This application is based on reference Japanese Patent Application No. 2013-208977 filed on Oct. 4, 2013, the disclosure of which is incorporated herein by reference.
The present disclosure relates to a manufacturing method for a resin hollow member. The present disclosure further relates to the resin hollow member. The present disclosure further relates to an airflow measuring device having the resin hollow member manufactured by the manufacturing method.
Conventionally, a thermal-type airflow measuring device is employed to measure a flow rate of air by utilizing heat transfer from a heating element to air. The conventional thermal-type airflow measuring device is employed, for example, to measure a flow rate of intake air drawn into the internal combustion engine.
An airflow measuring device includes a case and a sensor. The case forms a passage of air. The sensor is located in the passage formed in the case. The case of the airflow measuring device is, for example, a resin hollow member having a hollow space. The case utilizes the hollow space as the passage of air.
For example, Patent Document 1 may disclose a method for manufacturing a resin hollow member. The method includes a primary forming step and a secondary forming step. The primary forming step includes to injection-mold resin to form a pair of half hollow members, such that each of the half hollow members has a half-hollow space. In the secondary forming step, the half hollow members are mated to form a resin filling space between the mated surfaces, and the resin filling space is charged with melting resin. Subsequently, the melting resin is solidified. That is, the half hollow members are joined together with secondary resin to manufacture the resin hollow member.
It is noted that, the manufacturing method of Patent Document 1 may have a concern that the joined portion between the half hollow members may have an insufficient strength. For example, in the resin hollow member formed by the method according to Patent Document 1, it may be difficult to enhance a joining strength between the half hollow members in a direction (mating direction) in which the half hollow members are opposed to each other.
Patent Document 2 may disclose to form a hole in a half hollow member to extended along a mated direction. Patent Document 2 may further disclose a secondary forming process to charge melting resin into the hole and to form a projected portion, which is greater than the hole in diameter, on the outside of the hole. It is noted that, the manufacturing method of Patent Document 2 includes to form the projected portion on the surface of the resin hollow member. Therefore, in a case where the resin hollow member is employed as, for example, a case of an airflow measuring device, the projected portion may cause turbulence in airflow around the surface of the airflow measuring device. Consequently, the turbulence may exert an adverse effect on measurement of airflow.
Publication of unexamined Japanese patent application No. 2011-148293
Japanese Patent Gazette No. 3263167
It is an object of the present disclosure to produce a method for manufacturing a resin hollow member and to enable to enhance a joining strength between half hollow members. It is another object of the present disclosure to produce the resin hollow member.
According to an aspect of the present disclosure, a method is for manufacturing a resin hollow member. The resin hollow member has a hollow space internally. The method comprises mating a pair of half hollow members to each other at mating surfaces to form a resin filling space between the mating surfaces, the half hollow members being formed of resin. The method further comprises charging the resin filling space with melting resin and solidifying the melting resin. Each of the mating surface has a groove, which has a bottom surface in which a hole opens. The groove and the hole form the resin filling space between the mating surfaces when the half hollow members are mated to each other. A wall surface of the groove and an inner periphery of the hole are equipped with a melting projection, which are configured to be melted with heat of the melting resin and to be solidified with the melting resin.
According to another aspect of the present disclosure, a method is for manufacturing a resin hollow member having a hollow space internally. The method comprises mating a pair of half hollow members to each other at mating surfaces to cause a groove, which is formed in each of the mating surfaces, and a hole, which opens in a bottom surface of the groove, to form a resin filling space between the mating surfaces, the half hollow members being formed of resin. The method further comprises charging the resin filling space with melting resin to melt a melting projection, which is formed on a wall surface of the groove and an inner periphery of the hole, with heat of the melting resin. The method further comprises solidifying the melting projection with the melting resin.
According to another aspect of the present disclosure, a resin hollow member has a hollow space internally. The resin hollow member comprises a first half hollow member. The resin hollow member further comprises a second half hollow member. The first half hollow member and the second half hollow member have mating surfaces, respectively. Each of the mating surfaces defines a groove, which has a bottom surface in which a hole opens. The groove and the hole are configured to form a resin filling space between the mating surfaces when the first half hollow member and the second half hollow member are mated to each other at the mating surfaces. A wall surface of the groove and an inner periphery of the hole are equipped with a melting projection, which are configured to be melted with heat of the melting resin and to be solidified with the melting resin.
The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description made with reference to the accompanying drawings. In the drawings:
As follows, an embodiment according to the present disclosure will be described in detail with reference to drawings.
Configurations of a resin hollow member 1 and an airflow measuring device 3 according to an embodiment will be described with reference to
The airflow measuring device 3 further includes a sensor 9 for detecting a flow of air drawn into the passage 8. The sensor 9 includes a sensor chip 9a and a driver control circuit (not shown). The sensor chip 9a includes a semiconductor circuit board equipped with an element such as a heating element. The driver control circuit drives the element of the sensor chip 9a. The sensor chip 9a and the control circuit are integrated into a single component to form a sub-assembly. In the airflow measuring device 3, the sub-assembly is inserted in the case 2, such that the sensor chip 9a is exposed to the passage 8.
The passage 8 formed in the case 2 includes an inlet 11, an outlet 12, a straight passage 13, a bent portion 15, and a round passage 17. The inlet 11 opens toward the upstream in the air intake passage. The outlet 12 opens toward the downstream in the air intake passage. The straight passage 13 is formed linearly between the inlet 11 and the outlet 12. The round passage 17 branches from an intermediate portion of the straight passage 13 to extend through the bent portion 15 toward an outlet 16. The outlet 16 opens toward the downstream in the air intake passage.
The bent portion 15 of the round passage 17 is branched from the straight passage 13 to extend radially outward relative to the air intake passage. Subsequently, the bent portion 15 extends toward the downstream of the air intake passage. Subsequently, the bent portion 15 extends radially inward relative to the air intake passage. The sensor chip 9a is located in the round passage 17.
With the present configuration, the airflow measuring device 3 draws a part of intake air, which flows through the air intake passage, into the passage 8. In addition, the sensor chip 9a generates an electric signal representing a flow rate of intake air and sends the electric signal. In the present configuration, the sensor chip 9a is not located directly in the air intake passage. The sensor chip 9a is located in the passage 8 of the case 2 of the airflow measuring device 3. The present configuration of the airflow measuring device 3 enables to avoid direct influence of turbulence of flow in the air intake passage exerted to the sensor chip 9a. Thus, the present configuration enables the sensor chip 9a to send an electric signal representing the measurement result with less variation.
A manufacturing method for the resin hollow member 1 according to the embodiment will be described with reference to
As described below, the manufacturing method of the resin hollow member 1 includes a primary forming step and a secondary forming step. In the primary forming step, the half hollow members 5 and 6 are formed. In the secondary forming step, the half hollow members 5 and 6 are joined together with a secondary resin. Specifically, as shown in
In the primary forming step, as shown in
Referring to
The grooves 5c and 6c and the holes 5d and 6d form a single space when the mating surfaces 5b and 6b are in contact with each other. The space formed with the grooves 5c and 6c and the holes 5d and 6d is the resin filling space 20. In the present embodiment, the holes 5d and 6d are formed as single holes in the mating surfaces 5b and 6b, respectively. It is noted that, two or more holes may be formed in at least one of the mating surfaces 5b and 6b, as the hole 5d and 6d.
It is further noted that, a gate G is formed in at least one of the half hollow members 5 and 6 to charge melting resin into the resin filling space 20. In the present embodiment, the gate G is formed in the half hollow member 5. The gate G is formed separately from the holes 5d and 6d.
As follows, the resin filling space 20 will be described further in detail. A wall surface, which forms the resin filling space 20, has a melting projection. When the resin filling space 20 is charged with melting resin, the melting projection is melted with heat of the melting resin and is solidified with the melting resin.
More specifically, as shown in
It is noted that, the melting projections 25 and 26 may be formed on a groove lateral surface.
As shown in
In
As shown in
According to the embodiment, the melting projections 25 to 28 formed on both the grooves 5c and 6c and the holes 5d and 6d enable to enhance a welding strength among the secondary resin portion 21 and the half hollow members 5 and 6. Therefore, the joining strength between the half hollow members 5 and 6 can be enhanced. In addition, a projected portion is not formed on the surface of the resin hollow member 1, dissimilarly to a conventional form. Therefore, in a case where the present embodiment is employed in the case 2 for the airflow measuring device 3, turbulence of flow may be avoided.
The configurations of the resin hollow member 1 and the airflow measuring device 3 are not limited to those in the above-described embodiment, and may employ various modifications. As shown in
In addition, as shown in
In addition, the melting projections 27 and 28 may not be formed throughout the holes 5d and 6d in total length. For example, as shown in
Furthermore, for example, as shown in
For example, as shown in
The cross-sectional shape of the projection t is not limited to a trapezoidal shape. As shown in
The method for manufacturing the resin hollow member according to the present disclosure includes to mate the pair of half hollow members to each other to form the resin filling space between the mating surfaces. The method further includes to charge the resin filling space with the melting resin. The method further includes to solidify the melting resin.
The half hollow member has the groove, which is formed on the mating surface, and the hole, which opens in the bottom surface of the groove. The groove and the hole form the resin filling space between mating surfaces when the half hollow members are mated to each other.
The melting projection is formed on the wall surface of the groove and the inner circumferential periphery of the hole. The melting projection is melted with heat of the melting resin. The melting projection is solidified with the melting resin.
According to the present method and configuration, the melting projection on both the groove and the hole may enable to enhance welding strength, thereby to enhance joining strength between the half hollow members.
In addition, a projected portion is not formed on the surface of the resin hollow member, dissimilarly to a conventional form. Therefore, in a case where the present embodiment is employed in the case for the airflow measuring device, turbulence of flow may be avoided.
It should be appreciated that while the processes of the embodiments of the present disclosure have been described herein as including a specific sequence of steps, further alternative embodiments including various other sequences of these steps and/or additional steps not disclosed herein are intended to be within the steps of the present disclosure.
While the present disclosure has been described with reference to preferred embodiments thereof, it is to be understood that the disclosure is not limited to the preferred embodiments and constructions. The present disclosure is intended to cover various modification and equivalent arrangements. In addition, while the various combinations and configurations, which are preferred, other combinations and configurations, including more, less or only a single element, are also within the spirit and scope of the present disclosure.
Number | Date | Country | Kind |
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2013-208977 | Oct 2013 | JP | national |
Number | Date | Country |
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B-3263167 | Sep 1994 | JP |
2004-293436 | Oct 2004 | JP |
2006-035760 | Feb 2006 | JP |
2011-148293 | Aug 2011 | JP |
2011-218700 | Nov 2011 | JP |
2013-077055 | Apr 2013 | JP |
Entry |
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Office Action issued Oct. 27, 2015 in corresponding JP Application No. 2013-208977. |
Number | Date | Country | |
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20150096365 A1 | Apr 2015 | US |