Patent Application
20150042536
A portion of the disclosure of this patent document contains material that is subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent files or records, but otherwise reserves all copyright rights whatsoever.
The present disclosure relates generally to antenna solutions, and more particularly in one exemplary aspect to antenna solutions that have a desired peak passive intermodulation (“PIM”) performance; e.g., in one embodiment lower than −155 dBc.
Antennas in wireless communication networks are critical devices for both transmitting and receiving signals with and without amplification. With the evolution of network communication technology migrating from less to more capable technology; e.g., third generation systems (“3G”) to fourth generation systems (“4G”) with higher power, the need for antennas which can clearly receive fundamental frequencies or signals with minimal distortion are becoming more critical. The distortion experienced during signal reception is due in large part to the by-products of the mixture of these fundamental signals. Passive intermodulation, or PIM, is the undesired by-products of these mixed signals, which can severely interfere and inhibit the efficiency of a network system's capability in receiving the desired signals. With higher carrier power levels experienced in today's modern wireless communication networks, low PIM antennas with a peak PIM performance (for instance, lower than about −153 decibels relative to the carrier (“dBc”) for cellular network applications are desired (such as 3G (e.g., 3GPP, 3GPP2, and UMTS), HSDPA/HSUPA, TDMA, CDMA (e.g., IS-95A, WCDMA, etc.), GSM, WiMAX (802.16), Long Term Evolution (LTE) and LTE-Advanced (LTE-A), etc.). In addition, over time, the PIM value may drop due to nonlinearity, dissimilar materials, thermal expansion and/or contraction, and galvanic corrosion.
Accordingly, there is a need for apparatus, systems and methods that eliminate nonlinearity, such as via the reduction of dissimilar materials in antenna embodiments.
The aforementioned needs are satisfied herein by providing improved antenna apparatus, and methods for manufacturing and using the same.
In a first aspect, a low passive intermodulation (PIM) antenna apparatus is disclosed. In one embodiment, the low PIM antenna apparatus includes a radiating element comprised of a plurality of protruding portions. In one variant, each of the protruding portions are separated from one another by an equal amount. The low PIM antenna apparatus of this variant further includes a formed ground plane comprising an electrical path length and a diameter, the electrical path length being greater than the diameter and a connector that is coupled to the formed ground plane and the radiating element.
In a second aspect, a ground plane apparatus for use with an antenna apparatus such as, for example, a low PIM antenna apparatus is disclosed.
In a third aspect, a radiating element for use with an antenna apparatus such as, for example, a low PIM antenna apparatus is disclosed.
In a fourth aspect, methods of manufacturing the aforementioned low PIM antenna apparatus are disclosed. In one embodiment, and in order to obtain a reliable low PIM performance in long term use, the antenna is designed and manufactured by using laser welds as much as possible instead of the use of traditional soldering methods. These laser welded joints are used so as to avoid the use of dissimilar materials within RF paths or possible cold solder joints, which are known to cause PIM. In another embodiment, all custom flanged connectors or adapters are laser welded to the ground plane. Furthermore, screws and dissimilar metallic components within the RF path are avoided as they are nonlinear junctions which could affect low PIM performance in a long term use.
In a fifth aspect, methods of manufacturing the aforementioned ground plane apparatus are disclosed.
In a sixth aspect, methods of manufacturing the aforementioned radiating element are disclosed.
In a seventh aspect, methods of using the aforementioned antenna apparatus are disclosed.
Various objects, features, aspects and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawings.
The features, objectives, and advantages of the disclosure will become more apparent from the detailed description set forth below when taken in conjunction with the drawings, wherein:
Reference is now made to the drawings wherein like numerals refer to like parts throughout.
As used herein, the terms “antenna”, and “antenna assembly” refer without limitation to any system that incorporates a single element, multiple elements, or one or more arrays of elements that receive/transmit and/or propagate one or more frequency bands of electromagnetic radiation. The radiation may be of numerous types, e.g., microwave, millimeter wave, radio frequency, digital modulated, analog, analog/digital encoded, digitally encoded millimeter wave energy, or the like. The energy may be transmitted from location to another location, using, or more repeater links, and one or more locations may be mobile, stationary, or fixed to a location on earth such as a base station.
As used herein, the terms “board” and “substrate” refer generally and without limitation to any substantially planar or curved surface or component upon which other components can be disposed. For example, a substrate may comprise a single or multi-layered printed circuit board (e.g., FR4), a semi-conductive die or wafer, or even a surface of a housing or other device component, and may be substantially rigid or alternatively at least somewhat flexible.
As used herein, the terms “portable device”, “mobile device”, “client device”, and “computing device”, include, but are not limited to, personal computers (PCs) and minicomputers, whether desktop, laptop, or otherwise, set-top boxes, personal digital assistants (PDAs), handheld computers, personal communicators, tablet/phablet computers, portable navigation aids, J2ME equipped devices, cellular telephones, smartphones, tablet computers, personal integrated communication or entertainment devices, portable navigation devices, or literally any other device capable of processing data.
Furthermore, as used herein, the terms “radiator,” “radiating plane,” and “radiating element” refer without limitation to an element that can function as part of a system that receives and/or transmits radio-frequency electromagnetic radiation; e.g., an antenna. Hence, an exemplary radiator may receive electromagnetic radiation, transmit electromagnetic radiation, or both.
The terms “feed”, and “RF feed” refer without limitation to any energy conductor and coupling element(s) that can transfer energy, transform impedance, enhance performance characteristics, and conform impedance properties between an incoming/outgoing RF energy signals to that of one or more connective elements, such as for example a radiator.
As used herein, the terms “top”, “bottom”, “side”, “up”, “down”, “left”, “right”, and the like merely connote a relative position or geometry of one component to another, and in no way connote an absolute frame of reference or any required orientation. For example, a “top” portion of a component may actually reside below a “bottom” portion when the component is mounted to another device (e.g., to the underside of a PCB).
As used herein, the term “wireless” means any wireless signal, data, communication, or other interface including without limitation Wi-Fi, Bluetooth, 3G (e.g., 3GPP, 3GPP2, and UMTS), HSDPA/HSUPA, TDMA, CDMA (e.g., IS-95A, WCDMA, etc.), FHSS, DSSS, GSM, PAN/802.15, WiMAX (802.16), 802.20, narrowband/FDMA, OFDM, PCS/DCS, Long Term Evolution (LTE) or LTE-Advanced (LTE-A), analog cellular, Zigbee, Near field communication (NFC)/RFID, CDPD, satellite systems such as GPS and GLONASS, and millimeter wave or microwave systems.
The present disclosure provides, inter alia, improved low PIM antenna components, assemblies, and methods for manufacturing and utilizing the same.
More specifically, embodiments of the present disclosure include an ultra-wide band quarter-wave monopole over ground plane antenna apparatus that operates within a desired wide frequency band (e.g., from 698-5900 MHz in one exemplary implementation). The radiating structure comprises a monopole antenna comprised of three (3) features that are separated from one another by one hundred twenty (120°), thus producing a triangular shaped pattern when viewed from above. Such a configuration is advantageous as it reduces the nulls by about twenty percent (20%) as compared with similar antenna implementations having a single flat radiating element.
In addition, adding the third leg to shunt feed to ground allows for tuning the low NM antenna apparatus to obtain the desired RF frequency bandwidth.
Moreover, in order to reduce the diameter of the ground plane while simultaneously increasing the electrical length of the ground plane, forming of the ground plane (see e.g.,
In one exemplary implementation, the use of screws, rivets and gaps from around, for example, the connector flange is reduced or even eliminated. In addition, all electrical components utilized within such a desired antenna apparatus (i.e., radiating element, ground plane, and connector) are made from the same nonferrous material. Such a solution advantageously reduces the overall cost and improves the reliability of the underlying antenna by, inter alia, utilizing state of the art technologies such as e.g., laser welding.
Methods of manufacturing and using the aforementioned low PIM antenna assembly are also disclosed.
Detailed descriptions of the various embodiments and variants of the apparatus and methods of the present disclosure are now provided. While primarily discussed in the context of low passive intermodulation (“PIM”) antennas for distributed antenna systems (“DAS”), the various apparatus and methodologies discussed herein are not so limited. In fact, many of the apparatus and methodologies described herein are useful in the manufacture of any number of antenna apparatus that can benefit from the radiating element and ground plane geometries and methods described herein, which may also be useful in different applications, and/or provide different signal conditioning functions.
Some exemplary embodiments of the present disclosure relate to low cost, low PIM antennas for distributed antenna systems (“DAS”) with broadband frequencies in the range of 698-2700 MHz. Antenna embodiments of the present disclosure include a plastic radome, a conductive (e.g. metal) radiating element, a conductive (e.g. metal) ground plane, and a feeding network, the latter which may comprise, for example, a single custom direct mount connector, an N type or 7-16DIN type connector, or a custom cable pigtail with custom connectors and adapters. Exemplary embodiments of the present disclosure also include a novel mounting base which can be utilized in conjunction with various feeding network interfaces. The radiating element and the ground plane are, in one implementation, specifically made to meet desired voltage standing wave ratios (“VWSR”) with form factors and assembly techniques which help to achieve the desired PIM level for use in e.g., modern wireless communication networks. Embodiments of the present disclosure also include a mounting base that is designed so that when mounted against, for example, an office ceiling tile or any hard installation surface, it can house all three (3) antennas of three (3) connector configurations. For example, a mounting base is disclosed that can be used in conjunction with N pigtail, N direct mount and 7-16 DIN direct mount in a way that results in fast installation and fast removal. The mounting base is utilized with the antenna with N or 7-16 DIN direct mount connector for installation, and is optional for the antenna with N pigtail connector. The mounting base also has features to allow the antennas to be exchangeable with other brand mounting bases.
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The other end of the illustrated cable pigtail includes a standard connector of, for example, an N or 7-16 DIN type that is soldered to a semi-flexible cable 234. The semi-flexible cable incorporates enough flexibility so as to ease assembly. The length of the semi-flexible cable could be of any desired length so long as the gain loss is acceptable.
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It will be recognized that while certain aspects of the present disclosure are described in terms of specific design examples, these descriptions are only illustrative of the broader methods of the disclosure, and may be modified as required by the particular design. Certain steps may be rendered unnecessary or optional under certain circumstances, Additionally, certain steps or functionality may be added to the disclosed embodiments, or the order of performance of two or more steps permuted. All such variations are considered to be encompassed within the present disclosure described and claimed herein.
While the above detailed description has shown, described, and pointed out novel features of the present disclosure as applied to various embodiments, it will be understood that various omissions, substitutions, and changes in the form and details of the device or process illustrated may be made by those skilled in the art without departing from the principles of the present disclosure. The foregoing description is of the best mode presently contemplated of carrying out the present disclosure. This description is in no way meant to be limiting, but rather should be taken as illustrative of the general principles of the present disclosure. The scope of the present disclosure should be determined with reference to the claims.
This application claims the benefit of priority to co-owned U.S. Provisional Patent Application Ser. No. 61/864,432 of the same title filed Aug. 9, 2013, the contents of which are incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| 61864432 | Aug 2013 | US |
