.g., electrodeposited copper or the like, so as to fuse each of the at least two tightly wound turns together and thereby provide for a shortened electrical transmission pathway through the electrical contact.
In an alternative embodiment, a low inductance electrical contact is provided including at least two active-coil sections that electrically communicate with one another through a transmission-coil section. The transmission-coil section comprises at least two tightly wound turns that are over coated with a conductive noble metal so as to fuse the two tightly wound turns together.
An LGA interposer for providing data communication between a first and a second array of contact pads, e.g., as may be arranged on an IC package and test circuit board, comprises a dielectric housing having an array of cavities; and a plurality of low inductance electrical contacts positioned within the cavities. A portion of each electrical contact is electrically accessible to the first and second arrays of contact pads. In one embodiment, each electrical contact includes at least two transmission-coil sections each comprising at least two tightly wound turns. One or more active-coil sections are integral with, and positioned between the transmission-coil sections so as to provide (i) electrical signal communication between the at least two transmission-coil sections, and (ii) spring characteristics. The transmission-coil sections are over coated with a conductive noble metal, e.g., electrodeposited copper or the like, so as to fuse each of the at least two tightly wound turns together and thereby provide for a shortened electrical transmission pathway through the electrical contact. In an alternative embodiment, each electrical contact includes at least two active-coil sections that electrically communicate with one another through a transmission-coil section. The transmission-coil section comprises at least two tightly wound turns that are over coated with a conductive noble metal so as to fuse the two tightly wound turns together.
These and other features and advantages of the present invention will be more fully disclosed in, or rendered obvious by, the following detailed description of the preferred embodiments of the invention, which are to be considered together with the accompanying drawings wherein like numbers refer to like parts and further wherein:
a is a perspective view of an electrical contact similar to that shown in
b is a cross-sectional view of the electrical contact shown in
c is a perspective view of an electrical contact similar to that shown in
This description of preferred embodiments is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description of this invention. The drawing figures are not necessarily to scale and certain features of the invention may be shown exaggerated in scale or in somewhat schematic form in the interest of clarity and conciseness. In the description, relative terms such as “horizontal,” “vertical,” “up,” “down,” “top” and “bottom” as well as derivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) should be construed to refer to the orientation as then described or as shown in the drawing figure under discussion. These relative terms are for convenience of description and normally are not intended to require a particular orientation. Terms including “inwardly” versus “outwardly,” “longitudinal” versus “lateral” and the like are to be interpreted relative to one another or relative to an axis of elongation, or an axis or center of rotation, as appropriate. Terms concerning attachments, coupling and the like, such as “connected” and “interconnected,” refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise. The term “operatively connected” is such an attachment, coupling or connection that allows the pertinent structures to operate as intended by virtue of that relationship. In the claims, means-plus-function clauses are intended to cover the structures described, suggested, or rendered obvious by the written description or drawings for performing the recited function, including not only structural equivalents but also equivalent structures.
Referring to
In one embodiment of the invention, ho using 6 is formed from a top half 13 and a mating bottom half 15 such that apertures 10 lead to a receptacle cavity 16, i.e., a void defined within housing 6 by recessed portions of top half 13 and mating bottom half 15 (FIG. 2). Cavity 16 is larger th an apertures 10 such that an annular shoulder 18 surrounds each aperture 10. If interposer 8 is to be mounted to a test circuit board 19 such that electrical contacts 5 are at least partially preloaded, than accommodations are made for releasable fasteners, e.g. screws 12, to be secured through housing 6, and circuit board 100.
Any of the various polymeric materials known to be useful in the electronics industry may be used in connection with housing 6, including, without limitation, thermoplastics (crystalline or non-crystalline, cross-linked or non-crosslinked), thermosetting resins, elastomers or blends or composites thereof. Illustrative examples of useful thermoplastic polymers include, without limitation, polyolefins, such as polyethylene or polypropylene, copolymers (including terpolymers, etc.) of olefins such as ethylene and propylene, with each other and with other monomers such as vinyl esters, acids or esters of -unsaturated organic acids or mixtures thereof, halogenated vinyl or vinylidene polymers such as polyvinyl chloride, polyvinylidene chloride, polyvinyl fluoride, polyvinylidene fluoride and copolymers of these monomers with each other or with other unsaturated monomers, polyesters, such as poly(hexamethylene adipate or sebacate), poly(ethylene terephthalate) and poly(tetramethylene terephthalate), polyamides such as Nylon-6, Nylon-6,6, Nylon-6,10, Versamids, polystyrene, polyacrylonitrile, thermoplastic silicone resins, thermoplastic polyethers, thermoplastic modified cellulose, polysulphones and the like.
Examples of some thermosetting resins useful herein include, without limitation, epoxy resins, such as resins made from epichlorohydrin and bisphenol A or epichlorohydrin and aliphatic polyols, such as glycerol, and which can be conventionally cured using amine or amide curing agents. Other examples include phenolic resins obtained by condensing a phenol with an aldehyde, e.g., phenolformaldehyde resin.
Referring to
Transmission-coils 30 are preferably coated with an electrodeposited layer of a highly electrically conductive metal 33, such as copper, silver, gold, palladium, or the like so as to fuse each of the tightly wound turns together (
Active-coils 32 are typically integral with transmission-coils 30 so as to communicate between two adjacent transmission-coil sections, and comprise a mean coil diameter 40 and coil-to-coil pitch α, so as to provide a preselected spring rate when compressed together. Active-coils 32 and transmission-coils 30 may be either left-hand wound or right-hand wound from a single wire. Also, electrical contacts 5 may include only one active-coil 32, or a plurality of active-coils 32, as required for a particular interconnection application. For example, in one embodiment, two transmission-coil sections 45a and 45b are spaced apart by two active-coils 32a,32b. Each transmission-coil section 45a,45b often includes four transmission-coil turns that are formed so as to have a pitch angle α that is less than about 10°, and a successively varying mean diameter so as to form a tapered profile (FIG. 6). The tapered profile provides for more accurate true position location of each electrical contact with respect to contact pads 11 on IC package 9. Transmission-coil sections 45a,45b are over coated with a conductive layer of copper 33 (e.g., via electroplating, sputtering, or hot dipping) so as to minimize the effective electrical path length, with at least the terminal coil surfaces 51a,51b further coated with a highly conductive noble metal, such as gold or the like. Active-coils 32a,32b are positioned between transmission-coil sections 45a,45b and comprise mean coil diameter 40 and a pitch angle a selected to provide the requisite contact normal force. It will be understood that one or more of the active-coils may be over coated with a conductive layer of copper 33, and further coated (e.g., via electroplating, sputtering, or hot dipping) with both a barrier metal layer and a highly conductive noble metal, such as gold or the like.
In another embodiment, two active-coil sections 65a and 65b are spaced apart by one transmission-coil 67 with each having an end transmission-coil 70a,70b (FIG. 8). Each active-coil section 65a,65b comprises a mean coil diameter 40 and a pitch angle α selected to provide the requisite contact normal force. Normal forces in the range from about twenty grams to about forty grams can be achieved through the proper adjustment of wire diameter, coil diameter, and pitch angle. Transmission-coil section 67 is over coated with a conductive, relatively thick layer of copper 33 so as to minimize the effective electrical path length, and comprises six or seven generally cylindrically shaped sections of turns. Each end transmission-coil 70a,70b comprises a six or seven turn, constant mean coil diameter section 75 and one or more coils of varying mean coil diameter so as to form a tapered transition section 77. At least the terminal coil surfaces 81a,81b are coated with a highly conductive noble metal, such as gold or the like.
Of course, it is not necessary to arrange the closely spaced transmission-coils at the ends of electrical contacts 5. Although less preferred, it is also possible to reverse the arrangement of coil sections in the present invention (FIG. 12). For example, two active-coil sections 85a and 85b may be spaced apart by one transmission-coil 87. Each active-coil section 85a,85b comprises a mean coil diameter 40 and a pitch angle a selected to provide the requisite contact normal force. A transition-coil 88 is also provided to allow for the connection of each active-coil section 85a,85b to the centrally located transmission-coil 87. Transition-coils 88 have a mean coil diameter 91 and a pitch angle β that may differ from the coil diameter and pitch angle of active-coil sections 85a,85b. This construction allows for a very wide range of spring properties and loading schemes to be employed in the present invention. In an alternative embodiment, one or both of active-coil sections 85a,85b have a successively varying mean coil diameter so as to form an outwardly (
The electrical contacts of the present invention are arranged within housing 6 to form LGA interposer 8. Although the following description of one preferred embodiment of LGA interposer 8 will be disclosed in connection with one embodiment of electrical contact, it will be understood that all variations and their obvious equivalents may be used to form an LGA interposer in accordance with the present invention. Referring to FIGS. 2 and 23-25, with top half 13 removed from housing 6, each electrical contact 5 is oriented so as to be in substantially coaxial confronting relation with the entrance to receptacle cavity 16. Once in this position, each electrical contact 5 is moved toward mating bottom half 15 until the inner surfaces of annular shoulder 18 of bottom half 15 engage a portion of each electrical contact 5. In many of the embodiments of electrical contact 5, angular shoulder 18 will engage one or more transition coils (e.g., transition coils 77 in
In many applications where an IC package 9 is to be temporarily mounted to a test circuit board 100, it is advantageous to pre-load each of the electrical contacts against circuit traces 102 on test circuit board 100 so that reliable electrical and mechanical engagement may be maintained between LGA interposer 8 and test circuit board 100. With the present invention, screws 12 may be mounted in corresponding threaded holes within test circuit board 100 such that, as screws 12 are threaded into their corresponding holes within housing 6 and test circuit board 100, they draw housing 6 toward test circuit board 100. As this happens, annular shoulders 18 engage transition portions 77 and thereby compress active-coils 65b in each of electrical contacts 5. As this occurs, terminal-coil surfaces 81b are pressed into intimate electrical and mechanical contact with corresponding circuit traces 102 on the surface of test circuit board 100. The magnitude of the pre-loaded contact force applied to circuit traces 102 may be pre-determined by appropriate selection of a spring constant for active-coil sections 65b in each of electrical contacts 5. It should be noted that the spring rate for individual electrical contacts 5 may be varied within LGA interposer 8 so that variations in pre-loaded contact force may be provided to accommodate surface features or physical requirements of the surface of test circuit board 100.
Once LGA interposer 8 has been pre-loaded (FIG. 24), an IC package 9 may be positioned above transmission-coils 70a of electrical contacts 5 and pressed downwardly so as to compress active-coil sections 65a in each of electrical contacts 5, thereby creating an electrical circuit between test circuit board 100 and contact pads 11 of IC package 9. Advantageously, each of the transmission-coil sections have been over coated with an electrodeposited layer of copper or similar highly conductive noble metal. Thus, as electrical signals pass between test circuit board 100 and IC package 9, the electrical path length is minimized through electrical contacts 5. In particular, the over coated portions of electrical contact 5 act as a substantially solid, highly conductive transmission path so as to maintain a pre-selected characteristic impedance for the electrical system.
It is to be understood that the present invention is by no means limited only to the particular constructions herein disclosed and shown in the drawings, but also comprises any modifications or equivalents within the scope of the claims.
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