Patent Grant
6917256
The present invention relates generally to the field of microwave or millimeter wave energy transmission and more particularly relates to the physical coupling of a transmission line to a waveguide.
The demand for Monolithic Microwave Integrated Circuit (MMIC) devices has increased dramatically over the past few years. This increase is due largely to the frequent utilization of MMIC devices in radar systems, electronic warfare devices, missiles and array weapons as well as a wide variety of non-military communications applications. In most cases, there are a number of microwave or millimeter wave components involved, including MMICs, diodes, printed circuits, antennas, and certain waveguide components such waveguide power combiners or waveguide antenna feeds.
These “mixed microwave circuits,” are those in which part of the circuit is in the form of conductively bounded hollow circular or rectangular guides (waveguides), and part of the circuit is in the form of the well known conductor strip sandwiched between parallel dielectric slabs (stripline) or the equally well known conductor strip mounted on a dielectric slab (microstrip). Most of the components utilized for microstrip/stripline transmission lines are typically mounted on planar microstrip transmission line circuits since this method provides manufacturing efficiencies at a relatively low cost.
As the frequency of operation for a given circuit increases, the use of waveguide elements becomes increasingly desirable because of the inherent low loss characteristics associated with waveguide transmission. However, while generally more desirable, waveguide transmission is typically more expensive to implement than microstrip/stripline transmission lines. In addition, since MMICs cannot be mounted directly into a typical waveguide structure, it is generally necessary to transition one or more times between transmission lines of these different types. These commonly implemented transitions between microstrip/stripline and waveguide have also been an issue for certain applications.
However, as the monolithic circuitry in these devices becomes increasingly dense, and as operating frequencies for commercial applications become increasingly popular for broadband applications at K-Band frequencies (18 GHz) through W-band frequencies (94 GHz) and beyond, to include millimeter and sub-millimeter wave ranges, minimizing signal loss becomes an increasingly important consideration. This places a growing burden on existing millimeter wave manufacturing technologies, and especially on radio frequency (RF) input/output transitions, which are often the source of signal capture loss.
The various transition techniques used for channeling high frequency signals in many double-sided or multilayer circuit boards that are connected to a waveguide, typically requires a probe to pass through both the waveguide wall and the circuit board so that when the probe protrudes into the waveguide, it will pick up the signals propagating within the waveguide. In order for such an arrangement to work properly, it is common practice to connect the probe to a microstrip conductor. This is typically accomplished by having the microstrip line on the printed circuit board extend into the side of the waveguide to form an E-plane launch. However, with this arrangement, the transition to the waveguide is often quite “lossy,” and may result in more than 1 dB of loss. Additionally, this arrangement may require hand tuning, using a tuning screw that protrudes into the waveguide, or by other means well know to those skilled in the art. These commonly used practices for assembling and tuning transitions can be quite expensive because of the time and labor associated with assembly and tuning.
Finally, the losses associated with these transitions, which are a combination of both dissipative and impedance mismatch loss, are unacceptable for many applications such as low-noise receivers and certain classes of power amplifiers. Additionally, dissipative and impedance mismatch losses may also result in further degradation or actual loss of signal. Well know methods for tuning, to reduce impedance mismatch losses and improve performance, can increase the cost of devices incorporating these transitions to unacceptable levels for many commercial applications.
In view of the foregoing, it should be appreciated that there is still a need for an efficient, cost effective method and apparatus for coupling microwave or millimeter wave frequency range energy from a microstrip transmission line to a waveguide transmission line. Furthermore, other desirable features and characteristics of the present invention will become apparent from the subsequent description and the appended claims, taken in conjunction with the accompanying drawings.
The present invention will hereinafter be described in conjunction with the appended drawing figures, wherein like numerals denote like elements, and:
Referring now to
Referring now to
Groundplane 210 is a conductive housing for conductor strip 230 and dielectric slab 220 and may be fabricated from one or more components. In this embodiment, groundplane 210 includes a conductive lid 212 that is attached to groundplane 210 after conductor strip 230 and dielectric slab 220 have been placed inside groundplane 210. Conductive lid 212 becomes part of groundplane 210 and may be attached using conductive epoxy, solder, or some other suitable means known to those skilled in the art. Dielectric slab 220 may be fixed in place by applying non-conductive epoxy to the edges of dielectric slab 220 where it contacts the interior surface of groundplane 210.
It should be noted that the transition from microstrip 100 to suspended stripline 200 increases the characteristic impedance of the signal line, given a signal line with the same physical dimensions and composition. Accordingly, conductor strip 230 should be relatively wider than conductor strip 130 to lower the impedance at the point of the transition. This is also advantageous because the effective ohmic loss associated with conductor strip 230 will be reduced.
From the point of connection to microstrip 100 to the point of connection to a waveguide, the width of conductor strip 230 can be gradually tapered down towards its terminal end to match the desired impedance for the specific waveguide application. In addition, the dielectric properties of dielectric slab 220 become less significant because suspended stripline is used and the dielectric properties of dielectric 205, typically the air surrounding dielectric slab 220 and conductor strip 230, will enter into the equation as well.
Referring now to
Dielectric slab 360 and conductor strip 350 extend into waveguide 310, thereby providing an e-plane launch for the signal carried by conductor strip 350 into waveguide 310. This allows the transmission line to be fabricated fairly easily, and at a relatively low cost. Microstrip section 330 is typically connected to some type of active device (not shown this FIG.) and may be used to transmit a signal to and from the active device to waveguide 310. The signal from the active device is transmitted to waveguide 310 by conductor strip 350.
Rectangular waveguide 310 is representative of the type of waveguides typically used to transmit microwave signals and is well known to those skilled in the art. An opening in waveguide 310 is provided to receive dielectric slab 360 and conductor strip 350 into waveguide 310. Additionally, a depth guide 365 is positioned between the end of dielectric slab 360 and the sidewall of waveguide 310 during the assembly process. The use of depth guide 365 allows for controlling the depth of insertion of dielectric slab 360 and conductor strip 350 into waveguide 310. While the use of depth guide 365 is optional, it is considered desirable because the depth of insertion into waveguide 310 can be an important consideration for certain applications. After dielectric slab 360 has been positioned and firmly fixed in place, depth guide 365 may be removed from waveguide 310.
A large variety of components related to waveguides such as couplers, detectors, isolators, attenuators, and slotted lines are commercially available for various standard waveguide bands from 1 GHz to over 30 GHz. Typically, as the frequency increases, the availability of the various components decreases and the cost of the available components increases. This makes the relatively inexpensive approach of the present invention generally more compelling as the transmission frequency increases.
As with conductor strip 230 of
Referring now to
Without tuning, the low loss transition connection between microstrip section 330 and waveguide 310 demonstrates a loss of approximately {fraction (1/10)} dB at a frequency of 30 GHz. While various tuned microwave transmission waveguide transition components available today can provide similar performance, the cost of such components is significantly higher that the apparatus described herein. While not limited to any specific frequency or range of frequencies, the methods and apparatus described herein are especially useful in frequencies in the range of 25 GHz and above.
Thus, there has been provided a low loss waveguide for use in transitioning a transmission line from a microstrip transmission line to a waveguide. Although the present invention has been illustrated by depicting a microstrip transmission line connected to a waveguide, the low loss waveguide of the present invention provides a relatively inexpensive and easy to fabricate solution for connecting many types of transmission lines to a waveguide. For example, regular, non-suspended stripline may be transitioned to suspended stripline in a manner similar to that shown in
The relatively low loss transition provided by the methods and apparatus of the present invention allows for a potential relaxation in the specifications for active devices commonly used in microwave transmission applications. By providing a lower loss transition, less power is needed from power amplifiers to drive a given signal for a given application. Additionally, it is possible to allow a higher noise calculation figure in a specification for a low noise amplifier, while still achieving the same performance at the module level, resulting in a more efficient power amplifier. Finally, the various thermal considerations for microwave applications requiring a smaller power amplifier are also simplified.
While the preferred exemplary embodiments have been presented in the foregoing detailed description, it should be appreciated that a vast number of variations exist. It should also be appreciated that the preferred embodiments are only examples and are not intended to limit the scope, applicability, or configuration of the invention in any way. Rather, the foregoing detailed description provides those skilled in the art with a convenient roadmap for implementing the preferred exemplary embodiments of the invention. It should be understood that various changes may be made in the function and arrangement of elements described in the exemplary preferred embodiment without departing from the spirit and scope of the invention as set forth in the appended claims.
| Number | Name | Date | Kind |
|---|---|---|---|
| 4870375 | Krueger et al. | Sep 1989 | A |
| 4901040 | Ahlborn et al. | Feb 1990 | A |
| 5539361 | Davidovitz | Jul 1996 | A |
| 5724049 | Park et al. | Mar 1998 | A |
| 5726664 | Park et al. | Mar 1998 | A |
| 5912598 | Stones et al. | Jun 1999 | A |
| 5982250 | Hung et al. | Nov 1999 | A |
| 6002305 | Sanford et al. | Dec 1999 | A |
| 6040739 | Wedeen et al. | Mar 2000 | A |
| 6333683 | Hampel | Dec 2001 | B1 |
| 6353416 | Hopkins et al. | Mar 2002 | B1 |
| 6396363 | Alexanian et al. | May 2002 | B1 |
| 6486748 | Stones et al. | Nov 2002 | B1 |
| 6501431 | Irion et al. | Dec 2002 | B1 |
| 6512431 | Pergande | Jan 2003 | B2 |
| 6549106 | Martin | Apr 2003 | B2 |
| 6573803 | Ziegner et al. | Jun 2003 | B1 |
| 6624716 | Goff | Sep 2003 | B2 |
| 6667549 | Cahill | Dec 2003 | B2 |
| 6707348 | Ammar | Mar 2004 | B2 |
| Number | Date | Country | |
|---|---|---|---|
| 20040036550 A1 | Feb 2004 | US |
