Patent Application
20070139904
The present disclosure generally relates to multi-piece shielding assemblies for shielding components of a printed circuit board from electromagnetic interference (EMI)/radio frequency interference (RFI).
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Electronic equipment typically includes electrical components and circuits mounted on a substrate that can be sensitive to electromagnetic interference (EMI) and radio frequency interference (RFI). Such EMI/RFI interference may originate from internal sources within the electronic equipment or from external EMI/RFI interference sources. Interference can cause degradation or complete loss of important signals, thereby rendering the electronic equipment inefficient or inoperable. Accordingly, the circuits (sometimes referred to as RF modules or transceiver circuits) usually require EMI/RFI shielding in order to function properly. Such shielding reduces interference not only from external sources, but also from various functional blocks within the module.
As used herein, the term “EMI” should be considered to generally include and refer to EMI emissions and RFI emissions, and the term “electromagnetic” should be considered to generally include and refer to electromagnetic and radio frequency from external sources and internal sources. Accordingly, the term shielding (as used herein) generally includes and refers to EMI shielding and RFI shielding, for example, to prevent (or at least reduce) ingress and egress of EMI and RFI relative to a housing or other enclosure in which electronic equipment is disposed.
By way of example, electronic circuits or components of a printed circuit board (PCB) are often enclosed with shields to localize EMI within its source, and to insulate other devices proximal to the EMI source. Such shields may be soldered or otherwise affixed to the PCB, thus increasing the overall size of the PCB. Soldered shields, however, may need to be removed to repair or replace a covered component, which can be an expensive and time-consuming task that can even cause damage to the PCB.
According to various aspects, exemplary embodiments are provided of assemblies operable for providing EMI shielding for electrical components on generally opposite first and second sides of a board. In one exemplary embodiment, the assembly generally includes a frame attachable to the board's first side, and first and second covers configured to be positioned on generally opposite sides of the board. The frame includes walls and at least one opening along an upper portion of the frame. The frame's walls are configured to be disposed generally about one or more electrical components on the board's first side. The first cover is configured to cover the at least one opening of the frame. The second cover is attachable to the first cover with the first and second covers respectively positioned along the board's generally opposite first and second sides. Accordingly, the assembly is operable for shielding one or more electrical components on the board's first side that are within a first interior defined by the frame's walls, first cover, and at least a portion of the board's first side, and one or more electrical components on the board's second side that are within a second interior defined by the second cover and at least a portion of the board's second side.
Another embodiment includes a low-profile assembly capable of providing board-level EMI shielding for electrical components on generally opposite first and second sides of a board. In this embodiment, the assembly generally includes a frame attachable to the board's first side. The frame includes walls and at least one opening along an upper portion of the frame. The frame's walls are configured to be disposed generally about one or more electrical components on the board's first side. The assembly also includes a first cover having a lid portion to cover the at least one opening of the frame. The first cover has wall portions downwardly depending relative to the lid portion. The wall portions have sufficient length for extending across a thickness defined between the board's first and second sides to thereby allow positioning of the end portions of the first cover's wall portions on a side of the board opposite that of the lid portion. The assembly further includes a second cover. At least one of the first and/or second covers includes one or more protrusions for interlocking engagement with corresponding openings of the other one of the first and/or second covers to thereby attach the second cover to the first cover. This interlocking engagement can also help retain the relative positioning of the first cover generally over the frame with the lid portion covering the at least one opening of the frame. Accordingly, the assembly is operable for shielding one or more electrical components on the board's first side that are within a first interior defined by the frame's walls, first cover, and at least a portion of the board's first side, and one or more electrical components on the board's second side that are within a second interior defined by the second cover and at least a portion of the board's second side.
Additional aspects relate to methods of using EMI shielding assemblies. One particular embodiment includes a method of providing EMI shielding for electrical components on generally opposite first and second sides of a board. The method generally includes positioning a first cover relative to a frame such that one or more electrical components on the board's first side are within a first interior defined by the frame, first cover, and at least a portion of the board's first side. The method also includes attaching a second cover to the first cover such that the first and second covers are respectively positioned along the board's generally opposite first and second sides, and such that one or more electrical components on the board's second side are within a second interior defined by the second cover and at least a portion of the board's second side.
Further aspects and features of the present disclosure will become apparent from the detailed description provided hereinafter. In addition, any one or more aspects of the present disclosure may be implemented individually or in any combination with any one or more of the other aspects of the present disclosure. It should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the present disclosure, are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way.
The following description is merely exemplary in nature and is in no way intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features.
Various embodiments are disclosed of shielding assemblies capable of providing EMI shielding for electrical components on both sides of a printed circuit board. In some embodiments, a shielding assembly includes a frame adapted to be secured to a board, and first and second covers that are configured to be positioned on generally opposite sides of the board. To install or assemble such a dual-sided shielding assembly, the frame is placed (e.g., using pick-and-place equipment, etc.) on a first side of a printed circuit board (e.g., PCMCIA-type wireless card, etc.). The frame can then be mounted to the first side of the board, such as via an exemplary surface mounting process (e.g., soldering, solder reflowing, etc.). The first and second covers can then be respectively positioned on or adjacent the generally opposite first and second sides of the board. The first cover and second cover can then be attached to each other, such that the first and second covers are respectively positioned along the board's generally opposite first and second sides. The attachment of the first and second covers can also retain the relative positioning of the first cover generally over the frame. Additionally, or alternatively, other means may be provided for attachment of the frame and the first cover. The attachment of the second cover to the first cover can be accomplished in various ways, such as by an interlocking engagement of one or more protuberances (e.g., catches, snaps, latches, tabs, detents, protuberances, protrusions, ribs, ridges, ramp-ups, darts, lances, dimples, half-dimples, combinations thereof, etc.) with one or more retaining openings (e.g., recesses, voids, cavities, slots, grooves, holes, depressions, combinations thereof, etc.). In some embodiments, the first cover includes tabs that extend from the first side through to the second side. The tabs have end portions with protrusions for interlocking engagement with corresponding openings of the second cover. The first and/or second cover can be made from sheet metal. Alternatively, other suitable materials can be used. In some embodiments, a plurality of interior EMI shielding compartments may be formed within the first interior defined by the frame, first cover, and at least a portion of the board's first side, and/or within a second interior defined by the second cover and at least a portion of the board's second side. One or more other components may also be disposed along (e.g., overmolded, molded to, attached, etc.) an interior portion of the first and/or second covers, such as resilient partitioning members or partitioning ribs, electrically-conductive elastomer, thermal interface materials (e.g., thermally-conductive compliant material, etc.), etc. In some embodiments, one or more resilient or flexible members (e.g., electrically-conductive elastomeric members or components, etc.) are disposed (e.g., overmolded onto, adhesively bonded, welded, etc.) on an inner surface of the first and/or second cover. The resilient or flexible members can establish contact and electrical conductivity with at least one electrically-conductive surface (e.g., grounding traces, etc.) on the corresponding first and/or second side of the board or substrate.
According to various aspects, exemplary embodiments are provided of assemblies operable for providing EMI shielding for electrical components on generally opposite first and second sides of a board. In one exemplary embodiment, the assembly generally includes a frame attachable to the board's first side, and first and second covers configured to be positioned on generally opposite sides of the board. The frame includes walls and at least one opening along an upper portion of the frame. The frame's walls are configured to be disposed generally about one or more electrical components on the board's first side. The first cover is configured to cover the at least one opening of the frame. The second cover is attachable to the first cover with the first and second covers respectively positioned along the board's generally opposite first and second sides. Accordingly, the assembly is operable for shielding one or more electrical components on the board's first side that are within a first interior defined by the frame's walls, first cover, and at least a portion of the board's first side, and one or more electrical components on the board's second side that are within a second interior defined by the second cover and at least a portion of the board's second side.
Another embodiment includes a low-profile assembly capable of providing board-level EMI shielding for electrical components on generally opposite first and second sides of a board. In this embodiment, the assembly generally includes a frame attachable to the board's first side. The frame includes walls and at least one opening along an upper portion of the frame. The frame's walls are configured to be disposed generally about one or more electrical components on the board's first side. The assembly also includes a first cover having a lid portion to cover the at least one opening of the frame. The first cover has wall portions downwardly depending relative to the lid portion. The wall portions have sufficient length for extending across a thickness defined between the board's first and second sides to thereby allow positioning of the end portions of the first cover's wall portions on a side of the board opposite that of the lid portion. The assembly further includes a second cover. At least one of the first and/or second covers includes one or more protrusions for interlocking engagement with corresponding openings of the other one of the first and/or second covers to thereby attach the second cover to the first cover. This interlocking engagement can also help retain the relative positioning of the first cover generally over the frame with the lid portion covering the at least one opening of the frame. Accordingly, the assembly is operable for shielding one or more electrical components on the board's first side that are within a first interior defined by the frame's walls, first cover, and at least a portion of the board's first side, and one or more electrical components on the board's second side that are within a second interior defined by the second cover and at least a portion of the board's second side.
Additional aspects relate to methods of using EMI shielding assemblies. One particular embodiment includes a method of providing EMI shielding for electrical components on generally opposite first and second sides of a board. The method generally includes positioning a first cover relative to a frame such that one or more electrical components on the board's first side are within a first interior defined by the frame, first cover, and at least a portion of the board's first side. The method also includes attaching a second cover to the first cover such that the first and second covers are respectively positioned along the board's generally opposite first and second sides, and such that one or more electrical components on the board's second side are within a second interior defined by the second cover and at least a portion of the board's second side.
Accordingly, some embodiments can provide shielding assemblies that are low profile and/or with a reduced height or reduce shielding envelope. Some embodiments can also provide dual-sided board component access and reduce part count, for example, by using only one frame in some embodiments.
The assembly 100 is capable of shielding electronic component(s) from EMI/RFI emitted from other electronic components, and/or inhibiting EMI/RFI emitted by the electronic component(s) from interfering with other components. The assembly 100 can be used with a wide range of electronic components and packages, such as integrated circuits mounted on a printed circuit board, etc.
With continued reference to
With further reference to
In various embodiments, the frame 160 can be integrally or monolithically formed as a single component. In one particular embodiment, the frame 160 can be formed by stamping a flat profile pattern in a piece of material for the frame 160. The stamped profile for the frame 160 can include the opening 168 and the notches or cutouts 166. After stamping the flat pattern profile for the frame 160 into the piece of material, the walls 164 may then be folded or bent generally perpendicular as shown in
A wide range of materials can be used for the frame 160, such as nickel-silver alloys, copper-nickel alloys, cold rolled steel, stainless steel, tin-plated cold rolled steel, tin-plated copper alloys, carbon steel, brass, copper, aluminum, copper-beryllium alloys, phosphor bronze, steel, combinations thereof, among other suitable electrically-conductive and/or non-magnetic materials. In one exemplary embodiment, a frame 160 is formed from a sheet of nickel silver alloy having a thickness of about 0.20 millimeter. The materials and dimensions provided herein are for purposes of illustration only, as the assembly and components thereof can be configured from different materials and/or with different dimensions depending, for example, on the particular application, such as the component to be shielded, space considerations within the overall apparatus, EMI shielding and heat dissipation needs, and other factors.
As shown in
The first cover 120 also includes tabs or wall portions 125 downwardly depending relative to the lid portion 121. As shown in
As shown in
The tab end portions 127 may also be bent or curved so as define camming surfaces 128. During installation of the assembly 100, contact between the camming surfaces 128 and frame 160 and/or board 180 can urge the tabs 125 generally outwardly. Accordingly, this camming feature can thus facilitate the positioning of the tab end portions 127 through the corresponding notches 185 of the board 180 and subsequent engagement of the first cover's protuberances 126 within the second cover's openings 142.
The first cover's tabs 125 include protuberances 126 configured to be retained by corresponding openings 142 of the second cover 140. In the particular embodiment shown in
With further reference to
Alternatively, the first cover 120 can include other suitable locking means besides the half-dimple protuberances, such as catches, snaps, latches, tabs, detents, protrusions, ribs, ridges, ramp-ups, darts, lances, dimples, half-dimples, combinations thereof, etc. In yet other alternative embodiments, the first cover 120 may comprise one or more retaining openings (e.g., recesses, voids, cavities, slots, grooves, holes, depressions, combinations thereof, etc.) configured to engagingly receive one or more protuberances (e.g., catches, snaps, latches, tabs, detents, protuberances, protrusions, ribs, ridges, ramp-ups, darts, lances, dimples, half-dimples, combinations thereof, etc.) of the second cover 140. In still other embodiments, the first cover 120 may include both retaining apertures and protuberances. Alternatively, other means can be employed for attaching the first cover to the second cover besides the interlocking engagement of protuberances within openings.
In various embodiments, the first cover 120 can be integrally or monolithically formed as a single component. In this particular embodiment, the first cover 120 can be formed by stamping in a piece of material a flat profile pattern for the first cover 120. The stamped profile for the first cover 120 includes the protuberances 126 (e.g., inwardly extending half-dimples and detents defined thereby, etc.), the wall portions 124, and tabs 125. After stamping the flat pattern profile for the first cover 120 into the piece of material, the wall portions 124 may then be folded or bent generally perpendicular as shown in
A wide range of materials can be used for the first cover 120, such as nickel-silver alloys, copper-nickel alloys, cold rolled steel, stainless steel, tin-plated cold rolled steel, tin-plated copper alloys, carbon steel, brass, copper, aluminum, copper-beryllium alloys, phosphor bronze, steel, combinations thereof, among other suitable electrically-conductive and/or non-magnetic materials. In one exemplary embodiment, the first cover 120 is formed from a sheet of nickel silver alloy having a thickness of about 0.13 millimeter. The materials and dimensions provided herein are for purposes of illustration only, as the assembly and components thereof can be configured from different materials and/or with different dimensions depending, for example, on the particular application, such as the component to be shielded, space considerations within the overall apparatus, EMI shielding and heat dissipation needs, and other factors.
As shown in
The first cover 120 and flexible rib members 130 and/or 132 cooperatively define or form partitioned EMI shielding areas, enclosures, or compartments. When the assembly 100 is installed, the flexible or elastomer rib members 130 and/or 132 may intervene between one or more areas on a circuit board to partition one or more areas from other areas. The elastomer rib members 130 and/or 132 can provide for an attenuation of transfer of electromagnetic (EMI) energy among each of the one or more partitioned areas.
In the particular illustrated embodiment, the rib members 130 and 132 are generally perpendicular to each other, such that there are three EMI shielding compartments 136,137, and 138. Accordingly, the ribs 130, 132 and first cover 120 can thus provide partitioned areas defined by the assembly 100 that provide EMI shielding of one or more electrical components located within each partitioned area. Alternative embodiments can include more or less rib members in other configurations (e.g., shapes, sizes, materials, orientation, etc.) for defining more or less EMI shielding compartments. In yet other embodiments, the first cover does not include any of such rib members.
As shown in
In some embodiments, the elastomer rib members 130 and/or 132 may comprise electrically-conductive material disposed on the exterior surface of the elastomer member. In such embodiments, the electrically-conductive elastomeric rib members 130 and/or 132 can be disposed or affixed on the inner surface 122 of the first cover's lid portion 121 by an adhesive (or other suitable attachment means) that bonds the electrically-conductive elastomeric member 130 and/or 132 to the first cover 120. The elastomer members 130 and/or 132 may be dispensed onto (e.g., via form-in-place dispensing equipment, hand-held dispenser or caulk gun, etc.), molded onto (e.g., overmolded, etc.) or attached (e.g., adhesively attached, etc.) to various portions of the first cover 120. By way of example only, various embodiments include electrically-conductive elastomer dispensed onto the first cover 120. Other embodiments include electrically-conductive elastomer over-molded onto the first cover 120 through an insert-molding process.
The electrically-conductive elastomeric rib members 130, 132 can be formed from various materials. In some preferred embodiments, the rib members 130, 132 are formed from elastomeric materials filled with electrically-conductive particles. Examples of preferred elastomeric materials include silicone, fluorosilicone, fluorocarbon, and Ethylene Propylene Diene Monomer [EPDM]. Thermoplastic elastomer can also be used as the elastomeric material. Examples of preferred electrically-conductive particles include silver coated glass particles, which can be used to make an elastomeric material electrically-conductive. In other embodiments, silver particles, silver coated copper particles, silver coated aluminum particles, silver plated nickel particles, nickel coated graphite particles, and graphite particles can also be used to make the elastomeric material electrically-conductive.
The electrically-conductive elastomer rib members 130 and 132 may be arranged in any number of configurations, and may be formed integrally or separately from each other. For example, the elastomer rib member 130 may comprise a separate rib portion that meets or converges at an intersection point with the elastomer rib portion 132.
In some embodiments, the elastomer rib members 130 and/or 132 can be thermally conductive (e.g., have a thermal conductivity coefficient greater than that of air alone, etc.) for creating a thermally-conducting heat path from the assembly 100 to the board 180. In such embodiments, the elastomer rib members 130 and/or 132 can be configured to contact at least one electrically-conductive surface on the first side 182 of the board 180 from which to conduct heat, such as a grounding trace or a board-mounted electrical component. With this contact, the elastomer rib members 130 and/or 132 can facilitate transferring and/or thermally conducting of heat from the at least one electrically-conductive surface to the first cover 120.
Some embodiments include a thermal interface material disposed on an interior portion of the first cover 120 and/or second cover 140 for forming a thermally-conducting heat path from one or more electrical components of the board to the assembly. This thermal interface material may comprise the elastomeric rib members 130 and/or 132 in some embodiments, or the thermal interface material may be in addition to, or as an alternative to, the elastomeric rib members 130 and/or 132 on other embodiments. In either case, a wide variety of materials can be used for a thermal interface, which are preferably better thermal conductors and have higher thermal conductivities than air alone. Accordingly, the thermal interface (with its compressive contact against the electrical component) can thus allow for improved heat transfer from the electrical component to the first cover 120 as compared to those designs relying solely upon air to define the heat path between the electrical component and the underside of the cover. Some preferred embodiments include a thermal interface formed from T-fleX™ 600 series thermal gap filler material commercially available from Laird Technologies, Inc. of Saint Louis, Missouri. In one particular preferred embodiment, a thermal interface comprises T-flex™ 620 thermal gap filer material, which generally includes reinforced boron nitride filled silicone elastomer. By way of further example, other embodiments include thermal interfaces molded from electrically-conductive elastomer. Additional exemplary embodiments include thermal interface materials formed from ceramic particles, ferrite EMI/RFI absorbing particles, metal or fiberglass meshes in a base of rubber, gel, grease or wax, etc. Other suitable thermal interface materials are set forth in the table below. Alternative embodiments, however, can provide an assembly that does not include any such thermal interfaces.
With reference to
The openings 142 are configured for engagingly receiving the first cover's protuberances 126, as shown in
In the particular embodiment shown in
In various embodiments, the second cover 140 can be integrally or monolithically formed as a single component. In this particular embodiment, the second cover 140 can be formed by stamping in a piece of material a flat profile pattern for the second cover 140. The stamped profile for the second cover 140 includes the openings 142 and wall portions 144. After stamping the flat pattern profile for the second cover 140 into the piece of material, the wall portions 144 may then be folded or bent generally perpendicular as shown in
A wide range of materials can be used for the second cover 140, such as nickel-silver alloys, copper-nickel alloys, cold rolled steel, stainless steel, tin-plated cold rolled steel, tin-plated copper alloys, carbon steel, brass, copper, aluminum, copper-beryllium alloys, phosphor bronze, steel, combinations thereof, among other suitable electrically-conductive and/or non-magnetic materials. In one exemplary embodiment, the second cover 140 is formed from a sheet of nickel silver alloy having a thickness of about 0.13 millimeter. The materials and dimensions provided herein are for purposes of illustration only, as the assembly and components thereof can be configured from different materials and/or with different dimensions depending, for example, on the particular application, such as the component to be shielded, space considerations within the overall apparatus, EMI shielding and heat dissipation needs, and other factors.
As shown in
The second cover 140 and flexible rib member 145 cooperatively define or form partitioned EMI shielding areas, enclosures, or compartments. When the assembly 100 is installed, the flexible or elastomer rib member 145 may intervene between one or more areas on a circuit board to partition one or more areas from other areas. The elastomer rib member 145 can provide for an attenuation of transfer of electromagnetic (EMI) energy between each of the one or more partitioned areas.
In the particular illustrated embodiment, the second cover 140 and rib member 145 cooperatively define two EMI shielding compartments 146 and 147.
Alternative embodiments can include more or less rib members in other configurations (e.g., shapes, sizes, materials, orientation, etc.) for defining more or less EMI shielding compartments. In yet other embodiments, the second cover does not include any of such rib members.
As shown in
In some embodiments, the elastomer member 145 may comprise electrically-conductive material disposed on the exterior surface of the elastomer member. In such embodiments, the at least one electrically-conductive elastomeric member 145 can be disposed or affixed on the inner surface 143 of the second cover 140 by an adhesive (or other suitable attachment means) that bonds the electrically-conductive elastomeric member 145 to the second cover 140. The elastomer member 145 may be dispensed onto (e.g., via form-in-place dispensing equipment, hand-held dispenser or caulk gun, etc.), molded onto (e.g., overmolded, etc.) or attached (e.g., adhesively attached, etc.) to various portions of the second cover 140. By way of example only, various embodiments include electrically-conductive elastomer dispensed onto the second cover 140. Other embodiments include electrically-conductive elastomer over-molded onto the second cover 140 through an insert-molding process.
The electrically-conductive elastomeric member 145 can be formed from various materials. In some preferred embodiments, the member 145 is formed from elastomeric materials filled with electrically-conductive particles. Examples of preferred elastomeric materials include silicone, fluorosilicone, fluorocarbon, and Ethylene Propylene Diene Monomer [EPDM]. Thermoplastic elastomer can also be used as the elastomeric material. Examples of preferred electrically-conductive particles include silver coated glass particles, which can be used to make an elastomeric material electrically-conductive. In other embodiments, silver particles, silver coated copper particles, silver coated aluminum particles, silver plated nickel particles, nickel coated graphite particles, and graphite particles can also be used to make the elastomeric material electrically-conductive.
In some embodiments, the elastomer rib member 145 may be thermally conductive (e.g., have a thermal conductivity coefficient greater than that of air alone, etc.) for creating a thermally-conducting heat path from the assembly 100 to the board 180. In such embodiments, the elastomer rib member 145 may be configured to contact at least one electrically-conductive surface on the second side 184 of the board 180 from which to conduct heat, such as a grounding trace or a board-mounted electrical component. With this contact, the elastomer rib member 145 may facilitate transferring and/or thermally conducting of heat from the at least one electrically-conductive surface to the second cover 140.
In those embodiments in which the elastomeric rib member 145 is thermally conductive, a wide variety of materials can be used for such a thermal interface, which are preferably better thermal conductors and have higher thermal conductivities than air alone. Accordingly, the thermal interface (with its compressive contact against the electrical component) can thus allow for improved heat transfer from the electrical component to the second cover 140 as compared to those designs relying solely upon air to define the heat path between the electrical component and the underside of the cover. Some preferred embodiments include a thermal interface formed from T-flex™ 600 series thermal gap filler material commercially available from Laird Technologies, Inc. of Saint Louis, Mo. In one particular preferred embodiment, a thermal interface comprises T-fleX™ 620 thermal gap filer material, which generally includes reinforced boron nitride filled silicone elastomer. By way of further example, other embodiments include thermal interfaces molded from electrically-conductive elastomer. Additional exemplary embodiments include thermal interface materials formed from ceramic particles, ferrite EMI/RFI absorbing particles, metal or fiberglass meshes in a base of rubber, gel, grease or wax, etc. Other suitable thermal interface materials are set forth in the table below. Alternative embodiments, however, can provide an assembly that does not include any such thermal interfaces.
An exemplary process for assembling or installing the shielding assembly 100 to the board 180 is now provided for purposes of illustration only. In this example, the frame 160 is surface mounted (e.g., soldered, etc.) to the first side 182 of the board 180. The first and second covers 120, 140 are respectively positioned on, alongside, or adjacent the generally opposite first and second sides 182, 184 of the board 180, such that the first cover 120 is positioned generally over the frame 160 with the first cover's lid portion 121 substantially covering the frame's opening or window 168, and such that the first cover's protuberances 126 are interlockingly engaged within the second cover's openings 142. This interlocking engagement can also help retain the relative positioning of the first cover 120 generally over the frame 160.
During this exemplary installation process, the curved or bent end portions 128 of the tab end portions 127 operate as camming surfaces. As the first cover 120 is being disposed generally over the frame 160, contact between the camming surfaces 128 and the frame 160 (e.g., frame's perimeter rim 162, wall portions 164, etc.) and/or board 180 can urge the tabs 125 generally outwardly. Accordingly, this camming feature can thus facilitate the positioning of the tab end portions 127 through the corresponding notches 185 of the board 180 and subsequent engagement of the first cover's protuberances 126 within the second cover's openings 142.
Also during this exemplary installation process, the first cover's protuberances 126 can also operate as camming surfaces. As the first cover 120 is being disposed generally over the frame 160, contact between the protuberances 126 (e.g., the lower rounded portions of the inwardly extending half-dimples in the illustrated embodiment, etc.) and the frame 160 (e.g., frame's perimeter rim 162, wall portions 164, etc.) and/or board 180 can urge the tabs 125 generally outwardly. Accordingly, this camming feature can thus facilitate the positioning of the tab end portions 127 through the corresponding notches 185 of the board 180 and subsequent engagement of the first cover's protuberances 126 within the second cover's openings 142.
Depending on the particular application, the first cover 120 may be positioned adjacent the board's first side 182 and generally over the frame 160 before positioning the second cover 140 adjacent the board's second side 184. Or, for example, the second cover 140 may be positioned adjacent the board's second side 184 before positioning the first cover 120 adjacent the board's first side 182 and/or generally over the frame 160. In yet further embodiments, the relative positioning of first and second covers 120 and 140 may occur substantially simultaneously. In some embodiments, the positioning of the frame 160, first cover 120, and/or second cover 140 can be accomplished using pick-and-place equipment (e.g., vacuum pick-and-place equipment, etc.). In such embodiments, the frame 160, first cover 120, and/or the second cover 140 can be configured to allow for handling by pick-and-place equipment (e.g., vacuum pick-and-place equipment, etc.).
Certain terminology is used herein for purposes of reference only, and thus is not intended to be limiting. For example, terms such as “upper”, “lower”, “above”, and “below” refer to directions in the drawings to which reference is made. Terms such as “front”, “back”, “rear”, “bottom” and “side”, describe the orientation of portions of the component within a consistent but arbitrary frame of reference which is made clear by reference to the text and the associated drawings describing the component under discussion. Such terminology may include the words specifically mentioned above, derivatives thereof, and words of similar import. Similarly, the terms “first”, “second” and other such numerical terms referring to structures do not imply a sequence or order unless clearly indicated by the context.
When introducing elements or features and the exemplary embodiments, the articles “a”, “an”, “the” and “said” are intended to mean that there are one or more of such elements or features. The terms “comprising”, “including” and “having” are intended to be inclusive and mean that there may be additional elements or features other than those specifically noted. It is further to be understood that the method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order or performance. It is also to be understood that additional or alternative steps may be employed.
The description of the disclosure is merely exemplary in nature and, thus, variations that do not depart from the gist of the disclosure are intended to be within the scope of the disclosure. Such variations are not to be regarded as a departure from the spirit and scope of the disclosure.
This application is a continuation-in-part of U.S. patent application Ser. No. 29/244,955 filed Dec. 16, 2005. This application is a continuation-in-part of U.S. patent application Ser. No. 29/244,956 filed Dec. 16, 2005. This application is a continuation-in-part of U.S. patent application Ser. No. 29/244,957 filed Dec. 16, 2005. The disclosures of the above applications are incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 29244955 | Dec 2005 | US |
| Child | 11514071 | Aug 2006 | US |
| Parent | 29244956 | Dec 2005 | US |
| Child | 11514071 | Aug 2006 | US |
| Parent | 29244957 | Dec 2005 | US |
| Child | 11514071 | Aug 2006 | US |
