Claims
- 1. A low profile additive for molding compositions comprising discrete particles of less than about 50 microns diameter of a cross-linked styrene terpolymer characterized by a glass transition temperature of less than about 100.degree. Celsius and consisting essentially of the reaction product of about 20 to about 60 weight percent styrene, about 25 to about 75 weight percent of at least one monounsaturated acrylate or methacrylate comonomer which has a glass transition temperature of below about 0.degree. Celsius when hemopolymerized and which is selected from the group consisting of ethyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, s-butyl acrylate, 2-ethyl hexyl acrylate, n-hexyl methacrylate, n-octyl methacrylate, isodecyl methacrylate, tridecyl methacrylate, and mixtures thereof, and about 2 to about 25 weight percent of at least one polyunsaturated monomer.
- 2. A low profile additive according to claim 1 characterized by a glass transition temperature of less than about 50.degree. Celsius.
- 3. A low profile additive according to claim 2 wherein the polyunsaturated monomer is a diunsaturated monomer.
- 4. A low profile additive according to claim 3 wherein said diunsaturated monomer is divinyl benzene.
- 5. A low profile additive according to claim 4 comprising a terpolymer of styrene, n-butyl acrylate and divinyl benzene.
- 6. A low profile additive according to claim 5 comprising a terpolymer reaction product of about 30 to about 50 weight percent styrene, about 30 to about 60 weight percent of n-butyl acrylate and about 10 to about 20 weight percent of divinyl benzene.
- 7. A low profile additive according to claim 1 having admixed therewith a pigment.
Parent Case Info
This is a division of application Ser. No. 838,793, filed Oct. 10, 1977, now abandoned, and a continuation of Ser. No. 636,876, filed Dec. 2, 1975, now abandoned.
US Referenced Citations (7)
Divisions (1)
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Number |
Date |
Country |
Parent |
838793 |
Oct 1977 |
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