Claims
- 1. A phosphor ink applying device for applying phosphor ink to a surface of an object, comprising:one or more tanks for storing phosphor ink, a plurality of nozzle members, each nozzle member having at least one nozzle aperture, moving unit for moving the nozzle members, pressuring unit for applying pressure to the phosphor ink stored in any of the tanks so as to discharge the phosphor ink through the nozzle aperture, and control unit for individually controlling a discharge quantity of phosphor ink discharged through each nozzle aperture, according to a predetermined discharge flow set for each nozzle aperture.
- 2. The phosphor ink applying device of claim 1,wherein each nozzle member includes a discharge quantity varying unit for varying the discharge quantity through each nozzle aperture, and the control unit controls the discharge quantity of the phosphor ink by driving each discharge quantity varying unit individually.
- 3. The phosphor ink applying device of claim 2,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 4. The phosphor ink applying device of claim 2,wherein the discharge quantity varying unit is a flow path resistance varying unit for varying the discharge quantity by varying the flow path resistance of the phosphor ink to the nozzle members.
- 5. The phosphor ink applying device of claim 1,wherein the pressuring unit includes at least one applied pressure varying unit for varying the pressure applied to the phosphor ink, and the control unit controls the discharge quantity of the phosphor ink by driving each applied pressure varying unit individually.
- 6. The phosphor ink applying device of claim 5,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 7. The phosphor ink applying device of claim 1,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 8. The phosphor ink applying device of claim 1,wherein the control unit controls the discharge quantity of phosphor ink through each nozzle aperture so as to correct the deviations in discharge flow through each nozzle aperture.
- 9. The phosphor ink applying device of claim 1,wherein the object is a substrate for use in a plasma display panel and has barrier ribs.
- 10. The phosphor ink applying device of claim 1,wherein the control means controls the discharge quantity of the phosphor ink through each nozzle aperture so as to correct any deviations in discharge flow through each nozzle aperture.
- 11. A phosphor ink applying device for applying phosphor ink to a surface of an object, comprising:one or more tanks for storing phosphor ink, a plurality of nozzle members, each nozzle member having at least one nozzle aperture, moving unit for moving the nozzle members, pressuring unit for applying pressure to the phosphor ink stored in any of the tanks so as to discharge the phosphor ink through the nozzle aperture, discharge quantity varying unit for varying a discharge quantity of phosphor ink to which pressure is applied, and control unit for controlling a discharge quantity of phosphor ink discharged through each nozzle aperture, according to a predetermined discharge flow set for each nozzle aperture, by driving each discharge quantity varying unit individually.
- 12. The phosphor ink applying device of claim 11,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 13. The phosphor ink applying device of claim 11,wherein the discharge quantity varying unit is a flow path resistance varying unit for varying the discharge quantity by varying the flow path resistance of the phosphor ink to the nozzle members.
- 14. The phosphor ink applying device of claim 13,wherein the flow path resistance varying unit includes a valve.
- 15. The phosphor ink applying device of claim 11,wherein the object is a substrate for use in a plasma display panel and has barrier ribs.
- 16. The phosphor ink applying device of claim 11,wherein the moving unit includes a slideable table for carrying the substrate, and the nozzle members are provided so as to be above grooves between the barrier ribs of the substrate.
- 17. The phosphor ink applying device of claim 11,wherein the control means controls the discharge quantity of the phosphor ink through each nozzle aperture so as to correct any deviations in discharge flow through each nozzle aperture.
- 18. The phosphor ink applying device of claim 11,wherein the control unit controls the discharge quantity of the phosphor ink through each nozzle aperture so as to correct the deviations in discharge flow through each nozzle aperture.
- 19. A phosphor ink applying method for applying phosphor ink to a surface of an object, comprising:pressuring step for applying pressure to the phosphor ink stored in any of one or more tanks so as to discharge the phosphor ink through a plurality of nozzle members, each nozzle member having at least one nozzle aperture, and control step for individually controlling a discharge quantity of phosphor ink discharged through each nozzle aperture, according to a predetermined discharge flow set for each nozzle aperture.
- 20. The phosphor ink applying method of claim 19,wherein the phosphor ink applying method further includes a discharge quantity varying step for varying the discharge quantity through each nozzle aperture individually, and the control step controls the discharge quantity of the phosphor ink by each discharge quantity varying step individually.
- 21. The phosphor ink applying method of claim 20,wherein the discharge quantity varying step is a flow path resistance varying step for varying the discharge quantity by varying the flow path resistance of the phosphor ink to the nozzle members.
- 22. The phosphor ink applying method of claim 21,wherein the object is a substrate for use in plasma display panel and has barrier ribs.
- 23. The phosphor ink applying method of claim 19,wherein the control unit controls the discharge quantity of the phosphor ink through each nozzle aperture so as to correct the deviations in discharge flow through each nozzle aperture.
- 24. The phosphor ink applying method of claim 19,wherein the pressuring step includes at least one of applied pressure varying step for varying the pressure applied to the phosphor ink through each nozzle aperture individually, and controlling the discharge quantity of the phosphor ink by each applied pressure varying step.
- 25. The phosphor ink applying method of claim 24,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 26. The phosphor ink applying method of claim 19,wherein the nozzle members are positioned offset from each other in the direction of the nozzle movement in relation to the surface.
- 27. The phosphor ink applying method of claim 19,wherein the control means controls the discharge quantity of the phosphor ink through each nozzle aperture so as to correct any deviations in discharge flow through each nozzle aperture.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-296314 |
Oct 1999 |
JP |
|
RELATED APPLICATIONS
This is a divisional application of Ser. No. 09/857,672 filed Oct. 9, 2001, now U.S. Pat. No. 6,503,116, which is the national stage filing of PCT/JP 00/07223 filed on Oct. 18, 2000.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
6249264 |
Sano et al. |
Jun 2001 |
B1 |
6508687 |
Suzuki et al. |
Jan 2003 |
B2 |
6511145 |
Tsuboi et al. |
Jan 2003 |
B1 |
6547617 |
Kawamura et al. |
Apr 2003 |
B1 |
Foreign Referenced Citations (6)
Number |
Date |
Country |
63155527 |
Jun 1988 |
JP |
8257466 |
Oct 1996 |
JP |
10223138 |
Aug 1998 |
JP |
10228863 |
Aug 1998 |
JP |
11213896 |
Aug 1999 |
JP |
11239748 |
Sep 1999 |
JP |