The present invention relates to suspensions for disk drives. In particular, the invention is a dual stage actuation (DSA) suspension and method of manufacture.
Dual stage actuation (DSA) disk drive head suspensions are generally known and commercially available. By way of example, one embodiment of a DSA head suspension 10 is shown in
The second stage actuation functionality of the illustrated DSA suspension 10 is incorporated into the baseplate 12. As shown, the baseplate 12 has one or more motor-receiving areas or openings 24 (two in the illustrated embodiment). Piezoelectric (PZT) motors 26 are mounted to the baseplate 12 in the motor-receiving openings 24. The motors 26 are mounted to tabs 28 extending from the baseplate 12 into the motor-receiving openings 24. In the illustrated suspension 10 the tabs 28 are portions of the hinge 14. In other embodiments (not shown) the tabs 28 to which the PZT motors 26 are mounted can be other components such as a separate motor plate welded to the baseplate. Epoxy or other adhesive is typically used to mount the motors 26 to the tabs 28.
DSA suspensions can be embodied in still other forms. For example, an alternative DSA suspension structure is illustrated and described in the Okawara U.S. Patent Publication No. 2010/0067151 which is incorporated herein by reference in its entirety and for all purposes. Briefly, the suspension shown in the Okawara publication has an actuator plate to which the motors are mounted. The actuator plate is mounted between the baseplate and hinge. In still other DSA suspensions (not shown), the motors can be mounted to the load beam or hinge.
An electrical connection or conductive joint between an electrical ground contact on a face of the motor and the ground plane of the suspension is typically made by conductive adhesive (e.g., epoxy with silver and/or nickel particles). The ground contacts on the motors typically have an external plated gold (Au) layer. These connections are typically formed by applying a mass of the conductive adhesive at a location where the ground contact of the motor is adjacent to a stainless steel portion of the baseplate, load beam, hinge or flexure. The conductive adhesive contacts both the motor ground contact and the stainless steel portion of the suspension, thereby providing an electrical connection or ground joint from the motor to the stainless steel portions of the suspension that function as the ground plane.
The conductive joint between the motor and the ground plane should be capable of functioning at or below a threshold level of acceptable resistance under all applied processing and operational load conditions. However, consistently maintaining acceptable resistance to ground levels has been difficult. In particular, the resistance of the conductive adhesive-to-stainless steel component joints have been determined to be relatively high and unstable.
A dual stage actuation (DSA) suspension in accordance with the invention has a stable, low resistance conductive adhesive electrical connection between an electrical contact on a motor and a plated contact area on a stainless steel component of the suspension. The contact area on the suspension component is plated with conductive and generally non-corrosive metal or metal alloy such as gold or nickel gold. In one embodiment, the stainless steel component includes a stainless steel layer of a flexure and the suspension includes a baseplate having a through hole. The conductive adhesive connection extends from the motor, across a portion of the baseplate, into the though hole of the baseplate and into contact with the plated contact area on the stainless steel layer of the flexure.
The invention is a dual stage actuation (DSA) suspension having a stable, low resistance conductive adhesive electrical connection or joint between an electrical contact on a motor of the suspension and a plated metal contact area on a stainless steel component of the suspension. One embodiment of the invention includes a ground joint between the electrical contact of a piezoelectric (PZT) motor and a gold or nickel gold plated contact area on the stainless steel suspension component. The gold or nickel gold or other conductive and generally non-corrosive metal or alloy plated area on the stainless steel suspension component is referred to generally in the description of the invention below as the plated region. In still other embodiments a layer of nickel is plated on the stainless steel, and a gold layer is plated on the nickel layer.
As described below in connection with the attached drawing figures, the invention can be embodied in a number of different structures. For example, the invention can be embodied in DSA suspensions such as that described above in connection with
The invention provides a reliable, stable and low resistance joint between the conductive adhesive and the plated stainless steel contact area. The desired resistance level can vary with the application of the suspension (e.g., with the drive circuitry that the motor is to be connected). One example specification calls for ground contact resistance levels no greater than 2500 ohms. Another specification calls for resistance levels no greater than 100 ohms. Still other embodiments of the invention have a resistance no greater than 10 ohms and even less than 1 ohm over the life of the suspension.
Although the invention is described with reference to a number of different embodiments, those skilled in the art will recognize that changes can be made in form and detail without departing from the spirit and scope of the invention.
This application claims the benefit under 35 U.S.C. 119 of Provisional Application No. 61/396,239, filed May 24, 2010, which is incorporated herein by reference in its entirety for all purposes.
Number | Name | Date | Kind |
---|---|---|---|
4422906 | Kobayashi | Dec 1983 | A |
4659438 | Kuhn et al. | Apr 1987 | A |
5320272 | Melton et al. | Jun 1994 | A |
5521778 | Boutaghou et al. | May 1996 | A |
5608591 | Klaassen | Mar 1997 | A |
5657186 | Kudo et al. | Aug 1997 | A |
5694270 | Sone et al. | Dec 1997 | A |
5754368 | Shiraishi et al. | May 1998 | A |
5773889 | Love et al. | Jun 1998 | A |
5796552 | Akin, Jr. et al. | Aug 1998 | A |
5812344 | Balakrishnan | Sep 1998 | A |
5818662 | Shum | Oct 1998 | A |
5898544 | Krinke et al. | Apr 1999 | A |
5914834 | Gustafson | Jun 1999 | A |
6046887 | Uozumi et al. | Apr 2000 | A |
6156982 | Dawson | Dec 2000 | A |
6215622 | Ruiz et al. | Apr 2001 | B1 |
6229673 | Shinohara et al. | May 2001 | B1 |
6249404 | Doundakov et al. | Jun 2001 | B1 |
6278587 | Mei | Aug 2001 | B1 |
6307715 | Berding et al. | Oct 2001 | B1 |
6330132 | Honda | Dec 2001 | B1 |
6349017 | Schott | Feb 2002 | B1 |
6459549 | Tsuchiya et al. | Oct 2002 | B1 |
6490228 | Killam | Dec 2002 | B2 |
6539609 | Palmer et al. | Apr 2003 | B2 |
6600631 | Berding et al. | Jul 2003 | B1 |
6647621 | Roen et al. | Nov 2003 | B1 |
6661617 | Hipwell, Jr. et al. | Dec 2003 | B1 |
6735052 | Dunn et al. | May 2004 | B2 |
6831539 | Hipwell, Jr. et al. | Dec 2004 | B1 |
6833978 | Shum et al. | Dec 2004 | B2 |
6856075 | Houk et al. | Feb 2005 | B1 |
6950288 | Yao et al. | Sep 2005 | B2 |
7064928 | Fu et al. | Jun 2006 | B2 |
7177119 | Bennin et al. | Feb 2007 | B1 |
7218481 | Bennin et al. | May 2007 | B1 |
7307817 | Mei | Dec 2007 | B1 |
7322241 | Kai | Jan 2008 | B2 |
7382582 | Cuevas | Jun 2008 | B1 |
7385788 | Kubota et al. | Jun 2008 | B2 |
7391594 | Fu et al. | Jun 2008 | B2 |
7403357 | Williams | Jul 2008 | B1 |
7417830 | Kulangara | Aug 2008 | B1 |
7459835 | Mei et al. | Dec 2008 | B1 |
7509859 | Kai | Mar 2009 | B2 |
7625654 | Vyas et al. | Dec 2009 | B2 |
7629539 | Ishii et al. | Dec 2009 | B2 |
7649254 | Graydon et al. | Jan 2010 | B2 |
7832082 | Hentges et al. | Nov 2010 | B1 |
7872344 | Fjelstad et al. | Jan 2011 | B2 |
7914926 | Kimura et al. | Mar 2011 | B2 |
7929252 | Hentges et al. | Apr 2011 | B1 |
8149542 | Ando | Apr 2012 | B2 |
8174797 | Iriuchijima | May 2012 | B2 |
8199441 | Nojima | Jun 2012 | B2 |
8228642 | Hahn et al. | Jul 2012 | B1 |
8248731 | Fuchino | Aug 2012 | B2 |
8248734 | Fuchino | Aug 2012 | B2 |
8248735 | Fujimoto et al. | Aug 2012 | B2 |
8248736 | Hanya et al. | Aug 2012 | B2 |
8339748 | Shum et al. | Dec 2012 | B2 |
8553364 | Schreiber et al. | Oct 2013 | B1 |
20020075606 | Nishida et al. | Jun 2002 | A1 |
20020118492 | Watanabe et al. | Aug 2002 | A1 |
20030089520 | Ooyabu et al. | May 2003 | A1 |
20030135985 | Yao et al. | Jul 2003 | A1 |
20040181932 | Yao et al. | Sep 2004 | A1 |
20040221447 | Ishii et al. | Nov 2004 | A1 |
20060274452 | Arya | Dec 2006 | A1 |
20070227769 | Brodsky et al. | Oct 2007 | A1 |
20080247131 | Hitomi et al. | Oct 2008 | A1 |
20090135523 | Nishiyama et al. | May 2009 | A1 |
20090176120 | Wang | Jul 2009 | A1 |
20090190263 | Miura et al. | Jul 2009 | A1 |
20090294740 | Kurtz et al. | Dec 2009 | A1 |
20100067151 | Okawara et al. | Mar 2010 | A1 |
20100073825 | Okawara | Mar 2010 | A1 |
20100097726 | Greminger et al. | Apr 2010 | A1 |
20100143743 | Yamasaki et al. | Jun 2010 | A1 |
20100177445 | Fuchino | Jul 2010 | A1 |
20100195252 | Kashima | Aug 2010 | A1 |
20100220414 | Klarqvist et al. | Sep 2010 | A1 |
20100246071 | Nojima et al. | Sep 2010 | A1 |
20100271735 | Schreiber | Oct 2010 | A1 |
20110013319 | Soga et al. | Jan 2011 | A1 |
20110228425 | Liu et al. | Sep 2011 | A1 |
20110242708 | Fuchino | Oct 2011 | A1 |
20110279929 | Kin | Nov 2011 | A1 |
20120002329 | Shum et al. | Jan 2012 | A1 |
20120113547 | Sugimoto | May 2012 | A1 |
Number | Date | Country |
---|---|---|
2001057039 | Feb 2001 | JP |
2001307442 | Nov 2001 | JP |
2002050140 | Feb 2002 | JP |
2004300489 | Oct 2004 | JP |
2007115864 | May 2007 | JP |
Entry |
---|
Cheng et al, “Vapor deposited thin gold coatings for high termperature electrical contacts”, Proc. 42nd IEEE Holm Conf. of Electrical Contacts (1996) p. 404-413. |
Cheng, Yang-Tse, “Vapor deposited thin gold coatings for high temperature electrical contacts”, Electrical Contacts, 1996, Joint with the 18th International Conference on Electrical Contacts, Proceedings of the Forty-Second IEEE Holm Conference, Sep. 16-20, 1996 (abstract only). |
Fu, Yao, “Design of a Hybrid Magnetic and Piezoelectric Polymer Microactuator”, a thesis submitted to Industrial Research Institute Swinburne (IRIS), Swinburne University of Technology, Hawthorn, Victoria , Australia, Dec. 2005. |
Harris, N. R. et al., “A Multilayer Thick-film PZT Actuator for MEMs Applications”, Sensors and Actuators A: Physical, vol. 132, No. 1, Nov. 8, 2006, pp. 311-316. |
Jing, Yang, “Fabrication of piezoelectric ceramic micro-actuator and its reliability for hard disk drives”, Ultrasonics, Ferroelectrics and Frequency Control, IEEE, vol. 51, No. 11, Nov. 2004, pp. 1470-1476 (abstract only). |
Kon, Stanley et al., “Piezoresistive and Piezoelectric MEMS Strain Sensors for Vibration Detection”, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2007, Proc. Of SPIE vol. 6529. |
Li, Longqiu et al., “An experimental study of the dimple-gimbal interface in a hard disk drive”, Microsyst Technol (2011) 17:863-868. |
Pichonat, Tristan et al., “Recent developments in MEMS-based miniature fuel cells”, Microsyst Technol (2007) 13:1671-1678. |
Raeymaekers, B. et al., “Investigation of fretting wear at the dimple/gimbal interface in a hard disk drive suspension”, Wear, vol. 268, Issues 11-12, May 12, 2010, pp. 1347-1353. |
Raeymaekers, Bart et al., “Fretting Wear Between a Hollow Sphere and Flat Surface”, Proceedings of the STLE/ASME International Joint Tribology Conference, Oct. 19-21, 2009, Memphis, TN USA, 4 pages. |
Rajagopal, Indira et al., “Gold Plating of Critical Components for Space Applications: Challenges and Solutions”, Gold Bull., 1992, 25(2), pp. 55-66. |
Yoon, Wonseok et al., “Evaluation of coated metallic bipolar plates for polymer electrolyte membrane fuel cells”, The Journal of Power Sources, vol. 179, No. 1, Apr. 15, 2008, pp. 265-273 (abstract only). |
Number | Date | Country | |
---|---|---|---|
61396239 | May 2010 | US |