1. Field of the invention
The present invention relates to an electrical connector for electrically connecting a Central Processing Unit (CPU) to a printed circuit board (PCB), especially to a low profile electrical connector.
2. Description of Related Art
Central Processing Unit (CPU) electrical connectors are widely used for establishing electrical connection between the CPU and a printed circuit board (PCB). Therefore, CPU connectors are mounted on motherboards and hold CPUs execution of programs. Sever types of CPU connectors are available with different structures. For example, a type of land grid array (LGA) socket is found in U.S. Pat. No. 7,074,048 issued to Liao et al. (hereinafter “Liao”) on Jul. 11, 2006. Liao discloses a LGA socket including an insulative housing having a plurality of passageways passing through a top surface to a bottom surface of the insulative housing. Each passageway accommodates a terminal which includes a base portion positioned in a vertical direction, an elastic arm extending upwardly from the base portion and a solder portion bent horizontally from a bottom of the base portion. The base portion has a plurality of barbs on two opposite sides thereof for engaging with sidewalls of the passageway to secure the contact in the passageway. A solder ball is soldered on a bottom surface of the solder portion for electrically connecting with the PCB.
The contact is received in the passageway by the barbs which causes the height of the contact must be increased so as to unfavorable to low profile of the electrical connector.
Hence, it is desirable to provide an improved electrical connector to overcome the aforementioned disadvantages.
Accordingly, an object of the present invention is to provide a lower profile electrical connector with a low contact.
According to one aspect of the present invention, there is provided an electrical connector for electrically connecting a central processing unit (CPU) to a printed circuit board (PCB), comprising a housing, a plurality of contacts, and a plurality of solder balls. The housing has a plurality of passageways extending passing through the housing and a plurality of protrusions located outside the passageways and corresponding the passageways one-to-one. A plurality of contacts partially are disposed in the passageways and each has a hole to match with the protrusion and secure the contacts on the housing. A plurality of solder balls are connected with corresponding contacts.
According to another aspect of the present invention, there is provided an electrical connector, comprising a housing with a plurality of passageways. A plurality of contacts are partially received in corresponding passageways. Each contact has a base portion fixed on the housing and not positioned in the passageway. A plurality of solder balls are connected with corresponding contacts and located just below the base portion.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of a preferred embodiment when taken in conjunction with the accompanying drawings.
Reference will now be made to the drawings to describe the present invention in detail.
Referring to
Referring to FIGS. 1,3,4 and 5, the housing 2 has a cavity 20 having a receiving/supporting surface 21. The receiving surface 21 of the cavity 20 has a plurality of protrusions 23 extending upwardly therefrom and a plurality of passageways 24 passing through the receiving surface 21 and a bottom surface 22 of housing 2. The protrusion 23 is use for alignment and retention the contact 3. Each passageway 24 is located at a side of the corresponding protrusion 23 to allow the tail portion 32 passing through thereof. A plurality of receiving recesses 25 are defined at the bottom surface 22 of the housing 2 and communicate with corresponding passageways 24 for receiving the solder balls 4. Each recess 25 defines a resisting surface 250 substantially just below the protrusion 23 to resist the solder ball 4 moving upwardly in a vertical direction, furthermore, the inclined portion 320 and edge of the recess 25 to clamp the solder ball 4 so as to prevent the solder ball 4 to fall of the recess 25. The receiving surface 21 of cavity 20 further has a plurality of posts 26 extending upwardly and higher than the protrusions 23 for supporting the CPU. The posts 26 flush with a top surface of the housing 2.
Referring to
In the present invention, the cavity 20 is defined for reducing the height of the connector and the contact. Clearly, the cavity 20 also could be eliminated such that the protrusions 23 and the posts 26 are disposed on the top surface of the housing 2.
Although the present invention has been described with reference to particular embodiments, it is not to be construed as being limited thereto. Various alterations and modifications can be made to the embodiments without in any way departing from the scope or spirit of the present invention as defined in the appended claims.
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Number | Date | Country | |
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20140030925 A1 | Jan 2014 | US |