1. Field of the Invention
The present disclosure relates to an electrical connector, and more particularly to a low profile, fine pitch electrical connector.
2. Description of Related Art
Land grid array (LGA) electrical connectors are widely used in personal computer (PC) systems to electrically connect LGA chips with printed circuit boards (PCBs). U.S. Pat. No. 6,905,357 issued to Ma on Jun. 14, 2005 discloses a typical LGA electrical connector. The electrical connector comprises an insulating housing, a plurality of contacts received in the housing with contacting portions for contacting the LGA chip and soldering portions for soldering on the PCB, a metallic frame surrounding the insulating housing, a load plate and a load lever attached to the metallic frame. When using, the electrical connector is assembled on a PCB with soldering portion of the contacts corresponding soldering on a plurality of pads of the PCB. The LGA chip is assembled into the insulating housing and contacts the contacting portions of the contacts so as to establish an electrical connection therebetween.
However, with miniaturization of the electrical connector, the size of the insulating housing becomes smaller and smaller and the arrangement density of the contacts becomes higher and higher. So, it is difficult to align the contacts with corresponding pads of the PCB correctly. Another aspect, as the insulating housing become smaller, the strength of the insulating housing may be not good enough to meet the requirement.
In view of the above, an improved electrical connector is desired to overcome the problems mentioned above.
Accordingly, an object of the present disclosure is to provide a low profile, fine pitch electrical connector.
According to one aspect of the present disclosure, an electrical connector for assembling on a printed circuit board (PCB) having an alignment feature is provided. The electrical connector comprises an insulating housing, a plurality of contacts received in the insulating housing and a stiffener insert molding with the insulating housing, the stiffener align with the alignment feature and assembled on the PCB.
Other objects, advantages and novel features of the disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
Reference will now be made to the drawings to describe a preferred embodiment of the present disclosure in detail.
Referring to
Referring to
The insulating housing 1 is insert molding with the stiffener 3 for increasing the strength of the insulating housing 1. The insulating housing 1 locates into the cavity 30. From a top view, the area of the insulating housing is smaller than that of the cavity 30, i.e. the insulating housing 1 locates on partial of the cavity 30. In this embodiment, the insulating housing 1 locates on a corner of the stiffener 3.
Referring to
Referring to
While preferred embodiment in accordance with the present disclosure has been shown and described, equivalent modifications and changes known to persons skilled in the art according to the spirit of the present disclosure are considered within the scope of the present disclosure as defined in the appended claims.
Number | Date | Country | Kind |
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102127342 | Jul 2013 | TW | national |
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M379877 | May 2010 | TW |
Number | Date | Country | |
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20150037985 A1 | Feb 2015 | US |