Claims
- 1. A magnetron sputtering system for deposition of non-magnetic materials comprising permanent magnets fastened to the magnetic target surface facing the substrates at an appropriate distance from the substrates.
- 2. The system of claim 1, wherein the magnets are coated with suitable materials such as the target material or a non-contaminating material with respect to the deposited coating so that no contaminating materials are deposited on the substrate due to magnet erosion.
- 3. The system of claim 1, wherein the permanent magnets are directly exposed to the plasma rather than through the thick target.
- 4. The system of claim 1 wherein, the permanent magnets are held on the backing plate by a method selected from the group consisting of magnetic force, adhesive bonding, mechanical means or by a combination of these means.
- 5. The system of claim 1, wherein the thickness of the target is not limited.
- 6. The system of claim 1, wherein the surface of the target is a non-planar, machined surface that may be used for a variety of applications.
- 7. The system of claim 1, wherein there is additionally a water jacket.
- 8. The system of claim 1, wherein there are no rotating magnets.
- 9. The system of claim 1, wherein the magnets provide a stable plasma with no abnormal arc discharge and deposition uniformity due to their location of the surface of the target.
- 10. The system of claim 1, wherein the plasma feeding and cooling are effected without the use of a high power motor.
- 11. The system of claim 1, wherein the shape of the magnets provides magnetic flux over the entire erosion area.
- 12. The system of claim 1, wherein the target is laminated to a magnetic backing plate.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a Continuation-In-Part of Ser. No. 10/090,948, filed Mar. 2, 2002, now U.S. Pat. No. 6,623,610, issued Sep. 23, 2003 which is considered as being incorporated herein.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
10090948 |
Mar 2002 |
US |
Child |
10664790 |
Sep 2003 |
US |