Low-resistance resistor and its manufacturing method

Information

  • Patent Grant
  • 6816056
  • Patent Number
    6,816,056
  • Date Filed
    Monday, April 21, 2003
    21 years ago
  • Date Issued
    Tuesday, November 9, 2004
    19 years ago
Abstract
The present invention relates to the resistors used for detecting current in a current-carrying circuit as a voltage, and aims to provides a resistor which assures highly accurate measurement of resistance even if the measuring point is not precisely placed. To obtain the above purpose, the resistor of the present invention comprises a sheet metal resistor element (11) and separate metal terminals (12),(13) electrically connected to both ends of the sheet resistor element(11). These terminals (12),(13) are made of metal having the same or greater electrical conductivity than that of the resistor element (11). With the above configuration, resistance of the terminals can be made smaller than that of the resistor element. This enables to reduce the proportion of resistance of the terminals in the entire resistor, allowing to ignore its effect on fluctuation of resistance due to deviation in measuring points of a resistance measuring terminal.
Description




FIELD OF THE INVENTION




The present invention relates to the field of low-resistance resistors (hereafter referred to as “resistors”) used for detecting current in a current-carrying circuit as a voltage, and their manufacturing method.




BACKGROUND OF THE INVENTION




The conventional resistor of this type is disclosed in Japanese Laid-open Patent Publication No. H6-20802.




A conventional resistor is described below with reference to drawings.




FIG.


29


(


a


) is a perspective, and FIG.


29


(


b


) is a sectional view of the conventional resistor.




In FIGS.


29


(


a


) and (


b


), a resistor element


1


is a rectangular parallelepiped resistance metal made of an alloy of nickel, chromium, aluminum, and copper, and it has an integrated structure with opposing ends


2


and


3


. A conductive material such as solder is coated on both ends


2


and


3


of the resistor element


1


, typically by plating, to form terminals


4


and


5


. A central portion


6


is the central area of the resistor element


1


, excluding the terminals


4


and


5


, and this central portion


6


is bent against the terminals


4


and


5


in order to create a gap between the resistor and a substrate when the resistor is mounted on the substrate. An insulating material


7


is provided on the central portion


6


of the resistor element


1


.




A method for manufacturing the conventional resistor configured as above is described below.




FIGS.


30


(


a


) to


30


(


e


) are process charts illustrating the manufacturing method of the conventional resistor. In FIG.


30


(


a


), the rectangular parallelepiped resistor element


1


having an integrated structure made of an alloy of nickel, chromium, aluminum, and copper with a predetermined resistance is formed.




In FIG.


30


(


b


), a conductive material


8


is plated on the entire face of the resistor element


1


(not illustrated).




In FIG.


30


(


c


), the conductive material


8


coated on the central portion


6


of the resistor element


1


is scraped off with a wire brush so as to expose the resistor element


1


at the central portion


6


.




In FIG.


30


(


d


), the terminals


4


and


5


disposed at the sides of the resistor element


1


are bent downward against the central portion


6


of the resistor element


1


.




Lastly, in FIG.


30


(


e


), the central portion


6


of the resistor element


1


is covered with an insulating material


7


by molding to complete the conventional resistor.




The above conventional resistor achieves the integrated structure of the resistor element


1


and terminals


4


and


5


by bending the resistance metal, and the resistor element


1


is made of an alloy of nickel, chromium, aluminum, and copper. The terminals


4


and


5


are configured by plating a conductive material such as solder on the surface of both ends


2


and


3


.




The electrical conductivity of the alloy of nickel, chromium, aluminum, and copper configuring the resistor element


1


has lower electrical conductivity than metals generally having good conductivity such as copper, silver, gold, and aluminum. Since the base material of the terminals


4


and


5


is made of the same alloy as that of the resistor element


1


, the base material configuring the terminals


4


and


5


has a larger resistance in proportion to its smaller electrical conductivity compared to metals generally having good conductivity. Accordingly, both ends


2


and


3


of the resistor element


1


are coated, such as by plating, with a conductive material such as solder in order to reduce resistance.




In the case of resistors having large resistance in the conventional configuration, resistance at the terminals


4


and


5


is reduced by coating a conductive material such as solder on the surface of both ends


2


and


3


of the resistor element


1


, and thus the difference in resistance between the resistor element


1


and terminals


4


and


5


becomes extremely large. Consequently, the composite resistance of the resistor element


1


and terminals


4


and


5


, which is the overall resistance of the resistor, may be represented by only the resistance of resistor element


1


, allowing to ignore the resistance at the terminals


4


and


5


.




However, in the case of resistors with a resistance of 0.1 ohms or below, the resistance of the terminals


4


and


5


in the entire resistor cannot be ignored. For accurate measurement of the resistance of a resistor with a high resistance, the four-probe method is generally used. However, for measuring the resistance of a resistor with a resistance of 0.1 ohms or below, the resistance varies according to the position of the probe contacting the terminals


4


and


5


, even the four-probe method is used, because the resistance of the terminals


4


and


5


affect the resistance of the entire resistor with increasing resistance of the terminals


4


and


5


. In this case, fluctuation in resistance due to deviation in the measuring point on the terminals


4


and


5


increases as the proportion of the resistance of the terminals


4


and


5


in the entire resistor increases. Accordingly, it is necessary to specify the measuring point for reproducing measurements with high accuracy in the conventional configuration. However, assuring the reproducibility of the same measuring point is extremely difficult even when the measuring point is specified, thus decreasing the reproducibility of the resistance measurements.




SUMMARY OF THE INVENTION




The present invention aims to address the above disadvantage of the prior art, and provides a resistor which assures highly accurate measurement of resistance even if the measuring point is not precisely placed.




To solve the aforementioned disadvantage of the conventional resistor, the resistor of the present invention comprises a sheet metal resistor element and separate metal terminals electrically connected to both ends of the sheet resistor element. These terminals are made of metal having the same or greater electrical conductivity than that of the resistor element. The terminals and the resistor element are connected through a third metal.




With the above configuration, resistance of the terminals can be made smaller than that of the resistor element because the terminals are made of a material having the same or greater electrical conductivity than that of the resistor element. This enables to reduce the proportion of resistance of the terminals in the entire resistor, allowing to ignore its effect on fluctuation of resistance due to deviation in measuring points of a resistance measuring terminal. The present invention can thus assure reproducibility of highly accurate measurement of resistance, providing the resistor which assures highly accurate measurement of resistance even if the measuring point is not precisely placed.











BRIEF DESCRIPTION OF THE DRAWINGS




FIG.


1


(


a


) is a sectional view of a resistor in accordance with a first exemplary embodiment of the present invention.




FIG.


1


(


b


) is a plan view of the resistor in accordance with the first exemplary embodiment of the present invention.




FIG.


1


(


c


) is a side view of a terminal, a key part, of the resistor in accordance with the first exemplary embodiment of the present invention seen from an open side.




FIGS.


2


(


a


) to


2


(


d


) are process charts illustrating a method for manufacturing the resistor in accordance with the first exemplary embodiment of the present invention.





FIG. 3

is a sectional view of another example of the resistor in accordance with the first exemplary embodiment of the present invention.




FIG.


4


(


a


) is a sectional view of a resistor in accordance with a second exemplary embodiment of the present invention.




FIG.


4


(


b


) is a plan view of the resistor in accordance with the second exemplary embodiment of the present invention.





FIG. 5

is a sectional view of a resistor in accordance with a third exemplary embodiment of the present invention.





FIG. 6

is a side view of a terminal, a key part, of a resistor in accordance with a fourth exemplary embodiment of the present invention seen from an open side.




FIG.


7


(


a


) is a sectional view of a resistor in accordance with a fifth exemplary embodiment of the present invention.




FIG.


7


(


b


) is a plan view of the resistor in accordance with the fifth exemplary embodiment of the present invention.




FIGS.


8


(


a


) to


8


(


d


) are process charts illustrating a method for manufacturing the resistor in accordance with the fifth exemplary embodiment of the present invention.




FIG.


9


(


a


) is a sectional view of a resistor in accordance with a sixth exemplary embodiment of the present invention.




FIG.


9


(


b


) is a plan view of the resistor in accordance with the sixth exemplary embodiment of the present invention.




FIG.


10


(


a


) is a sectional view of a resistor in accordance with a seventh exemplary embodiment of the present invention.




FIG.


10


(


b


) is a plan view of the resistor in accordance with the seventh exemplary embodiment of the present invention.




FIG.


11


(


a


) is a sectional view of a resistor in accordance with an eighth exemplary embodiment of the present invention.




FIG.


11


(


b


) is a plan view of the resistor in accordance with the eighth exemplary embodiment of the present invention.




FIG.


11


(


c


) is a side view of a terminal, a key part, of the resistor in accordance with the eighth exemplary embodiment of the present invention seen from an open side.





FIG. 12

is a side view of another example of a terminal of the resistor in accordance with the eighth exemplary embodiment of the present invention seen from an open side.




FIG.


13


(


a


) is a sectional view of a resistor in accordance with a ninth exemplary embodiment of the present invention.




FIG.


13


(


b


) is a plan view of the resistor in accordance with the ninth exemplary embodiment of the present invention.




FIG.


14


(


a


) is a sectional view of a resistor in accordance with a tenth exemplary embodiment of the present invention.




FIG.


14


(


b


) is a plan view of the resistor in accordance with the tenth exemplary embodiment of the present invention.




FIG.


14


(


c


) is a sectional view of a terminal cut widthwise of the resistor in accordance with the tenth exemplary embodiment of the present invention.




FIG.


15


(


a


) is a sectional view of a resistor in accordance with an eleventh exemplary embodiment of the present invention.,




FIG.


15


(


b


) is a plan view of the resistor in accordance with the eleventh exemplary embodiment of the present invention.





FIG. 16

is a sectional view of a resistor in accordance with a twelfth is exemplary embodiment of the present invention.





FIG. 17

is a sectional view of a resistor in accordance with a thirteenth exemplary embodiment of the present invention.





FIG. 18

is a sectional view of a resistor in accordance with a fourteenth exemplary embodiment of the present invention.




FIGS.


19


(


a


) to


19


(


c


) are process charts illustrating a method for manufacturing the resistor in accordance with the fourteenth exemplary embodiment of the present invention.




FIG.


20


(


a


) is a sectional view of a resistor in accordance with a fifteenth exemplary embodiment of the present invention.




FIG.


20


(


b


) is a plan view of a surface of the resistor in accordance with the fifteenth exemplary embodiment of the present invention.




FIG.


20


(


c


) is a plan view of a rear face of the resistor in accordance with the fifteenth exemplary embodiment of the present invention.




FIG.


21


(


a


) is a sectional view of a resistor in accordance with a sixteenth exemplary embodiment of the present invention.




FIG.


21


(


b


) is a plan view of the resistor in accordance with the sixteenth exemplary embodiment of the present invention.





FIG. 22

is a sectional view of another example of the resistor in accordance with the sixteenth exemplary embodiment of the present invention.





FIG. 23

is a sectional view of a resistor in accordance with a seventeenth exemplary embodiment of the present invention.




FIG.


24


(


a


) is a sectional view of a resistor in accordance with an eighteenth exemplary embodiment of the present invention.




FIG.


24


(


b


) is a plan view of the resistor in accordance with the eighteenth exemplary embodiment of the present invention.




FIGS.


25


(


a


) to


25


(


e


) are process charts illustrating a method for manufacturing the resistor in accordance with the eighteenth exemplary embodiment of the present invention.




FIG.


26


(


a


) is a sectional view of a resistor in accordance with a nineteenth exemplary embodiment of the present invention.




FIG.


26


(


b


) is a plan view of the resistor in accordance with the nineteenth exemplary embodiment of the present invention.




FIG.


26


(


c


) is a sectional view taken along Line A—A in FIG.


26


(


b


).




FIGS.


27


(


a


) to


27


(


e


) are process charts illustrating a method for manufacturing the resistor in accordance with the nineteenth exemplary embodiment of the present invention.




FIG.


28


(


a


) is a sectional view of a resistor in accordance with a twentieth exemplary embodiment of the present invention.




FIG.


28


(


b


) is a plan view of the resistor in accordance with the twentieth exemplary embodiment of the present invention.




FIG.


28


(


c


) is a sectional view taken long Line B—B in FIG.


28


(


b


).




FIG.


29


(


a


) is a perspective of a conventional resistor.




FIG.


29


(


b


) is a sectional view of the conventional resistor.




FIGS.


30


(


a


) to


30


(


e


) are process charts illustrating a method for manufacturing the conventional resistor.











DESCRIPTION OF THE PREFERRED EMBODIMENTS




First Exemplary Embodiment




A resistor in a first exemplary embodiment is described below with reference to drawings.




FIG.


1


(


a


) is a sectional view of the resistor in the first exemplary embodiment of the present invention. FIG.


1


(


b


) is a plan view of the resistor, and FIG. I(


c


) is a side view of a terminal, a key part of the resistor, seen from the open side.




In FIGS.


1


(


a


) to


1


(


c


), a resistor element


11


is made such as of a sheet of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy. First and second terminals


12


and


13


have a concave groove


14


of a width k which is equivalent to a thickness T of the resistor element


11


, and are provided and electrically connected to both ends o f the resistor element


11


. The thickness t of these first and second terminals


12


and


13


is thicker than the thickness T of the resistor element


11


; their width m is equivalent to or wider than the width W of the resistor element


11


; and their length w is shorter than the length L of the resistor element


11


. The first and second terminals


12


and


13


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


11


.




A manufacturing method of the resistor in the first exemplary embodiment of the present invention as configured above is described next with reference to drawings.




FIGS.


2


(


a


) to


2


(


d


) are process charts illustrating the manufacturing method of the resistor in the first exemplary embodiment of the present invention.




In FIG.


2


(


a


), a metal sheet or metal strip such as of copper, silver, gold, aluminum, copper nickel, and copper zinc having electrical conductivity equivalent to or greater than the resistor element


11


(not illustrated) is formed into the first and second terminals


12


and


13


having the concave groove


14


, using a range of processes including cutting, casting, forging, pressing, and drawing. The first and second terminals are formed in a way to achieve the next dimensions: Width k of the concave groove


14


equivalent to the thickness T of the resistor element


11


, thickness t thicker than the thickness T of the resistor element


11


, width m equivalent to or wider than the width W of the resistor element


11


, and the length w shorter than the length L of the resistor element


11


.




In FIG.


2


(


b


), a metal sheet or metal strip such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into the resistor element


11


having a predetermined sheet shape and predetermined resistance, calculated from the volume resisitivity, section area, and length, through a range of processes including cutting, punching, and pressing.




In FIG.


2


(


c


), after fitting both ends of the resistor element


11


into the groove


14


of the first and second terminals


12


and


13


, the first and second terminals


12


and


13


are heat pressed in the vertical direction (in the direction of holding the resistor element


11


).




In FIG.


2


(


d


), a protective film


16


made of a film such as of epoxy resin, polyimide resin, or poly-carbodiimide resin is cut into a predetermined shape by means of punching and pressing, and is placed on the top and bottom of the resistor element


11


(not illustrated). The protective film


16


is formed on the top, bottom, and side faces of the resistor element


11


by thermal compression bonding or ultrasonic welding to complete the resistor in the first exemplary embodiment of the present invention.




The direction of inserting both ends of the resistor element


11


into the groove


14


of the first and second terminals


12


and


13


may be from the open side of the first and second terminals


12


and


13


or from the side face of the first and second terminals


12


and


13


.




For adjusting the resistance of the resistor in the first exemplary embodiment of the present invention, a through groove may be created on the resistor element


11


or a part of the surface and/or side face of the resistor element


11


may be cut by laser, punching, diamond wheel cutting, grinding, etching, or the like while measuring the resistance between predetermined points or calculating the required processing after measuring the resistance. The resistance may also be adjusted or corrected at the time of forming the resistor element


11


.




If a material with a lower electrical conductivity than the resistor element


11


is used for the first and second terminals


12


and


13


in the resistor as manufactured above, deviations in the resistance due to variations in the position of measuring point are magnified, making it inappropriate for practical use. Accordingly, the first and second terminals


12


and


13


are made of a material having electrical conductivity equivalent to of greater than that of the resistor element


11


.




Deviations in resistance due to the position of measuring point may also be reduced by making the thickness t of the first and second terminals


12


and


13


greater than the thickness T of the resistor element


11


. In particular, the thickness t of the first and second terminals


12


and


13


may be required to be three times or more greater than the thickness T of the resistor element


11


to achieve allowable dispersion in resistance fully satisfying in-house specification.





FIG. 3

shows another example of a resistor in the first exemplary embodiment of the present invention.




In

FIG. 3

, a third conductive metal layer


15


is provided between the resistor element


11


and the first terminal


12


and between the resistor element


11


and the second terminal


13


to provide an electrical connection between the resistor element


11


and the first terminal


12


, and between the resistor element


11


and the second terminal


13


. For bonding the resistor element


11


and the first and second terminals


12


and


13


, a range of methods may be used: (1) brazing after inserting a third conductive metal such as copper, silver, gold, tin, and solder between the resistor element


11


and the first and second terminals


12


and


13


; (2) plating the resistor element


11


and first and second terminals


12


and


13


, and thermal compression bonding after fitting the resistor element


11


into the first and second terminals


12


and


13


; and (3) applying conductive paste to the resistor element


11


and the first and second terminals, and then thermosetting after fitting the resistor element


11


into the first and second terminals


12


and


13


.




Second Exemplary Embodiment




A resistor in a second exemplary embodiment of the present invention is described below with reference to drawings.




FIG.


4


(


a


) is a sectional view, and FIG.


4


(


b


) is a plan view of the resistor in the second exemplary embodiment of the present invention.




In FIGS.


4


(


a


) and


4


(


b


), a resistor element


17


, made typically of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy, is corrugated in the thickness direction. First and second terminals


18


and


19


have a concave groove


20


of the width k which is equivalent to the thickness T of the resistor element


17


, and are provided and electrically connected to both ends of the resistor element


17


. The thickness t of these first and second terminals


18


and


19


is thicker than the total thickness V of the resistor element


17


; their width m is equivalent to or wider than the width W of the resistor element


17


; and their length w is shorter than the length L of the resistor element


17


. The first and second terminals


18


and


19


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


17


.




A manufacturing method of the resistor in the second exemplary embodiment of the present invention as configured above is described next with reference to drawings.




The manufacturing method of the resistor in the second exemplary embodiment is the same as that described for the resistor in the first exemplary embodiment using

FIG. 2. A

metal sheet or strip such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into the resistor element


11


having a predetermined sheet shape and predetermined resistance, calculated from the volume resistivity, section area, and length, through a range of processes including cutting, punching, and pressing. A detail which differs from the first exemplary embodiment is that, after forming the resistor element


11


as described above, a sheet of resistor element


11


is corrugated in the thickness direction in accordance with dimensions required for the resistor, so as to form the resistor element


17


.




The resistance of the resistor in the second exemplary embodiment may be increased by bending the resistor element


17


in such a way that the length L of the resistor element


17


is increased in the longer side direction. On the other hand, the resistance of this resistor may be reduced by rotating it 90°, that is to bend it in a way so that its width W becomes longer.




When the resistor element


17


is bent in the width W direction, some other changes in its shape may be required. More specifically, the first and second terminals


18


and


19


may require a broader width k for the groove


20


to match the total thickness V in the bending direction of the resistor element


17


. Or, the edge of the resistor element


17


may not be bent in order to fit the resistor element


17


into the original width k of the groove


20


.




Third Exemplary Embodiment




A resistor in a third exemplary embodiment of the present invention is described below with reference to a drawing.





FIG. 5

is a sectional view of the resistor in the third exemplary embodiment of the present invention.




In

FIG. 5

, a resistor element


21


is made typically of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy. An insulating sheet


22


, made such as of alumina, glass , glass fiber impregnated epoxy resin, or paper impregnated phenolic resin, has the same dimensions as the top or bottom face of the resistor element


21


, and is disposed at least on the top or bottom face of the resistor element


21


. First and second terminals


22


and


23


have a concave groove


25


of the width k which is equivalent to the sum T of the thickness T


1


of the resistor element


21


and the thickness T


2


of the insulating sheet


22


, and are provided and electrically connected to both ends of the resistor element


21


. The thickness t of these first and second terminals


18


and


19


is thicker than the sum T of the thickness T


1


of the resistor element


21


and the thickness T


2


of the insulating sheet


22


; their width m is equivalent to or wider than the width W of the resistor element


21


; and their length w is shorter than the length L of the resistor element


21


. The first and second terminals


23


and


24


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


21


.




A manufacturing method of the resistor in the third exemplary embodiment of the present invention as configured above is described next with reference to drawings.




The manufacturing method of the resistor in the third exemplary embodiment is substantially the same as that described for the resistor in the first exemplary embodiment using

FIG. 2. A

metal sheet or metal strip such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into the resistor element


21


having a predetermined sheet shape and predetermined resistance, calculated from the volume resistivity, section area, and length, through a range of processes including cutting, punching, and pressing. A detail which differs from the first exemplary embodiment is that, after forming the resistor element


21


as described above, the insulating sheet


22


made such as of alumina , glass, glass impregnated epoxy resin, or paper impregnated phenolic resin having the same two-dimensional size as the resistor element


21


is made such as by dividing, cutting, punching, and pressing, and then attached to the resistor element


21


.




Processes and materials for manufacturing the first and second terminals


23


and


24


are the same as those indicated in FIG.


2


(


a


). However, the thickness t and groove width k of the first and second terminals


23


and


24


differ for the thickness of the insulating sheet


22


.




Fourth Exemplary Embodiment




A resistor in a fourth exemplary embodiment of the present invention is described with reference to drawings.





FIG. 6

is a side view of a terminal, a key part, of the resistor in the fourth exemplary embodiment of the present invention seen from an open side.




In

FIG. 6

, first and second terminals


26


and


27


have a cavity


28


of the same shape as a section face in the width direction of the resistor element


11


. The thickness t of these first and second terminals


26


and


27


is thicker than the thickness T of the resistor element


11


; their width m is equivalent to or wider than the width W of the resistor element


11


; and their length w is shorter than the length L of the resistor element


11


. The first and second terminals


26


and


27


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


11


.




Fifth Exemplary Embodiment




A resistor in a fifth exemplary embodiment of the present invention is described with reference to drawings.




FIG.


7


(


a


) is a sectional view, and FIG.


7


(


b


) is a plan view of the resistor in the fifth exemplary embodiment of the present invention




In FIGS.


7


(


a


) and


7


(


b


), a resistor element


29


is made such as of a copper-nickel alloy wire, nickel-chromium wire, or copper-manganese-nickel alloy wire.




First and second terminals


30


and


31


have a concave groove


32


of the width k which is equivalent to a diameter R of the resistor element


29


, and are provided and electrically connected to both ends of the resistor element


29


. The thickness t of these first and second terminals


30


and


31


is thicker than the resistor element


29


; their width m is equivalent to or greater than the diameter R of the resistor element


29


; and their length w is shorter than the length L of the resistor element


29


. The first and second terminals


30


and


31


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


29


.




A method for manufacturing the resistor in the fifth exemplary embodiment of the present invention as configured above is described next with reference to drawings.




FIGS.


8


(


a


) to


8


(


d


) are process charts illustrating the manufacturing method of the resistor in the fifth exemplary embodiment of the present invention.




In FIG.


8


(


a


), a metal wire made such as of copper, silver, gold, aluminum, copper nickel, or copper zinc which have the same or greater electrical conductivity than that of the resistor element


29


(not illustrated) is ground, cast, forged, pressed, and drawn to form the first and second terminals


30


and


31


having the groove


32


of the width k equivalent to the diameter R of the resistor element


29


. The first and second terminals


30


and


31


are formed in a way to achieve the next dimensions: thickness t thicker than that of the resistor element


29


, the width m same or greater than the diameter R of the resistor element


29


, and length w shorter than the length L of the resistor element


29


.




In FIG.


8


(


b


), a metal wire such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is cut into the resistor element


29


having a predetermined sheet shape and predetermined resistance, calculated from the volume resistivity, section area, and length.




In FIG.


8


(


c


), both ends of the resistor element


29


is fitted to the groove


32


of the first and second terminals


30


and


31


, and they are thermally pressed in the vertical direction of the terminal (direction of holding the resistor element).




In FIG.


8


(


d


), a protective film


33


made such as of a film of epoxy resin, polyimide resin, or poly-carbodiimide resin is cut, punched, or pressed into a predetermined shape, placed over and below the resistor element


29


(not illustrated). The protective film


33


is formed on the top, bottom, and side faces of the resistor element


29


by thermal compression bonding or ultrasonic welding to complete the resistor in the fifth exemplary embodiment.




Both ends of the resistor element


29


may be inserted to the groove


32


of the first and second terminals


30


and


31


from the open side or from the side face of the first and second terminals


30


and


31


.




For bonding the resistor element


29


and the first and second terminals


30


and


31


, a range of methods may be used: (1) brazing after inserting a third conductive metal such as copper, silver , gold; tin, or solder between the resistor element


29


and the first and second terminals


30


and


31


; (2) plating and thermal compression bonding the resistor element


29


and first and second terminals


30


and


31


; and (3) applying conductive paste to the resistor element


29


and the first and second terminals


30


and


31


, and then thermosetting after fitting the resistor element


29


into the first and second terminals


30


and


31






For adjusting the resistance of the resistor in the fifth exemplary embodiment of the present invention, a through groove may be created on the resistor element


29


or a part of the surface and/or side face of the resistor element


29


may be cut by laser, punching, diamond wheel cutting, grinding, etching, or the like while measuring the resistance between predetermined points or calculating required processing after measuring the resistance. The resistance may also be adjusted or corrected at the time of forming the resistor element


29


.




Sixth Exemplary Embodiment




A resistor in a sixth exemplary embodiment of the present invention is described with reference to drawings.




FIG.


9


(


a


) is a sectional view, and FIG.


9


(


b


) is a plan view of the resistor in the sixth exemplary embodiment of the present invention.




In FIGS.


9


(


a


) and


9


(


b


), a resistor element


34


is typically made of a copper-nickel alloy wire, nickel-chromium wire, or copper-Manganese-nickel alloy wire bent into a cylindrical coil shape.




First and second terminals


35


and


36


have a concave groove


37


of the width k which is equivalent to the diameter R of the resistor element


34


, and are provided and electrically connected to both ends of the resistor element


34


. The thickness t of these first and second terminals


35


and


36


is thicker than the total thickness V of the resistor element


34


; their width m is equivalent to or wider than the width W of the resistor element


34


; and their length w is shorter than the length L of the resistor element


34


. The first and second terminals


35


and


36


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


34


.




A method for manufacturing the resistor in the sixth exemplary embodiment of the present invention as configured above is described next with reference to drawings.




The manufacturing method of the resistor in the sixth exemplary embodiment is the same as that described for the resistor in the fifth exemplary embodiment using

FIG. 8. A

metal wire such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into the resistor element


29


having a predetermined wire shape and predetermined resistance, calculated from the volume resistivity, section area, and length, through a range of processes including dividing, cutting, and pressing. A detail which differs from the fifth exemplary embodiment is that, after forming the resistor element


29


as described above, a resistor element wire


29


is bent into a cylindrical coil shape, so as to form the resistor element


34


.




Seventh Exemplary Embodiment




A seventh exemplary embodiment of the present invention is described with reference to drawings.




FIG.


10


(


a


) is a sectional view, and FIG.


10


(


b


) is a plan view of a resistor in the seventh exemplary embodiment of the present invention.




In FIGS.


10


(


a


) and


10


(


b


), a resistor element


38


, made such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy, is bent symmetrically to the left and right in one plane. First and second terminals


39


and


40


have a concave groove


41


of the width k which is equivalent to the diameter R of the resistor element


38


, and are provided and electrically connected to both ends of the resistor element


38


. The thickness t of these first and second terminals


39


and


40


is greater than the diameter R of the resistor element


38


; their width m is equivalent to or wider than the width W of the resistor element


38


; and their length w is shorter than the length L of the resistor element


38


. The first and second terminals


39


and


40


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


38


.




A manufacturing method of the resistor in the seventh exemplary embodiment of the present invention as configured above is described next with reference to drawings.




The manufacturing method of the resistor in the seventh exemplary embodiment is the same as that described for the resistor in the fifth exemplary embodiment using

FIG. 8. A

metal wire such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into the resistor element


29


having a predetermined wire shape and predetermined resistance, calculated from the volume resistivity, section area, and length, through a range of processes including dividing, cutting, and pressing. A detail which differs from the fifth exemplary embodiment is that, after forming the resistor element


29


as described above, a resistor element wire


9


is bent symmetrically to the left and right in one plane in accordance with dimensions required for the resistor, so as to form the resistor element


38


.




Eighth Exemplary Embodiment




A resistor in an eighth exemplary embodiment of the present invention is described below with reference to drawings.




FIG.


11


(


a


) is a sectional view, FIG.


11


(


b


) is a plan view, and FIG.


11


(


c


) is a sectional view of a terminal, a key part, of the resistor in the eighth exemplary embodiment of the present invention.




In FIGS.


11


(


a


) to


11


(


c


), first and second resistor elements


42


and


43


are made typically of a copper-nickel alloy wire, nickel-chromium wire, or copper-manganese-nickel alloy wire. First and second terminals


44


and


45


have a concave groove


46


of the width k which is equivalent to the diameter R of the resistor elements


42


and


43


, and are provided and electrically connected to both ends of the resistor elements


42


and


43


. The thickness t of these first and second terminals


44


and


45


is thicker than that of the resistor elements


42


and


43


; their width m is equivalent to or wider than the width W of the resistor elements


42


and


43


; and their length w is shorter than the length L of the resistor elements


42


and


43


. The first and second terminals


44


and


45


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor elements


42


and


43


.




A method for manufacturing of the resistor in the eighth exemplary embodiment of the present invention as configured above is described next with reference to drawings.




The manufacturing method of the resistor in the eighth exemplary embodiment is the same as that described for the resistor in the fifth exemplary embodiment using

FIG. 8. A

metal wire such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into a plurality of resistor elements


42


and


43


having a predetermined wire shape and predetermined resistance, calculated from the volume resistivity, section area, and length, through a range of processes including cutting, punching, and pressing. A detail which differs from the fifth exemplary embodiment is that, after forming the resistor elements


42


and


43


as described above, these resistor elements


42


and


43


are connected to the first and second terminals


44


and


45


in a way that the resistor elements


42


and


43


do not directly and electrically contact each other.





FIG. 12

is a side view of a terminal in another example of the resistor in the eighth exemplary embodiment of the present invention.




In

FIG. 12

, first and second cavities


47


and


48


have a section shape equivalent to the first and second resistor elements


42


and


43


and are formed respectively on the first and second terminals


44


and


45


instead of the concave groove


46


of the width k equivalent to the diameter R of the resistor elements


42


and


43


shown in FIG.


11


.




Ninth Exemplary Embodiment




A resistor in a ninth exemplary embodiment of the present invention is described below with reference to drawings.




FIG.


13


(


a


) is a sectional view, and FIG.


13


(


b


) is a plan view of the resistor in the ninth exemplary embodiment of the present invention.




In FIGS.


13


(


a


) and


13


(


b


), a resistor element


49


is made typically a sheet or strip of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy. First and second terminals


50


and


51


have a concave groove


52


of the width k which is equivalent to the total thickness T of the resistor element


49


, and are provided and electrically connected to both ends of the resistor element


49


. The thickness t of these first and second terminals


50


and


51


is thicker than the total thickness T of the resistor element


49


; their width m is equivalent to or wider than the width W of the resistor element


49


; and their length w is shorter than the length L of the resistor element


49


. The first and second terminals


50


and


51


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


49


. A protective film


53


, made such as of epoxy resin, polyimide resin, or poly-carbodiimide resin is formed on the resistor element


49


at an area not connected to the first and second terminals


50


and


51


.




A manufacturing method of the resistor in the ninth exemplary embodiment of the present invention as configured above is described next with reference to drawings.




The manufacturing method of the resistor in the ninth exemplary embodiment is basically the same as that described for the resistor in the first exemplary embodiment using FIG.


2


. More specifically, a film of epoxy resin, polyimide resin, poly-carbodiimide resin, or the like is disposed to vertically sandwich the resistor element


49


, and the protective film


53


is formed on the top, bottom, and side faces of the resistor element


49


by thermal compression bonding or ultrasonic welding, regardless of the shape of the resistor element, to complete the resistor in the ninth exemplary embodiment of the present invention.




Tenth Exemplary Embodiment




A resistor in a tenth exemplary embodiment of the present invention is described below with reference to drawings.




FIG.


14


(


a


) is a sectional view, FIG.


14


(


b


) is a plan view, and

FIG. 14

(


c


) is a sectional view of a terminal, cut in a width m direction, of the resistor in the tenth exemplary embodiment of the present invention.




In FIGS.


14


(


a


) to


14


(


c


), a resistor element


54


is made typically of a shape or a strip of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy. First and second terminals


55


and


56


have a concave groove


57


of the width k which is equivalent to the total thickness T of the resistor element


54


, and are provided and electrically connected to both ends of the resistor element


54


. The thickness t of these first and second terminals


55


and


56


is thicker than the total thickness T of the resistor element


54


; their width m is equivalent to or wider than the width W of the resistor element


54


; and their length w is shorter than the length L of the resistor element


54


. The first and second terminals


55


and


56


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


54


. A protective film


58


, made such as of epoxy resin, polyimide resin, or poly-carbodiimide resin, is formed on the resistor element


54


at an area not connected to the first and second terminals


55


and


56


to achieve the same dimensions as the width m and thickness t of the first and second terminals


55


and


56


.




A method for manufacturing the resistor in the tenth exemplary embodiment of the present invention as configured above is basically the same as that described for the resistor in the first exemplary embodiment using FIG.


2


. More specifically, a film of epoxy resin, polyimide resin, poly-carbodiimide resin, or the like is disposed to vertically sandwich the resistor element


54


, and the protective film


58


is formed on the top, bottom, and side faces of the resistor element


54


by thermo compression bonding or ultrasonic welding, regardless of the shape of the resistor element, to complete the resistor in the tenth exemplary embodiment of the present invention.




A detail which differs from the ninth exemplary embodiment of the present invention is a formation area of the protective film


58


. The protective film


58


is formed on the resistor element


54


to level with the width m and thickness t of the first and second terminals


55


and


56


. This can be achieved by making the thickness of a film of epoxy resin, polyimide resin, or poly-carbodiimide resin thicker than the difference between the top surface level of the resistor element


54


and top surface level of the first and second terminals


55


and


56


, and difference between the lower surface level of the resistor element


54


and lower surface level of the first and second terminals


55


and


56


; and pressing the film to the same level as the top and bottom faces of the first and second terminals


55


and


56


.




Eleventh Exemplary Embodiment




A resistor in an eleventh exemplary embodiment of the present invention is described below with reference to drawings.




FIG.


15


(


a


) is a sectional view, and FIG.


15


(


b


) is a plan view of the resistor in the eleventh exemplary embodiment of the present invention.




In FIGS.


15


(


a


) and


15


(


b


), a resistor element


59


is made typically of a sheet or strip of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy. First and second terminals


60


and


61


have an L shape section face, and are provided and electrically connected to both ends of the resistor element


59


. The thickness y of these first and second terminals


60


and


61


underneath the resistor element


59


is greater than the thickness x contacting the end face of the resistor element


59


. The first and second terminals


60


and


61


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


59


.




A method for manufacturing the resistor in the eleventh exemplary embodiment of the present invention as configured is basically the same as that described for the resistor in the first exemplary embodiment using FIG.


2


. However, in the eleventh exemplary embodiment, the first and second terminals


60


and


61


having the L-shape section face are formed instead of the shape of the first and second terminals illustrated in FIG.


2


(


a


). In a process corresponding to FIG.


2


(


c


), the resistor element


59


is placed on the first and second terminals


60


and


61


. For bonding the resistor element


59


and the first and second terminals


60


and


61


, a range of methods may be used: (1) brazing after inserting a third conductive metal such as copper, silver, gold, tin, and solder between the resistor element


59


and the first and second terminals


60


and


61


; and (2) applying conductive paste to the resistor element


59


and the first and second terminals


60


and


61


, and then thermosetting after fitting the resistor element


59


into the first and second terminals


60


and


61


.




Twelfth Exemplary Embodiment




A resistor in a twelfth exemplary embodiment of the present invention is described below with reference to drawings.





FIG. 16

is a sectional view of the resistor in the twelfth exemplary embodiment of the present invention.




In

FIG. 16

, a resistor element


64


is made typically of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy. An insulating sheet


65


, made such as of alumina , glass, glass impregnated epoxy resin, or paper impregnated phenolic resin, is attached to the top face of the resistor element


64


. First and second terminals


66


and


67


have an L-shape section face, and are provided and electrically connected to both ends of the resistor element


64


. The first and second terminals


66


and


67


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


64


. The insulating sheet


65


may also be attached to the bottom face of the resistor element


64


.




A method for manufacturing the resistor in the twelfth exemplary embodiment as configured above is basically the same as that described for the resistor in the eleventh exemplary embodiment. However, in the twelfth exemplary embodiment, the first and second terminals


66


and


67


having the L-shape section face are formed instead of the shape described in FIG.


2


(


a


). In a process corresponding to FIG.


2


(


b


), a metal sheet or metal strip such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into the resistor element


64


having a predetermined sheet shape and predetermined resistance, calculated from the volume resistivity, section area, and length, through a range of processes including cutting, punching, and pressing. Then, the insulating sheet


65


, made such as of alumina, glass, glass impregnated epoxy resin, or paper impregnated phenolic resin, with the same two-dimensional size as the resistor element


64


, is obtained by dividing, cutting, punching, or pressing, and the resistor element


64


and insulating sheet


65


are pasted. In a process corresponding to FIG.


2


(


c


), the resistor element


64


is placed on the first and second terminals


60


and


61


. For bonding the resistor element


64


and the first and second terminals


66


and


67


, a range of methods may be used: (1) brazing after inserting a third conductive metal such as copper, silver, gold, tin, and solder between the resistor element


64


and the first and second terminals


66


and


67


; and (2) applying conductive paste to the resistor element


64


and the first and second terminals


66


and


67


, and then thermosetting after fitting the resistor element


64


into the first and second terminals


66


and


67


.




Thirteenth Exemplary Embodiment




A resistor in a thirteenth exemplary embodiment of the present invention is described below with reference to drawings.





FIG. 17

is a sectional view of the resistor in the thirteenth exemplary embodiment of the present invention.




In

FIG. 17

, a resistor element


68


, made of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy has a shape that both ends are thicker than a central potion, and there is a step between the central portion and ends (its length-wise section face show an H shape). Steps


69


and


70


are provided at both ends


71


and


72


which are thicker than a central portion


73


of the resistor element


68


. First and second terminals


74


and


75


are electrically connected to both ends of the resistor element


68


, and their section face has a one-side open shape. Inside the first and second terminals


74


and


75


is wider than openings


76


and


77


. The first and second terminals


74


and


75


are made of metals such as copper, silver, gold, aluminum, copper nickel or copper zinc which have the same or greater electrical conductivity than that of the resistor element


68


.




In

FIG. 17

, the steps


69


and


70


and the openings


76


and


77


are bent in the thickness direction for preventing detachment, however, the direction is not limited. For example, they may be bent vertical against the thickness direction. The number of steps and bendings are also not limited.




A method for manufacturing the resistor in the thirteenth exemplary embodiment of the present invention as configured above is basically the same as that described for the resistor in the first exemplary embodiment using

FIG. 2. A

detail which differs is the shape of the material. In a process corresponding to FIG.


2


(


a


), inside of the first and second terminals


74


and


75


is broader than their openings


76


and


77


. In a process corresponding to FIG.


2


(


b


), steps


69


and


70


thicker than the central portion


73


are provided at both ends


71


and


72


of the resistor element


68


in accordance with the shape of the groove of the first and second terminals


74


and


75


.




Fourteenth Exemplary Embodiment




A resistor in a fourteenth exemplary embodiment of the present invention is described below with reference to drawings.





FIG. 18

is a sectional view of the resistor in the fourteenth exemplary embodiment of the present invention.




In

FIG. 18

, an insulating substrate


79


is a sheet of a glass impregnated epoxy resin substrate, paper impregnated phenolic resin substrate, or the like. First and second terminals


80


and


81


are formed on both ends of the insulating substrate


79


for electrically connecting the top and bottom faces of the insulating substrate


79


, and are made of metals such as copper, silver, gold, aluminum , copper nickel, or copper zinc with the same or greater electrical conductivity than that of a resistor element


78


. A metal layer


82


such as of solder is formed on the top face of the first and second terminals


80


and


81


. The resistor element


78


made such as of a sheet of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed on the metal layer


82


in a way to electrically connect the metal layer


82


on the first terminal


80


and the metal layer


82


on the second terminal


81


.




In

FIG. 18

, the top and bottom faces of the insulating substrate


79


are electrically connected by the first and second terminals


80


and


81


on both ends of the insulating substrate


79


. This may also be achieved by providing the electrodes which vertically penetrate through the insulating substrate


79


.




A method for manufacturing the resistor in the fourteenth exemplary embodiment of the present invention is described next with reference to drawings.




FIGS.


19


(


a


) to


19


(


c


) are process charts illustrating the manufacturing method of the resistor in the fourteenth exemplary embodiment of the present invention.




In FIG.


19


(


a


), a strip of metal foil pattern typically made of copper, silver, or gold having the same or greater electrical conductivity than that of the resistor element


78


is formed on the top, bottom , and side faces of the insulating substrate


79


made typically of a glass impregnated epoxy resin substrate or paper impregnated phenolic resin substrate. Then, the metal foil pattern is exposed to the light and etched to form the first and second terminals


80


and


81


with a predetermined shape.




In FIG.


19


(


b


), solder paste


82


is screen printed on the top face of the first and second terminals


80


and


81


.




In FIG.


19


(


c


), a metal sheet made typically of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into the resistor element


78


having a predetermined sheet shape and predetermined resistance, calculated from the volume resistivity, section area, and length, through a range of processes including cutting , punching, and pressing. Both ends of the resistor element


78


are placed on the top face of the solder paste


82


, and firmly bonded by the reflow process to complete the resistor in the fourteenth exemplary embodiment of the present invention.




In the fourteenth exemplary embodiment of the present invention, the resistor element


78


and the first and second terminals


80


and


81


are bonded by soldering the solder paste


82


. This may also be achieved through other methods such as: (1) brazing after inserting a third conductive metal such as copper, silver, gold , tin, and solder between the resistor element


78


and the first and second terminals


80


and


81


; and (2) plating and thermal compression bonding the resistor element


78


and first and second terminals


80


and


81


.




For adjusting the resistance of the resistor element in the fourteenth exemplary embodiment of the present invention , a through groove may be to created on the resistor element


78


or a part of the surface and/or side of the resistor element


78


may be cut by laser, punching, diamond wheel cutting, grinding, etching, and so on while measuring the resistance between predetermined points or calculating required processing after measuring the resistance. The resistance may also be adjusted or corrected at the time of forming the resistor element


78


.




Fifteenth Exemplary Embodiment




A resistor in a fifteenth exemplary embodiment of the present invention is described below with reference to drawings.




FIG.


20


(


a


) is a sectional view, FIG.


20


(


b


) is a plan view of the surface, and FIG.


20


(


c


) is a plan view of the rear face of the resistor in the fifteenth exemplary embodiment of the present invention.




In FIGS.


20


(


a


) to


20


(


c


), a resistor element


83


is made such as of a sheet of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy. An insulating substrate


83


is a sheet of a glass impregnated epoxy resin substrate, paper impregnated phenolic resin substrate, or the like. First, second, third , and fourth terminals


85


,


86


,


87


, and


88


are disposed at four corners of the insulating substrate


84


, in a way to electrically connect top and bottom faces of the insulating substrate


84


, and are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


83


. The resistor element


83


is electrically connected to the surface of the first, second, third, fourth terminals


85


,


86


,


87


, and


88


through a metal layer


89


on their top faces.




In

FIG. 20

, the first, second, third, fourth terminals


85


,


86


,


87


, and


88


are formed at four corners of the insulated substrate


84


so as to electrically connect the top and bottom faces of the insulated substrate


84


. This may also be achieved by providing the electrodes which vertically penetrate through the insulating substrate


79


.




A method for manufacturing the resistor in the fifteenth exemplary embodiment of the present invention is the same as that described using FIG.


19


. The difference is that four terminals are formed in the fifteenth exemplary embodiment, while two terminals are formed in the fourteenth exemplary embodiment.




Sixteenth Exemplary Embodiment




A resistor in a sixteenth exemplary embodiment of the present invention is described below with reference to drawings.




FIG.


21


(


a


) is a sectional view, and FIG.


21


(


b


) is a plan view of the resistor in the sixteenth exemplary embodiment of the present invention.




In FIGS.


21


(


a


) and


21


(


b


), a resistor element


90


is made such as of a sheet of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy. Rectangular parallelepiped first, second, third, and fourth terminals


91


,


92


,


93


, and


94


are electrically connected respectively at the top and bottom faces of both ends of the resistor element


90


.




A method for manufacturing the resistor in the sixteenth exemplary embodiment as configured above is basically the same as that described for the resistor in the first exemplary embodiment using FIG.


2


. In a process corresponding to FIG.


2


(


a


), four rectangular parallelepiped terminals are formed. In a process corresponding to FIG.


2


(


c


), the first and third terminals


91


and


93


are bonded to the top face of both ends of the resistor element


90


, using processes such as: (1) inserting a third conductive metals such as copper, silver, gold, tin, or solder between the resistor element and terminals, disposing the first and third terminals


91


and


93


on the top face of both ends of the resistor element


90


, and brazing; or (2) applying conductive paste to the resistor element


90


and the first and third terminals


91


and


93


, disposing the first and third terminals


91


and


93


on the top face of both ends is of the resistor element


90


, and thermosetting. Then, the resistor element


90


is turned over to bond the second and fourth terminals


92


and


94


on the bottom face of both ends of the resistor element


90


using the aforementioned processes. The above operation may be implemented at once to bond the first, second, third, and fourth terminals


91


,


92


,


93


, and


94


to the resistor element


90


.





FIG. 22

is a sectional view of another example of the resistor in the sixteenth exemplary embodiment of the present invention.




A detail which differs from

FIG. 21

in

FIG. 22

is that the first and second terminals


91


and


92


, and the third and fourth terminals


93


and


94


are electrically connected, and each pair of terminals looks like a single terminal.




Accordingly, the manufacturing method of the example shown in

FIG. 22

is that (1) inserting a third conductive metals such as copper, silver, gold, tin, or solder between the resistor element and terminals, disposing the first and third terminals


91


and


93


on the top face of both ends of the resistor element


90


, and brazing; or (2) applying conductive paste to the resistor element


90


and the first and third terminals


91


and


93


, disposing the first and third terminals


91


and


93


on the top face of both ends of the resistor element


90


, and thermosetting. When the resistor element


90


is turned over, after bonding the first and third terminals


91


and


93


on the top face of both ends of the resistor element


90


, to bond the second and fourth terminals


92


and


94


on the bottom face of both ends of the resistor element


90


, the first and second terminals


91


and


92


, and the third and fourth terminals


93


and


94


are simultaneously connected.




Seventeenth Exemplary Embodiment




A resistor in a seventeenth exemplary embodiment of the present invention is described below with reference to drawings.





FIG. 23

is a sectional view of the resistor in the seventeenth exemplary embodiment of the present invention.




In

FIG. 23

, a resistor element


95


, made typically of a sheet of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy has first and second notches


96


and


97


provided near both ends. These first and second notches


96


and


97


in the resistor element


95


are created as a widthwise slit on the resistor element


95


. First and second terminals


98


and


99


are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc having the same or greater electrical conductivity than that of the resistor element


95


.




First and second protrusions


100


and


101


on the first and second terminals


98


and


99


have the same or smaller size than that of the first and second notches


96


and


97


, and they are provided as a widthwise slit on the first and second terminals


98


and


99


.




The first and second terminals


98


and


99


are disposed at both ends of the resistor element


95


. The first notch


96


on the resistor element


95


, and the first protrusion


100


on the first terminal


98


, and the second notch


97


on the resistor element


95


and second protrusion


101


on the second terminal


99


are mechanically connected respectively. In addition, the resistor element


95


and the first and second terminals


98


and


99


are electrically connected.




A method for manufacturing the resistor in the seventeenth exemplary embodiment of the present invention is described next with reference to drawing.




The manufacturing method of the resistor in the seventeenth exemplary embodiment of the present invention is basically the same as that described for the resistor in the first exemplary embodiment using FIG.


2


. However, the shape of the first and second terminals differ from that described in FIG.


2


(


a


). The notches


96


and


97


are also created on the resistor element


95


, which is different from the resistor element described in FIG.


2


(


b


). The first and second notches


96


and


97


are created such as by cutting and pressing after forming the resistor element


95


with a predetermined sheet shape and predetermined resistance. In a process corresponding to FIG.


2


(


c


), as shown in

FIG. 23

, the resistor element


95


is placed on the first and second terminals


98


and


99


in a way that the first notch


96


on the resistor element


95


fits with the first protrusion


100


on the first terminal


98


, and the second notch


97


on the resistor element


95


fits with the second protrusion


101


on the second terminal


99


. Then, the resistor element


95


and the first and second terminals


98


and


99


are bonded and connected using the next methods: (1) brazing after inserting a third conductive metal such as copper, silver, gold, tin, and solder between the resistor element


95


and the first and second terminals


98


and


99


; and (2) applying conductive paste between the resistor element


95


and the first and second terminals


98


and


99


, and thermosetting after fitting the resistor element


95


into the first and second terminals


98


and


99


.




Eighteenth Exemplary Embodiment




A resistor in an eighteenth exemplary embodiment of the present invention is described below with reference to drawings.




FIG.


24


(


a


) is a sectional view, and FIG.


24


(


b


) is a plan view of the resistor in the eighteenth exemplary embodiment of the present invention.




As shown in

FIG. 24

, a resistor element


102


, made such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy has first and second through holes


103


and


104


. First and second terminals


105


and


106


have first and second protrusions


107


an


108


which can be inserted to the first and second through holes


103


and


104


, and are made of metals such as copper, silver, gold, aluminum, copper nickel, or copper zinc having the same or greater electrical conductivity than that of the resistor element


102


.




The first and second terminals


105


and


106


are disposed at both ends of the resistor element


102


. The first through hole


103


on the resistor element


102


, and the first protrusion


107


on the first terminal


105


, and the second through hole


104


on the resistor element


102


and second protrusion


108


on the second terminal


106


are mechanically connected respectively. In addition, the resistor element


102


and the first and second terminals


105


and


106


are electrically connected.




A manufacturing method of the resistor in the eighteenth exemplary embodiment of the present invention as configured above is described next with reference to drawings.




FIGS.


25


(


a


) to


25


(


e


) are process charts illustrating the manufacturing method of the resistor in the eighteenth exemplary embodiment of the present invention.




As shown in FIG.


25


(


a


), first and second terminals


105


and


106


have first and second protrusions


107


and


108


, and are made of metal sheet or metal strip such as of copper, silver, gold, aluminum, copper nickel, or copper zinc with the same or greater electrical conductivity than that of the resistor element


102


using processes such as cutting, casting, forging, pressing, and drawing.




In FIG.


25


(


b


), a metal sheet or metal strip such as of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into the resistor element


102


having a predetermined sheet shape and predetermined resistance, calculated from the volume resistivity, section area, and length, through a range of processes including cutting, punching, and pressing.




In FIG.


25


(


c


), the first and second through holes


103


and


104


are created in both ends of the resistor element


102


using processes such as punching, cutting, and laser.




In FIG.


25


(


d


), the first protrusion


107


on the first terminal


105


is inserted into the first through hole


103


on the resistor element


102


, and the second protrusion


108


on the second terminal


106


is inserted into the second through hole


104


on the resistor element


102


.




In FIG.


25


(


e


), the first and second terminals


105


and


106


are bent along the circumference of the resistor element


102


by pressing to sandwich the resistor element


102


in the thickness direction.




The first and second terminals


105


and


106


may not necessary have the shape shown in FIGS.


25


(


a


) to


25


(


e


). They may just have an opening sufficient for inserting the resistor element


102


, and then caulked after inserting the resistor element


102


at both ends.




The resistor element


102


and the first and second terminals


105


and


106


may be bonded and connected using the next methods: (1) brazing after inserting a third conductive metal such as copper, silver, gold, tin, and solder between the resistor element


102


and the first and second terminals


105


and


106


; and (2) applying conductive paste between the resistor element


102


and the first and second terminals


105


and


106


, and thermosetting.




For adjusting the resistance of the resistor in the eighteenth exemplary embodiment of the present invention, a through groove may be created on the resistor element


102


or a part of the surface and/or side of the resistor element


102


may be cut by laser, punching, diamond wheel cutting, grinding, etching, and so on while measuring the resistance between predetermined points or calculating the required processing after measuring the resistance. The resistance may also be adjusted or corrected at the time of forming the resistor element


102


.




In the first exemplary embodiment as described above , the groove


14


of the first and second terminals


12


and


13


is fitted to both ends of the resistor element


11


, and then the first and second terminals


2


and


13


are thermally pressed in the vertical direction (to hold the resistor element


11


) so that the first and second terminals


12


and


13


are disposed at the top and bottom faces of the resistor element


11


. As a result, it has an effect that the resulting resistor may be mounted in either way, regardless of the surface and rear face of the resistor.




In the second exemplary embodiment as described above, a metal sheet is corrugated to the thickness direction to form the resistor element


17


. An upper limit of the resistance of the resistor may be increased by bending the resistor element


17


in such a way that the length L of the resistor element


17


becomes longer in the length direction . On the other hand, a lower limit of the resistance of this resistor may be reduced by bending the resistor element


17


in a way that its width W becomes longer.




The second exemplary embodiment of the present invention also has the first and second terminals


18


and


19


which have the groove


20


of the width k equivalent to the thickness T of the resistor element


17


. The thickness t of the terminals is thicker than the total thickness V of the resistor element


17


, their width m is equivalent to or longer than the width W, and their length w is shorter than the length L of the resistor element


17


. This enables to make the resistance of the first and second terminals


18


and


19


smaller than that of the resistor element


17


by the shape, and thus reduces the proportion of the resistance of the first and second terminals


18


and


19


in the entire resistor. This enables to reduce fluctuation in the resistance which is dependant of a resistance measuring terminal on a contact point. Furthermore, since a clearance is provided between the resistor element


17


and a circuit board, thermal damage to a mounting circuit board due to self heat generation of the resistor element


17


is preventable.




The third exemplary embodiment of the present invention comprises the metal sheet resistor element


21


, insulating sheet


22


disposed at least on one of the top and bottom faces of the resistor element


21


, and the first and second terminals


23


and


24


electrically connected to the resistor element


21


. The first and second terminals


23


and


24


have the groove


25


of the width k equivalent to the sum T of the thickness T


1


of the resistor element


21


and the thickness T


2


of the insulating sheet


22


, and are electrically connected to the resistor element


21


. The insulating sheet


22


supports or reinforces the resistor element


21


, and improves mechanical strength, thus preventing changes in characteristics by deformation.




Also in the third exemplary embodiment, the first and second terminals


23


and


24


have the groove


25


of the width k equivalent to the sum T of the thickness T


1


of the resistor element


21


and the thickness T


2


of the insulating sheet


22


. The thickness t of the first and second terminals


23


and


24


is also thicker than the sum T of the thickness T


1


of the resistor element


21


and the thickness T


2


of the insulating sheet


22


, their width m is equivalent to or wider than the width W of the resistor element


21


, and their length w is shorter than the length L of the resistor element


21


. This shape enables to make the resistance of the first and second terminals


23


and


24


smaller than that of the resistor element


21


, and thus reduces the proportion of the resistance of the first and second terminals


23


and


24


in the entire resistor. Accordingly, fluctuation in the resistance dependant of a resistance measuring terminal on a contact point may be reduced. Furthermore, since a clearance is provided between the resistor element


17


and a substrate, thermal damage to a mounting substrate due to self heat generation of the resistor element


17


is preventable.




The fifth exemplary embodiment of the present invention comprises the metal wire resistor element


29


, the concave groove


32


covering both ends of the resistor element


29


, and first and second metal terminals


30


and


31


electrically connected to the resistor element


29


. The wire resistor element


29


which has the diameter greater than thickness than that of the sheet resistor element enables to obtain the larger resistance than that obtainable with the sheet resistor element. Its mechanical strength can also be reinforced to improve the bending strength of the resistor.




The sixth exemplary embodiment comprises the metal wire resistor element


34


bent into a cylindrical coil shape, concave groove


37


covering both ends of the resistor element


34


, and first and second metal terminals


35


and


36


electrically connected to the resistor element


34


. The length of the resistor element can be made longer by coiling the resistor element


34


, and thus an upper limit of the resistance obtained by the resistor element


34


can be increased.




The seventh exemplary embodiment of the present invention comprises the metal wire resistor element


38


bent symmetrically to the left and right in one planes concave groove


41


covering both ends of the resistor element


38


, and first and second metal terminals


39


and


40


′ electrically connected to the resistor element


38


. Since the metal wire configuring the resistor element


38


is bent symmetrically to the left and right in one plane, the current direction alternates. This enables to cancel the magnetic field generated, and thus reduces magnetic interference of the resistor.




The eighth exemplary embodiment of the present invention comprises a plurality of metal wire resistor elements


42


and


43


which do not directly and electrically contact, concave groove


46


covering both ends of the resistor element


42


and


43


, and first and second metal terminals


44


and


45


electrically connected to the resistor element


42


and


43


. The resistor elements


42


and


43


are connected in parallel so that the resistance is not adjusted only by the shape of the resistor element. In other words, the resistance is not directly affected by the dimensions of the resistor. This enables to prevent decrease in the strength due to any change in the shape.




The eleventh exemplary embodiment of the present invention comprises the metal sheet resistor element


59


, and first and second metal terminals


60


and


61


having an L-shape section face disposed at both ends of the resistor element


59


and electrically connected to the resistor element


59


. An inner wall of the L-shape first and second terminals


60


and


61


acts as a reference for positioning the first and second terminals


60


and


61


to both ends of the resistor element


59


. This enables to improve the accuracy of connecting position of the first and second terminals


60


and


61


and the resistor element


59


, reducing deviation in resistance.




Also in the eleventh exemplary embodiment of the present invention, the thickness y of a portion of the first and second terminals


60


and


61


underneath the resistor element


59


is made thicker than the thickness x of a portion contacting end faces of the resistor element


59


, improving heat radiation performance.




The twelfth exemplary embodiment of the present invention comprises the metal sheet resistor element


64


, insulating sheet


65


pasted on at least one of the top and bottom faces of the resistor element


64


, and the first and second metal terminals


66


and


67


having an L-shape section face disposed at both ends of the resistor element


64


and electrically connected to the resistor element


64


. The insulating sheet


65


supports or reinforces the resistor element


64


. This enables to improve the mechanical strength and prevent changes in characteristics due to deformation.




The thirteenth exemplary embodiment of the present invention comprises the resistor element


68


provided with the steps


69


and


70


between the central portion


73


and both ends


71


and


72


by making the both ends


71


and


72


thicker than the central portion


73


, and the first and second metal terminals


74


and


75


disposed at both ends of the resistor element


68


. The first and second metal terminals


74


and


75


have a one-end open section face, and their inside is broader than their opening. The steps


69


and


70


of the resistor element


68


are at least electrically connected to the inside of the opening of the first and second terminals


74


and


75


. This mechanical connection of the inside of the opening of the first and second terminals


74


and


75


and the steps


69


and


70


of the resistor element


68


enables to improve the accuracy of bonding position and reliability of bonding between the first and second terminals


74


and


75


and the resistor element


68


.




The fourteenth exemplary embodiment of the present invention comprises the metal sheet resistor element


78


, insulating substrate


79


, and the first and second metal terminals


80


and


81


formed to electrically connect the top and bottom faces of the insulating substrate


79


at both ends. The resistor element


78


and the first and second metal terminals


80


and


81


disposed on the top face of the insulating substrate


79


are also electrically connected. This improves the accuracy of formation position and dimensions of the first and second terminals


80


and


81


to control a connection area of the first and second terminals


80


and


81


and the resistor element


78


, reducing dispersion in resistance of the resistor.




The fifteenth exemplary embodiment of the present invention comprises the metal sheet resistor element


83


, insulating substrate


84


,and four metal terminals


85


,


86


,


87


, and


88


formed to electrically connect the top and bottom faces of the insulating substrate


84


. The resistor element


83


and the four metal terminals


85


,


86


,


87


, and


8


disposed on the top face of the insulating substrate


84


are also electrically connected. This achieves a four-terminal resistor, improving the accuracy of current detection.




The sixteenth exemplary embodiment of the present invention comprises the metal resistor element


90


and four metal terminals


91


,


92


,


93


, and


94


. Each of the terminals


91


,


92


,


93


, and


94


is disposed on and electrically connected to the top and bottom faces of both ends of the resistor element


90


. The four metal terminals


91


,


92


,


93


, and


94


are thus symmetrically disposed, with the resistor element


90


in the center, to the thickness direction of the resistor element


90


. This eliminates the directivity of the surface and rear face of the resistor.




The sixteenth exemplary embodiment, as shown in

FIG. 22

, also has the terminals


91


,


92


,


93


, and


94


disposed on the top and bottom faces of both ends of the resistor element


90


, and these terminals are electrically connected to each other. These four terminals


91


,


92


,


93


, and


94


are thus disposed symmetrically, with the resistor element


90


in the center, to the thickness direction of the resistor element


90


. This eliminates the directivity of the surface and rear face of the resistor, further increasing the terminal volume for improving radiating performance.




The seventeenth exemplary embodiment of the present invention comprises the metal resistor element


95


having the first and second notches


96


and


97


near its both ends, and the first and second metal terminals


98


and


99


disposed at both ends of the resistor element


95


. The first and second terminal


98


and


99


have the first and second protrusions


100


and


101


corresponding to the first and second notches


96


and


97


. The resistor element


95


and the first and second terminals


98


and


99


are at least electrically connected through the first and second protrusions


100


and


101


, and the first and second notches


96


and


97


. The mechanical connection of the protrusions


100


and


101


and the notches


96


and


97


improves the accuracy of position and resistance, and reliability of bonding between the resistor element


95


and the first and second terminals


98


and


99


.




The eighteenth exemplary embodiment of the present invention comprises the metal resistor element


102


having two or more first and second through holes


103


and


014


, and the first and second metal terminals


105


and


106


disposed at both ends of the resistor element


102


. The first and second terminals


105


and


106


have one or more first and second protrusions


107


and


108


with the same shape as the through holes


103


and


104


. At least one of the protrusions


107


and


108


of the terminals


105


and


106


is inserted into at least one of the through holes


103


and


104


of the resistor element


102


, and at least one face of the terminals


105


and


106


is electrically connected to the resistor element


102


. The mechanical connection of the protrusions


107


and


108


and the through holes


103


and


104


improves the accuracy of position and resistance, and reliability of bonding between the resistor element


102


and the first and second terminals


105


and


106


.




The manufacturing method of the resistor in the fourteenth exemplary embodiment comprises the steps of forming the first and second terminals


80


and


81


with a metal foil pattern with a predetermined shape whose top and bottom faces are electrically connected to a part of the top, side, and bottom faces of the insulated substrate


79


. This enables to use the thin film formation process such as light exposure for the metal foil pattern, and thus the accuracy of shape and formation position can be improved. Accordingly, dispersion in the resistance at terminals and a connected portion between the terminals and resistor element can be reduced.




Nineteenth Exemplary Embodiment




A resistor in a nineteenth exemplary embodiment of the present invention is described below with reference to the drawings.




FIG.


26


(


a


) is a sectional view, FIG.


26


(


b


) is a plan view, and FIG.


26


(


c


) is a sectional view taken along Line A—A in FIG.


26


(


a


) of the resistor in the nineteenth exemplary embodiment of the present invention.




In FIGS.


26


(


a


) to


26


(


c


), a resistor element


111


is typically made of a sheet of copper-nickel alloy, nickel-chromium alloy, copper-manganese-nickel alloy or a combination thereof. First and second concaved terminals


112


and


113


have a concave groove


114


of a width k equivalent to the thickness T


6


f the resistor element


111


. The entire surface of the first and second terminals


112


and


113


are coated with a low melting point metal


115


(hereinafter metal


115


).




The first and second terminals


112


and


113


are electrically connected to both ends of the resistor element


111


in the groove


114


through the low melting point metal


115


. The thickness t of these first and second terminals


112


and


113


is thicker than the thickness T of the resistor element


111


; their width m is equivalent to or wider than the width W of the resistor element


111


; and their length w is shorter than the length L of the resistor element


111


. The first and second terminals


112


and


113


are made of metals such as of copper, silver, gold, or aluminum with the same or greater electrical conductivity than that of the resistor element


111


. The metal


115


electrically connects the resistor element


111


and the first and second terminals


112


and


113


, and the metal


115


on the circumference of the first and second terminals


112


and


113


also acts as a connecting material when the resistor is mounted on a printed circuit board. Here, the metal


115


refers to metals having a melting point of 500° C. or below, such as tin, tin lead alloy, tin silver alloy, tin antimony alloy, tin zinc alloy, tin bismuth alloy, silver zinc alloy, silver lead alloy, gold tin alloy, or zinc. The use of a metal with a low melting point prevents degradation of resistance characteristics due to oxidization of terminals or resistor element at connecting the terminals and resistor element, which may occur if a metal with a high melting point is used for coating the terminals. An insulating protective film


116


, typically made of epoxy resin, polyimide resin, or poly-carbodiimide resin, covers the entire face of the resistor element


111


except the first and second terminals


112


and


113


.




A manufacturing method of the resistor in the nineteenth exemplary embodiment of the present invention as configured above is described next with reference to drawings.




FIGS.


27


(


a


) to


27


(


b


) are process charts illustrating the manufacturing method of the resistor in the nineteenth exemplary embodiment of the present invention.




In FIG.


27


(


a


), first and second terminals


112


and


113


are made of metals such as copper, silver, gold, or aluminum with greater electrical conductivity than that of the resistor element


111


using processes such as cutting, casting, forging, pressing, and drawing. The first and second terminals


112


and


113


have a groove


114


of a width k which is equivalent to or greater than the thickness T of the resistor element


111


. The thickness t of these first and second terminals


112


and


113


is greater than the thickness T of the resistor element


111


; their width m is equivalent to or wider than the width W of the resistor element


111


; and their length w is shorter than the length L of the resistor element


111


.




In FIG.


27


(


b


), the metal


115


is formed on the entire face of the first and second terminals


112


and


113


, typically by barrel plating.




In a process shown in FIG.


27


(


c


), a metal sheet made of copper-nickel alloy, nickel-chromium alloy, or copper-manganese-nickel alloy is formed into the resistor element


111


by a range of of processes including cutting, punching, and pressing. The resistor element has a predetermined sheet shape and predetermined resistance, calculated from the volume resistivity, section area, and length.




In FIG.


27


(


d


), the first and second terminals


112


and


113


are coated with the metal


115


and disposed to both ends of the resistor element


11


through the groove


114


, and set on a die for cold forging of the first and second terminals


112


and


113


.




Then, a work piece is loaded to and unloaded from an oven held at the temperature above the melting point of the metal


115


(not illustrated) to electrically connect the first and second terminals


112


or


113


and resistor element


111


through the metal


115


.




Lastly, in FIG.


27


(


e


), the insulated protective film


116


, made of a film of epoxy resin, polyimide resin, or poly-carbodiimide resin, is cut into a predetermined shape using processes such as cutting, punching, and pressing, and disposed on the top and bottom faces of the resistor element


111


(not illustrated). The insulated protective film


116


is thermal compression bonded on the entire face of the resistor element


111


, except on the first and second terminals


112


and


113


, thereby completing the resistor in the nineteenth exemplary embodiment of the present invention.




The side face of the first and second terminals


112


and


113


, after being connected to the resistor element


111


, does not necessarily have a gap or space as shown in FIG.


27


. For example, there may be no space, depending on the state of cold forging.




For adjusting the resistance of the resistor in the nineteenth exemplary embodiment of the present invention, a through groove may be created on the resistor element


111


. Alternatively, a part of the surface and/or side of the resistor element


111


may be cut by laser, punching, diamond wheel cutting, grinding, etching, and so on while measuring the resistance between predetermined points or calculating the required processing after measuring the resistance. The resistance may also be adjusted or corrected at the time of forming the resistor element


111


.




If a material with a lower electrical conductivity than the resistor element


111


is used for the first and second terminals


112


and


113


in the resistor as manufactured above, dispersion in resistance due to variations in the measuring point increases, making it inappropriate for practical use. Accordingly, the first and second terminals


112


and


113


are made of a material having electrical conductivity greater than that of the resistor element


111


.




Dispersion in resistance due to the position of the measuring point may also be reduced by making the thickness t of the first and second terminals


112


and


113


thicker than the thickness T of the resistor element


111


.




Also, for suppressing temperature rise against heat generated by applying a current, the thickness t of the first and second terminals


112


and


113


is preferably made thicker than the thickness T of the resistor element


111


.




The same effects are also achievable when the resistor in the nineteenth exemplary embodiment is manufactured with a process shown in FIG.


27


(


c


) implemented before the process shown in FIG.


27


(


a


), i.e., in the sequence of manufacture is shown as FIG.


27


(


c


), FIG.


27


(


a


), FIG.


27


(


b


), FIG.


27


(


d


), and FIG.


27


(


e


).




Twentieth Exemplary Embodiment




A resistor in a twentieth exemplary embodiment of the present invention is described below with reference to drawings.




FIG.


28


(


a


) is a sectional view, FIG.


28


(


b


) is a plan view, and FIG.


28


(


c


) is a sectional view taken along Line B—B in FIG.


28


(


b


) of the resistor in the twentieth exemplary embodiment of the present invention.




In FIGS.


28


(


a


) to


28


(


c


), a resistor element


121


is typically made of a sheet of copper-nickel alloy, nickel-chromium alloy, copper-manganese-nickel alloy or a combination thereof. First and second concaved terminals


122


and


123


have a concave groove


124


of a width k equivalent to the thickness T of the resistor element


111


. The entire surface of the first and second terminals


122


and


123


are coated with a low melting point metal


125


such as tin, tin lead alloy, tin silver alloy, tin antimony alloy, tin zinc alloy, tin bismuth alloy, silver zinc , alloy silver lead alloy, gold tin alloy, or zinc typically by plating. The first and second terminals


122


and


123


are electrically connected to both ends of the resistor element


111


in the groove


114


through the metal


125


.




The thickness t of these first and second terminals


122


and


123


is thicker than the thickness T of the resistor element


121


; their width m is equivalent to or wider than the width W of the resistor element


121


; and their length w is shorter than the length L of the resistor element


121


. The first and second terminals


122


and


123


are made of metals such as copper, silver, gold, or aluminum with the same or greater electrical conductivity than that of the resistor element


121


. The metal


125


electrically connects the resistor element


121


and the first and second terminals


122


and


123


. The metal


125


on the circumference of the first and second terminals


122


and


123


also acts as a connecting material when the resistor is mounted on a printed circuit board. Except for the first and second terminals


122


and


123


, insulating protective film


126


, typically made of epoxy resin, polyimide resin, or poly-carbodiimide resin, covers the entire face of the resistor element


121


.




A manufacturing method of the resistor in the twentieth exemplary embodiment of the present invention as configured above, and is described next with reference to drawings.




The manufacturing method of the resistor in the twentieth exemplary embodiment is basically the same as that described for the resistor in the nineteenth exemplary embodiment using FIG.


27


. Moire specifically, in a process shown in FIG.


27


(


e


), the insulated protective film


126


, is cut into a predetermined shape using processes such as cutting, punching, and pressing, and disposed on the top and bottom faces of the resistor element


121


(not illustrated). The insulated protective film is thermal compression bonded to form the insulated protective film


126


on the entire face of the resistor element


121


except for the first and second terminals


122


and


123


. A detail which differs in this process from the nineteenth exemplary embodiment process is the thickness of a film is increased for the purpose of leveling the insulated protective film


126


to the top and bottom face level of the first and terminals


122


and


123


. Thus, pressing is required for adjusting the shape.




In the thermal compression bonding, the resistor element


121


may optionally be pressed for a period to bond the resistor element


121


to the insulated protective film


126


, and then the insulated protective film


126


may be heated without applying pressure to accelerate curing.




The manufacturing method of the resistor in the nineteenth exemplary embodiment of the present invention comprises a first process of forming a first and second metal terminals


112


and


113


into a concave shape, and then coating the metal terminals with a low melting point on their entire face of the terminals to obtain the first and second terminals


112


and


113


, a second process of creating the metal sheet resistor element


111


whose shape is adjusted to obtain a predetermined resistance, and a third process of covering both ends of the resistor element


111


with the first and second terminals


112


and


113


by cold forging, and electrically connecting the resistor element


111


and the first and second terminals


112


and


113


by heating and cooling. The implementation of the third process enables reduction of contact resistance without deforming the bonded portion which may occur by welding. Thus the process improves electrical connectivity between the resistor element


111


and the first and second terminals


112


and


113


, and eliminates the need for forming a bonding material for mounting the resistor onto a printed circuit board after initial coating, thereby improving the productivity.




Industrial Applicability




As described above, the resistor of the present invention comprises a sheet metal resistor element and separate metal terminals electrically connected to both ends of the sheet resistor element. These terminals are made of metal having the same or greater electrical conductivity than that of the resistor element.




With the above configuration, resistance of the terminals can be made smaller than that of the resistor element because the terminals are made of a material having the same or greater electrical conductivity than that of the resistor element. This enables to reduce the proportion of resistance of the terminals in the entire resistor, allowing to ignore its effect on fluctuation of resistance due to deviation in measuring points of a resistance measuring terminal. The present invention can thus assure reproducibility of highly accurate measurement of resistance, providing the resistor which assures highly accurate measurement of resistance even if the measuring point is not precisely placed.



Claims
  • 1. A low-resistance resistor comprising:a resistor element made of metal sheet; and a metal terminal disposed at both ends of said resistor element, said terminal being made of metal having greater electrical conductivity than that of said resistor element, and having an L shape section face; wherein said resistor element and said terminal are electrically connected through a third metal, the resistor element being disposed on the L shape terminal.
  • 2. The low-resistance resistor as defined in claim 1, wherein at least a part of a surface of said resistor element is covered with an insulating layer.
  • 3. A low-resistance resistor comprising:a resistor element made of metal sheet: an insulating sheet attached to at least one face of said resistor element; and a metal terminal disposed at both ends of said resistor element, said terminal being made of metal having greater electrical conductivity than that of said resistor element, and having an L shape section face; wherein said resistor element and said terminal are electrically connected through a third metal, the resistor element being disposed on the L shape terminal.
  • 4. A resistor comprising:a metal resistor element provided with a step at both ends, a thickness of said both ends being thicker than a central portion of the metal resistor element; and a metal terminal disposed at both ends of said resistor element, said terminal having a one-side-open section face with an inner space broader than its opening, and being electrically connected to said step of said resistor element at least at said inner space of the opening.
Priority Claims (2)
Number Date Country Kind
9-269561 Oct 1997 JP
9-347471 Dec 1997 JP
Parent Case Info

This Application is a Divisional of U.S. patent application Ser. No. 09/509,928, filed Jul. 20, 2000, pending, which is a U.S. National Phase Application of PCT International Application PCT/JP98/04427 filed Oct. 1, 1998.

US Referenced Citations (4)
Number Name Date Kind
4509034 Sakai Apr 1985 A
4588976 Jaselli May 1986 A
5287083 Person et al. Feb 1994 A
5294910 Tani et al. Mar 1994 A
Foreign Referenced Citations (3)
Number Date Country
01-120801 May 1989 JP
06-20808 Jan 1994 JP
06-224014 Aug 1994 JP
Non-Patent Literature Citations (2)
Entry
Japanese search repot for PCT/JP98/04427 dated Nov. 24, 1998.
English translation of Form PCT/ISA/210.