Claims
- 1. A phosphor ink applying device for applying phosphor ink to a surface of an object, comprising:one or more tanks for storing phosphor ink, a plurality of nozzle members, each nozzle member having at least one of nozzle aperture, moving means for moving the nozzle members, pressuring means for applying pressure to the phosphor ink stored in any of the tanks so as to discharge the phosphor ink through the nozzle aperture, and control means for individually controlling a discharge quantity of phosphor ink discharged through each nozzle aperture, according to a shape of the surface to which the phosphor ink is to be applied.
- 2. The phosphor ink applying device of claim 1,wherein each nozzle member includes a discharge quantity varying means for varying the discharge quantity through each nozzle aperture, and the control means controls the discharge quantity of the phosphor ink by driving each discharge quantity varying means individually.
- 3. The phosphor ink applying device of claim 2,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 4. The phosphor ink applying device of claim 2,wherein the discharge quantity varying means is a flow path resistance varying means for varying the discharge quantity by varying the flow path resistance of the phosphor ink to the nozzle members.
- 5. The phosphor ink applying device of claim 1,wherein the pressuring means includes at least one of applied pressure varying means for varying the pressure applied to the phosphor ink, and the control means controls the discharge quantity of the phosphor ink by driving each applied pressure varying means individually.
- 6. The phosphor ink applying device of claim 5,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 7. The phosphor ink applying device of claim 1,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 8. The phosphor ink applying device of claim 1,wherein the object is a substrate for use in a plasma display panel and has barrier ribs.
- 9. A phosphor ink applying device for applying phosphor ink to a surface of an object, comprising:one or more tanks for storing phosphor ink, a plurality of nozzle members, each nozzle member having at least one of nozzle aperture, moving means for moving the nozzle members, pressuring means for applying pressure to the phosphor ink stored in any of the tanks so as to discharge the phosphor ink through the nozzle aperture, discharge quantity varying means for varying a discharge quantity of phosphor ink to which pressure is applied, and control means for controlling a discharge quantity of phosphor ink discharged through each nozzle aperture, according to a shape of the surface to which the phosphor ink is to be applied, by driving each discharge quantity varying means individually.
- 10. The phosphor ink applying device of claim 9,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 11. The phosphor ink applying device of claim 9,wherein the discharge quantity varying means is a flow path resistance varying means for varying the discharge quantity by varying the flow path resistance of the phosphor ink to the nozzle members.
- 12. The phosphor ink applying device of claim 11,wherein the flow path resistance varying means is valve.
- 13. The phosphor ink applying device of claim 9,wherein the object is a substrate for use in a plasma display panel and has barrier ribs.
- 14. The phosphor ink applying device of claim 9,wherein the moving means includes a slideable table for carrying the substrate, and the nozzle members are provided so as to be above grooves between the barrier ribs of the substrate.
- 15. A phosphor ink applying method for applying phosphor ink to a surface of an object, comprising:pressuring step for applying pressure to the phosphor ink stored in any of one or more tanks so as to discharge the phosphor ink through a plurality of nozzle members, each nozzle member having at least one of nozzle aperture, and control step for individually controlling a discharge quantity of phosphor ink discharged through each nozzle aperture, according to a shape of the surface to which the phosphor ink is to be applied.
- 16. The phosphor ink applying method of claim 15,the phosphor ink applying method further includes a discharge quantity varying step for varying the discharge quantity through each nozzle aperture individually, and the control step controls the discharge quantity of the phosphor ink by each discharge quantity varying step individually.
- 17. The phosphor ink applying method of claim 16,Wherein the discharge quantity varying step is a flow path resistance varying step for varying the discharge quantity by varying the flow path resistance of the phosphor ink to the nozzle members.
- 18. The phosphor ink applying method of claim 17,wherein the object is a substrate for use in plasma display panel and has barrier ribs.
- 19. The phosphor ink applying method of claim 15,wherein the pressuring step includes at least one of applied pressure varying step for varying the pressure applied to the phosphor ink through each nozzle aperture individually, and the control means controls the discharge quantity of the phosphor ink by each applied pressure varying step.
- 20. The phosphor ink applying method of claim 19,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 21. The phosphor ink applying method of claim 15wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 22. A phosphor ink applying method for applying phosphor ink to a surface of an object, comprising:pressuring step for applying pressure to the phosphor ink stored in any of one or more tanks so as to discharge the phosphor ink through a plurality of nozzle members, each nozzle member having at least one of nozzle aperture, and control step for individually controlling a discharge quantity of phosphor ink discharged through each nozzle aperture, according to a shape of the surface to which the phosphor ink is to be applied discharge quantity varying step for varying a discharge quantity of phosphor ink to which pressure is applied, and control step for controlling a discharge quantity of phosphor ink discharged through each nozzle aperture, according to a shape of the surface to which the phosphor ink is to be applied, by driving each discharge quantity varying means individually.
- 23. The phosphor ink applying method of claim 22,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 24. The phosphor ink applying method of claim 22,wherein the discharge quantity varying step is a flow path resistance varying step for varying the discharge quantity by varying the flow path resistance of the phosphor ink to the nozzle members.
- 25. The phosphor ink applying method of claim 24,wherein the object is a substrate, for use in a plasma display panel and has barrier ribs.
- 26. The phosphor ink applying method of claim 25,wherein the phosphor ink applying method further comprising moving means includes a slideable table for carrying the substrate, and the nozzle members are provided so as to be above grooves between the barrier ribs of the substrate.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-296314 |
Oct 1999 |
JP |
|
RELATED APPLICATIONS
This is a divisional application of Ser. No. 09/857,672 which is the national stage filing of PCT/JP00/07223 filed on Oct. 18, 2000.
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