This application claims priority from Japanese Patent Application No. JP2004-226635, filed Aug. 3, 2004, the entire disclosure of which is incorporated herein by reference.
The present invention relates to a magnetic head which is used for writing to, and reading from, a magnetic recording medium, and a method of manufacturing the same.
In a hard disk drive, data on a recording medium is read or written by a magnetic head. In order to increase the magnetic disk's recording capacity per unit area, a higher areal density is needed. However, the existing longitudinal recording method has a problem that as the recorded bit length decreases, it becomes difficult to increase the areal density due to thermal fluctuation in medium magnetization. A solution to this problem is a perpendicular recording method whereby magnetization signals are recorded in a direction perpendicular to the medium. In the perpendicular recording method, the following types of read head may be used: a GMR head (Giant magnetoresistive head), TMR head (Tunneling giant magnetoresistive head) which provides higher reproduction output, and a CPP (Current perpendicular to the plane) type GMR head in which current flows perpendicularly to the film surface.
In the perpendicular recording method, in order to increase the areal density, the track density and the linear density must be improved as well. In order to improve the linear density, the write head's field gradient must be improved. One method of improving the field gradient is to use a double-layered recording medium having a soft under layer as the lower layer and use, as a write head, a single pole type head which has a main pole and a return pole. However, in order to achieve a high areal density of 200 Gb/in2, the field intensity of the write head must be improved.
Methods of increasing the field intensity include: (1) increasing the cross-sectional area of the air bearing surface of the main pole; and (2) reducing the throat height. The cross-sectional area of the main pole is the product of the track width and the main pole height. The track width must be decreased in order to achieve a high areal density. As for the main pole height, a problem inherent in perpendicular recording might arise that if there is a skew angle in the head, data is written with a side face of the main pole. For this reason, the height is limited to the same level as the track width. On the other hand, there is no limitation to decreasing the throat height. However, because the throat height depends on alignment accuracy on a wafer and air bearing surface processing accuracy, it is difficult not only to reduce the throat height but also to achieve a high accuracy. The throat height which is now needed is approximately 300 nm or less and a processing accuracy of ±50 nm is needed.
The air bearing surface of a head is processed using an ELG (Electro Lapping Guide) element as a processing detection pattern. For example, JP-A No. 67408/2000 discloses a method which uses two ELGs.
The above document discloses a manufacturing process of a magnetic head for conventional longitudinal recording in which a first and a second ELG (Electro Lapping Guide) are provided and the second ELG has the same shape as a read head. However, the above document refers to a method of controlling the element height of read head with high accuracy wherein the ELGs are only located on the read head side.
As mentioned above, the throat height of the perpendicular recording head must be reduced in order to increase the field intensity. However, the alignment accuracy in a wafer manufacturing process is approximately ±100 nm and furthermore an air bearing surface processing accuracy of ±50 nm is superimposed on this, so it is difficult to achieve the required perpendicular head throat height accuracy, ±50 nm.
Therefore, a feature of the present invention is to provide a manufacturing method whereby the throat height of the perpendicular recording head is reduced with high accuracy and provide a magnetic head for perpendicular recording with a throat height reduced with high accuracy.
There are two methods of processing the head air bearing surface: one method is that a bar cut from a wafer is processed to finish the air bearing surface, and the other is that a single slider cut from a bar is processed to finish the air bearing surface.
In the method in which a bar is processed, an electro lapping guide may be placed between head elements. In this case, a head element may be inserted between two or more electro lapping guides as in conventional head processing methods. On the other hand, in the method in which the air bearing surface of a single slider is processed, an electro lapping guide for air bearing surface processing is inserted into a slider (head element).
Another advantage of this method is that throat height is guaranteed because processing of the throat height of write head is done using electro lapping guides for air bearing surface processing. Inspection of a read head after air bearing surface processing can be done by measuring, for example, a transfer curve for a GMR head (measurement of GMR head output under a magnetic field) and the head as a single unit is thereby guaranteed. In the case of a write head, write/read characteristics must be evaluated using a medium. When the method in the present invention is employed, throat height is guaranteed with electro lapping guides for air bearing surface processing, so the read head can be evaluated, for example, by evaluation of transfer curves.
A magnetic head according to an embodiment of the present invention includes a read head with a magnetoresistive element and a write head with a main pole and a return pole (single pole type head), and has an electro lapping guide for air bearing surface processing for exclusive use with the write head. In addition to the electro lapping guide for air bearing surface processing for exclusive use with the write head, it may have an electro lapping guide for air bearing surface processing for exclusive use with the read head. Air bearing surface processing may be done using both the electro lapping guide for air bearing surface processing for exclusive use with the write head and the electro lapping guide for air bearing surface processing for exclusive use with the read head. Also, the read element (magnetoresistive element) itself may be used to monitor processing for the read head. It is more advantageous in terms of accuracy that for the electro lapping guide for air bearing surface processing for exclusive use with the write head, a photoresist pattern is made at the same time when a photoresist pattern for the main pole is made.
In a magnetic head according to another embodiment of the present invention, a perpendicular recording magnetic head with a main pole, a return pole and a shield provided in the vicinity of the main pole may have an electro lapping guide for air bearing surface processing for which a photoresist pattern is made at the same time when a photoresist pattern for the shield in the vicinity of the main pole is made and may further have an electro lapping guide for air bearing surface processing for exclusive use with the read head. Air bearing surface processing may be done using both the electro lapping guide for air bearing surface processing for which a photoresist pattern is made at the same time when a photoresist pattern for the shield in the vicinity of the main pole is made, and the electro lapping guide for air bearing surface processing for exclusive use with the read head. Alternatively, the read element itself may be used to monitor processing for the read head.
According to the present invention, throat height control can be done with high accuracy. When processing is done while the read head ELG or the resistance of the read head itself is being monitored, both the element height of read head and the throat height of write head can be optimized. When a shield (trailing shield, etc.) is located in the vicinity of the main pole, the thickness from the air bearing surface of the trailing shield can be controlled if an electro lapping guide for air bearing surface processing is provided similarly.
Next, embodiments of the present invention will be described referring to the accompanying drawings. To facilitate understanding, like functional elements are designated by like reference numerals in the following drawings.
In making an electro lapping guide (ELG), photolithography for an electro lapping guide must be done in a target process (main pole photolithography process in the case of the write head). More specifically, the electro lapping guide for air bearing surface processing with the same pattern as that of the main pole itself must be placed on a mask (or reticle) in which a main pole processing pattern is made. The thickness of the main pole film of the write head is in the range of 200-300 nm and thus the main pole film is thicker and lower in electric resistance than the GMR film of the read head (approx. 30 nm). For this reason, when an electro lapping guide (ELG) is made, its resistance variation with its height variation due to lapping is small and the sensitivity in throat height control is low. A solution to this problem is to replace only the electro lapping guide film by a film whose resistance is equivalent to that of the film used for a read head electro lapping guide. As this type of film, NiFe, Ta, NiCr or Cr film may be used. This replacement improves the electro lapping guide accuracy and improves the throat height processing accuracy.
Furthermore, when a film whose resistance is equivalent to that of the film used for a read head electro lapping guide is used, namely a film which has the same processing characteristic as the film used for a read head electro lapping guide is used, the read head and the write head are equal in the relationship between the air bearing surface lapping amount and the rate of change in electro lapping guide resistance and controllability of processing work for the read head sensor height and the throat height of write head is improved.
Next, (e) shows that the unwanted mask material and the NiFe film are removed by lift off and the main pole film 22 is partially replaced by the electro lapping guide film 21. This electro lapping guide film is not limited to NiFe film; it may be Ta, NiCr or Cr film. (f) shows that an electro lapping guide photoresist pattern 23 is made when the main pole pattern is made. Lastly, as shown in (g), ion milling etching is done using the photoresist pattern made at step (f) as a mask to make an electro lapping guide. When air bearing surface processing was performed using the electro lapping guide made by this method, a throat height processing accuracy of ±30 nm was achieved.
The thickness Gd of the trailing shield 30 and the side shield 31 from the air bearing surface is as important as throat height H. The reason is that if the thickness Gd of the trailing shield 30 and the side shield 31 from the air bearing surface is larger than throat height H, the field intensity which is applied from the main pole to the medium will decrease. On the other hand, if it is smaller, a sufficient effect of magnetic field gradient improvement or a sufficient effect of magnetic field distribution improvement will not be observed. Therefore, it is necessary to control the thickness Gd of the trailing shield 30 and the side shield 31 from the air bearing surface with high accuracy.
Hence, by providing an electro lapping guide for the trailing shield and the side shield and processing the air bearing surface, high accuracy in the thickness from the air bearing surface is achieved. At this time, the thickness (film thickness) of the trailing shield and the side shield in the wafer process is 1-2 μm and larger than the thickness (film thickness) of the main pole. Here, it may be not a milling process as a process of making a main pole or read head but a plating process. Again, in this case, when photolithography is done for the trailing shield and the side shield, a photoresist pattern for the electro lapping guide must be made at the same time.
First, (a) shows an electrode 20 made for an electro lapping guide. (b) shows a main pole film 22 made on the electrode pattern 20. (c) shows that a lift-off pattern 34 is made in a portion where an electro lapping guide is to be made and the main pole film is removed by milling. (d) shows that a NiFe film of 20 nm is made as an electro lapping guide film 21 by sputtering. Although the electrode 20 lies under the electro lapping guide film 21, it is shown here in order to facilitate understanding. (e) shows that the unwanted mask material and the NiFe film are removed by lift-off and the main pole film 22 is partially replaced by the electro lapping guide film 21. This electro lapping guide film is not limited to NiFe film; it may be Ta, NiCr or Cr film. Although the electrode 20 lies under the electro lapping guide film 21, it is shown here in order to facilitate understanding.
Next, (f) shows an insulating film 24 of alumina or silica laid over it. Although the electrode 20 lies under the electro lapping guide film 21, it is shown here in order to facilitate understanding. (g) shows that after a seed layer for plating is made on the insulating film 24, an electro lapping guide photoresist pattern 25 is made at the same time when a resist frame for plating is made for the trailing shield or side shield. Although the electrode 20 and the main pole are invisible due to the existence of the photoresist pattern 25, they are shown here in order to facilitate understanding. At step (h), a plating pattern 26 is made on the electro lapping guide when plating is done on the trailing shield or side shield. Then, as shown in (i), after the photoresist pattern and the seed layer for plating are removed, a pattern is transferred to the insulating film 24, for example, by ion milling and the pattern is transferred to the electro lapping guide film 21 using it as a mask, for example, by ion milling to obtain an electro lapping guide for the trailing shield.
When air bearing surface processing was performed using the electro lapping guide for the trailing shield which was made by the above method, a processing accuracy of ±30 nm in the trailing shield thickness from the air bearing surface was achieved.
The use of this perpendicular recording magnetic head makes it possible to improve the track density and the linear density and produce a magnetic write/read apparatus with an areal density of 200 Gbit/in2.
It is to be understood that the above description is intended to be illustrative and not restrictive. Many embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims alone with their full scope of equivalents.
Number | Date | Country | Kind |
---|---|---|---|
2004-226635 | Aug 2004 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
4670732 | Church | Jun 1987 | A |
4689877 | Church | Sep 1987 | A |
4914868 | Church et al. | Apr 1990 | A |
5175938 | Smith | Jan 1993 | A |
5210667 | Zammit | May 1993 | A |
5588199 | Krounbi et al. | Dec 1996 | A |
5655475 | Crandell et al. | Aug 1997 | A |
5678086 | Gandola et al. | Oct 1997 | A |
5703740 | Cohen et al. | Dec 1997 | A |
5742995 | Amin et al. | Apr 1998 | A |
5749769 | Church et al. | May 1998 | A |
5772493 | Rottmayer et al. | Jun 1998 | A |
5997381 | Dee et al. | Dec 1999 | A |
6027397 | Church et al. | Feb 2000 | A |
6193584 | Rudy et al. | Feb 2001 | B1 |
6347983 | Hao et al. | Feb 2002 | B1 |
6728067 | Crawforth et al. | Apr 2004 | B2 |
6758722 | Zhu | Jul 2004 | B2 |
6935923 | Burbank et al. | Aug 2005 | B2 |
6950289 | Lam et al. | Sep 2005 | B2 |
6982042 | Church et al. | Jan 2006 | B2 |
7016143 | Kirschenbaum et al. | Mar 2006 | B2 |
7062838 | Ding et al. | Jun 2006 | B2 |
7116519 | Koeppe et al. | Oct 2006 | B2 |
7119990 | Bajorek et al. | Oct 2006 | B2 |
7206172 | Ding et al. | Apr 2007 | B2 |
7245459 | Cyrille et al. | Jul 2007 | B2 |
7290325 | Wu | Nov 2007 | B2 |
7333300 | Church et al. | Feb 2008 | B2 |
7360296 | Cyrille et al. | Apr 2008 | B2 |
7369361 | Sasaki et al. | May 2008 | B2 |
7469465 | Ding et al. | Dec 2008 | B2 |
20020173227 | Lam et al. | Nov 2002 | A1 |
20020176214 | Shukh et al. | Nov 2002 | A1 |
20030020467 | Kasahara et al. | Jan 2003 | A1 |
20050063101 | Church et al. | Mar 2005 | A1 |
20050070206 | Kasiraj et al. | Mar 2005 | A1 |
20050128638 | Koeppe et al. | Jun 2005 | A1 |
20050164607 | Bajorek | Jul 2005 | A1 |
20060028770 | Etoh et al. | Feb 2006 | A1 |
20080144215 | Hsiao et al. | Jun 2008 | A1 |
Number | Date | Country |
---|---|---|
02-095572 | Apr 1990 | JP |
10-172115 | Jun 1998 | JP |
2000-067408 | Mar 2000 | JP |
2000-137905 | May 2000 | JP |
2001-198806 | Jul 2001 | JP |
2002-100005 | Apr 2002 | JP |
2002-197615 | Jul 2002 | JP |
2002-298309 | Oct 2002 | JP |
2005-317069 | Nov 2005 | JP |
Number | Date | Country | |
---|---|---|---|
20060028770 A1 | Feb 2006 | US |