This invention relates generally to connecting integrated circuit packages to circuit boards.
A socket is a device that acts as an interface between a packaged integrated circuit and a printed circuit board. A socket provides both an electrical and a mechanical interface between the printed circuit board and the integrated circuit package.
Conventionally, sockets have been dedicated to certain package technologies. For example, sockets useful with ball grid array packages are dedicated in the sense that they do not receive land grid array packages and vice versa. As a result, it is necessary to change out the sockets when using different packages, even when the packaged die is the same.
In some cases, a prototype of an integrated circuit die may be packaged in a land grid array package. Later in development, the same integrated circuit die may be packaged in a ball grid array package. Conventionally, different sockets are needed for each of these stages.
Thus, there is a need for better ways for implementing sockets for connecting integrated circuits to printed circuit boards.
Referring to
As better shown in
The upper S-shaped spring 22 portion 25a may then make a wiping action contact on the balls 12 as shown in
The socket 40 may electrically connect to a printed circuit board 10 in one embodiment of the present invention. The circuit board 10 may, for example, be a motherboard. The board 10 may have a number of lands 50 formed thereon. The lower spring 22 portions 25b may make wiping electrical contact on the lands 50 in one embodiment of the present invention.
Referring to
Referring to
As shown in
In some embodiments, the pitch and diameter of the surfaces 24, formed in the surface 42, may be varied to match a particular ball grid array package B pitch and ball diameter.
Thus, self-centering and self-aligning attachment of either ball grid array or land grid array packages may be achieved with the same socket 40 in one embodiment of the present invention. Thus, different generations of a chip set or integrated circuit package may be utilized with the same socket design. The socket 40 can accommodate early land grid array packages without requiring solder balls, in order to speed the testing transition in some embodiments. The same socket can then be used for the next generation integrated circuit with solder balls without the need for socket replacement. This is because the socket may be designed to accommodate and align both land grid array and ball grid array packages in some embodiments.
While the present invention has been described with respect to a limited number of embodiments, those skilled in the art will appreciate numerous modifications and variations therefrom. It is intended that the appended claims cover all such modifications and variations as fall within the true spirit and scope of this present invention.
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Number | Date | Country | |
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20050227509 A1 | Oct 2005 | US |