Claims
- 1. A shielded assembly comprised of a substrate and, disposed above said substrate, a shield, wherein said shield is comprised of a nanomagnetic material wherein said nanomagnetic material has a saturation magnetization of from about 1 to about 36,000 Gauss, a coercive force of from about 0.01 to about 5000 Oersteds, a relative magnetic permeability of from about 1 to about 500,000, and an average particle size of less than about 200 nanometers.
- 2. The shielded assembly as recited in claim 1 wherein said shield is comprised of a first layer comprising said nanomagnetic material and a second layer comprised of a second material with an electrical resistivity of from about 1 microohm-centimeter to about 1×1025 microohm centimeters.
- 3. The shielded assembly as recited in claim 2, wherein said shield is contiguous with said substrate.
- 4. The shielded assembly as recited in claim 3, wherein said second material has a dielectric constant of from about 1.1 to about 10.
- 5. The shielded assembly as recited in claim 4, wherein said shield is comprised of at least about 35 weight percent of said nanomagnetic material.
- 6. The shielded assembly as recited in claim 5, wherein said first layer is disposed between said substrate and said second layer.
- 7. The shielded assembly as recited in claim 6, wherein said shield has a magnetic shielding factor of at least about 0.5.
- 8. The shielded assembly as recited in claim 7, wherein said shield has a magnetic shielding factor of at least about 0.9.
- 9. A shielded assembly comprised of a substrate and, disposed above said substrate, a shield, wherein said shield is comprised of a nanomagnetic material and a second material with an electrical resistivity of from about 1 microohm-centimeter to about 1×1025 microohm centimeters, and wherein said nanomagnetic material has a saturation magnetization of from about 1 to about 36,000 Gauss, a coercive force of from about 0.01 to about 5000 Oersteds, a relative magnetic permeability of from about 1 to about 500,000, and an average particle size of less than about 200 nanometers.
- 10. The shielded assembly as recited in claim 9, wherein said shield is comprised of a first layer comprising said nanomagnetic material and a second layer comprised of said second material.
- 11. The shielded assembly as recited in claim 10, wherein said shield is contiguous with said substrate.
- 12. The shielded assembly as recited in claim 11, wherein said second material has a dielectric constant of from about 1.1 to about 10.
- 13. The shielded assembly as recited in claim 12, wherein said first layer is disposed between said substrate and said second layer.
- 14. The shielded assembly as recited in claim 13, wherein said shield is comprised of at least about 35 weight percent of said nanomagnetic material.
- 15. The shielded assembly as recited in claim 14, wherein said shield is comprised of from about 40 to about 60 weight percent of said second material.
- 16. The shielded assembly as recited in claim 15, wherein said shield has a magnetic shielding factor of at least about 0.5.
- 17. The shielded assembly as recited in claim 16, wherein said second material is selected from the group consisting of silicon dioxide, aluminum nitride, cerium oxide, yttrium dioxide, and mixtures thereof.
- 18. The shielded assembly as recited in claim 17, wherein said shield has a magnetic shielding factor of at least about 0.9.
- 19. A shielded assembly comprised of a substrate and, disposed above said substrate, a nanomagnetic material wherein said nanomagnetic material has a saturation magnetization of from about 1 to about 36,000 Gauss, a coercive force of from about 0.01 to about 5000 Oersteds, a relative magnetic permeability of from about 1 to about 500,000, and an average particle size of less than about 200 nanometers.
- 20. The shielded assembly as recited in claim 19, wherein said nanomagnetic material is contiguous with said substrate.
Parent Case Info
[0001] CROSS-REFERENCE TO RELATED PATENT APPLICATIONS
[0002] This application is a continuation-in-part of applicants' copending patent application U.S. Ser. No. 10/303,264, which in turn was a continuation-in-part of U.S. Ser. No. 10/260,247 now issued at U.S. Pat. No. 6,673,999, filed on Sep. 30, 2002, which in turn was a continuation-in-part of U.S. Ser. No. 10/054,407, filed on Jan. 22, 2002 now issued as U.S. Pat. No. 6,506,972.
Continuations (1)
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Number |
Date |
Country |
Parent |
10303264 |
Nov 2002 |
US |
Child |
10810916 |
Mar 2004 |
US |
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
10260247 |
Sep 2002 |
US |
Child |
10303264 |
Nov 2002 |
US |
Parent |
10054407 |
Jan 2002 |
US |
Child |
10260247 |
Sep 2002 |
US |