The number of types of electronic devices that are commercially available has increased tremendously the past few years and the rate of introduction of new devices shows no signs of abating. Devices such as tablet computers, laptop computers, desktop computers, all-in-one computers, cell phones, storage devices, wearable-computing devices, portable media players, navigation systems, monitors, adapters, and others, have become ubiquitous.
Electronic devices can share power and data over cables that can include one or more wires, fiber optic lines, or other conductors. Connector inserts can be located at each end of these cables and can be inserted into connector receptacles in the communicating electronic devices to form pathways for power and data.
A connector insert can have contacts that mate with corresponding contacts in a connector receptacle. These contacts can form portions of electrical paths for data, power, or other types of signals. One type of contact, a spring-loaded contact, can be used in either a connector insert or a connector receptacle. But a spring-loaded contact can have a reduced reliability, particularly if currents for a power supply flow through the spring.
A connector receptacle can be positioned in an opening in an electronic device. In many devices, this opening can be on a side of the electronic device. But these electronic devices are becoming thinner, making such positioning increasing difficult. This difficulty can be particularly exacerbated when the connector receptacle is a magnetic connector. For example, it can be difficult to provide sufficient magnetic force in a low-profile connector receptacle to reliably hold a corresponding connector insert.
Thus, what is needed are connector inserts having reliable contacts, as well as connector receptacles having improved magnetic circuits for use in electronic devices having a thin form factor.
Accordingly, embodiments of the present invention can provide connector inserts having reliable contacts, as well as connector receptacles having improved magnetic circuits for use in electronic devices having a thin form factor. These and other embodiments of the present invention can further provide connector receptacles that can be easily aligned to an opening in an electronic device, as well as connector inserts and connector receptacles that can be readily manufactured.
An illustrative embodiment of the present invention can provide contacts for connector inserts and connector receptacles that are highly reliable. These contacts can be spring-loaded contacts having a contacting portion or plunger biased by a spring or other biasing structure. As a connection is made between a spring-loaded contact and a corresponding contact, the biased plunger can be depressed. As a result, the spring can apply a force between the plunger and the corresponding contact to form an electrical connection. Current in the electrical connection can flow through the plunger and a barrel or other housing for the plunger that is in contact with the plunger. But in some circumstances, as the plunger is depressed, contact between the plunger and the barrel can be broken. When this happens, current can flow through the spring. If the contact is a power supply contact, the current can damage or destroy the spring thereby rendering the contact and possibly the connector inoperable.
Accordingly, an illustrative embodiment of the present invention can provide spring-biased contacts that include an intermediate object between a plunger and a spring or other biasing structure. The intermediate object can have a first length that is greater than an inner diameter of a barrel that houses the plunger, spring and intermediate object. The intermediate object can be between a backside of the plunger and the spring, where the intermediate object simultaneously contacts an inside surface of barrel at a first location and a second location. The first location and the second location can be on opposite sides of the intermediate object. The first location can be a first distance from a front opening of the barrel and the second location can be a second distance from the front opening of the barrel, where the first distance is different than the second distance.
In these and other embodiments of the present invention, an inside surface of the barrel can provide a first force along a first vector against the intermediate object at the first location and the inside surface of the barrel can provide a second force along a second vector against the intermediate object at the second location. The first force vector and the second force vector can be parallel and non-overlapping.
The intermediate object can have various shapes. For example, the intermediate object can have a capsule shape. The intermediate object can have a stadium-of-rotation shape. The intermediate object can have a spherocylinder shape. The intermediate object can have a shape defined by two hemispheres separated by a cylinder.
In these and other embodiments of the present invention, an interface between the plunger and the intermediate object can be arranged to provide a force between the intermediate object and the barrel as well as a force between the plunger and the barrel. For example, a backside of the plunger can have a sloped surface. The backside of the plunger can have a conical surface. The backside of the plunger can have an off-center conical surface. The backside of the plunger can have a sloped off-center conical surface. The contact can be one of several contacts in a connector receptacle or connector insert.
These and other embodiments of the present invention can provide a connector system having an improved magnetic circuit This magnetic circuit can provide a magnet array arranged to provide a strong attachment that allows the use of a low profile connector receptacle and connector insert. The magnet array can include magnets and magnetic elements, where the magnetic elements can be magnetically conductive pole pieces. Each pole piece can have magnets at two or more of its sides. The magnets can be arranged in an alternating manner such that the field lines of the pole pieces provide a strong magnetic attachment to a magnetically conductive attraction plate of a corresponding connector. The magnetic circuit can further include the attraction plate, which can be arranged to be attracted to the magnet array and to fit in a connector that houses the magnet array.
An illustrative embodiment of the present invention can provide a connector receptacle that can be easily aligned with an opening in a device enclosure for an electronic device. The electronic device can include a printed circuit board or other substrate, and can be at least partially housed in a device enclosure. The device enclosure can have an opening. A connector receptacle can be mounted on a portion of the device enclosure, the board, or other substrate. The connector receptacle can be attached to the enclosure or board using brackets. The brackets can be positionable within a housing of the connector receptacle such that the connector receptacle can be positionable within the electronic device in at least one dimension. This can allow the connector receptacle to be aligned with the opening in the device enclosure of the electronic device.
While embodiments of the present invention can provide connector inserts and connector receptacles for delivering power, these and other embodiments of the present invention can be used as connector receptacles in other types of connector systems, such as connector systems that can be used to convey power, data, or both.
In various embodiments of the present invention, contacts, shields, plungers, springs, intermediate objects, pistons, barrels, and other conductive portions of a connector receptacle or connector insert can be formed by stamping, metal-injection molding, machining, CNC machining, micro-machining, 3-D printing, or other manufacturing process. The conductive portions can be formed of stainless steel, steel, copper, copper titanium, phosphor bronze, or other material or combination of materials. They can be plated or coated with nickel, gold, or other material. The nonconductive portions, such as housings, locks, pistons, and other structures can be formed using injection or other molding, 3-D printing, machining, or other manufacturing process. The nonconductive portions can be formed of silicon or silicone, rubber, hard rubber, plastic, nylon, glass-filled nylon, liquid-crystal polymers (LCPs), ceramics, or other nonconductive material or combination of materials. The printed circuit boards or other boards used can be formed of FR-4 or other material. The magnets can be permanent magnets formed of recycled rare-earth magnets, other rare-earth magnets, or other magnetic elements.
Embodiments of the present invention can provide connector receptacles and connector inserts that can be located in, and can connect to, various types of devices such as portable computing devices, tablet computers, desktop computers, laptops, all-in-one computers, wearable computing devices, smart phones, storage devices, portable media players, navigation systems, monitors, power supplies, video delivery systems, adapters, remote control devices, chargers, and other devices. These connector receptacles and connector inserts can provide interconnect pathways for signals that are compliant with various standards such as one of the Universal Serial Bus (USB) standards including USB Type-C, High-Definition Multimedia Interface® (HDMI), Digital Visual Interface (DVI), Ethernet, DisplayPort, Thunderbolt™, Lightning™, Joint Test Action Group (JTAG), test-access-port (TAP), Peripheral Component Interconnect express, Directed Automated Random Testing (DART), universal asynchronous receiver/transmitters (UARTs), clock signals, power signals, and other types of standard, non-standard, and proprietary interfaces and combinations thereof that have been developed, are being developed, or will be developed in the future. Other embodiments of the present invention can provide connector receptacles and connector inserts that can be used to provide a reduced set of functions for one or more of these standards. In various embodiments of the present invention, these interconnect paths provided by these connector receptacles and connector inserts can be used to convey power, ground, signals, test points, and other voltage, current, data, or other information.
Various embodiments of the present invention can incorporate one or more of these and the other features described herein. A better understanding of the nature and advantages of the present invention can be gained by reference to the following detailed description and the accompanying drawings.
This figure illustrates an electronic device 300 including connector receptacle 100. Electronic device 300 can include bottom enclosure 301 encasing connector receptacle 100. Electronic device 300 can further include top enclosure 302 over bottom enclosure 301. Top enclosure 302 can house a screen or monitor, or other electronic components (not shown.) Bottom enclosure 301 can house a keyboard, processor, battery, or other electronic components (not shown.) The electronic components in top enclosure 302 and bottom enclosure 301 can receive and provide power and data using connector receptacle 100. In one example, the electronic components in top enclosure 302 and bottom enclosure 301 can receive power via connector receptacle 100 and can provide data regarding a charging status of a battery (not shown) of electronic device 300 via connector receptacle 100.
Connector receptacle 100 can include shield 170 having tabs 172. Tabs 172 can be inserted into and soldered to openings (not shown) in a printed circuit board (not shown) in bottom enclosure 301 of electronic device 300. Connector insert 200 can be plugged into or mated with connector receptacle 100. Connector insert 200 can include passage 202 for a cable (not shown.)
In this example, electronic device 300 can be a laptop or portable computer. In these and other embodiments of the present invention, electronic device 300 can instead be another portable computing device, tablet computer, desktop computer, all-in-one computer, wearable-computing device, smart phone, storage device, portable media player, navigation system, monitor, power supply, video delivery system, adapter, remote control device, charger, or other device.
Examples of connector receptacles 100 and connector inserts 200 are shown in the following figures.
Magnet array 150 can be positioned around contact housing 110. Contact housing 110 can pass through an opening 168 in magnet array 150. Magnet array 150 can include pole piece 152, pole piece 154a, pole piece 154b, pole piece 156a, pole piece 156b, and pole piece 158. Magnet array 150 can include magnet 151, magnet 153a, magnet 153b, magnet 155a, magnet 155b, magnet 157a, magnet 157b, and magnet 159. Each of pole piece can be formed of a soft magnetic alloy or other magnetically conductive material, such as martensitic stainless steel, ferritic stainless steel, low-carbon steel, iron-cobalt, an iron-silicon or nickel-iron alloy, or other ferro-magnetic material, or other material.
Each of these pole pieces can be abutted by two or more magnets. For example, pole piece 152 can be abutted by magnet 151, magnet 153a, and magnet 153b. Pole piece 152 can guide field lines of magnet 151, magnet 153a, and magnet 153b. For example, magnet 151, magnet 153a, and magnet 153b can have their north pole adjacent to pole piece 152 and their south pole away from pole piece 152, such that pole piece 152 can guide field lines from their north poles. Alternatively, magnet 151, magnet 153a, and magnet 153b can have their south pole adjacent to pole piece 152 and their north pole away from pole piece 152, such that pole piece 152 can guide field lines to their south poles. Pole piece 152, pole piece 154a, pole piece 154b, pole piece 156a, pole piece 156b, and pole piece 158 can guide field lines of alternating polarities. For example, pole piece 152, pole piece 156a, and pole piece 156b can guide field lines of a first polarity, while pole piece 154a, pole piece 154b, and pole piece 158 can guide field lines of a second polarity. Additional magnet 167 and additional magnet 169 can be included in magnet array 150. For example, additional magnet 167 can be adjacent to pole piece 152. In the example where magnet 151, magnet 153a, and magnet 153b have their north poles adjacent to pole piece 152, additional magnet 167 can also have its north pole adjacent to pole piece 152 while the south pole of additional magnet 167 can face away from pole piece 152. Additional magnet 167 and additional magnet 169 can further increase a magnetic attraction provided at a face of connector receptacle 100. Further details of magnet array 150 can be found in
Contact housing 110 can further be supported by housing 130 and lock 140. Contact housing 110 can be positioned between housing 130 and lock 140. Housing 130 can include post 136, tabs 132, and tabs 134. Tab 132 can fit in opening 192 of shield 190. Tab 134 can fit in opening 174 of shield 170. Shield 170 can further include tabs 172. Lock 140 can include posts 142, which can fit in corresponding notches (not shown) in housing 130. Brackets 160 can fit in openings 194 of shield 190. In these and other embodiments of the present invention, brackets 160 can be replaced with a single bracket, such as bracket 2360 (shown in
In these and other embodiments of the present invention, connector receptacle 100 can be located in an electronic device that also includes speakers, haptic components, actuators, or other components. These can cause vibrations in nearby components, such as connector receptacle 100, that can result in audible noise. Similarly, the magnetic field generated by magnet array 150 interacting with variable current flowing through contacts 120 can also induce vibrations resulting in audible noise. Accordingly, embodiments of the present invention can provide dampeners that can reduce the tendency of connector receptacle 100 to generate vibrational noise. These dampeners can also protect magnet array 150 from cracking, chipping, or other damage. For example, foam pieces, adhesives, silicone, plastic insulators, elastomers, and other materials or structures can be placed or formed between or among portions of connector receptacle 100. These can be formed of epoxy, room-temperature-vulcanizing silicone or other silicone or other elastomeric material, or other material. For example, dampeners can be placed between magnet array 150 and shield 170, between magnet array 150 and shield 190, between magnet array 150 and faceplate 180, between contact housing 110 and magnet array 150, or elsewhere in connector receptacle 100.
Silicone, such as a room-temperature-vulcanizing silicone, can be placed between contact housing 110 and magnet array 150. For example, silicone can be placed or formed along sides of contact housing 110, along top and bottom sides of contact housing 110, or a combination thereof. The silicone or other material can be formed ahead of time and placed in the desired location. The silicone or other material can instead be injected between contact housing 110 and magnet array 150 and cured in place. In this example, silicone can be injected between sides of contact housing 110 and pole piece 152, and between contact housing 110 and pole piece 158 to form dampener 117 and dampener 119, respectively. Dampener 117 can be formed between a left side (as seen from a front of contact receptacle 100) of contact housing 110 and pole piece 152, while dampener 119 can be formed between a right side of contact housing 110 and pole piece 158. The silicone for dampener 117 and dampener 119 can be injected using a needle placed between contact housing 110 and magnet array 150 from a back side (not shown) of magnet array 150 before housing 130 and lock 140 are attached.
Alternatively, dampener 117 and dampener 119 can be formed as pieces of silicon, foam, or other material ahead of time and inserted or otherwise placed between contact housing 110 and magnet array 150. For example, dampener 117 and dampener 119 can be inserted between contact housing 110 and magnet array 150 from a back side of magnet array 150 before housing 130 and lock 140 are attached. Alternatively, dampener 117 and dampener 119 can be attached to sides of contact housing 110, and then magnet array 150 can be formed around contact housing 110, dampener 117, and dampener 119.
It can be desirable to accurately align mesa 112 and contacting surfaces 122 to an opening in bottom enclosure 301 of electronic device 300 (shown in
In this example bracket 160 can be capable of moving up board until tab 162 hits a top 137 of slot 135. Also or instead, the upward travel can be limited by an edge 197 at a top of opening 194 in shield 190. Also or instead, the upward travel can be limited by edge 139 of housing 130 engaging bracket 160. Bracket 160 can be capable of moving downward until bracket 160 hits bottom edge 195 of opening 194. This arrangement can allow bracket 160 to move vertically relative to a remaining portion of connector receptacle 100. In this example, mesa 112 can be located in recess 113. In these and other embodiments of the present invention, brackets 160 can be replaced with a single bracket, or with three or more than three brackets. A single bracket, such as bracket 2360 (shown in
As contact is made between spring-loaded contact 800 and a corresponding contact, such as contacting surface 122 of contact 120 (shown in
Accordingly, an illustrative embodiment of the present invention can provide spring-biased contacts that include an intermediate object between plunger 810 and spring 860 or other biasing structure. Examples are shown in the following figures.
Intermediate object 850 can have a first length L1 that is greater than an inner diameter D1 of barrel 820. Intermediate object 850 can be between a backside 814 of plunger 810 and spring 860, where intermediate object 850 simultaneously contacts an inside surface of barrel at first location 852 and second location 854. First location 852 and second location 854 can be on opposite sides of intermediate object 850. First location 852 can be a first distance (not shown) from front opening 822 of barrel 820 and second location 854 can be a second distance (not shown) from front opening 822, the first distance different than the second distance.
In these and other embodiments of the present invention, an inside surface of barrel 820 can provide a first force along a first force vector F1 against intermediate object 850 at first location 852. The inside surface of barrel 820 can provide a second force along a second force vector F2 against intermediate object 850 at second location 854. The first force vector F1 and the second force vector F2 can be parallel and non-overlapping. Backside 814 of plunger 810 can provide third force vector F3 to intermediate object 850 at location 858. Spring 860 can provide fourth force vector F4 to intermediate object 850 at location 856.
In these and other embodiments of the present invention, intermediate object 1570 can be formed of a conductive material, while piston 1580 can be formed of a nonconductive or insulating material. This arrangement can provide current flow through spring-loaded contact 1500 while protecting spring 1560 from excessive currents. Plunger 1510 can contact intermediate object 1570 at location 1572. Currents can flow through this location through intermediate object 1570 and to barrel 1520 at location 1576. When piston 1580 is nonconductive, current does not flow through intermediate object 1570 to piston 1580 via location 1574. This can protect spring 1560 from seeing excessive current. When piston 1580 is conductive, currents can flow through intermediate object 1570 to piston 1580 via location 1574. Piston 1580 can be can then contact inside surface of barrel 1520 providing and other current path to protect spring 1560.
In these and other embodiments of the present invention, intermediate object 1750 can be formed of a conductive material. When spring-loaded contact 1700 is mated with a corresponding contact, plunger 1710 can contact intermediate object 1750 at its backside 1714. Current can flow through plunger 1710 and through this location to intermediate object 1750 and then to barrel 1720 at location 1756. Plunger 1710 can tilt in barrel 1720 making contact with barrel 1720 at location 1715 and location 1719. As a result, current can also flow through plunger 1710 to barrel 1720 at location 1715 and location 1719.
In these and other embodiments of the present invention, backside 1714 of plunger 1710, and the other backsides of the other plungers shown here, can have various contours. For example, they can be flat, sloped, or otherwise curved, they can be conical or have conical indentations or other non-uniform surfaces. Backside 1714 of plunger 1710 can have an off-center conical surface. The backside of the plunger can have a sloped off-center conical surface.
In these and other embodiments of the present invention, piston 1850 can be formed of a conductive material. When spring-loaded contact 1800 is mated with a corresponding contact, plunger 1810 can contact piston 1850 at its backside 1814. Current can flow through plunger 1810 and through this location to piston 1850 and to barrel 1820 at location 1856. Plunger 1810 can tilt in barrel 1820 making contact with barrel 1820 at location 1811 of wide portion 1816 and location 1819 of wide portion 1813. As a result, current can also flow through plunger 1810 to barrel 1820 at location 1811 and location 1819. The inclusion of wide portion 1816 and wide portion 1813 can help to improve the connection between plunger 1810 and barrel 1820, thereby reducing an impedance of spring-loaded contact 1800.
In these and other embodiments of the present invention, backside 1814 of plunger 1810, and the other backsides of the other plungers shown here, can have various contours. For example, they can be flat, sloped, or otherwise curved, they can be conical or have conical indentations or other non-uniform surfaces. Backside 1814 of plunger 1810 can have an off-center conical surface. The backside of the plunger can have a sloped off-center conical surface.
In these and other embodiments of the present invention, piston 1950 can be formed of a conductive material. When spring-loaded contact 1900 is mated with a corresponding contact, plunger 1910 can contact piston 1950 at its backside 1914. Current can flow through plunger 1910 and through this location to piston 1950 and to barrel 1920 at location 1956. Plunger 1910 can tilt in barrel 1920 making contact with barrel 1920 at location 1915 and location 1919 of portion 1916 of plunger 1910. As a result, current can also flow through plunger 1910 to barrel 1920 at location 1911 and location 1919.
In these and other embodiments of the present invention, backside 1914 of plunger 1910, and the other backsides of the other plungers shown here, can have various contours. For example, they can be flat, sloped, or otherwise curved, they can be conical or have conical indentations or other non-uniform surfaces. Backside 1914 of plunger 1910 can have an off-center conical surface. The backside of the plunger can have a sloped off-center conical surface.
While piston 1950 can be conductive, it can still be desirable to protect spring 1960 from current. Accordingly, a portion of piston 1950 can be insulated or nonconductive. An example is shown in the following figure.
Insulating piece 1958 can help to prevent piston 1950 from electrically contacting spring 1960, thereby protecting spring 1960. Insulating piece 1958 can be tape, molded plastic, or other insulating material. Insulating piece 1958 can be die cut, molded, or formed in other ways.
Connector receptacle 100 (shown in
Each pole piece can be abutted by two or more magnets. In general, each pole piece can have magnets at two or more surfaces. Each pole piece can direct or guide the magnetic field provided by poles of two or more magnets at its surfaces. A pole piece can have two or more magnets oriented with their north poles at surfaces of the pole piece and their south poles away from the surfaces of the pole piece, and the pole piece can direct the magnetic field from the magnet's north poles to connecting face 2100 of magnet array 150. Another pole piece can have magnets oriented with their south poles at surfaces of the pole piece and their north poles away from the surfaces of the pole piece, and the pole piece can direct the magnetic field to the magnet's south poles from connecting face 2100 of magnet array 150. For example, pole piece 152 can be abutted by a north pole of magnet 151, a north pole of magnet 153a, and a north pole of magnet 153b. Pole piece 152 can guide magnetic field lines from the north pole of magnet 151, the north pole of magnet 153a, and the north pole of magnet 153b to connecting face 2100. (Pole piece 152 can be labeled “N” in this figure to indicate that magnetic field lines are directed from north poles of magnet 151, magnet 153a, and magnet 153b to connecting face 2100. It should be noted that pole piece 152, and the other pole pieces, are magnetically soft and do not have an intrinsic polarity.) Accordingly, magnet 151, magnet 153a, and magnet 153b can have their north pole adjacent to pole piece 152 and their south pole away from pole piece 152. More specifically, pole piece 152 can have the north pole of magnet 151 at first surface 2110, and the north poles of magnet 153a and magnet 153b at second surface 2130, where first surface 2110 and second surface 2130 are opposing surfaces. Pole piece 152 can further have additional magnet 167 at third surface 2120, where third surface 2120 is adjacent to first surface 2110 and adjacent to second surface 2130. Additional magnet 167 can have its north pole adjacent to third surface 2120.
Pole piece 154a can have a south pole of magnet 153a at fourth surface 2140 and a south pole of magnet 155a at fifth surface 2150, where fourth surface 2140 and fifth surface 2150 are opposing surfaces. (Pole piece 154a can be labeled “S” in this figure to indicate that magnetic field lines are directed to south poles of magnet 153a and magnet 153b from connecting face 2100.) Similarly, pole piece 154b can have a south pole of magnet 153b and a south pole of magnet 155b at opposing surfaces. Pole piece 156a can have a north pole of magnet 155a and a north pole of magnet 157a at opposing surfaces. Pole piece 156b can have a north pole of magnet 155b and a north pole of magnet 157b at opposing surfaces. Pole piece 158 can have a south pole of magnet 157a and a south pole of magnet 157b at a surface that opposes a surface adjacent to a south pole of magnet 159.
Alternatively, pole piece 152 can have a south pole of magnet 151 at first surface 2110 and a south pole of magnet 153a and a south pole of magnet 153b at second surface 2130, where first surface 2110 and second surface 2130 are opposing surfaces. Pole piece 152 can also have a south pole of additional magnet 167 at third surface 2120, where third surface 2120 is adjacent to first surface 2110 and adjacent to second surface 2130. Pole piece 154a can have a north pole of magnet 153a at fourth surface 2140 and a north pole of magnet 155a at fifth surface 2150, where fourth surface 2140 and fifth surface 2150 are opposing surfaces. Similarly, pole piece 154b can have a north pole of magnet 153b and a north pole of magnet 155b at opposing surfaces. Pole piece 156a can have a south pole of magnet 155a and a south pole of magnet 157a at opposing surfaces. Pole piece 156b can have a south pole of magnet 155b and a south pole of magnet 157b at opposing surfaces. Pole piece 158 can have a north pole of magnet 157a and a north pole of magnet 157b at a surface that opposes a surface adjacent to a north pole of magnet 159.
Pole piece 152, pole piece 154a, pole piece 154b, pole piece 156a, pole piece 156b, and pole piece 158 can guide field lines having alternating polarities. For example, pole piece 152, pole piece 156a, and pole piece 156b can guide field lines of a first polarity, while pole piece 154a, pole piece 154b, and pole piece 158 can guide field lines of a second polarity. That is, pole piece 152 can guide field lines from north poles of magnet 151, magnet 153a, and magnet 153b, pole piece 154a can guide field lines to south poles of magnet 153a and magnet 155a, pole piece 154b can guide field lines to south poles of magnet 153b and magnet 155b, pole piece 156a can guide field lines from north poles of magnet 155a and magnet 157a, pole piece 156b can guide field lines from north poles of magnet 155b and magnet 157b, and pole piece 158 can guide field lines to south poles of magnet 157a, magnet 157b, and magnet 159. Additional magnet 167 and additional magnet 169 can be included. For example, additional magnet 167 can be adjacent to pole piece 152. In the example where magnet 151, magnet 153a, and magnet 153b have their north poles adjacent to pole piece 152, additional magnet 167 can also have its north pole adjacent to pole piece 152 while the south pole of additional magnet 167 can face away from pole piece 152. Additional magnet 169 can have its south pole adjacent to pole piece 158, while its north pole faces away from pole piece 158. Additional magnet 167 and additional magnet 169 can further increase a magnetic field at connecting face 2100.
Each pole piece, such as pole piece 152, pole piece 154a, pole piece 154b, pole piece 156a, pole piece 156b, and pole piece 158, as well as magnetic element 2210 and magnetic element 2212 (both shown in
In this configuration, magnet 151, magnet 153a, magnet 153b (shown in
Additional magnets including additional magnet 167 and additional magnet 169 can also be positioned at, and coincident with, rear surfaces of pole piece 152 and pole piece 158, respectively. Further additional magnets including additional magnet 2240a, additional magnet 2240b (not shown), additional magnet 2242a, and additional magnet 2242b (not shown) can be positioned at, and coincident with, rear surfaces of pole piece 154a, pole piece 154b, pole piece 156a, and pole piece 156b, respectively. These further additional magnets can increase the magnetic flux in pole piece 154a, pole piece 154b, pole piece 156a, and pole piece 156b, thereby increasing the attraction force of magnet array 150.
Magnetic element 2210 and magnetic element 2220 can be formed of various materials. For example, magnetic element 2210 and magnetic element 2220 can be formed of a magnetically conductive material, for example a soft magnetic alloy or other magnetically conductive material, such as martensitic stainless steel, ferritic stainless steel, low-carbon steel, iron-cobalt, an iron-silicon or nickel-iron alloy, or other ferro-magnetic material, or other type of material.
The configuration of this magnetic circuit including magnet array 150 can vary in these and other embodiments of the present invention. For example, attraction plate 250 can be formed of a pole piece and magnet assembly similar to magnet array 150. Different numbers of pole pieces and magnets can be used. For example, one, two, or more than two permanent magnets can be used. Additional magnet 167, additional magnet 169, additional magnet 2240a, additional magnet 2240b, additional magnet 2242a, and additional magnet 2242b can be included or omitted, as can magnetic element 2210 and magnetic element 2220. Also, the relative thickness and dimensions of the pole pieces and magnets can vary. For example, pole piece 154a, pole piece 154b, pole piece 156a, and pole piece 156b can be narrower or shorter than magnet 153a, magnet 153b, magnet 155a, magnet 155b, magnet 157a, and magnet 157b. Alternatively, magnet 153a, magnet 153b, magnet 155a, magnet 155b, magnet 157a, and magnet 157b can be narrower or shorter than pole piece 154a, pole piece 154b, pole piece 156a, and pole piece 156b. The same can be true for pole piece 152 and pole piece 158 as compared to magnet 151 and magnet 159.
The addition of magnetic element 2210 and magnetic element 2220 can increase the size of connector receptacle 100. Accordingly these and other embodiments of the present invention can employ alternative structures to reduce a size of connector receptacle 100. An example is shown in the following figure.
Connector receptacle 2300 can include connector housing 2310 around contacts 2320. Connector housing 2310 can include mesa 2312. Contacts 2320 can include contacting surfaces 2322 on mesa 2312. Contact housing 2310 and contacts 2320 can be the same or similar to contact housing 110 and contacts 120 (both shown in
Connector receptacle 2300 can include brackets and associated structures, such as brackets 160, slots 135, and openings 194 as shown in
Connector receptacle 2300 can include further include faceplate 2380. Faceplate 2380 can include opening 2382, which can provide a passage for contact housing 2310. Mesa 2312 can be adjacent to faceplate 2380. Faceplate 2380 can be the same or similar to faceplate 180 (shown in
Various structures and materials can be used to provide further support for contacts 2320. For example, an adhesive, epoxy, silicone, or other material can be formed or otherwise inserted around portions of contacts 2320. For example, a room-temperature-vulcanizing silicone or other silicone can form dampener 2390, which can be inserted or formed between magnet array 2350, housing 2330, contact housing 2310, magnetic element 2210, and magnetic element 2220. Dampener 2390 can reduce a vibration of contacts 2320 that can be caused by speakers, haptic components, actuators, or other components in or near electronic device 300 housing connector receptacle 2300, or by the magnetic field generated by magnet array 2350 interacting with variable current flowing through contacts 2320. The silicone for dampener 2390 can be injected through opening 2372 in top cover 2370. Alternatively, dampener 2390 can be formed ahead of time and slid over contacts 2320.
Other dampeners can be utilized for noise reduction and the protection of magnet array 2350. For example, silicone strips 2392, 2394, and 2396 can be positioned between a top surface 2352 of magnet array 2350 and top cover 2370. Top cover 2370 and bottom cover 2375 can attach to magnetic element 2210 and magnetic element 2220, for example using spot or laser welding. Silicone strips 2392, 2394, and 2396 can be used to consume the vertical space between top cover 2370 and bottom cover 2375 that is not used by magnet array 2350. Silicone strips 2392, 2394, and 2396 can prevent vibration between top cover 2370 and magnet array 2350, and between bottom cover 2375 and magnet array 2350. Silicone strips 2392, 2394, and 2396 can be formed ahead of time and placed on top surface of magnet array 2350 and then covered by top cover 2370, or silicone in the pattern of silicone strips 2392, 2394, and 2396 can be dispensed on top surface 2352 of magnet array 2350 and then covered by top cover 2370 during assembly. Alternatively, silicone strips 2392, 2394, and 2396 can be formed ahead of time and placed on top cover 2370, which can then be placed against top surface 2352 of magnet array 2350, or silicone in the pattern of silicone strips 2392, 2394, and 2396 can be dispensed on top cover 2370, which can then be placed against top surface 2352 of magnet array 2350 during assembly. Additional dampers (not shown) can be located between magnet array 150 and bottom cover 2375.
As before dampeners can be positioned between contact housing 2310 and magnet array 2350 to protect magnet array 2350 and to reduce vibration. For example, silicone can be placed or formed along sides of contact housing 2310 to form dampeners, such as dampener 117 and dampener 119 (shown in
While embodiments of the present invention can provide connector inserts and connector receptacles for delivering power, these and other embodiments of the present invention can be used as connector receptacles in other types of connector systems, such as connector systems that can be used to convey power, data, or both.
In various embodiments of the present invention, contacts, shields, plungers, springs, pistons, intermediate objects, barrels, and other conductive portions of a connector receptacle or connector insert can be formed by stamping, metal-injection molding, machining, micro-machining, CNC machining, 3-D printing, or other manufacturing process. The conductive portions can be formed of stainless steel, steel, copper, copper titanium, phosphor bronze, or other material or combination of materials. They can be plated or coated with nickel, gold, or other material. The springs can be coated with parylene. The nonconductive portions, such as housings, locks, pistons, and other structures can be formed using injection or other molding, 3-D printing, machining, or other manufacturing process. The nonconductive portions can be formed of silicon or silicone, rubber, hard rubber, plastic, nylon, glass-filled nylon, liquid-crystal polymers (LCPs), ceramics, or other nonconductive material or combination of materials. The printed circuit boards or other boards used can be formed of FR-4 or other material.
Embodiments of the present invention can provide connector receptacles and connector inserts that can be located in, and can connect to, various types of devices such as portable computing devices, tablet computers, desktop computers, laptops, all-in-one computers, wearable computing devices, smart phones, storage devices, portable media players, navigation systems, monitors, power supplies, video delivery systems, adapters, remote control devices, chargers, and other devices. These connector receptacles and connector inserts can provide interconnect pathways for signals that are compliant with various standards such as one of the Universal Serial Bus (USB) standards including USB Type-C, High-Definition Multimedia Interface® (HDMI), Digital Visual Interface (DVI), Ethernet, DisplayPort, Thunderbolt™, Lightning™ Joint Test Action Group (JTAG), test-access-port (TAP), Peripheral Component Interconnect express, Directed Automated Random Testing (DART), universal asynchronous receiver/transmitters (UARTs), clock signals, power signals, and other types of standard, non-standard, and proprietary interfaces and combinations thereof that have been developed, are being developed, or will be developed in the future. Other embodiments of the present invention can provide connector receptacles and connector inserts that can be used to provide a reduced set of functions for one or more of these standards. In various embodiments of the present invention, these interconnect paths provided by these connector receptacles and connector inserts can be used to convey power, ground, signals, test points, and other voltage, current, data, or other information.
It is well understood that the use of personally identifiable information should follow privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining the privacy of users. In particular, personally identifiable information data should be managed and handled so as to minimize risks of unintentional or unauthorized access or use, and the nature of authorized use should be clearly indicated to users.
The above description of embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, and many modifications and variations are possible in light of the teaching above. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications to thereby enable others skilled in the art to best utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. Thus, it will be appreciated that the invention is intended to cover all modifications and equivalents within the scope of the following claims.
This application is a continuation-in-part of U.S. patent application Ser. No. 17/033,514, filed Sep. 25, 2020, and claims priority to U.S. provisional patent application 63/259,910, filed Sep. 24, 2021, which are incorporated by reference.
Number | Name | Date | Kind |
---|---|---|---|
2644145 | Adams | Jun 1953 | A |
3378810 | Dorrell | Apr 1968 | A |
3435168 | Cooney | Mar 1969 | A |
3753103 | Tetreault et al. | Aug 1973 | A |
4050762 | Hines et al. | Sep 1977 | A |
4397519 | Cooney | Aug 1983 | A |
4597622 | Coe | Jul 1986 | A |
4612703 | Cooney | Sep 1986 | A |
4686465 | Kruger | Aug 1987 | A |
4874316 | Kamon et al. | Oct 1989 | A |
4983909 | Swart et al. | Jan 1991 | A |
5417595 | Cullen et al. | May 1995 | A |
5801544 | Swart et al. | Sep 1998 | A |
5909100 | Watanabe | Jun 1999 | A |
5993269 | Ito | Nov 1999 | A |
6053777 | Boyle | Apr 2000 | A |
6159056 | Boyle | Dec 2000 | A |
6377059 | Vinther et al. | Apr 2002 | B2 |
6447328 | Feldman | Sep 2002 | B1 |
6506082 | Meek et al. | Jan 2003 | B1 |
6604864 | Nguyen | Aug 2003 | B2 |
6696850 | Sanders | Feb 2004 | B1 |
6758682 | Kosmala | Jul 2004 | B1 |
6861862 | Tate | Mar 2005 | B1 |
6957986 | Jing | Oct 2005 | B2 |
7252512 | Tai | Aug 2007 | B2 |
7311526 | Rohrbach et al. | Dec 2007 | B2 |
7315176 | Nelson et al. | Jan 2008 | B2 |
7611389 | Toivanen et al. | Nov 2009 | B2 |
7682206 | Kainz | Mar 2010 | B2 |
7749032 | Yin et al. | Jul 2010 | B1 |
7775801 | Shiff et al. | Aug 2010 | B2 |
7798867 | Sanders | Sep 2010 | B2 |
8043103 | Yamada et al. | Oct 2011 | B2 |
8337256 | Lin | Dec 2012 | B1 |
8734189 | Kim | May 2014 | B2 |
8905795 | Kim et al. | Dec 2014 | B2 |
8926376 | Mori | Jan 2015 | B2 |
9130317 | Wang | Sep 2015 | B2 |
9252531 | Guo | Feb 2016 | B2 |
9300081 | Rudisill | Mar 2016 | B2 |
9431742 | DiFonzo et al. | Aug 2016 | B2 |
9748680 | Huang et al. | Aug 2017 | B1 |
9780475 | Kim et al. | Oct 2017 | B2 |
9780484 | DiFonzo et al. | Oct 2017 | B2 |
10114038 | Tong et al. | Oct 2018 | B2 |
10367279 | Mardi | Jul 2019 | B2 |
10566734 | Pabouctsidis | Feb 2020 | B1 |
11437747 | Tziviskos | Sep 2022 | B2 |
20030124895 | Winter et al. | Jul 2003 | A1 |
20030176113 | Sasaki | Sep 2003 | A1 |
20040137800 | Jing | Jul 2004 | A1 |
20100089187 | Yin et al. | Apr 2010 | A1 |
20110018567 | Shiga | Jan 2011 | A1 |
20110070747 | Ball | Mar 2011 | A1 |
20130095690 | Kim et al. | Apr 2013 | A1 |
20130330983 | DiFonzo et al. | Dec 2013 | A1 |
20160020542 | DiFonzo et al. | Jan 2016 | A1 |
20180191097 | Yonnet | Jul 2018 | A1 |
20210336382 | Klein | Oct 2021 | A1 |
20220102893 | Tziviskos | Mar 2022 | A1 |
20220102910 | DiFonzo | Mar 2022 | A1 |
20220102911 | DiFonzo | Mar 2022 | A1 |
Number | Date | Country |
---|---|---|
508785 | Mar 1975 | JP |
6276668 | May 1987 | JP |
6323655 | Feb 1988 | JP |
63274070 | Nov 1988 | JP |
972932 | Mar 1997 | JP |
1040990 | Feb 1998 | JP |
10282142 | Oct 1998 | JP |
10332767 | Dec 1998 | JP |
2001021583 | Jan 2001 | JP |
2002174642 | Jun 2002 | JP |
2003281984 | Oct 2003 | JP |
2004179066 | Jun 2004 | JP |
2005005146 | Jan 2005 | JP |
2006501475 | Jan 2006 | JP |
2007316023 | Dec 2007 | JP |
2011027549 | Feb 2011 | JP |
2011192407 | Sep 2011 | JP |
2013068593 | Apr 2013 | JP |
200255378 | Nov 2001 | KR |
200301592 | Jul 2003 | TW |
563929 | Nov 2003 | TW |
M312806 | May 2007 | TW |
I286409 | Sep 2007 | TW |
I289376 | Nov 2007 | TW |
200803072 | Jan 2008 | TW |
M406183 | Jun 2011 | TW |
9804018 | Jan 1998 | WO |
2005053106 | Jun 2005 | WO |
2013035399 | Mar 2013 | WO |
Entry |
---|
U.S. Appl. No. 17/033,514 , “First Action Interview Pilot Program Pre-Interview Communication”, dated Dec. 20, 2021, 6 pages. |
U.S. Appl. No. 17/033,514 , “Notice of Allowance”, dated Apr. 29, 2022, 7 pages. |
Number | Date | Country | |
---|---|---|---|
20220102911 A1 | Mar 2022 | US |
Number | Date | Country | |
---|---|---|---|
63259910 | Sep 2021 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 17033514 | Sep 2020 | US |
Child | 17543487 | US |