Claims
- 1. A magnetic head assembly mounted on an arm, said assembly being utilized in the recording and reproducing of data on and from a recording/reproducing surface of a magnetic disk, said magnetic head assembly comprising:a support body for connecting the magnetic head assembly to the arm; and a head chip attached to said support body, said head chip being configured and arranged for making substantially continuous sliding contact with said recording/reproducing surface of said magnetic disk during recording/reproducing, said head chip including: a wafer base, a read/write element for recording/reproducing data from said recording/reproducing surface of said magnetic disk, said read/write element being formed from a plurality of thin film layers superposed upon said wafer base, said head chip being elongated in a direction generally perpendicular to a plane generally defined by said recording/reproducing surface.
- 2. The magnetic head assembly of claim 1 wherein said head chip comprises a perpendicular recording head.
- 3. The magnetic head assembly of claim 1 wherein said wafer base primarily extends from said support body in a generally perpendicular direction and is elongated in said generally perpendicular direction.
- 4. The magnetic head assembly of claim 1 wherein said head chip and said support body are bonded together with an ultraviolet-ray hardening adhesive.
- 5. The magnetic head assembly of claim 1 wherein said head chip is bonded to said support body near a distal end thereof, and further wherein said wafer base faces away from said distal end of said support body.
- 6. The magnetic head assembly of claim 1 wherein said head chip is bonded to said support body near a distal end thereof, and further wherein said wafer base faces toward said distal end of said support body.
- 7. The magnetic head assembly of claim 1 wherein said head chip is electrically connected to a set of lead wires on said support body by a set of bonding wires.
- 8. The magnetic head assembly of claim 1 wherein said head chip is electrically connected to a set of lead wires on said support body by at least one set of fillet-bonds, whereby said at least one set of fillet-bonds also serves to maintain said head chip in a bonded relationship with said support body.
- 9. The magnetic head assembly of claim 8 wherein said at least one set of fillet-bonds comprises a low melting point solder.
- 10. The magnetic head assembly of claim 1 wherein said support body has a bent portion and said head chip is mounted on said bent portion of said support body.
- 11. The magnetic head assembly of claim 1 wherein said head chip further includes a main pole, a coil wound around said main pole and a return yoke.
- 12. A magnetic disk drive comprising:a magnetic disk; a magnetic head assembly mounted on an arm, said assembly being utilized in the recording and reproducing of data on and from a recording/reproducing surface of said magnetic disk, said magnetic head assembly including: a support body for connecting the magnetic head assembly to the arm; and a head chip attached to said support body, said head chip being configured and arranged for making substantially continuous sliding contact with said recording/reproducing surface of said magnetic disk during recording/reproducing, said head chip including: a wafer base, a read/write element for recording/reproducing data from said recording/reproducing surface of said magnetic disk, said read/write element being formed from a plurality of thin film layers superposed upon said wafer base, said head chip being elongated in a direction generally perpendicular to a plane generally defined by said recording/reproducing surface.
Priority Claims (7)
Number |
Date |
Country |
Kind |
4-7679 |
Jan 1992 |
JP |
|
4-159496 |
Jun 1992 |
JP |
|
4-183800 |
Jul 1992 |
JP |
|
4-217077 |
Aug 1992 |
JP |
|
4-231184 |
Aug 1992 |
JP |
|
4-231185 |
Aug 1992 |
JP |
|
4-279920 |
Oct 1992 |
JP |
|
Parent Case Info
This is a divisional of application Ser. No. 08/896,729, filed Jul. 18, 1997, U.S. Pat. No. 6,141,182 which is a continuation of Ser. No. 08/030,365, filed Mar. 17, 1993, now abandoned which was filed as PCT/JP93/00050, on Jan. 18, 1993.
US Referenced Citations (10)
Foreign Referenced Citations (5)
Number |
Date |
Country |
58-81719 |
Jun 1983 |
JP |
60-29914 |
Feb 1985 |
JP |
61-153117 |
Sep 1986 |
JP |
1-263906 |
Oct 1989 |
JP |
2-009068 |
Jan 1990 |
JP |
Continuations (1)
|
Number |
Date |
Country |
Parent |
08/030365 |
|
US |
Child |
08/896729 |
|
US |