Claims
- 1. A magnetic recording medium, comprising:a substrate; an underlayer formed on the substrate; and a spinel-type iron oxide thin film comprising maghemite as a main component formed on the underlayer, said spinel-type iron oxide thin film having a thickness (t) of 5 to 50 nm, being constituted by grains having an average grain size (D) of 5 to 30 nm, a standard deviation of grain sizes of not more than 4 nm and a ratio (D/t) of the average grain size (D) to the thickness (t) of less than 1.0, and exhibiting a coercive force of not less than 159 kA/m (2,000 Oe) and a coercive squareness ratio S* of not less than 0.5:1 in a longitudinal recording medium or a squareness ratio not less than 0.75:1 in a perpendicular recording medium.
- 2. A magnetic recording medium according to claim 1, wherein said spinel-type iron oxide thin film comprising maghemite as a main component has a center-line mean (Ra) of 0.1 to 1.0 nm and a maximum height (Rmax) of 1 to 12 nm.
- 3. A magnetic recording medium according to claim 1, wherein said underlayer is a single-layered or multi-layered film comprising an oxide thin film of a NaCl-type structure, a metal or alloy thin film of a bcc structure, and a metal or alloy thin film of a B2 structure.
- 4. A magnetic recording medium according to claim 1, which further has a coercive force of 199 to 955 kA/m (2,500 to 12,000 Oe), and a saturation magnetization (value of magnetization when applying a magnetic field of 1,590 kA/m (20 kOe) thereto) of 29 to 53 Wb/cm3 (230 to 420 emu/cm3).
- 5. A process for producing a magnetic recording medium, comprising:forming an underlayer on a substrate; subjecting the underlayer to sputtering treatment in an oxygen-rich atmosphere using a Fe target, a Fe alloy target or a target comprising iron oxide as a main component; conducting a reactive sputtering using a Fe target, a Fe alloy target or a sputtering using a target comprising iron oxide as a main component to form a spinel-type iron oxide thin film comprising magnetite as a main component on the underlayer; and oxidizing the spinel-type iron oxide thin film comprising magnetite as a main component to transform into a spinel-type iron oxide thin film comprising maghemite as a main component wherein the spinel-type iron oxide thin film has a thickness (t) of 5 to 50 nm, is constituted by grains having an average grain size (D) of 5 to 30 nm, a standard deviation of grain sizes of not more than 4 nm and a ratio (D/t) of the average grain size (D) to the thickness (t) of less than 1.0, and exhibits a coercive force of not less than 159 kA/m (2.000 Oe) and a coercive squareness ratio S* of not less than 0.5:1 in a longitudinal recording medium or a squareness ratio not less than 0.75:1 in a perpendicular recording medium.
- 6. A process according to claim 5, wherein the sputtering treatment for treating the underlayer in an oxygen-rich atmosphere is conducted at a substrate temperature of 20 to 200° C., and the formation of the spinel-type iron oxide thin film comprising magnetite as a main component is conducted at a substrate temperature of 30 to 250° C.
- 7. A process for producing a magnetic recording medium, comprising:forming an underlayer comprising a Cr metal thin film or a Cr alloy thin film on a substrate; subjecting the underlayer to sputtering treatment in an oxygen-rich atmosphere using an Fe target, an Fe alloy target or a target comprising iron oxide as a main component; and conducting a reactive sputtering using an Fe target, an Fe alloy target or a sputtering using a target comprising iron oxide as a main component to form a spinel-type iron oxide thin film comprising maghemite as a main component on the underlayer wherein the spinel-type iron oxide thin film has a thickness (t) of 5 to 50 nm, is constituted by grains having an average grain size (D) of 5 to 30 nm, a standard deviation of grain sizes of not more than 4 nm and a ratio (D/t) of the average grain size (D) to the thickness (t) of less than 1.0, and exhibits a coercive force of not less than 159 kA/m (2000 Oe) and a coercive squareness ratio S* of not less than 0.5:1 in a longitudinal recording medium or a squareness ratio not less than 0.75:1 in a perpendicular recording medium.
- 8. A process according to claim 7, wherein the sputtering treatment for treating the underlayer in an oxygen-rich atmosphere is conducted at a substrate temperature of 100 to 250° C., and the formation of the spinel-type iron oxide thin film comprising maghemite as a main component is conducted at a substrate temperature of 100 to 250° C.
Priority Claims (3)
Number |
Date |
Country |
Kind |
2001-202824 |
Mar 2001 |
JP |
|
2001-202825 |
Mar 2001 |
JP |
|
2001-202826 |
Mar 2001 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATION
This application is a continuation-in part of application, Ser. No. 09/741,890 filed Dec. 22, 2000, now U.S. Pat. No. 6,753,077.
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09/741890 |
Dec 2000 |
US |
Child |
10/185728 |
|
US |