1. Field of the Invention
This invention relates to luminescent ceramics, such as those used in light-emitting devices.
2. Description of the Related Art
White light-emitting diodes (LED) are well-known solid state lighting devices and have been widely put to practical use. Examples of uses of LEDs include indicators for various instruments, backlighting for LCD displays used in cellular phones, signboards, ornamental illumination, etc. For some applications, it is difficult to obtain an LED which emits light in the color range desired for the application. For example, many LEDs emit blue light, but often white light is desired for a device. In these situations, phosphors can be used to change the color of the emitted light. This is done by allowing blue or some other colored light emitted from the LED to pass through the phosphor. Some of the light passes through the phosphor unaltered, but some of the light is absorbed by the phosphor, which then emits light of a different wavelength. Thus, the phosphor tunes the apparent color of the emitted light by converting part of the light to light of a different wavelength. Many white light-emitting devices are based upon this type of color conversion. For example, one type of conventional white-light emitting device comprises a blue-LED and yellow light emitting YAG phosphor powder dispersed in encapsulant resin such as epoxy or silicone.
The luminous efficiency of LEDs has improved in recent years. As a result, LED use may expand to white light-emitting devices which require more luminance intensity such as headlights for automobiles, backlighting for mid- to large-size LCD displays, and general lighting replacing current fluorescent and incandescent lamps. For these applications, it may be helpful have a light-emitting device that maintains its emission efficiency under higher driving conditions and greater emission flux. In some instances, higher driving conditions may greatly increase heat generation in the LED device, and this increased temperature may reduce both LED efficiency and device lifetime. For example, a temperature rise may cause a reduction of the internal quantum efficiency of an LED semiconductor chip and a shortening of the encapsulant resin's lifetime. Recently, LED devices have been prepared which use a luminescent ceramic plate instead of a powder. This has helped reduce thermal quenching somewhat, possibly due to the better thermal conductivity of the plate as compared to a powder dispersed in a resin. However, thermal quenching remains a problem even for ceramic plates.
Some embodiments provide luminescent ceramics for use in light-emitting devices. These ceramics tend to have a lower amount of dopant than conventional luminescent ceramics in general use. In some embodiments, the luminescent ceramic comprises a host material comprising a rare earth element and at least one rare earth dopant, wherein the rare earth dopant may be about 0.01% to 0.5% of the rare earth atoms present in the material. Some embodiments provide a luminescent ceramic comprising: a polycrystalline phosphor represented by the formula (A1-xEx)3B5O12; wherein A is Y, Gd, La, Lu, Tb, or a combination thereof; x is in the range of about 0.0001 to about 0.005; B is Al, Ga, In, or a combination thereof; and E is Ce, Eu, Tb, Nd, or a combination thereof; wherein the ceramic has a wavelength of maximum absorbance in the range of about 420 nm to about 480 nm.
Some embodiments provide a luminescent ceramic comprising: a polycrystalline phosphor represented by the formula (Y1-(x+y)GdyCex)3B5O12, wherein x and B are the same as those described above, and y is in the range of about 0.005 to about 0.05.
Some embodiments provide a light-emitting device comprising: a light-emitting diode having a wavelength of maximum emission in the range of about 420 nm to about 480 nm, and a luminescent ceramic as disclosed herein, wherein the luminescent ceramic is positioned to receive and convert at least a portion of the light emitted from the light-emitting diode to light having a wavelength of maximum emission in the range of about 500 nm to about 700 nm.
These and other embodiments are described in greater detail below.
The drawings are not to scale.
Some of the embodiments disclosed herein provide a light-emitting device comprising a luminescent ceramic which has a lower amount of dopant than conventional luminescent ceramics in general use. In some embodiments, the luminescent ceramic comprises a polycrystalline phosphor with a low dopant concentration represented by formulas such as, but not limited to (A1-xEx)3B5O12, (Y1-xEx)3B5O12; (Gd1-xEx)3B5O12; (La1-xEx)3B5O12; (Lu1-xEx)3B5O12; (Tb1-xEx)3B5O12; (A1-xEx)3Al5O12; (A1-xEx)3Ga5O12; (A1-xEx)3In5O12; (A1-xCex)3B5O12; (A1-xEux)3B5O12; (A1-xTbx)3B5O12; (A1-xEx)3Nd5O12; and the like. In some embodiments, the ceramic comprises a garnet, such as a yttrium aluminum garnet, with a low dopant concentration. Some embodiments provide a composition represented by the formula (Y1-xCex)3Al5O12. Some embodiments provide a composition represented by the formula (Y1-(x+y)GdyCex)3Al5O12. In any of the above formulas, x may be in the range of about 0.0001 to about 0.005, from about 0.0005 to about 0.004, or alternatively, from about 0.0008 to about 0.0025. In some embodiments, y may be in the range of about 0.005 to about 0.05, from about 0.01 to about 0.03, or alternatively 0.015 to about 0.025.
The luminescent ceramics disclosed herein may be useful to absorb light emitted from a light-emitting diode and emit light of a different color, thus allowing tuning of the color. In some embodiments, the luminescent ceramic may absorb blue light and emit yellow light. For example, in some embodiments, the ceramic has a wavelength of maximum absorbance in the range of about 420 nm to about 480 nm, and a wavelength of maximum emission in the range of about 500 nm to about 750 nm, or alternatively, about 500 nm to about 600 nm.
Although the absorption-emission profile of a luminescent ceramic and the dopant concentration may affect the color of a light-emitting device, these are not the only tools available to tune the color. For example, without being limiting, the color may also be tuned by varying the thickness of the luminescent ceramic and/or by adding additional luminescent ceramics of various colors such as green, blue, and red.
In some embodiments, the luminescent ceramic may be made thicker to increase the amount of light emitted from the light-emitting diode which is converted to light of a different wavelength. Thus, the observed light will appear less like the color of the light-emitting diode and more like the color of the ceramic. Alternatively, the luminescent ceramic may be made thinner to decrease the amount of converted light, thus making the color appear more similar to that of the light-emitting diode. For example, in the case that the light-emitting diode emits blue light and the luminescent ceramic is yellow, or emits yellow light, a thinner ceramic may yield light which appears more blue, and a thicker ceramic may yield light which appears more white or yellow. In some embodiments, the luminescent ceramic has a thickness in the range of about 50 μm to about 5 mm, about 0.2 mm to about 2 mm, or alternatively, about 1 mm. The geometry of the luminescent ceramic may also affect the color of the emitted light since the effective thickness of the luminescent ceramic may depend upon the path the light takes through the ceramic. In some embodiments, the luminescent ceramic is a flat plate. In other embodiments, the luminescent ceramic is dome-shaped, convex, concave, capped, a plate with relief structure, a plate with a microlens structure, or the like.
In some embodiments, at least one additional component, e.g., a luminescent ceramic, is added to the device to tune the color of the light emitted by a device. The additional component may include any type of luminescent ceramic, and it may be of any color, such as red, blue, green, etc. Some embodiments provide a luminescent ceramic, or an additional luminescent ceramic, comprising a rare earth host material with a rare earth dopant, wherein the amount of rare earth dopant is in the range of about 0.01% to about 0.05%, or alternatively about 0.01% to 0.02% of the rare earth atoms in the ceramic. Some embodiments provide a luminescent ceramic comprising (Sr,Ca,Ba)2SiO4:Eu, Ca3SC2Si3O12:Ce, CaSc2O4:Ce, Ca3SiO4Cl2:EU, Sr3SiO5:EU, Ca3Si2O7:Eu, CaAl12O19:Mn, SrAl2O4:Eu, Ba3MgSi2O8:Eu, BaMgAl10O17:Eu, La2O2S:Eu, SrGa2S4:Eu, CaAlSiN3:Eu, Ca2Si5N8:Eu, and CaSiAlON:Eu, wherein the element following the colon is the dopant (for example, Ce is the dopant in Ca3Sc2Si3O12:Ce). The additional component, e.g., luminescent ceramic, may be in any form. In some embodiments, the additional luminescent ceramic is any form described above for the luminescent ceramic, such as flat plate. In some embodiments, the additional luminescent ceramic is in the form of particles dispersed in another part of the device, such as in a resin encapsulating the device.
In some embodiments, the low dopant concentration of the luminescent ceramic may reduce thermal quenching. In some embodiments, this may provide better thermal stability of the luminous efficiency to a light-emitting device, or in other words provide more stable luminous efficiency at high temperatures. In some embodiments, this may improve the thermal stability of the color, or in other words provide a more stable color at higher temperatures. In some embodiments, the luminescent ceramic has a first luminescent efficiency at 200° C. and a second luminescent efficiency at 25° C., wherein the first luminescent efficiency is at least about 80%, 82%, 85%, 87% or alternatively 90% of the second luminescent efficiency. In some embodiments, these luminescence efficiencies are determined at the wavelengths of peak emission of the luminescent ceramic. The particular value may vary according to the phosphor material and the activator concentration. In some embodiments, the luminescence efficiency of a luminescent ceramic comprising a cerium doped yttrium aluminum garnet (YAG:Ce) is determined by irradiating the ceramic at about 450-470 nm, or alternatively about 460 nm, and measuring luminescence at about 500-600 nm, about 510-550, or alternatively about 530 nm.
The luminescent ceramic may be transparent or translucent. However, in some instances small defects in the luminescent ceramic, such as air voids, may cause backscattering loss of light from a light-emitting diode. Normally, the number of defects in a luminescent ceramic material is small, and the backscattering loss is minimal. However, in some instances, since the number of defects may be small, it may difficult to obtain consistent scattering levels in the ceramic. Thus, in some embodiments, additional defects may be added which may increase the scattering, but may provide better consistency in the scattering from one ceramic to another. In some embodiments, the total light transmittance of the luminescent ceramic, measured at about 800 nm, is greater than or equal to about 50%, or alternatively about 60%, to about 70%, or alternatively about 80%. In some embodiments, additional scattering may be provided by controlling air void density or alien crystal phase growth (non-polycrystalline phase material). In some embodiments, the luminescent ceramic further comprises a second component, e.g., at least a second ceramic material. In some embodiments, the second ceramic material is selected from at least one of: yttrium aluminum garnet powder; amorphous powders comprising yttrium, aluminum, oxygen, and/or cerium; YAlO3:Ce; Al2O3 powders; alumina; yttria; and yttrium aluminum oxide.
There are many methods generally known in the art that may be applied to prepare the luminescent ceramics disclosed herein. In some embodiments, the luminescent ceramics are prepared by methods such as commonly known ceramic body fabrication procedures, including molded ceramic green compact preparation. In some embodiments, conventional molded ceramic compact manufacturing processes using ceramics raw powders with properly added polymer based binder materials and/or flux (such as SiO2 and/or MgO), dispersant, and/or solvent may be employed. In some embodiments, particle size may be important. For example, if the particle size becomes too large, it may become difficult to achieve the desired highly dense ceramic because large particles may not easily agglomerate or fuse to each other, even at high sintering temperature. Furthermore, increased particle size may increase the number of air voids in the ceramic layer. On the other hand, smaller nano-sized particles may have an increased ability to fuse with one another, which may result in highly dense and air void-free ceramic elements. In some embodiments, the raw powders used to prepare luminescent ceramics may be nano-sized particles with an average particle size no greater than about 1000 nm, or alternatively, no greater than about 500 nm.
In some embodiments, binder resin, dispersant, and/or solvent may be added to the raw powder during mixing and/or molding to facilitate the fabrication process. In some embodiments, the mixing process may employ equipment such as a mortar and pestle, a ball milling machine, a bead milling machine, etc. In some embodiments, the molding process utilizes methods such as simple die pressing, monoaxial pressing, hot isostatic pressing (HIP), and cold isostatic pressing (CIP). In some embodiments, to control the thickness of ceramic layer, controlled quantities of raw powders are loaded in a mold followed by applying pressure. In some embodiments, slip casting of slurry solution can be utilized to make a molded ceramic green compact. In some embodiments, the luminescent ceramic may be prepared by using flexible ceramic green sheet prepared by a tape casting method as widely employed in the multi-layer ceramic capacitor manufacturing process.
In some embodiments, the molded ceramic green body may be heat treated in an oxygen atmosphere, such as air, to remove binder resin or any other residues. The heat-treating may be carried out at any temperature higher than the temperature that the decomposition of the binder resin starts, but lower than the temperature at which the pores on the surface of the sample are closed off. In some embodiments, the heat-treating may comprise heating at a temperature in the range of 500° C. to 1000° C. for a time in the range of about 10 min to about 100 hr. The conditions may depend on binder resin decomposition speed, and may be adjusted to prevent warping and/or a deformation of ceramic green body.
Next, in some embodiments, sintering may be performed under a controlled atmosphere to provide void-free luminescent ceramics. The sintering temperature range depends on ceramic material being sintered, average particle size of raw powder, and density of ceramic green compact. In some embodiments where the ceramic comprises YAG:Ce, the sintering temperature may be in the range of about 1450° C. to about 1800° C. While any suitable sintering ambient condition may be employed, in some embodiments, the sintering ambient may be a vacuum; an inert gas such as helium, argon, and nitrogen; or a reducing gas such as hydrogen or mixture of hydrogen and inert gas.
The light emitting device comprising the luminescent ceramics disclosed herein may be any device that emits light. In one embodiment, a light emitting device may be a light emitting diode (LED), an organic light emitting diode (OLED), or an inorganic electroluminescent device (IEL).
In some embodiments, the luminescent ceramics may be mounted into a blue-LED to yield a device that emits light that appears more white.
Some embodiments comprise an additional luminescent ceramic. For example, one embodiment, illustrated in
In some embodiments, an additional luminescent ceramic is in a powder form.
In some embodiments, multiple LEDs may be incorporated into a light emitting device. For example, one embodiment, illustrated in
In other embodiments, multiple emitting units comprising a blue-LED 5 and a luminescent ceramic 10 are mounted on the substrate 1. For example, another embodiment illustrated in
In some embodiments, array type emitting units may also be assembled to form a light emitting device. As depicted in
Yttrium (III) nitrate hexahydrate (0.5988 mol, 229.346 g, 99.9% pure, Sigma-Aldrich), Aluminum nitrate nonahydrate (1.0 mol, 375.14 g, 99.97% pure, Sigma-Aldrich), and Cerium (III) nitrate hexahydrate (0.0012 mol, 0.521 g, 99.99% pure, Sigma-Aldrich) were dissolved in 1000 ml of deionized water. In this example, the Ce doping amount was 0.2 mol %.
This precursor solution of 1.6 M was carried into a plasma reaction chamber via an atomization probe using a liquid pump.
Deposition experiments were conducted with an RF induction plasma torch (TEKNA Plasma System, Inc PL-35 [Quebec, Canada]) operating at 3.3 MHz. RF generator plate power was in the range of 12-15 kW. Reactant injection was performed using a radial atomization probe (TEKNA Plasma System, Inc SDR-772). Crystalline phases of the deposited particles were investigated using X-ray diffraction (XRD) spectra obtained with a Rigaku Miniflex (Rigaku Americas, the Woodlands, Tex., USA)] (CuKα). The crystalline phase of the obtained sample was identified as mixture of amorphous and yttrium aluminum perovskite (YAP).
The average particle diameter (Dave) was obtained from BET surface area measurements based on data acquired from a Micrometritics model Gemini 2365 gas sorptometer (Norcross, Ga., USA). Obtained Dave of the sample was 87 nm. The powder obtained was then deagglomerated with a planet ball mill using 3 mm yttria stabilized zirconia ball under water. The obtained powder was pre-annealed at 1000° C. for 2 hours under the H2/N2=3%/97% mixture gas ambient. XRD showed phase pure YAG structure, and Dave obtained by BET measurement was 103 nm.
Preparation of Luminescent Ceramic Sample
The raw powder prepared above (with 4 g, Dave=103 nm), Poly(vinyl butyral-co-vinyl alcohol-co-vinyl acetate) (0.21 g, average Mw 90,000-120,000 powder, Sigma-Aldrich), fumed silica powder (0.012 g, CAB-O-SIL® HS-5, Cabot Corporation, Tuscola, Ill., USA), and methanol (10 ml) were mixed by ball mill. By blowing hot air form a dryer and continually moving the pestle, methanol was completely removed to obtain a dried powder. The dried powder (400 mg) was spread out into a die set with a diameter of 13 mm (Product#: 0012-6646, 3 mm KBr Die Set, International Crystal Laboratories, Inc., Garfield, N.J., USA) followed by applying a pressure of 5000 psi using hydraulic press. The resulting ceramic green compact was heat treated at 800° C. (heating rate is 4° C./min) for 1 hr in air in order to remove binder resin.
The ceramic compact was then sintered at 1600° C. (heating rate was 2° C./min) for 5 hours in vacuum. A yellow colored translucent YAG:Ce ceramic disc with a thickness about 1 mm was obtained.
The general procedure of Example 1 was repeated except that Ce doping amount was changed from 0.2 mol % to 0.05 mol % by changing the composition of nitrate precursor. A yellow colored translucent YAG:Ce ceramic disc was obtained. The color of the ceramic disc was slightly paler yellow compared to the sample obtained in Example 1.
The general procedure of Example 1 was repeated except that Ce doping amount was changed from 0.2 mol % to 0.4 mol % by changing the composition of nitrate precursor. A yellow colored translucent YAG:Ce ceramic disc was obtained. The color of the ceramic disc was slightly deeper in color compared to the sample obtained in Example 1.
The general procedure of Example 1 was repeated except that Yttrium (III) nitrate hexahydrate (0.5912 mol, 226.449 g, 99.9% pure, Sigma-Aldrich), Gadolinium (III) nitrate hexahydrate (0.0189 mol, 8.553 g, 99.99% pure, Sigma-Aldrich), Aluminum nitrate nonahydrate (1.0 mol, 375.14 g, 99.97% pure, Sigma-Aldrich), and Cerium (III) nitrate hexahydrate (0.0012 mol, 0.521 g, 99.99% pure, Sigma-Aldrich) were dissolved in 1000 ml of deionized water. In this example, the Yttrium amount was 97.8 mol %, the Gadolinium amount was 2.0 mol % and Ce doping amount was 0.2 mol %. A yellow colored translucent Y/Gd Aluminum Garnet:Ce ceramic disc was obtained. The color of the ceramic disc was slightly paler yellow compared to the sample obtained in Example 1.
The general procedure of Example 1 was repeated except that Ce doping amount was changed from 0.2 mol % to 0.8 mol % by changing the composition of nitrate precursor. A yellow colored translucent YAG:Ce ceramic disc was obtained. The color of the ceramic disc was deeper in color compared to the sample obtained in Example 1.
The general procedure of Example 1 was repeated except that Ce doping amount was changed from 0.2 mol % to 2.0 mol % by changing the composition of nitrate precursor. A yellow colored translucent YAG:Ce ceramic disc was obtained. The color of the ceramic disc was deeper in color compared to the sample obtained in Example 1.
The general procedure of Example 1 was repeated except that Ce doping amount was changed from 0.2 mol % to 5.0 mol % by changing the composition of nitrate precursor. A yellow colored translucent YAG:Ce ceramic disc was obtained but showed lower translucency. The color of the ceramic disc was much deeper in color compared to the sample obtained in Example 1.
Commercial YAG:Ce phosphor powder (Kasei Optonix, Ltd P46-Y3 [Odawara City, Kanagawa, Japan) having a median particle size around 6.6 micron meter was spread out into die set with 13 mm of diameter (Product#: 0012-6646, 3 mm KBr Die Set, International Crystal Laboratories, Inc) followed by applying a pressure of 5000 psi using hydraulic press. A YAG:Ce phosphor powder tablet with a thickness of about 1 mm was obtained.
Y2O3 (33.81 g, 99.99%), Al2O3 (25.49 g, 99.99%), CeO2 (0.1033 g, 99.9%), and 0.5 g tetraethyl orthosilicate (TEOS, 99.99%, Sigma-Aldrich) were mixed by planetary ball mill in methanol. Poly(vinyl butyral-co-vinyl alcohol-co-vinyl acetate) (2.5 g, average Mw 90,000-120,000 powder, Sigma-Aldrich) was then added as a binder. In this example, the Ce doping amount was about 0.2 mol %.
By blowing hot air from a dryer and while continuing to move the pestle, methanol was completely removed to obtain a dried powder. The dried powder (400 mg) was spread out into a die set with a diameter of 13 mm (Product#: 0012-6646, 3 mm KBr Die Set, International Crystal Laboratories, Inc) followed by applying a pressure of 5000 psi using a hydraulic press. Then, the obtained ceramics green compact was heat treated at 800° C. (heating rate is 4° C./min) for 1 hr in air in order to remove binder resin.
The ceramic compact was then sintered at 1700° C. (heating rate was 2° C./min) for 5 hours in vacuum. A yellow colored translucent YAG:Ce ceramic disc with a thickness about 1 mm was obtained.
Evaluation of Thermal Quenching Property
Thermal quenching measurement were performed with Otsuka Electronics MCPD 7000 multi channel photo detector system together with associated optical components such as integrating spheres, light source, monochromator, optical fibers, and temperature controllable sample holder.
The obtained luminescent ceramic disc or powder tablet was irradiated with a Xe lamp (150W, L2274) at 460 nm after passing through a monochromator. An emission spectrum was acquired by using an integrating sphere. This measurement was performed over the range from 25° C. to 200° C. by 25° C. step while maintaining the same measurement condition. The peak values of the emission spectra were normalized by the value of 25° C., and then summarized in Table 1.
In Example 1, a thinner luminescent ceramic disc was prepared by spreading out 95 mg of said dried powder into the same die set with 13 mm of diameter. After sintering at 1600° C. for 5 hours in vacuum, a yellow colored translucent YAG:Ce ceramic disc with thickness about 240 micrometer was obtained.
Total light transmittance of the obtained luminescent ceramic disc was measured by using the optical configuration shown in
The measurement system of
The ceramic disc was carefully cut down into the size of around 1.5 mm×1.5 mm by using a diamond cutter. The small piece of ceramic disc was mounted into a blue LED chip by the following procedure. Casting type epoxy resin (Nitto Denko Corporation, NT8080) was used as encapsulant resin. A very small amount of epoxy resin was put onto an LED chip by using a toothpick. And then, the phosphor disk piece was carefully mounted onto the LED chip followed by curing at 135° C. for 5 hours. A LED device with a ceramic disk was driven, and white color emission was observed.
Casting type epoxy resin (0.4 g) was mixed with commercial YAG:Ce phosphor powder (0.6 g, Kasei Optonix, Ltd P46-Y3). The mixed solution was mounted onto the same type of blue LED chip used in Example 5, followed by being temporally cured at 135° C. for 30 min. Since the emission color was yellowish rather than white, the phosphor dispersed epoxy resin layer was carefully scratched by using sand paper until the emission color became white. This was followed by full curing at 135° C. for 5 hours.
A LED device with a commercial YAG:Ce phosphor powder was driven, and white color emission was observed.
A nano-sized powder similar to that described in Example 1, obtained right after plasma processing (Dave=87 nm) was annealed at 1400° C. for 2 hours under the H2/N2=3%/97% mixture gas ambient. The obtained powder showed a single YAG phase. The color was yellow but much paler than the commercial YAG:Ce powder used in Comparative Example 6.
Casting type epoxy resin (0.5 g) was mixed with YAG:Ce powder (0.5 g) By the same method described in Comparative Example 6, a LED device with YAG:Ce phosphor powder was driven, and white color emission was observed.
LED Performance Test
White light emission spectra for each LED were acquired by using Otsuka Electronics MCPD 7000 multi channel photo detector system (Osaka, Japan) together with associated optical components such as integrating spheres, optical fibers, and DC power source. Emission spectra under a driving condition of 20 mA were acquired for each LED device.
CIE chromaticity variation on driving current of Example 5 and Comparative Example 5 are given in Table A
This application claims the benefit of U.S. Provisional Patent Application No. 61/183,004, filed Jun. 1, 2009, which is incorporated by reference herein in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
5032568 | Lau et al. | Jul 1991 | A |
5061682 | Aksay et al. | Oct 1991 | A |
5200595 | Boulos et al. | Apr 1993 | A |
5321223 | Kimrey et al. | Jun 1994 | A |
5369091 | Fortunati et al. | Nov 1994 | A |
5401484 | Wurmbauer et al. | Mar 1995 | A |
5447708 | Helble et al. | Sep 1995 | A |
5560844 | Boulos et al. | Oct 1996 | A |
5599511 | Helble et al. | Feb 1997 | A |
5609921 | Gitzhofer et al. | Mar 1997 | A |
5625256 | Tiedt et al. | Apr 1997 | A |
5644193 | Matsuda et al. | Jul 1997 | A |
5998925 | Shimizu et al. | Dec 1999 | A |
6059936 | Cathey et al. | May 2000 | A |
6180029 | Hampden-Smith et al. | Jan 2001 | B1 |
6482387 | Glgn et al. | Nov 2002 | B1 |
6601776 | Oljaca et al. | Aug 2003 | B1 |
6656588 | Laine et al. | Dec 2003 | B1 |
6844285 | Wei | Jan 2005 | B1 |
6884514 | Simpson et al. | Apr 2005 | B2 |
6905636 | Yuan et al. | Jun 2005 | B2 |
6994837 | Boulos et al. | Feb 2006 | B2 |
7025756 | Frazier et al. | Apr 2006 | B2 |
7112758 | Ma et al. | Sep 2006 | B2 |
7126274 | Shimizu et al. | Oct 2006 | B2 |
7220398 | Sutorik et al. | May 2007 | B2 |
7253129 | Takagimi et al. | Aug 2007 | B2 |
7361938 | Mueller et al. | Apr 2008 | B2 |
20030094596 | Kijima et al. | May 2003 | A1 |
20030111644 | Chen et al. | Jun 2003 | A1 |
20030116080 | Huang | Jun 2003 | A1 |
20040101617 | Devi et al. | May 2004 | A1 |
20040145308 | Rossner et al. | Jul 2004 | A1 |
20050269582 | Mueller et al. | Dec 2005 | A1 |
20050271566 | Yadav | Dec 2005 | A1 |
20060045811 | Sugiyama | Mar 2006 | A1 |
20060051505 | Kortshagen et al. | Mar 2006 | A1 |
20060124951 | Sakata et al. | Jun 2006 | A1 |
20060125410 | Duggal et al. | Jun 2006 | A1 |
20060250069 | Sakata et al. | Nov 2006 | A1 |
20060265088 | Warford et al. | Nov 2006 | A1 |
20070029291 | Boulos et al. | Feb 2007 | A1 |
20070126017 | Krames et al. | Jun 2007 | A1 |
20070272664 | Schroder et al. | Nov 2007 | A1 |
20080020139 | Arbab et al. | Jan 2008 | A1 |
20080108496 | Gratson et al. | May 2008 | A1 |
20080138538 | Lewis et al. | Jun 2008 | A1 |
20080187746 | De Graaf et al. | Aug 2008 | A1 |
20080258109 | Kang et al. | Oct 2008 | A1 |
20080265749 | Bechtel et al. | Oct 2008 | A1 |
20090128738 | Matsumoto et al. | May 2009 | A1 |
20090212697 | Nakamura et al. | Aug 2009 | A1 |
20090262428 | Kurokawa | Oct 2009 | A1 |
Number | Date | Country |
---|---|---|
1 473 348 | Nov 2004 | EP |
1 588 991 | Oct 2005 | EP |
4-119914 | Apr 1992 | JP |
WO 2006097876 | Sep 2006 | WO |
WO 2007107915 | Sep 2007 | WO |
WO 2007107917 | Sep 2007 | WO |
WO 2008025723 | Mar 2008 | WO |
WO 2008026540 | Mar 2008 | WO |
WO 2008112710 | Sep 2008 | WO |
Number | Date | Country | |
---|---|---|---|
20100301739 A1 | Dec 2010 | US |
Number | Date | Country | |
---|---|---|---|
61183004 | Jun 2009 | US |