Patent Grant
11728067
Embodiments of the disclosure relate generally to magnet wire and, more particularly, to magnet wire that includes insulation systems incorporating corona resistant polyamideimide designed to improve the life and thermal conductivity of motor windings.
Magnet wire, also referred to as winding wire or magnetic winding wire, is utilized in a wide variety of electric machines and devices, such as inverter drive motors, motor starter generators, transformers, etc. Magnet wire typically includes polymeric enamel insulation formed around a central conductor. The enamel insulation is formed by applying a varnish onto the wire and curing the varnish in an oven to remove solvents, thereby forming a thin enamel layer. This process is repeated until a desired enamel build or thickness is attained. Polymeric materials utilized to form enamel layers are intended for use under certain maximum operating temperatures. Additionally, electrical devices may be subject to relatively high voltage conditions that may break down or degrade the wire insulation. For example, an inverter may generate variable frequencies that are input into certain types of motors, and the variable frequencies may exhibit steep wave shapes that cause premature motor winding failures.
Attempts have been made to reduce premature failures as a result of degradation of the wire insulation. These attempts have included minimizing damage to the wire and insulation during handling and manufacture of electric machines and devices, and using shorter lead lengths where appropriate. Further, a reactor coil or a filter between an inverter drive and a motor can extend the life of the windings by reducing the voltage spikes and high frequencies generated by the inverter drive/motor combination. However, such coils are expensive and add to the overall cost of the system. Increasing the amount of insulation can improve the life of the windings in an electrical device, but this option is both expensive and decreases the amount of space for the copper in the device, thereby producing a less efficient motor. Additionally, inter layer delamination may occur once a certain number of enamel layers has been reached.
More recent attempts to improve corona resistance involve the incorporation of filler materials into enamel. Wires have been developed that include multi-layer insulation systems in which filler material is dispersed in at least one enamel layer. However, many of these conventional wires have been found to exhibit poor flexibility when bent and shaped prior to incorporation into a motor assembly. In many cases, at least the outermost enamel layer (or topcoat) and sometimes more than one enamel layer was found to crack when the wires were shaped. Greater cracking was identified in rectangular or shaped wire. Therefore, there is an opportunity for improved magnet wire with insulation designed to withstand higher temperatures and/or voltages present within electrical devices for longer periods of time and that further exhibits improved flexibility that allows the wire to be bent and shaped.
The detailed description is set forth with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The use of the same reference numbers in different figures indicates similar or identical items; however, various embodiments may utilize elements and/or components other than those illustrated in the figures. Additionally, the drawings are provided to illustrate example embodiments described herein and are not intended to limit the scope of the disclosure.
Certain embodiments of the present disclosure are directed to magnet wire that includes a multi-layer insulation system having improved corona resistance, thermal life, and flexibility relative to conventional magnet wire. According to an aspect of the disclosure, a magnet wire may include a conductor and an insulation system formed around the conductor. The insulation system may include at least three layers of enamel insulation. A basecoat may be formed from a first polymeric material, such as polyester, THEIC polyester, polyester imide, or polyamideimide (“PAI”). In one example embodiment, the basecoat may be formed from THEIC polyester having a relatively high solids content and viscosity. A midcoat may be formed from a base resin material that includes PAI, and filler material may be added to or blended into the base resin material. A topcoat, such as a topcoat formed from unfilled PAI, may then be formed over the filled PAI midcoat.
Each of the basecoat, midcoat, and topcoat may include any suitable number of sublayers that provide a desired layer thickness. Additionally, any suitable ratios of thicknesses between the basecoat, midcoat, and topcoat may be utilized. In certain embodiments, the basecoat may have a first thickness between approximately ten percent (10%) and seventy percent (70%) of a total insulation thickness; the midcoat may have a second thickness between approximately five percent (5%) and eighty percent (80%) of the total insulation thickness, and the topcoat may have a third thickness between approximately five percent (5%) and fifty percent (50%) of the total insulation thickness. In certain embodiments, the basecoat may occupy between approximately forty-five percent (45%) and sixty-five percent (65%) of a total thickness, the midcoat may occupy between approximately twenty-five percent (25%) and forty percent (40%) of the total thickness, and the topcoat may occupy between five percent (5%) and fifteen percent (15%) of the total thickness. In yet other embodiments, the basecoat may occupy between approximately forty-five percent (45%) and sixty-five percent (65%) of a total thickness, the midcoat may occupy between approximately five (5%) and forty percent (40%) of the total thickness, and the topcoat may occupy between five percent (5%) and thirty-five percent (35%) of the total thickness. It has been found in certain embodiments that a magnet wire may provide desired electrical performance if the midcoat occupies at least five percent (5%) of a total enamel insulation thickness. In other embodiments, desired electrical performance may be provided if the midcoat occupies at least fifteen, twenty, or twenty-five percent of a total enamel insulation thickness.
According to an aspect of the disclosure, the midcoat may include filler material added to a polymeric resin that includes PAI. Even though the base resin may include polymeric materials in addition to PAI, for ease of understanding, the resin may be referred to as a PAI resin. The filler material may include a blend of at least chromium(III) oxide (Cr2O3) (also referred to as chromium oxide) and silica dioxide (SiO2) (also referred to as silica). A blend may additionally include other suitable materials as desired, such as titanium(IV) oxide (TiO2) (also referred to as titanium dioxide). The addition of the filler may improve the corona resistance and/or thermal life of an enamel layer formed from filled PAI and/or a magnet wire insulation system that incorporates a filled PAI enamel layer. As a result, the life of the magnet wire and/or an electrical device (e.g., motor, etc.) incorporating the magnet wire may be increased or extended under partial discharge and/or other adverse conditions. Filler material may be added to PAI at any suitable ratio to form a filled PAI layer. For example, in certain embodiments, a total amount of filler may be between approximately ten percent (10%) and approximately twenty-five percent (25%) by weight, such as approximately fifteen percent (15%) by weight. A wide variety of blending or mixing ratios may be utilized for various components incorporated into a filler. For example, chromium oxide and silica dioxide may be blended at a wide variety of suitable ratios by weight. In various embodiments, a filler may include between approximately twenty percent (20%) and approximately eighty percent (80%) by weight of silica dioxide and between approximately twenty percent (20%) and approximately eighty (80%) by weight of chromium oxide.
A multi-layer enamel system that combines a filled PAI midcoat with additional enamel layers may provide a wide variety of benefits. For example, an overall cost of an enamel system may be reduced relative to a system that includes all filled PAI. However, an overall performance of the enamel system (e.g., thermal endurance, corona resistance, etc.) may be comparable to that of insulation including all filled PAI and/or may be suitable for a desired application (e.g., an electric vehicle application, etc.). As another example, an enamel system may provide enhanced flexibility that permits a magnet wire to be shaped or processed. For example, a magnet wire may be bent into U-shaped hairpins or other suitable shapes for incorporation into a motor application, and enhanced flexibility permits the wire to be shaped without cracks being formed in the enamel insulation.
Other embodiments of the disclosure are directed to methods of making magnet wire that includes a multi-layer insulation system having improved corona resistance, thermal life, and flexibility. A conductor may be provided and a multi-layer insulation system may be formed around the conductor. In order to form the insulation system, a basecoat of first polymeric enamel insulation may be formed around the conductor. In certain embodiments, the first polymeric enamel insulation may include THEIC polyester, such as THEIC polyester formed from a resin material having a relatively high solids content and/or viscosity. For example, a varnish including THEIC polyester may be applied to the wire and cured in order to form the basecoat. In other embodiments, the first polymeric material may include, polyester, polyester imide, PAI, or another suitable material. A midcoat of second polymeric enamel insulation may be formed around the basecoat (e.g., by applying a varnish including filled PI and curing the applied material), and the second polymeric enamel insulation may include a filler dispersed in a base polyamideimide material. The filler may include a combination of silica dioxide and chromium oxide, such as 20 percent to 80 percent by weight of silica dioxide and 20 to 80 percent by weight of chromium oxide. Additionally, the filler may constitute between 10 percent and 25 percent by weight of the second polymeric insulation. A topcoat of third polymeric enamel insulation, such as third polymeric enamel insulation that includes unfilled PAI, may be formed around the midcoat (e.g., by applying a varnish including PAI and curing the applied material). The basecoat, midcoat, and topcoat may be formed with a wide variety of suitable thicknesses and/or builds, and a wide variety of suitable ratios of thicknesses may be utilized. Additionally, when the formed magnet wire is subsequently bent 180 degrees around a 4 mm mandrel, a topcoat crack frequency is less than 1.0, where the topcoat crack frequency representing a number of cracks in the respective topcoats per twenty samples of the wire respectively bent around the mandrel.
During formation of magnet wire, a wide variety of thicknesses and thickness ratios may be utilized with respect to the basecoat, midcoat, and topcoat. In one example, embodiment, forming a midcoat may include forming a midcoat that occupies at least twenty-five percent of the overall thickness of the insulation system. As another example, forming a basecoat may include forming a basecoat having a first thickness that is between ten percent and seventy percent of the total thickness of the insulation system; forming a midcoat may include forming a midcoat having a second thickness that is between twenty-five percent and eighty percent of the total thickness; and forming a topcoat may include forming a topcoat having a third thickness that is between five percent and fifty percent of the total thickness. As yet another example, forming a basecoat may include forming a basecoat having a first thickness that is between forty-five percent and sixty-five percent of the total thickness of the insulation system; forming a midcoat may include forming a midcoat having a second thickness that is between twenty-five percent and forty percent of the total thickness; and forming a topcoat may include forming a topcoat having a third thickness that is between five percent and fifteen percent of the total thickness.
Embodiments of the disclosure now will be described more fully hereinafter with reference to the accompanying drawings, in which certain embodiments of the disclosure are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.
The conductor 110 may be formed from a wide variety of suitable materials or combinations of materials. For example, the conductor 110 may be formed from copper, aluminum, annealed copper, oxygen-free copper, silver-plated copper, nickel plated copper, copper clad aluminum (“CCA”), silver, gold, a conductive alloy, a bimetal, carbon nanotubes, or any other suitable electrically conductive material. Additionally, the conductor 110 may be formed with any suitable cross-sectional shape, such as the illustrated circular or round cross-sectional shape. In other embodiments, a conductor 110 may have a rectangular (as shown in
Any number of layers of enamel, such as the illustrated basecoat 120, midcoat 130, and topcoat 140, may be formed around the conductor 110. An enamel layer is typically formed by applying a polymeric varnish to the conductor 110 and then baking the conductor 110 in a suitable enameling oven or furnace. The polymeric varnish typically includes thermosetting polymeric material or resin (i.e., solids) suspended in one or more solvents. A thermosetting or thermoset polymer is a material that may be irreversibly cured from a soft solid or viscous liquid (e.g., a powder, etc.) to an insoluble or cross-linked resin. Thermosetting polymers typically cannot be melted for application via extrusion as the melting process will break down or degrade the polymer. Thus, thermosetting polymers are suspended in solvents to form a varnish that can be applied and cured to form enamel film layers. Following application of a varnish, solvent is removed as a result of baking or other suitable curing, thereby leaving a solid polymeric enamel layer. As desired, a plurality of layers of enamel may be applied to the conductor 110 in order to achieve a desired enamel thickness or build (e.g., a thickness of the enamel obtained by subtracting the thickness of the conductor and any underlying layers). Each enamel layer may be formed utilizing a similar process. In other words, a first enamel layer may be formed, for example, by applying a suitable varnish and passing the conductor through an enameling oven. A second enamel layer may subsequently be formed by applying a suitable varnish and passing the conductor through either the same enameling oven or a different enameling oven. Additional layers are formed in a similar manner. An enameling oven may be configured to facilitate multiple passes of a wire through the oven. As desired, other curing devices may be utilized in addition to or as an alternative to one or more enameling ovens. For example, one or more suitable infrared light, ultraviolet light, electron beam, and/or other curing systems may be utilized.
Each layer of enamel, such as the basecoat 120, midcoat 130, and topcoat 140, may be formed with any suitable number of sublayers. For example, the basecoat 120 may include a single enamel layer or, alternatively, a plurality of enamel layers or sublayers that are formed until a desired build or thickness is achieved. Each layer of enamel may have any desired thickness, such as a thickness of approximately 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 70, 75, 80, 90, or 100 micrometers, a thickness included in a range between any two of the aforementioned values, and/or a thickness included in a range bounded on either a minimum or maximum end by one of the aforementioned values. A total insulation system (e.g., a combined thickness of the enamel layers) may also have any suitable thickness, such as a thickness of approximately, 30, 40, 50, 60, 70, 75, 80, 90, 100, 125, 150, 175, 200, 225, 250, 275, or 300 micrometers, a thickness included in a range between any two of the aforementioned values (e.g., a thickness between 60 and 100 microns, etc.), and/or a thickness included in a range bounded on either a minimum or maximum end by one of the aforementioned values. In certain embodiments, the example thickness values may apply to the thickness of an enamel layer or overall enamel system. In other embodiments, the example thickness values may apply to the build (e.g., a change in overall thickness of a wire resulting from addition of enamel, twice the thickness of an enamel layer or enamel system, the thickness on both sides of a wire resulting from the enamel layer or enamel system, etc.) of an enamel layer or overall enamel system. In yet other embodiments, the example thickness values provided above may be doubled in order to provide example build thickness values for an enamel layer or enamel system. Indeed, a wide variety of different wire constructions may be formed with enamel layers and/or insulation systems having any suitable thicknesses.
A wide variety of different types of polymeric materials may be utilized as desired to form an enamel layer. Examples of suitable thermosetting materials include, but are not limited to, polyamideimide (“PAI”), amideimide, polyester, tris(2-hydoxyethyl isocyanurate) or THEIC polyester, polyesterimide, polyimide, polysulfone, polyphenylenesulfone, polysulfide, polyphenylenesulfide, polyetherimide, polyamide, polyketones, etc. According to an aspect of the disclosure, at least one enamel layer, such as the midcoat 130, may include filled PAI. In certain embodiments, an entire enamel insulation system may be formed from PAI. For example, an enamel insulation system may include an unfilled PAI basecoat 120, a filled PAI midcoat 130, and an unfilled PAI topcoat 140. In other embodiments, one or more PAI layers may be combined with enamel layers formed from other types of thermoset material. For example, a basecoat 120 may be formed from a material other than PAI, such as polyester or THEIC polyester. A midcoat 130 may then be formed from filled PAI, and a topcoat 140 may be formed from unfilled PAI or another suitable thermosetting material. Any suitable thickness ratios may be utilized between the different enamel layers. Indeed, a wide variety of suitable combinations of enamel layers may be formed from any suitable materials and/or combinations of materials.
In certain embodiments, a magnet wire 100 may be formed with a three-layer insulation system. A basecoat 120 may be formed from a first polymeric material, such as polyester, THEIC polyester, polyester imide, or PAI. A midcoat 130 may be formed from filled PAI. A topcoat 140, such as a topcoat formed from unfilled PAI, may then be formed over the filled PAI midcoat 130. In one example embodiments, a basecoat 120 may include THEIC polyester. As desired, a THEIC polyester or modified THEIC polyester enamel may be formed from a material having a relatively high solids content and/or a relatively high viscosity. For example, the solids content may be at least 40% and preferably at least 50%. In certain embodiments, the solids content may be between 50% and 55%. In certain embodiments, the THEIC polyester material may have a viscosity of at least 25,000 centipoise, such as a viscosity between 25,000 and 65,000 centipoise. As a result of including a relatively high solids content and high viscosity, a basecoat 120 may be formed with a relatively low concentricity, such as a concentricity below 1.3, below 1.2 or below 1.1. This remains true for rectangular wire (such as the wire 150 of
As desired, the base PAI material utilized to form the midcoat 130 may have a relatively high solids content and/or relatively high viscosity. For example, the solids content may be at least 25% and preferably at least 30%. In certain embodiments, the solids content may be between 30% and 45%. In certain embodiments, the filled PAI material may have a viscosity of at least 10,000 centipoise, such as a viscosity between 10,000 and 25,000 centipoise. As a result of including relatively high solids content and high viscosity, a midcoat 130 may be formed with a relatively low concentricity, such as a concentricity below 1.3, below 1.2, or below 1.1 and the resulting flexibility of a magnet wire insulation system may be enhanced.
Any suitable ratios of thicknesses between the basecoat 120, midcoat 130, and topcoat 140 may be utilized in various embodiments. As desired, the thicknesses of different enamel layers may be based at least in part upon a desired application for the magnet wire 100 (e.g., hybrid and electric vehicle applications, etc.) and associated performance requirements, such as desired thermal performance, corona resistance, partial discharge performance, flexibility, etc. In certain embodiments, the basecoat 120 may have a first thickness that is between approximately ten percent (10%) and seventy percent (70%) of a total insulation thickness; the midcoat 130 may have a second thickness that is between approximately five percent (5%) and eighty percent (80%) of the total insulation thickness, and the topcoat 140 may have a third thickness that is between approximately five percent (5%) and fifty percent (50%) of the total insulation thickness. In certain embodiments, the basecoat 120 may occupy between approximately forty-five percent (45%) and sixty-five percent (65%) of a total thickness, the midcoat 130 may occupy between approximately twenty-five percent (25%) and forty percent (40%) of the total thickness, and the topcoat 140 may occupy between five percent (5%) and fifteen percent (15%) of the total thickness. In yet other embodiments, the basecoat may occupy between approximately forty-five percent (45%) and sixty-five percent (65%) of a total thickness, the midcoat may occupy between approximately five (5%) and forty percent (40%) of the total thickness, and the topcoat may occupy between five percent (5%) and thirty-five percent (35%) of the total thickness.
A wide variety of other suitable thickness ratios between a basecoat 120, midcoat 130, and topcoat 140 may be utilized as desired. In certain embodiments, the thickness of a filled PAI layer (e.g., a filled PAI midcoat 130, etc.) relative to the other enamel layers (e.g., a basecoat 120 and topcoat 140) may result in an insulation system having a desired overall performance that is improved relative to conventional enamel insulation systems. In other words, when the filled PAI insulation occupies a sufficient level of the overall insulation thickness, a magnet wire 100 may exhibit one or more desired performance characteristics, such as a desired thermal index, a desired thermal life, a desired corona resistance, a desired partial discharge inception voltage, etc. In certain embodiments, a filled PAI enamel layer (e.g., a filled PAI midcoat 130, etc.) may occupy at least five percent (5%) of the overall insulation thickness. Indeed, the filled PAI enamel layer may be sufficient for certain applications if it is thick enough to disperse a corona charge. In other embodiments, the filled PAI enamel layer (e.g., a filled PAI midcoat 130, etc.) may occupy at least twenty-five percent (25%) or at least thirty percent (30%) of the overall insulation thickness. In various other embodiments, the filled PAI enamel may have a thickness that occupies at least 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 70, 75, or 80% of the overall enamel thickness, or a thickness included in a range between any two of the above values.
A wide variety of benefits may be provided by incorporating a filled PAI into a multi-layer enamel insulation system. In certain embodiments, incorporation of a filled PAI enamel layer (e.g., a filled midcoat layer 130 in a three-layer insulation system, etc.) may improve the thermal performance, corona discharge performance, and/or the partial discharge performance of a magnet wire insulation system relative to conventional magnet wires. These performance characteristics may be similar or comparable to insulation that includes all filled PAI enamel. However, the combination of additional layers (i.e., non-filled PAI layer(s)) may lower or reduce an overall cost of the enamel insulation system relative to enamel that includes all filled PAI or higher cost materials. In other words, a sufficient amount of filled PAI enamel may be included to attain desired performance while lower cost enamel(s) may be utilized to achieve a desired overall insulation build or thickness and/or to promote other desired parameters, such as adhesion to the conductor 110 and/or lower abrasion.
With continued reference to the wires 100, 150 of
In certain embodiments, one or more suitable surface modification treatments may be utilized on a conductor and/or any number of enamel layers to promote adhesion with a subsequently formed enamel layer. Examples of suitable surface modification treatments include, but are not limited to, a plasma treatment, an ultraviolet (“UV”) treatment, a corona discharge treatment, and/or a gas flame treatment. A surface treatment may alter a topography of a conductor or enamel layer and/or form functional groups on the surface of the conductor or enamel layer that enhance or promote bonding of a subsequently formed layer. The altered topography may also enhance or improve the wettability of a varnish utilized to form a subsequent enamel layer by altering a surface tension of the treated layer. As a result, surface treatments may reduce interlayer delamination.
As desired in various embodiments, one or more other layers of insulation may be incorporated into a magnet wire 100, 150 in addition to a plurality of enamel layers. For example, one or more extruded thermoplastic layers (e.g., an extruded overcoat, etc.), semi-conductive layers, tape insulation layers (e.g., polymeric tapes, etc.), and/or conformal coatings (e.g., a parylene coating, etc.) may be incorporated into a magnet wire 100, 150. A wide variety of other insulation configurations and/or layer combinations may be utilized as desired. Additionally, an overall insulation system may include any number of suitable sublayers formed from any suitable materials and/or combinations of materials.
According to an aspect of the disclosure, one or more polyamideimide layers (and potentially other enamel layers) may include a suitable filler. For example, one or more PAI enamel layers incorporated into a magnet wire, such as magnet wires 100, 150 may include a suitable filler. Additionally, the filler may include a blend of at least chromium(III) oxide (Cr2O3) and silica dioxide (SiO2). A blend of chromium oxide and silica dioxide may additionally include other suitable materials as desired, such as titanium(IV) oxide (TiO2). In other embodiments, the filler may include a blend of at least titanium dioxide and silica dioxide. The addition of the filler may improve the corona resistance and/or thermal life of an enamel layer formed from filled PAI on a magnet wire (e.g., the midcoat 130 in
The addition of the filler may also improve the thermal conductivity of a magnet wire 100, 150. One or more filled PAI insulation layers may conduct or draw heat away from the conductor of a magnet wire. As a result, the magnet wire may operate at a relatively lower temperature than conventional magnet wires that do not include filled insulation layers. For example, when utilized in an electric machine, the magnet wire and/or the electric machine may operate at a temperature that is approximately 5, 6, 7, 8, 9, 10, 11, or 12 degrees Centigrade lower than conventional devices that do not utilize filled insulation layers. This improved thermal conductivity may facilitate operation of magnet wire and/or electric machines at higher voltages, thereby improving output. In various embodiments, a filled PAI insulation layer may have a thermal conductivity that is at least 1.5, 2, 3, or 4 times that of an unfilled PAI insulation layer having a similar thickness. In other words, a filled PAI insulation layer may have a first thermal conductivity that is at least 1.5, 2, 3, or 4 times that of a second thermal conductivity for the base PAI material into which filler is added.
Filler material may be added to PAI at any suitable ratio. In certain embodiments, a total amount of filler in a filled PAI enamel insulation layer may be between approximately ten percent (10%) and approximately twenty-five percent (25%) by weight. For example, a total amount of filler may be between approximately fifteen percent (15%) and approximately twenty percent (20%) by weight. In various other embodiments, a total amount of filler may be approximately 5, 7.5, 10, 12.5, 15, 17, 17.5, 20, 25, 30, 35, 40, 45, or 50 percent by weight, an amount included in a range between any two of the above values, or an amount included in a range bounded on either a minimum or maximum end by one of the above values. Substantial improvement in the life of windings was not observed at total filler levels much below about 5% by weight and, for certain magnet wire applications, insulation flexibility may be unacceptable as the filler percentage by weight is increased and exceeds a threshold value. For example, flexibility may be negatively impacted at total filler levels greater than about 50% based on weight.
A wide variety of blending or mixing ratios may be utilized for various components incorporated into a filler. For example, chromium oxide and silica dioxide may be blended at a wide variety of suitable ratios by weight. In various embodiments, a filler may include between approximately twenty percent (20%) and approximately eighty percent (80%) by weight of silica dioxide and between approximately twenty percent (20%) and approximately eighty (80%) by weight of chromium oxide. For example, a filler may include approximately 20, 25, 30, 33, 35, 40, 45, 50, 55, 60, 65, 67, 70, 75, or 80 percent by weight of silica dioxide, a weight percentage included in a range between any two of the above values (e.g., between 20% and 40%, etc.), or a weight percentage included in a range bounded on either a minimum or maximum end by one of the above values (e.g., at least 20%, etc.). Similarly, a filler may include approximately 20, 25, 30, 33, 35, 40, 45, 50, 55, 60, 65, 67, 70, 75, or 80 percent by weight of chromium oxide, a weight percentage included in a range between any two of the above values (e.g., between 20% and 40%, etc.), or a weight percentage included in a range bounded on either a minimum or maximum end by one of the above values (e.g., at least 20%, etc.). As desired, a ratio of a first component (e.g., titanium dioxide) to a second component (e.g., silica dioxide) may be approximately 80/20, 75/25, 70/30, 67/33, 65/35, 60/40, 55/45, 50/50, 45/55, 40/60, 35/65, 33/67, 30/70, 25/75, 20/80, or any other suitable ratio.
In certain embodiments, the components utilized in a filler may be selected based upon one or more desired properties. For example, a first filler component (e.g., chromium oxide, etc.) may be selected as an inorganic oxide having a relatively low resistivity and a second filler component (e.g., silica dioxide, etc.) may be selected as an inorganic oxide having a relatively large surface area. The mixture may be added to PAI prior to formation of an enamel layer, and the PAI enamel layer may include a mixture of a large surface area inorganic oxide and a low resistivity inorganic oxide. A large surface area inorganic oxide is believed to permit more energy to penetrate through the insulation, thereby reducing the degradation of the insulation caused by high voltage and high frequency wave shapes in electrical devices. Silica dioxide or silica is commercially available in grades having a wide variety of specific surface areas, such as surface areas ranging from approximately 90 to approximately 550 m2/g. For example, AEROSIL 90, available from Evonik Degussa Corporation, has a specific surface area of 90 m2/g, and CAB-O-SIL EH-5, available from Cabot Corporation, has a specific surface area of 380 m2/g. In certain embodiments, the resistance to the voltage wave shapes present in the windings of an electrical device may be improved with increasing silica surface area. Thus, silica grades having specific surface areas between approximately 380 m2/g and approximately 550 m2/g are preferred, or silica grades having specific surface areas greater than approximately 380 m2/g, 550 m2/g, or another threshold value may provide improved performance.
The components of a filler may include any suitable particle sizes, surface areas, and/or other dimensions. For example, a filler component may have a nominal particle size that is less than approximately one micron. In certain embodiments, a filler component may include nanoparticles. Additionally, a wide variety of suitable methods and/or techniques may be utilized to add a filler to a PAI polymer. In certain embodiments, a filler may be media-milled, ball-milled, or otherwise ground or milled in order to reduce agglomerates to below a desired amount, such as a Hegman gauge or grind of “eight” or finer. These are generally made at a higher concentration and can be reduced in the final “letdown” of the end formulation. As desired, the filler may be milled or ground until that particle size is below approximately 1.0 microns. Other particle sizes may be attained as desired. In certain embodiments, the filler may be milled directly into the PAI varnish in the presence of solvent. As a result of incorporating the filler directly into the PAI varnish (also referred to as a one part syntheses), a higher viscosity and/or higher solids content PAI may be attained. The higher viscosity and/or higher solids content may permit a better concentricity when a PAI enamel layer is formed, thereby resulting in enhanced flexibility. In other embodiments, the filler may be milled in another substance and then added to the PAI varnish. For example, a PAI or other paste that includes the filler may be formed, and the polymeric paste may then be combined with PAI prior to application of an enamel layer. It will be appreciated that the addition of solvent during milling may keep the filler particles from re-agglomerating or clumping. Once a filler has been dispersed in a PAI polymer, the PAI polymer may be applied to a conductor in any suitable manner. For example, uncured PAI insulation may be applied to magnet wire using multi-pass coating and floating or wiping dies followed by curing at an elevated temperature (e.g., curing in an enameling oven). Other enamel layers (e.g., basecoat enamel layers, a polyamideimide topcoat, etc.) may be formed in a similar manner.
A magnet wire 100, 150 that includes one or more filled PAI enamel layers may exhibit improved corona resistance, thermal conductivity, and/or thermal performance relative to conventional magnet wire enamels. For example, use of one or more filled PAI enamel layers may provide a thermal class, a thermal index, or a thermal endurance 220° C. magnet wire or higher. In certain embodiments, a wire that includes filled PAI insulation may have a thermal class, a thermal index, or a thermal endurance of 240° C. or greater. In certain embodiments, the addition of one or more topcoat layers (e.g., a PAI topcoat) may provide additional toughness and abrasion resistance without materially reducing the thermal class of the magnet wire. The thermal index of a magnet wire or magnet wire insulation layer is generally defined as a number in degrees Celsius that compares the temperature vs. time characteristics of an electrical insulation material. It may be obtained by extrapolating the Arrhenius plot of life versus temperature to a specified time, usually 20,000 hours. One test for measuring or determining the thermal index or thermal endurance of magnet wire is the ASTM D2307 test set forth by ASTM International. A thermal class generally specifies a range of thermal indexes established by a standards body, such as the National Electrical Manufacturers Association (“NEMA”) or UL. For example, a 220 class material may have a thermal index between 220° C. and 239° C. while a 240 class material has a thermal index between 240° C. and another threshold value. Further, the addition of one or more fillers to PAI may improve inverter duty life and/or electrical machine life without negatively affecting or ruining the thermal aging of the insulation.
As mentioned above, incorporation of filled PAI layers into a multi-layer enamel insulation system (e.g., a three-layer system as illustrated in
In certain embodiments, a multi-layer enamel system that includes a combination of filled PAI and additional layer(s), such as a system that includes a THEIC polyester basecoat 120, a filled PAI midcoat 130, and an unfilled PAI topcoat 140, may have a thermal index that exceeds a desired threshold value for a given application (e.g., an inverter duty wire for an elective vehicle or a hybrid electric vehicle, etc.). For example, a multi-layer insulation system may have a thermal index of at least 220° C. or at least 220° C. In various embodiments, a multi-layer insulation system may have a thermal index of at least 220, 230, 235, or 240° C., or a thermal index included in a range between any two of the above values. In certain embodiments, the overall thermal index for the insulation system may exceed that provided by certain polymeric materials utilized to form additional layers (e.g., THEIC polyester, etc.). In other words, inclusion of a filled PAI layer may improve the thermal index of an insulation system while inclusion of other layers may provide additional benefits (e.g., cost benefits, etc.).
In certain embodiments, a multi-layer enamel system that includes a combination of filled PAI and additional layer(s), such as a system that includes a THEIC polyester basecoat 120, a filled PAI midcoat 130, and an unfilled PAI topcoat 140, may exhibit enhanced partial discharge inception voltage (“PDIV”) and dielectric breakdown or dielectric strength performance suitable for desired applications (e.g., hybrid and electric vehicle applications, etc.). In certain embodiments, a round wire 100 having a three-layer insulation system may have a PDIV of at least 500 volts root mean square (RMS). A rectangular wire 150 having a three-layer insulation system may have an average PDIV of at least 1,100 volts. In other embodiments, a rectangular wire may have an average PDIV of at least 1,000, 1050, 1,100, 1,150, or 1,200 volts, or a PDIV included in a range between any two of the above values. Additionally, a magnet wire 100, 150 having a three-layer insulation system may have a dielectric breakdown at room temperature of at least 15,000 volts. In various embodiments, the dielectric breakdown may be at least 15,000, 16,000, 17,000, 18,000, 19,000, or 20,000 volts, or a dielectric breakdown included in a range between any two of the above values.
Additionally, in certain embodiments, a multi-layer insulation system that combines filled PAI with one or more additional enamel layers (e.g., THEIC polyester, etc.) may provide enhanced flexibility relative to certain conventional magnet wire insulation systems. This enhanced flexibility may permit rectangular magnet wire 150 to be more easily shaped or bent for incorporation into a desired application (e.g., a motor application, etc.) without cracking or otherwise damaging the insulation. For example, a magnet wire 150 may be more easily shaped into hairpins (e.g., approximately U-shaped hairpins) or other predefined shapes without damaging or compromising the insulation. It has been found that certain other insulation systems, such as certain insulation systems that incorporate filled PAI insulation over a polyester base, have lower flexibility that may result in cracked enamel when subjected to similar bending or shaping. In certain embodiments, a magnet wire 150 having an insulation system that incorporates filled PAI may have a flexibility that permits the wire 100 to be bent 180° around a 4 mm mandrel with a topcoat 140 crack frequency of less than 1.0. In other embodiments, the topcoat 140 crack frequency may be less than 1.0, 0.8, 0.75, 0.65, 0.5, 0.4, 0.25, 0.1, or a frequency included in a range between any two of the aforementioned values. In yet other embodiments, the topcoat 140 crack frequency may be zero. The topcoat crack frequency is defined as a total number of cracks identified in the topcoat 140 insulation layer per twenty samples of bent wire (e.g., a total number of cracks counted for the 20 samples divided by 20). As shown in the examples below, magnet wire having other insulation systems exhibited much lower flexibility that resulted in both topcoat cracks and/or cracks completely through the insulation system.
The magnet wires 100, 150 described above with reference to
The following examples are intended as illustrative and non-limiting, and represent specific embodiments of the present invention. The examples set forth comparative data for three different magnet wire constructions that incorporate multi-layer enamel insulation systems. The first wire construction includes a multi-layer enamel system as set forth in embodiments of this disclosure. The round wire samples having the first construction include an 18 AWG conductor, a THEIC polyester basecoat with a build of approximately 38 microns, a filled PAI midcoat (15% filler by weight with equal parts Cr2O3 and SiO2) with a build of approximately 23 microns, and an unfilled PAI topcoat with a build of approximately 8 microns. The rectangular wire samples include a THEIC polyester basecoat with a build of approximately 50 microns, a filled PAI midcoat (15% filler by weight with equal parts Cr2O3 and SiO2) with a build of approximately 28 microns, and an unfilled PAI topcoat with a build of approximately 7 microns.
The second wire construction is a construction generally described in U.S. Pat. No. 6,403,890 entitled “Magnet Wire Insulation for Inverter Duty Motors”. The second construction also includes a filled PAI midcoat; however, the polyester basecoat has a different formulation than the THEIC polyester basecoat of the inventive first wire construction. During product testing and evaluation, it was found that the second construction does not provide adequate flexibility for certain applications in which magnet wire is required to be bent and shaped prior to insertion into a motor. The round wire samples having the second construction include an 18 AWG wire having a polyester basecoat with a build of approximately 38 microns, a filled PAI midcoat (15% filler by weight with equal parts Cr2O3 and SiO2) with a build of approximately 25 microns, and an unfilled PAI topcoat with a build of approximately 8 microns. The rectangular samples have a polyester basecoat with a build of approximately 51 microns, a filled PAI midcoat (15% filler by weight with equal parts Cr2O3 and SiO2) with a build of approximately 25 microns, and an unfilled PAI topcoat with a build of approximately 9 microns.
The third wire construction is a construction generally described in U.S. patent application Ser. No. 17/316,333 entitled “Magnet Wire with Corona Resistant Polyamideimide Insulation”. The second construction also includes a filled PAI midcoat; however, the polyester basecoat has a different formation than the THEIC polyester basecoat of the inventive first wire construction. During product testing and evaluation, it was found that the second construction does not provide adequate flexibility for certain applications in which magnet wire is required to be bent and shaped prior to insertion into a motor. The round wire samples having the third construction include a 16 AWG wire having a polyester basecoat with a build of approximately 40 microns, a filled PAI midcoat (25% filler by weight with a 3:1 TiO2 and SiO2 ratio) with a build of approximately 46 microns, and an unfilled PAI topcoat with a build of approximately 6 microns. The rectangular samples have a polyester basecoat with a build of approximately 50 microns, a filled PAI midcoat (25% filler by weight with a 3:1 TiO2 and SiO2 ratio) with a build of approximately 30 microns, and an unfilled PAI topcoat with a build of approximately 8 microns.
Table 1 sets forth comparative thermal testing data for the three different wire constructions. For thermal testing, 10 samples of each type of wire were electrified and tested at different temperatures and the time to insulation failure was determined. At the time of this application's filing, full testing was not yet complete.
As shown in Table 1, the three wire types have similar thermal performance, which is not surprising given the filled PAI midcoat layers. Although full testing was not completed, the first wire has a thermal index exceeding 220° C. and will likely have a thermal index exceeding 240° C. Accordingly, a multi-layer construction that combines a THEIC polyester basecoat, a filled PAI midcoat, and a PAI topcoat may have a similar thermal performance to a magnet wire that includes primarily filled PAI insulation.
Table 2 provides partial discharge inception voltage (“PDIV”) and dielectric breakdown values for the three wire constructions. PDIV and dielectric breakdown values are provided for both round wire samples and rectangular wire samples. Industry standard PDIV tests were performed using a commercially available PDIV testing machine in which a specific ramp of voltages is applied to wire samples at a constant current and an appropriate PDIV value is determined. A root mean square (“RMS”) PDIV is calculated for round wire samples, and a peak PDIV is calculated for rectangular wire samples. To determine the dielectric breakdown of the round wire samples, a ramped voltage up to 20,000 volts is applied at different temperatures to twisted pairs formed from the wire, and a point of insulation failure or breakdown is identified. For rectangular wire, first testing was performed on lashed pairs of wire samples. Wire pairs were slightly bent, lashed together, and then subjected to a ramped voltage up to 20,000 volts at different temperatures. Additionally, a shotbox test was performed in which samples are placed in a box surrounded by ball bearings. A ramped voltage is then applied up to 20,000 volts, and a point of insulation failure is determined.
As shown in Table 2, all of the tested wires exhibit PDIV and dielectric breakdown performance that is acceptable for a wide variety of applications, such as hybrid and electric vehicle applications. The first wire exhibited the best overall dielectric breakdown performance, and particularly provided enhanced performance at 240° C.
Table 3 provides flexibility data for the three wire constructions. Both round samples and rectangular samples were tested. For round wire, samples were elongated and wrapped in a coil around mandrels having different sizes. Heat shock resistance tests were also performed in which samples were elongated twenty percent, wrapped around different mandrels, and then heated for half an hour at different temperatures (e.g., 240° C. and 260° C.). The mandrel sizes are approximately equal to the diameters of the samples that are tested. Determinations were then made as to whether any cracks are formed in the topcoat insulation (i.e., a PAI topcoat) and, in some cases, whether the insulation cracked to the bare conductor. For rectangular wire, samples were bent 180° around 4 mm, 6 mm, 8 mm, and 10 mm mandrels, and determinations were made as to whether any cracks are formed in the topcoat insulation or to the bare conductor. Based upon the tests, a topcoat crack frequency was calculated for the different types of wire. The topcoat crack frequency represents a number of cracks in the respective topcoats per 20 tested samples of wire (i.e., 20 samples of a given wire type).
As shown in Table 3, the first wire construction has much greater flexibility than the second and third wire constructions, both for round and rectangular samples. Indeed, the respective round and rectangular samples for the second and third wires often cracked through all of the insulation layers to expose a bare copper conductor. By contrast, topcoat cracks (if any) were identified in the first wire construction under 30× magnification. For certain sample runs of the first wire, the topcoat crack frequency was zero. Thus, it can be concluded that the unique enamel layer constructions of the first wire construction provides much greater flexibility than the other tested wires. This is especially true for rectangular wire, which is required for many hybrid and electric vehicle automotive applications.
Although the samples included in Tables 1-3 provide for specific blend ratios of filler materials, overall fill rates (e.g., approximately 15% by weight of the insulation, etc.), layer constructions and layer thicknesses in multi-layer systems, and ratios of layer thicknesses, a wide variety of other suitable blend ratios, fill rates, layer constructions, and layer thickness ratios may be utilized in other embodiments.
Conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments could include, while other embodiments do not include, certain features, elements, and/or operations. Thus, such conditional language is not generally intended to imply that features, elements, and/or operations are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without user input or prompting, whether these features, elements, and/or operations are included or are to be performed in any particular embodiment.
Many modifications and other embodiments of the disclosure set forth herein will be apparent having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the disclosure is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
This application is a continuation-in-part of U.S. patent application Ser. No. 17/316,333, filed May 10, 2021 and entitled “Magnet Wire with Corona Resistant Polyamideimide Insulation”, which is a continuation-in-part of U.S. Pat. No. 11,004,575, filed Aug. 26, 2020 and entitled “Magnet Wire with Corona Resistant Polyimide Insulation”, which is a continuation-in-part of U.S. Pat. No. 10,796,820, filed May 6, 2019 and entitled “Magnet Wire with Corona Resistant Polyimide Insulation”, which claims priority to U.S. Provisional Application No. 62/667,649, filed May 7, 2018 and entitled “Corona Resistant Polyimide Magnet Wire Insulation”. The contents of each of these prior matters is incorporated by reference herein in its entirety.
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| Number | Date | Country | |
|---|---|---|---|
| 20220262541 A1 | Aug 2022 | US |
| Number | Date | Country | |
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| Number | Date | Country | |
|---|---|---|---|
| Parent | 17316333 | May 2021 | US |
| Child | 17731357 | US | |
| Parent | 17003503 | Aug 2020 | US |
| Child | 17316333 | US | |
| Parent | 16403665 | May 2019 | US |
| Child | 17003503 | US |
