Claims
- 1. A method of manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, comprising the steps of:
a. providing a quantity of said items in a region within said environment; b. providing a manipulating electrode at a point near to said region, said manipulating electrode comprising:
i. a first electrode conducting element; and ii. spaced from said first electrode conducting element, a second, counter electrode conducting element, said first and second conducting elements having surfaces, such that any two that face each other, are shaped, sized and spaced such that the spacing between them is large relative to the extent of either facing surface, in any one dimension; and c. applying a voltage to said electrode, thereby attracting said plurality of items to said electrode, upon which they become retained.
- 2. The method of claim 1, further wherein at least one dimension of said first electrode conducting element is small relative to at least one dimension of said second electrode conducting element.
- 3. The method of claim 1, wherein said first and second conducting elements have surfaces, such that any two that face each other, are shaped, sized and spaced such that the spacing between them is at least twice as large as the extent of either facing surface, in any one dimension.
- 4. The method of claim 3, wherein said first and second conducting elements have surfaces, such that any two that face each other, are shaped, sized and spaced such that the spacing between them is at least four times as large as the extent of either facing surface, in any one dimension.
- 5. The method of claim 2, wherein at least one dimension of said first electrode conducting element is less than one-half the extent of at least one dimension of said second electrode conducting element.
- 6. The method of claim 5, wherein at least one dimension of said first electrode conducting element is less than one-eighth the extent of at least one dimension of said second electrode conducting element.
- 7. The method of claim 1, said first electrode conducting element comprising an elongated electrode, elongated along a first dimension.
- 8. The method of claim 7, said second conducting electrode element comprising a plate that is extended in two dimensions that are substantially perpendicular to said first dimension.
- 9. The method of claim 8, said step of providing said items comprising providing said items supported by said plate.
- 10. The method of claim 9, said step of providing said items comprising providing said items between said first and second conducting electrodes.
- 11. The method of claim 8, said step of providing said items comprising providing said items within a recess in said plate.
- 12. The method of claim 7, said second electrode conducting element comprising an elongated electrode, also elongated along said first dimension, and substantially parallel to said first electrode conducting element.
- 13. The method of claim 12, said first and second electrode conducting elements comprising substantially parallel pins.
- 14. The method of claim 12, said first and second electrode conducting elements comprising substantially parallel loops.
- 15. The method of claim 14, said loops also extending in a second dimension that is substantially perpendicular to said first dimension.
- 16. The method of claim 12, said first and second conducting elements being substantially parallel, and both having terminal ends, said step of providing said quantity of said items comprising providing said items adjacent said terminal ends.
- 17. The method of claim 1, said first electrode conducting element comprising a disc, having a center and a perimeter, and said second electrode conducting element comprising a ring that is substantially concentric with and circumscribes said disc, said ring having an inner boundary that is spaced from said perimeter of said disc.
- 18. The method of claim 8, said step of providing a voltage to said electrode comprising providing a voltage between said plate and said first electrode conducting element.
- 19. The method of claim 12, said step of providing a voltage to said electrode comprising providing a voltage between said first and second electrode conducting elements.
- 20. The method of claim 19, said step of providing a voltage comprising providing an AC voltage.
- 21. The method of claim 8, said step of providing a voltage comprising providing a DC voltage.
- 22. The method of claim 12, said step of attracting said items comprising attracting said items to each of said electrode conducting elements, and to space between said electrode conducting elements, where they are retained by contact with other of said retained items.
- 23. The method of claim 1, further comprising the step of providing relative motion between said manipulating electrode with said retained items and said region, such that they become more distant.
- 24. The method of claim 1, further comprising the steps of:
a. providing relative motion between said manipulating electrode with said retained items and a target, such that they become closer; and b. removing said voltage from said electrode, whereby said items fall to said target.
- 25. The method of claim 1, further comprising the steps of:
a. providing relative motion between said manipulating electrode with said retained items and a target, comprising a receptacle target region, such that they become closer; b. placing said elongated electrode into said receptacle target region; and c. releasing said retained items from said electrode, into said receptacle target region.
- 26. The method of claim 25, further wherein:
a. said receptacle target region contains a fluid; and b. said step of releasing comprises washing said items from said electrode with said fluid.
- 27. The method of claim 25, further:
a. said step of applying a voltage to said electrode comprising applying an AC voltage; b. said step of releasing comprising removing said voltage from said electrode, whereby said items fall to said target.
- 28. The method of claim 1, said step of providing an elongated manipulating electrode comprising providing an array of elongated manipulating electrodes.
- 29. The method of claim 28, further comprising the steps of:
a. causing motion of said array of electrodes with said retained items relative to a target comprising an array of receptacle target regions such that the array of electrodes and said target regions become closer; b. placing said array of elongated electrodes such that each enters into a respective receptacle of said array of receptacle target regions; and c. releasing said retained items from each electrode of said array, into said respective receptacle.
- 30. The method of claim 1, further comprising maintaining said atmosphere with a relative humidity of less than approximately 80%.
- 31. The method of claim 29, further comprising the step of calibrating said array of electrodes by measuring the amount of items released within each of a selected plurality of said receptacles.
- 32. The method of claim 29, further comprising the step of calibrating said array of electrodes by measuring the amount of items released within a selected one of said receptacles.
- 33. The method of claim 1, further comprising the steps of:
a. repeating the following steps i. and ii., of providing relative motion and releasing said items, a plurality of times:
i. providing relative motion between said manipulating electrode with said retained items and a target, such that they become closer; and ii. releasing said items from said electrode, whereby said items fall to said target in a discrete deposit of items; b. for a plurality of said discrete deposits of items, measuring the amount of items released in each of said discrete deposits, thereby calibrating collecting and releasing items using said method.
- 34. The method of claim 1, said first conducting element comprising a conductor having a dielectric cover.
- 35. The method of claim 1, said items characterized by a tap density, said step of providing a quantity of items comprising providing said items at the tap density.
- 36. The method of claim 1, said step of providing a quantity of items comprising providing said items at a substantially uniform density.
- 37. The method of claim 1, said step of providing a quantity of items comprising a quantity of granular material.
- 38. The method of claim 1, said step of providing a quantity of items comprising a quantity of thread like material.
- 39. The method of claim 1, said step of providing a quantity of items comprising a quantity of sheet material.
- 40. The method of claim 1, said step of providing a quantity of items comprising a quantity of polymer beads.
- 41. The method of claim 1, said step of providing a quantity of items comprising a quantity of granular material selected from the group consisting of excipients, proteins, salts, ceramic powder, pigments, catalysts, adhesives and phosphers.
- 42. The method of claim 1, further comprising the steps of:
a. providing relative motion between said manipulating electrode with said retained items and a target, such that they become closer; and b. removing said items from said manipulating electrode to said target.
- 43. The method of claim 42, said target comprising a well of a microtitre tray.
- 44. The method of claim 42, said target comprising a recess of a microchip.
- 45. The method of claim 1, said step of providing a quantity of items comprising the step of providing said items without having taken any step to determine whether said items carry a surface charge.
- 46. The method of claim 1, said first electrode conducting element comprising a conductive membrane within a recess of a pharmaceutical delivery microchip, whereby said items are attracted into said recess.
- 47. The method of claim 46, said conductive membrane being located at a closed end of a recess, above said region in which said items are retained, and said recess having an opening facing said region, such that said items are attracted against the force of gravity into said recess of said pharmaceutical delivery microchip.
- 48. A method of manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, comprising the steps of:
a. providing a quantity of said items in a region within said environment; b. providing a manipulating electrode at a point near to said region, said manipulating electrode configured such that when positioned at said point near to said region, and a voltage is applied to said electrode, an electric field is generated whose square has a non-zero gradient, sufficiently large that a force is generated to lift a plurality of said items against gravity, regardless of the surface charge condition of said items; c. applying a voltage to said electrode, thereby attracting said plurality of items to said electrode, upon which they are retained.
- 49. A method of manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, comprising the steps of:
a. providing a quantity of said items in a region within said environment; b. providing a manipulating electrode at a point near to said region, said manipulating electrode configured such that when positioned at said point near to said region and a voltage is applied to said electrode, an electric field is generated that is spatially non-uniform, to a degree sufficient to generate a force that is large enough to lift a plurality of said items against gravity, away from said region, regardless of the surface charge condition of said items; and c. applying said voltage to said electrode, thereby attracting said plurality of items to said electrode, upon which they become retained.
- 50. The method of claim 49, said step of providing a quantity of said items comprising providing said quantity of said items on an item support at said region, said method further comprising, after the step of applying a voltage, the step of causing relative motion between said electrode and said item support.
- 51. A method of manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, comprising the steps of:
a. providing a quantity of said items in a region within said environment; b. providing a manipulating electrode at a point near to said region, said manipulating electrode configured such that when positioned at said point near to said region and a voltage is applied to said electrode, an electric field is generated that gives rise to a dielectrophoretic force sufficiently large to lift a plurality of said items against gravity, regardless of the surface charge condition of said items; and c. applying a voltage to said electrode, thereby attracting said plurality of items to said electrode, upon which they are retained.
- 52. The method of claim 51, said manipulating electrode comprising a support and an elongated conducting element that extends from said support.
- 53. The method of claim 52, said elongated conducting element comprising a single conducting element.
- 54. The method of claim 52, said elongated conducting element comprising a plurality of conducting elements.
- 55. The method of claim 54, said plurality of conducting elements comprising parallel pins.
- 56. The method of claim 54, said plurality of conducting elements comprising substantially congruent, spaced apart loops.
- 57. A method of manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, comprising the steps of:
a. providing a quantity of said items in a region within said environment; b. providing an elongated manipulating electrode that is elongated along a dimension of elongation, terminating in a terminal end that is adjacent said region; c. applying a voltage to said electrode, thereby attracting said plurality of items to said terminal end of said electrode, upon which they become retained; and d. providing relative motion between said electrode and said region such that spacing between said terminal end said region increases.
- 58. The method of claim 57, said elongated conducting element comprising a single conducting element.
- 59. The method of claim 57, said elongated conducting element comprising a plurality of conducting elements.
- 60. The method of claim 59, said plurality of conducting elements comprising parallel pins.
- 61. The method of claim 59, said plurality of conducting elements comprising substantially congruent, spaced apart loops.
- 62. The method of claim 59, said plurality of conducting elements comprising spaced apart plates.
- 63. The method of claim 59, said quantity of items being dispersed in a cloud region in a fluid environment.
- 64. The method of claim 63, said cloud comprising an aerosol cloud.
- 65. A method of collecting micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, comprising the steps of:
a. providing a quantity of said items in a region within said environment; b. providing a pharmaceutical delivery microchip having a conductive membrane within a recess, at a point where said recess is near to said region, said conductive membrane configured such that when positioned at said point near to said region and a voltage is applied to said membrane, an electric field is generated that is sufficient to generate a force that is large enough to lift a plurality of said items against gravity, away from said region; and c. applying a voltage to said conductive membrane, thereby attracting said plurality of items to said membrane and into said recess, in which said membrane is located.
- 66. The method of claim 65, said conductive membrane being located at a closed end of a recess, above said region in which said items are retained, and said recess having an opening that is arranged facing said region, such that said items are attracted against the force of gravity into said recess of said pharmaceutical delivery microchip.
- 67. The method of claim 65, said microchip comprising a plurality of said conductive membranes, each located within a respective recess.
- 68. The method of claim 67, said step of applying a voltage comprising the step of simultaneously applying a voltage to a plurality of said conductive membranes, thereby simultaneously attracting a plurality of items to each of said plurality of membranes simultaneously.
- 69. The method of claim 68, said plurality of conductive membranes comprising substantially all of said membranes of said microchip.
- 70. The method of claim 68, said plurality of conductive membranes comprising fewer than all of said membranes of said microchip.
- 71. The method of claim 65, further comprising the step of providing a counter electrode in said region near to said quantity of items, said step of providing a voltage to said membrane comprising providing a voltage between said membrane and said counter electrode.
- 72. An apparatus for manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, said items being provided in a region upon a support, said apparatus comprising:
a. a manipulating electrode comprising:
i. a first electrode conducting element; and ii. spaced from said first electrode conducting element, a second, counter electrode conducting element, said first and second conducting elements having surfaces such that any two that face each other, are shaped, sized and spaced such that the spacing between them is large relative to the extent of either facing surface, in any one dimension; and b. a means for a coupling a voltage source to said electrode, to establish a voltage between said first and second electrode conducting elements.
- 73. The apparatus of claim 72, further comprising a stage configured to position said first electrode conducting element and said support such that said first electrode is at a selectable point relative to and adjacent a surface of said region of items.
- 74. The apparatus of claim 72, further wherein there exists at least one dimension of said first conducting electrode that is small relative to at least one dimension of said second conducting electrode.
- 75. The apparatus of claim 72, said first electrode conducting element comprising an elongated electrode, elongated along a first dimension.
- 76. The apparatus of claim 75, said second conducting electrode element comprising a plate that is extended in two dimensions that are substantially perpendicular to said first dimension.
- 77. The apparatus of claim 76, said items being supported by said plate.
- 78. The apparatus of claim 77, said support and said items being located between said first and second conducting electrodes.
- 79. The apparatus of claim 76, said plate comprising a recess, said region in which said items reside being said recess.
- 80. The apparatus of claim 75, said second electrode conducting element comprising an elongated electrode, also elongated along said first dimension, and substantially parallel to said first electrode conducting element.
- 81. The apparatus of claim 80, said first and second electrode conducting elements comprising substantially parallel pins.
- 82. The apparatus of claim 80, said first and second electrode conducting elements comprising substantially parallel and congruent loops.
- 83. The apparatus of claim 82, said loops also extending in a second dimension that is substantially perpendicular to said first dimension.
- 84. The apparatus of claim 80, said first and second conducting elements being substantially parallel, and both having terminal ends, said terminal ends being positioned so that said region in which said items reside is located adjacent said terminal ends.
- 85. The apparatus of claim 72, said first electrode conducting element comprising a disc, having a center and a perimeter, and said second electrode conducting element comprising a ring that is substantially concentric with and circumscribes said disc, said ring having an inner boundary that is spaced from said perimeter of said disc.
- 86. The apparatus of claim 76, said means for coupling a voltage source comprising means for providing a voltage between said plate and said first electrode conducting element.
- 87. The apparatus of claim 80, said means for coupling a voltage source comprising means for providing a voltage between said first and second electrode conducting elements.
- 88. The apparatus of claim 87, further comprising an AC voltage source, coupled to said first electrode conducting element.
- 89. The apparatus of claim 76, further comprising a DC voltage source coupled to said first electrode conducting element.
- 90. The apparatus of claim 72, further comprising a transport mechanism for providing relative motion between said manipulating electrode with said retained items and said support, such that they become more separated.
- 91. The apparatus of claim 72, further comprising:
a. a transport mechanism for providing relative motion between said manipulating electrode with said retained items and a target, such that they become closer; and b. a switch, coupled to said means for coupling voltage, that disconnects said voltage from said electrode.
- 92. The apparatus of claim 72, further comprising a transport mechanism that provides relative motion between said manipulating electrode with said retained items, and a target, comprising a receptacle target region, such that the manipulating electrode and the target become closer and such that said elongated electrode is placed into said receptacle target region.
- 93. The apparatus of claim 92, further wherein said receptacle target region contains a fluid formulated to wash said items from said electrode when said electrode is immersed in said fluid.
- 94. The apparatus of claim 92, further comprising an AC voltage source, and a switch configured to disconnect said voltage source from said electrode, upon activation of said switch.
- 95. The apparatus of claim 72, said elongated manipulating electrode comprising an array of elongated manipulating electrodes.
- 96. The apparatus of claim 95, further comprising a transport device coupled between said array of electrodes with said retained items and a target comprising an array of receptacle target regions, to provide relative motion such that the array of electrodes and said target regions become closer and such that each electrode of said array enters into a respective receptacle of said array of receptacle target regions.
- 97. The apparatus of claim 72, further comprising a humidity control module configured to maintain an atmosphere of less than approximately 80% relative humidity.
- 98. The apparatus of claim 96, further comprising a measuring module configured to measure the amount of items released within each of a selected plurality of said receptacles.
- 99. The apparatus of claim 72, said first conducting element comprising a conductor having a dielectric cover.
- 100. The apparatus of claim 72, further comprising a transport mechanism coupled to provide relative motion between said manipulating electrode and a target, such that they become closer.
- 101. The apparatus of claim 100, said target comprising a well of a microtitre tray.
- 102. The apparatus of claim 100, said target comprising a recess of a pharmaceutical delivery microchip.
- 103. The apparatus of claim 72, said first conducting element comprising a conductive membrane of a recess of a pharmaceutical delivery microchip.
- 104. The apparatus of claim 103, said microchip arranged such that to collect items, said conductive membrane, and said recess are located above said support, with said recess having an opening that faces downward.
- 105. The apparatus of claim 72, said electrode having a shank that terminates in a free end, said electrode configured to establish, when a voltage is provided thereto, a surrounding electric field characterized by a significant non- zero gradient within said region where said items reside when said electrode is near to said region.
- 106. The apparatus of claim 72, said electrode having a shank that terminates in a free end, said electrode configured to establish, when a voltage is provided thereto, a surrounding electric field that gives rise to a force upon an item within said region when said electrode is near to said region, sufficient to lift said item against gravity, without regard to any surface charge condition of said item.
- 107. The apparatus of claim 72, said electrode having a shank that terminates in a free end, said electrode configured to establish, when a voltage is provided thereto, a surrounding electric field that gives rise to a dielectrophoretic force upon an item within said region when said electrode is near to said volume sufficient to lift said item against gravity, without regard to the surface charge condition of said item.
- 108. The apparatus of claim 72, further comprising a voltage supply comprising a switch configured to turn switch said voltage supply between on and off.
- 109. The apparatus of claim 81, said electrode comprising a spacing adjuster that adjustably fixes said pins of a pair a selectable variable spacing apart.
- 110. The apparatus of claim 82, said electrode comprising a spacing adjuster that adjustably fixes said loops of a pair a selectable variable spacing apart.
- 111. The apparatus of claim 95, said electrode comprising a spacing adjuster that adjustably fixes said elongated manipulating electrodes of each pair of said array, a selectable variable spacing apart.
- 112. The apparatus of claim 109, said spacing adjuster comprising a first pin support, to which a first pin of said pair is fixed, and a second pin support, to which said second pin of said pair is fixed, said first and second pin supports being movable relative to each other, and said second pin support having an opening through which said first pin protrudes, said opening being large enough to permit said relative motion between said first and second pin supports.
- 113. The apparatus of claim 110, said spacing adjuster comprising a first loop support, to which a first loop of said pair is fixed, and a second loop support, to which said second loop of said pair is fixed, said first and second loop supports being movable relative to each other, and said second loop support having an opening through which said first loop protrudes, said opening being large enough to permit said relative motion between said first and second loop supports.
- 114. An apparatus for manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, said items being provided in a region upon a support, said apparatus comprising:
a. a manipulating electrode comprising a first electrode conducting element that terminates in a free end, said electrode configured to establish, when a voltage is provided thereto, a surrounding electric field characterized by a significant non-zero gradient within said region where said items reside when said electrode is near to said region; b. a coupling for a voltage source, to establish a voltage between said first electrode conducting element and a reference; c. a stage configured to provide a relative By w position between said first electrode conducting element and such that said first electrode is at a selectable point relative to and adjacent a surface of said region of items.
- 115. An apparatus for manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, said items being provided in a region upon a support, said apparatus comprising:
a. a manipulating electrode comprising a first electrode conducting element that terminates in a free end, said electrode configured to establish, when a voltage is provided thereto, a surrounding electric field that gives rise to a force upon an item within said region when said electrode is near to said region, sufficient to lift said item against gravity, without regard to the surface charge condition of said item b. a means for a coupling a voltage source to said electrode, to establish a potential bias between said first electrode conducting element and a reference; c. a stage configured to position said first electrode conducting element at a selectable point relative to and adjacent a surface of said region of items.
- 116. An apparatus for manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, said items being provided in a region upon a support, said apparatus comprising:
a. a manipulating electrode comprising a first electrode conducting element that terminates in a free end, said electrode configured to establish, when a voltage is provided thereto, a surrounding electric field that gives rise to a dielectrophoretic force upon an item within said region when said electrode is near to said region, sufficient to lift said item against gravity, without regard to the surface charge condition of said item b. a means for a coupling a voltage source to said electrode, to establish a voltage between said first electrode conducting element and a reference; c. a stage configured to position said first electrode conducting element at a selectable point relative to and adjacent a surface of said region of items.
- 117. An apparatus for manipulating micron scale items having a dielectric constant greater than that of an environment in which they are to be manipulated, said items being provided in a region, said apparatus comprising:
a. a manipulating electrode comprising:
i. a first elongated electrode conducting element, elongated along a first dimension.; and ii. spaced from said first electrode conducting element, a second, counter electrode conducting element, comprising an elongated electrode, also elongated along said first dimension, and substantially parallel to said first electrode conducting element, said first and second conducting elements being both having terminal ends, said region in which said items reside being located adjacent said terminal ends; b. a means for a coupling a voltage source to said electrode, to establish a voltage between said first and second electrode conducting elements; and c. a stage configured to position said first and second electrode conducting elements relative to said region such that said terminal ends of said first and second electrode conducting elements are at a selectable location relative to and adjacent a surface of said region of items.
- 118. The apparatus of claim 117, said first and second conducting elements comprising parallel plates.
- 119. The apparatus of claim 117, said first and second conducting elements comprising parallel pins.
- 120. The apparatus of claim 117, said first and second conducting elements comprising parallel loops.
- 121. An apparatus for receiving deposited micron scale items from a manipulating electrode, said apparatus comprising:
a. a plurality of target regions; b. an interconnected surface portion between said target regions; c. a conducting element substantially covering said interconnected surface potion, such that substantially all of it is commonly conductively coupled.
- 122. The apparatus of claim 121, said plurality of target regions comprising recesses.
- 123. The apparatus of claim 122, said recesses comprising wells of a microtitre tray.
- 124. A method for depositing micron scale items on a target comprising the steps of:
a. providing a target comprising:
i. a plurality of target regions; ii. an interconnected surface portion between said target regions; iii. a conducting element substantially covering said interconnected surface portion, such that substantially all of it is commonly conductively coupled; b. providing a substantially uniform surface charge to said entire surface of said target, including said target regions and said interconnected surface portion; c. providing a common voltage to said interconnected surface portion through said conducting element, such that said target regions retain said uniform surface charge, and said interconnected surface portion does not; d. providing at least one item retained on a manipulating electrode adjacent a target region of said target, such that it is drawn from said manipulating electrode to said target region and directed away from said interconnected surface portion.
- 125. The method of claim 124, said plurality of target regions comprising recesses.
- 126. The method of claim 125, said recesses comprising wells of a microtitre tray.
- 127. The method of claim 125, said step of providing said manipulating electrode adjacent a recess comprising providing said manipulating electrode within said recess.
- 128. An apparatus for receiving deposited micron scale items from a manipulating electrode, said apparatus comprising:
a. at least one target region; b. adjacent said at least one target region, a target electrode, configured to establish, when a voltage is provided thereto, a surrounding electric field that gives rise to a dielectrophoretic force upon an item retained upon said manipulating electrode, when said manipulating electrode is positioned adjacent said target region, sufficient to dislodge said item from said manipulating electrode, without regard to the surface charge condition of said item and to attract said item into said target region.
- 129. The apparatus of claim 128, said target electrode comprising an elongated electrode.
- 130. The apparatus of claim 129, said target electrode comprising a pair of elongated conducting elements.
- 131. The apparatus of claim 128, said target electrode comprising a pair of concentric conducting elements.
- 132. The apparatus of claim 128, said target region comprising a well of a microtitre tray.
- 133. The apparatus of claim 128, said target region comprising a well of a pharmaceutical delivery microchip.
- 134. The apparatus of claim 128, said target electrode comprising a component connector of a semiconductor chip.
- 135. The apparatus of claim 134, said target region comprising a shaped recess, said item to be deposited comprising a microelectronic component, said shaped recess being shaped to mate with said microelectronic component.
- 136. The apparatus of claim 128 further comprising electronic circuitry that couples said target electrode to a power source, at least one of said target electrodes being coupled to said circuitry so that it may be selectably provided with a voltage while others of said target electrodes are maintained at a reference voltage.
- 137. The apparatus of claim 128, said target electrode comprising:
a. a first electrode conducting element; and b. spaced from said first electrode conducting element, a second, counter electrode conducting element, said first and second conducting elements having surfaces that face each other, said facing surfaces being shaped, sized and spaced such that the spacing between them is large relative to the extent of at least one facing surface, in at least one dimension.
- 138. A method for depositing micron scale items on a target comprising the steps of:
a. providing a target comprising:
i. at least one target region; ii. adjacent said at least one target region, a target electrode, configured to establish, when a voltage is provided thereto, a surrounding electric field that gives rise to a dielectrophoretic force upon an item retained upon a manipulating electrode, when said manipulating electrode is positioned adjacent said target region, sufficient to dislodge said item from said manipulating electrode, without regard to the surface charge condition of said item, and to attract said item to said target region; b. providing a manipulating electrode upon which such an item is retained, adjacent said target region; c. providing a voltage to said target electrode, such that said retained item is drawn from said manipulating electrode to said target electrode.
- 139. The method of claim 138, said target comprising a microtitre tray, and said target region comprising a well of said microtitre tray.
- 140. The method of claim 139, said step of providing said manipulating electrode adjacent said target region comprising providing said manipulating electrode within said recess.
- 141. The method of claim 139, each of said wells of said microtitre tray have associated therewith a target electrode, further comprising the step of selectively providing voltage to a selectable one of said target electrodes, thereby selectively drawing said retained item from said manipulating electrode to said selected target electrode and its respective well.
- 142. The method of claim 138, said target comprising an semiconductor chip, and said target electrode comprising a component connector for a microelectronic part, said step of providing said manipulating electrode upon which such an item is retained comprising providing a manipulating electrode upon which a microelectronic component is retained.
- 143. A method of collecting micron scale items having a dielectric constant different from than that of an atmosphere in which they are to be manipulated, to a collecting electrode, the method, comprising the steps of:
a. providing a quantity of said items in a volume within said atmosphere, said volume having an open surface; b. providing an elongated manipulating electrode comprising:
i. an electrode support; ii. a first conducting component, extending from said support; and iii. a second conducting component, spaced from said first conducting component, both said first and second conducting components having a portion that is spaced away from said support; c. positioning said electrode near to said open surface of said volume of items; d. applying an AC voltage to said electrode, such that said first and second conducting components of said electrode are maintained with a potential voltage difference there-between, such that an electric field is generated having a non-zero gradient adjacent at least one of said conducting components, thereby attracting said items to said electrode, such that some of said items contact said electrode, and are retained thereon regardless of the state of any surface charge.
- 144. A method of collecting micron scale items having a dielectric constant different from than that of an atmosphere in which they are to be manipulated, to a collecting electrode, the method, comprising the steps of:
a. providing a quantity of said items in a volume within said atmosphere, said volume having an open surface; b. providing an elongated manipulating electrode comprising:
i. an electrode support; ii. a first conducting component, extending from said support; and iii. a second conducting component, spaced from said first conducting component, both said first and second conducting components having a portion that is spaced away from said support; c. positioning said electrode near to said open surface of said volume of items; d. applying an AC voltage to said electrode, such that said first and second conducting components of said electrode are maintained with a potential voltage difference there-between, such that a spatially non-uniform electric field is generated adjacent at least one of said conducting components, thereby attracting said items to said electrode, such that some of said items contact said electrode, and are retained thereon regardless of the state of any surface charge.
- 145. The method of claim 144, further comprising the step of moving said electrode and said retained items away from said open surface.
- 146. The method of claim 144, said step of providing a quantity of items comprising providing said items without regard to their charge state.
- 147. The method of claim 144, said step of attracting said items to said electrode arising due to a dielectrophoretic force to which said items are subjected by said field.
- 148. The method of claim 144, said first and second conducting components comprising at least two elongated pins.
- 149. The method of claim 144, said first conducting component comprising a ring, and said second conducting component comprising a rod, concentric with said ring.
- 150. The method of claim 149, said rod terminating in a disc having a terminal surface that is coplanar with a terminal surface of said ring.
- 151. The method of claim 144, said first and second conducting components comprising at least one loop.
- 152. The method of claim 151, said loop comprising a loop having an extent that is substantially parallel to said open surface.
- 153. The method of claim 151, said step of attracting said items comprising attracting said items to each of said loops, and to space between said loops.
- 154. The method of claim 144, at least one of said conducting components comprising a component that has a dielectric cover.
- 155. The method of claim 145, further comprising the steps of:
a. moving said electrode with said retained items relative to a target so that said electrode is near to said target; b. removing said voltage from said electrode, whereby said items fall to said target.
- 156. The method of claim 155, said step of moving said electrode comprising providing relative motion between said electrode and said target so that said electrode assumes a position above said target.
- 157. The method of claim 145, further comprising the steps of:
a. providing relative motion between said electrode with said retained items and a target comprising a receptacle, so that said electrode is near to said target; b. providing relative motion between said electrode and said receptacle such that said elongated electrode enters into said receptacle; and c. releasing said retained items from said electrode, into said receptacle.
- 158. The method of claim 157, further wherein:
a. said receptacle target region contains a fluid; and b. said step of releasing comprises washing said items from said electrode with said fluid.
- 159. The method of claim 144, said step of providing an elongated manipulating electrode comprising providing an array of elongated manipulating electrodes.
- 160. The method of claim 159, further comprising the steps of:
a. moving said array of electrodes with said adhered items near to a target comprising an array of receptacles; b. advancing said array of elongated electrodes such that each enters into a respective receptacle of said array of receptacles; and c. releasing said adhered items from each electrode of said array, into said respective receptacle.
- 161. The method of claim 144, further comprising maintaining said atmosphere with a relative humidity of less than approximately 80%.
- 162. The method of claim 160, further comprising the step of calibrating said array of electrodes by measuring the amount of items released within at least one of said receptacles.
- 163. The method of claim 162, said step of measuring comprising measuring the amount of items released within a selected plurality of said receptacles.
- 164. The method of claim 144, said step of providing a volume of items comprising providing said items at a substantially uniform density.
- 165. The method of claim 144, said items characterized by a tap density, said step of providing a volume of items comprising providing said items at the tap density.
- 166. An apparatus for collecting micron scale items having a dielectric constant different from than that of an atmosphere in which they are to be manipulated, to a collecting electrode, the apparatus, comprising:
a. a support for supporting a quantity of said items in a volume within said atmosphere, said volume having an open surface; b. an elongated manipulating electrode comprising:
i. an electrode support; ii. a first conducting component, extending from said support; and iii. a second conducting component, spaced from said first conducting component, both said first and second conducting components having a portion that is spaced away from said support; c. a positioning stage for positioning said electrode near to said open surface of said volume of items; d. a voltage supply couple, configured to couple an AC voltage to said elongated electrode, such that said first and second conducting components of said electrode are maintained with a potential voltage difference there-between, such that a non-uniform electric field is generated adjacent at least one of said conducting components, thereby, upon energization, attracting said items to said electrode, such that some of said items contact said electrode, and are retained thereon regardless of the state of any surface charge.
- 167. The apparatus of claim 166, further comprising an AC voltage supply, coupled by said voltage supply couple to said elongated electrode.
- 168. A method of collecting micron scale items having a dielectric constant greater than that of an atmosphere in which they are to be manipulated, to a collecting electrode, the method, comprising the steps of:
a. providing a quantity of said items in a volume within said atmosphere, said volume having an open surface; b. providing an elongated manipulating electrode comprising:
i. an electrode support; and ii. a conducting component, extending from said support; c. positioning said electrode near to said open surface of said volume of items; d. applying a DC voltage to said electrode, such that an electric field is generated having a non-zero gradient adjacent said conducting component, thereby attracting said items to said electrode, such that some of said items contact said electrode, and are retained thereon.
- 169. The method of claim 168, said electrode further comprising a second conducting component, spaced from said first conducting component, both said first and second conducting components having a portion that is spaced away from said support, said voltage being applied such that said second conducting component comprising said reference.
- 170. The method of claim 168, further comprising the step of moving said electrode and said retained items away from said open surface.
- 171. The method of claim 168, said step of providing a quantity of items comprising providing said items without regard to their charge state.
- 172. The method of claim 168, said step of attracting said items to said electrode arising due to a dielectrophoretic force to which said items are subjected by said field.
- 173. The method of claim 168, said step of attracting said items to said electrode arising without regard to any surface charge state of said items.
- 174. The method of claim 168, said step of attracting said items to said electrode arising without regard to any charge state of said items or polarity of said DC voltage relative to any such charge state.
- 175. The method of claim 169, said first and second conducting components comprising at least two elongated pins.
- 176. The method of claim 169, said first conducting component comprising a ring, and said second conducting component comprising a rod, concentric with said ring.
- 177. The method of claim 176, said rod terminating in a disc having a terminal surface that is coplanar with a terminal surface of said ring.
- 178. The method of claim 176, said rod terminating in a disc having a terminal surface that is not coplanar with a terminal surface of said ring.
- 179. The method of claim 169, said first and second conducting components comprising two loops.
- 180. The method of claim 179, said loops comprising loops having an extent that is substantially parallel to said open surface.
- 181. The method of claim 179, said step of attracting said items comprising attracting said items to each of said loops, and to space between said loops.
- 182. The method of claim 169, at least one of said conducting components comprising a component that has a dielectric cover.
- 183. The method of claim 170, further comprising the steps of:
a. moving said electrode with said retained items near to a target, said target comprised of an electrode which, when provided with a voltage, establishes a field having a non-zero gradient arranged to attract said items from said manipulating electrode to said target electrode; b. providing a voltage to said target electrode, thereby attracting said items away from said manipulating electrode, toward and to contact said target electrode.
- 184. The method of claim 183, said step of moving said electrode comprising moving said electrode to a position above said target.
- 185. The method of claim 170, further comprising the steps of:
a. moving said electrode with said retained items near to a target comprising a receptacle; b. advancing said elongated electrode into said receptacle; and c. releasing said retained items from said electrode, into said receptacle.
- 186. The method of claim 185, further wherein:
a. said receptacle target region contains a fluid; and b. said step of releasing comprises washing said items from said electrode with said fluid.
- 187. The method of claim 185, further wherein:
a. said receptacle target region is adjacent a target electrode that, when energized, gives rise to an electric field that attracts items retained on said first electrode toward said target electrode, without regard to the state of surface charge on said item; and b. said step of releasing comprises energizing said target electrode to draw said items from said first electrode toward said target electrode.
- 188. The method of claim 168, said step of providing an elongated manipulating electrode comprising providing an array of elongated manipulating electrodes.
- 189. The method of claim 188, further comprising the steps of:
a. moving said array of electrodes with said retained items near to a target comprising an array of receptacles; b. advancing said array of elongated electrodes such that each enters into a respective receptacle of said array of receptacles; and c. releasing said retained items from each electrode of said array, into said respective receptacle.
- 190. The method of claim 189, further comprising the step of calibrating said array of electrodes by measuring the amount of items released within each of a selected plurality of said receptacles.
- 191. The method of claim 168, said items characterized by a tap density, said step of providing a volume of items comprising providing said items at the tap density.
- 192. An apparatus for removing micron scale items having a dielectric constant greater than that of a fluid in which they are dispersed, from said fluid, said apparatus comprising:
a. an array of collecting electrodes, each comprising:
i. a first electrode conducting element; and ii. spaced from said first electrode conducting element, a second, counter electrode conducting element, said first and second conducting elements having surfaces that face each other, said facing surfaces being shaped, sized and spaced such that the spacing between them is large relative to the extent of either facing surface, in any one dimension; b. a means for a coupling a voltage source to said electrodes of said array to establish a voltage between said first and second electrode conducting elements; and c. a fluid conduction module arranged relative to said array such that it conducts said fluid past said array such that said micron scale items pass near to said collecting electrodes of said array.
- 193. The apparatus of claim 192 further wherein at least one dimension of said first conducting electrode is small relative to at least one dimension of said second conducting electrode.
- 194. A method for removing micron scale items having a dielectric constant greater than that of a fluid in which they are dispersed, from said fluid, said method comprising:
a. providing apparatus, comprising an array of collecting electrodes, each comprising:
i. a first electrode conducting element; and ii. spaced from said first electrode conducting element, a second, counter electrode conducting element, said first and second conducting elements having surfaces that face each other, said facing surfaces being shaped, sized and spaced such that the spacing between them is large relative to the extent of either facing surface, in any one dimension; b. providing a voltage between said first and second electrode conducting elements; and c. conducting said fluid past said array such that said micron scale items pass near to said collecting electrodes of said array while said voltage is provided, to attract said dielectric items to said collecting electrodes, thereby removing said micron scale items from said fluid.
- 195. An apparatus for collecting micron scale items having a dielectric constant greater than that of a fluid in which they are dispersed, from said fluid, said apparatus comprising:
a. a collecting electrode, comprising:
i. a first electrode conducting element; and ii. spaced from said first electrode conducting element, a second, counter electrode conducting element, said first and second conducting elements having surfaces that face each other, said facing surfaces being shaped, sized and spaced such that the spacing between them is large relative to the extent of either facing surface, in any one dimension; and b. a means for a coupling a voltage source to said electrodes of said array to establish a voltage between said first and second electrode conducting elements.
- 196. A method for collecting micron scale items having a dielectric constant greater than that of a fluid in which they are dispersed, from said fluid, said method comprising:
a. providing a collecting electrode, comprising:
i. a first electrode conducting element; and ii. spaced from said first electrode conducting element, a second, counter electrode conducting element, said first and second conducting elements having surfaces that face each other, said facing surfaces being shaped, sized and spaced such that the spacing between them is large relative to the extent of either facing surface, in any one dimension; and b. establishing a voltage between said first and second electrode conducting elements; c. providing said conducting elements within said fluid adjacent a region in which said items are dispersed, while said voltage is established, thereby attracting said items to said conducting elements.
- 197. A method of manipulating micron scale microelectronic parts, having a dielectric constant greater than that of an environment in which they are to be manipulated, comprising the steps of:
a. providing a microelectronic part on a support within said environment; b. providing an elongated manipulating electrode that is elongated along a dimension of elongation, terminating in a terminal end, with said terminal end adjacent said supported microelectronic part; and c. applying a voltage to said electrode, thereby attracting said microelectronic part to said terminal end of said electrode, upon which it becomes retained.
- 198. The method of claim 197, further comprising the step of providing relative motion between said electrode and said support such that spacing between said terminal end said region increases.
- 199. The method of claim 197, said elongated conducting element comprising a single conducting element.
- 200. The method of claim 197, said step of applying a voltage to said electrode being conducted without regard to any surface charge upon said microelectronic part, or a polarity of said voltage.
- 201. The method of claim 197, said microelectronic part having a shaped profile, said method further comprising the step of providing said manipulating electrode having a terminal end that is shaped to mate with said shaped profile of said microelectronic part.
- 202. The method of claim 197, said microelectronic part having a shaped perimeter, said step of providing an elongated manipulating electrode comprising the step of providing a manipulating electrode having a terminal end that is shaped to mate with said shaped perimeter, and further providing said electrode with said terminal end misaligned relative to said perimeter of said microelectronic part, said step of applying a voltage to said electrode, comprising applying a voltage to said electrode, thereby attracting said microelectronic part to said terminal end of said electrode, and aligning said perimeter of said microelectronic part with said terminal end of said electrode, upon which it becomes retained.
- 203. An apparatus for manipulating microelectronic parts having a shaped perimeter and surface contour, said apparatus comprising:
a. a support, for support of said microelectronic part; b. an elongated manipulating electrode that is elongated along a dimension of elongation, terminating in a terminal end, said terminal end shaped to mate with said surface contour of said microelectronic part; and c. a couple for coupling said electrode to a voltage supply.
- 204. The apparatus of claim 203, said terminal end of said elongated manipulating electrode further being shaped to register with said perimeter of said microelectronic part.
GOVERNMENT RIGHTS
[0001] The United States Government has certain rights in this invention pursuant to the Army Research Office Award # DAAH04-95-1-0104, Multidisciplinary Research in Smart Composites, awarded on Mar. 1, 1995.