Claims
- 1. A low-pass filter comprising:
- a plurality of dielectric layers forming a multilayer structure, the multilayer structure comprising:
- a first dielectric substrate having a microstripline on a first surface thereof;
- a second dielectric substrate having at least one capacitor electrode on a first surface thereof;
- a third dielectric substrate having a thin shielding electrode on a first surface thereof and being arranged between said first and second dielectric substrates
- said shielding electrode being disposed such that said first dielectric substrate separates said shielding electrode from said microstrip line and said third dielectric substrate separating said capacitor electrode from said shielding electrode;
- a dielectric sheet provided on a first surface of said multilayer structure; and
- a fourth dielectric substrate having a ground electrode on a first surface thereof, the fourth dielectric substrate being disposed on a second surface of said multilayer structure opposite to said first surface of said multilayer structure;
- said ground electrode of said fourth dielectric substrate being electrically connected with said shielding electrode of said second dielectric substrate.
- 2. The low-pass filter in accordance with claim 1, wherein a first capacitor is formed by said at least one capacitor electrode and said ground electrode, and a second capacitor is formed by said at least one capacitor electrode and said shielding electrode, said second capacitor being connected in parallel with said first capacitor.
- 3. The low-pass filter in accordance with claim 1, further comprising a fifth dielectric substrate having a ground electrode on a first surface thereof and wherein said fifth dielectric substrate is stacked between said dielectric sheet and said first surface of said multilayer structure.
- 4. The low-pass filter in accordance with claim 1, further comprising an external electrode being formed on an outer surface of said multilayer structure, said external electrode being electrically connected with any one of said microstripline, said capacitor electrode, said ground electrode and said shielding electrode.
- 5. The low-pass filter in accordance with claim 4, wherein at least three external electrodes are formed on said outer surface of said multilayer structure, for forming a .pi. filter.
- 6. The low-pass filter in accordance with claim 4, wherein said electric connection between said ground electrode and said shielding electrode is obtained by said external electrode on said outer surface of said multilayer structure.
- 7. The low-pass filter in accordance with claim 4, wherein a via-hole electrode is formed in said multilayer structure, said ground electrode being electrically connected with said shielding electrode by said via-hole electrode.
- 8. The low pass filter in accordance with claim 4, wherein a via-hole electrode is formed in said multilayer structure, an end of said microstripline being electrically connected with said capacitor electrode by said via-hole electrode.
- 9. The low-pass filter in accordance with claim 2, further comprising a fifth dielectric substrate having a ground electrode on a first surface thereof and wherein said fifth dielectric substrate is stacked between said dielectric sheet and said first surface of said multilayer structure.
- 10. The low-pass filter in accordance with claim 1, further comprising:
- a fifth dielectric substrate having a ground electrode on a first surface thereof, said ground electrode having at least one external electrode thereon, and wherein said fifth dielectric substrate is stacked between said dielectric sheet and said first surface of said multilayer structure; and further wherein:
- said first dielectric substrate further comprises a first microstripline having first and second external electrodes thereon; and a second microstripline having first and second external electrodes thereon;
- said second dielectric substrate further comprises at least a first capacitor electrode having at least one external electrode thereon; a second capacitor electrode having at least one external electrode thereon; and a third capacitor electrode having at least one external electrode thereon;
- said shielding electrode of said third dielectric substrate having at least one external electrode thereon;
- said ground electrode of said fourth dielectric substrate having at least one external electrode thereon;
- said shielding electrode of said third dielectric substrate and said ground electrode of said fourth dielectric substrate and said ground electrode of said fifth dielectric substrate being electrically connected via said external electrodes;
- said at least one external electrode of said first capacitor electrode and said first external electrode of said first microstripline being electrically connected;
- said at least one external electrode of said second capacitor electrode being connected to said second external electrode of said first microstripline and said second external electrode of said second microstripline;
- said at least one external electrode of said third capacitor electrode being connected to said first external electrode of said second microstripline.
Priority Claims (1)
Number |
Date |
Country |
Kind |
6-059085 |
Mar 1994 |
JPX |
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Parent Case Info
This is a continuation of application Ser. No. 08/408,377 filed on Mar. 22, 1995, now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (5)
Number |
Date |
Country |
0566145 |
Oct 1993 |
EPX |
0641035 |
Mar 1995 |
EPX |
4119551 |
Jan 1992 |
DEX |
4401173 |
Jul 1994 |
DEX |
5-218705 |
Aug 1993 |
JPX |
Non-Patent Literature Citations (1)
Entry |
European Search Report dated Jun. 28, 1995. |
Continuations (1)
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Number |
Date |
Country |
Parent |
408377 |
Mar 1995 |
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