This application is a national stage filing under 35 U.S.C. § 371 of international application number PCT/CN2021/074018, filed on Jan. 28, 2021, which claims priority to Chinese patent application No. 202110033052.9 filed on Jan. 11, 2021. The contents of these applications are incorporated herein by reference in their entirety.
The disclosure relates to the technical field of heat dissipation, and particularly to a manufacturing method for a vapor chamber, a vapor chamber and a middle frame vapor chamber.
In related arts, electronic products, such as mobile phones, are becoming thinner and lighter, leaving less and less assembly space for components. Therefore, vapor chamber, as an application hotspot of heat dissipation technology, is being applied to more types of mobile phones. According to existing technologies, the vapor chamber subjected to a heat treatment has greatly weakened material strength and lacks mechanical strength, thus being greatly limited in application. In addition, existing vapor chambers are all covered on electronic components in a traditional middle frame, and only have a heat dissipation function, thus being relatively simple in function.
The disclosure aims to solve at least one of the technical problems in the existing technology. Therefore, the disclosure provides a manufacturing method for a vapor chamber, which has a good anti-aging performance, and has a heat dissipation effect and a high mechanical strength at the same time, so that the vapor chamber has a supporting effect when electronic components are mounted, thus being multi-functional.
The disclosure further provides a vapor chamber manufactured by the manufacturing method for a vapor chamber above.
The disclosure further provides a middle frame vapor chamber having the vapor chamber above.
A manufacturing method for a vapor chamber according to an embodiment in a first aspect of the disclosure includes:
The manufacturing method for a vapor chamber according to an embodiment of the disclosure has at least the following beneficial effects. The vapor chamber does not react with water by the surface heat treatment, so that an anti-aging performance of the vapor chamber is effectively improved. In addition, the manufacturing method for a vapor chamber in the disclosure enhances an overall mechanical strength of the vapor chamber by welding the reinforcing rib for the vapor chamber, so that the vapor chamber has a heat dissipation effect and a high mechanical strength at the same time. The vapor chamber can have a supporting effect when electronic components are mounted, thus being multi-functional. Therefore, the vapor chamber manufactured by the manufacturing method for a vapor chamber in the disclosure has a good anti-aging performance and a very good mechanical strength, and can have a supporting effect on electronic components, thus being multi-functional.
According to some embodiments of the disclosure, preparing different raw materials for various parts of the vapor chamber, and machining and molding the various parts according to predetermined shapes of the various parts by using corresponding raw materials, includes:
According to some embodiments of the disclosure, assembling the machined and molded various parts of the vapor chamber, and welding and sealing the assembled various parts of the vapor chamber, includes:
According to some embodiments of the disclosure, performing a surface heat treatment on the vapor chamber after welding and sealing, includes:
According to some embodiments of the disclosure, performing a passivating treatment on the vapor chamber subjected to the surface heat treatment, includes:
According to some embodiments of the disclosure, assembling the vapor chamber subjected to the passivating treatment with a liquid injection pipe, includes:
A vapor chamber is provided according to an embodiment in a second aspect of the disclosure, which is manufactured by the above-mentioned manufacturing method for a vapor chamber.
The vapor chamber according to an embodiment of the disclosure has at least the following beneficial effects. The vapor chamber has a good anti-aging performance and a high mechanical strength, and can have a supporting effect on electronic components.
According to some embodiments of the disclosure, a surface of one side of the upper cover close to the liquid suction core is provided with a plurality of reinforcing ribs, the reinforcing ribs abut against a surface of one side of the lower cover close to the liquid suction core, and the reinforcing ribs are welded with the lower cover.
According to some embodiments of the disclosure, a surface of one side of the lower cover far away from the liquid suction core is provided with a plurality of welding points, a position of each of the welding points faces directly one of the reinforcing ribs inside the vapor chamber, and the reinforcing ribs are welded with the lower cover through the welding points.
A middle frame vapor chamber is provided according to an embodiment in a third aspect of the disclosure, which includes:
The middle frame vapor chamber according to an embodiment of the disclosure has at least the following beneficial effects. The vapor chamber and the middle frame are connected into a whole by welding the vapor chamber with the middle frame, which enhances a mechanical strength of the middle frame vapor chamber, thus reducing a thickness of the middle frame vapor chamber on the premise of achieving the same effect, and realizing large-area heat dissipation.
Additional aspects and advantages of the disclosure will be given in part in the following description, which will become apparent from the following description or be understood through practice of the disclosure.
The disclosure is further described hereinafter with reference to the drawings and the embodiments, wherein:
Embodiments of the disclosure are described in detail hereinafter, examples of the embodiments are shown in the drawings, and the same or similar reference numerals throughout the drawings denote the same or similar elements or elements having the same or similar functions. The embodiments described hereinafter with reference to the drawings are exemplary, are only intended to explain the disclosure, and cannot be understood as limiting the disclosure.
In the description of the disclosure, it should be understood that, the description with reference to the orientation or position relationship, such as the orientation or position relationship indicated by the terms “upper”, “lower”, “front”, “rear”, “left”, “right”, and the like is based on the orientation or position relationship shown in the drawings, which is only used for convenience of the description of the disclosure and simplification of the description instead of indicating or implying that the indicated device or element must have a specific orientation, and be constructed and operated in a specific orientation, and thus should not be understood as a limitation to the disclosure.
In the description of the disclosure, the term “several” refers to being one or more, the term “multiple” refers to being two or more, and the terms “greater than”, “less than”, “more than” and the like are understood as not including the following number, while the terms “above”, “below”, “within” and the like are understood as including the following number. If there is the description of first and second, it is only for the purpose of distinguishing between technical features, and should not be understood as indicating or implying relative importance, implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
In the description of the disclosure, unless otherwise explicitly defined, the terms “setting”, “mounting” and “connecting” should be understood in a broad sense, and those of ordinary skills in the art can reasonably determine the specific meanings of the above terms in the disclosure in combination with the specific contents of the technical solution.
In the description of the disclosure, the descriptions with reference to the terms “one embodiment”, “some embodiments”, “schematic embodiments”, “examples”, “specific examples”, or “some examples” refer to that the specific features, structures, materials, or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the disclosure. In the specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
A manufacturing method for a vapor chamber according to an embodiment of the disclosure is described hereinafter with reference to
As shown in
In related arts, a mobile phone is gradually becoming thinner and lighter, leaving less and less assembly space for electronic components. The vapor chamber 100, as a technical solution for heat dissipation of the mobile phone, has been widely applied.
The vapor chamber 100 does not react with water by the surface heat treatment on the vapor chamber 100, so that the anti-aging performance of the vapor chamber is effectively improved, and the reliability of the vapor chamber 100 is ensured. In addition, an overall mechanical strength of the vapor chamber 100 is enhanced by welding the reinforcing rib 111 for the vapor chamber 100, so that the vapor chamber 100 has a heat dissipation effect and a high mechanical strength at the same time. The vapor chamber 100 can have a supporting effect when electronic components are mounted, thus being multi-functional. Therefore, the manufacturing method for a vapor chamber 100 in the disclosure has a good anti-aging performance and a very good mechanical strength. In addition to realizing heat dissipation of electronic components, the vapor chamber can also be used as a support for mounting electronic components, thus being multi-functional.
It can be understood that, as shown in
Specifically, as shown in
Specifically, as shown in
It can be understood that, as shown in
It can be understood that, as shown in
It can be understood that, as shown in
Further, the sealing treatment above is performed by a secondary degasser. The sealing treatment can effectively remove waste gas in the vapor chamber, and effectively seal the liquid injection pipe, thus improving the heat dissipation effect of the vapor chamber.
It can be understood that, as shown in
The welding of the reinforcing ribs 111 can effectively enhance the mechanical strength of the vapor chamber.
It can be understood that, as shown in
Specifically, the braze welding may be high temperature braze welding, the fusion welding may be laser welding, and the pressure welding may be diffusion welding. By adopting the above welding methods, a better welding effect and a good sealing effect can be achieved.
It can be understood that, as shown in
The surface heat treatment can make the vapor chamber 100 have a very good anti-aging performance.
It can be understood that, as shown in
The passivating treatment can make the vapor chamber 100 have a good anti-corrosion performance.
It can be understood that, as shown in
Specifically, the annealing treatment is performed on the liquid injection pipe at an annealing temperature of 400° C. to 800° C., and after heat preservation for 1 hour to 3 hours, the liquid injection pipe is cooled to room temperature along with the furnace, thus being simple to operate, and providing conditions for subsequent processes.
The vapor chamber 100 according to an embodiment of the disclosure is described hereinafter with reference to
As shown in
After the process treatments above, the vapor chamber 100 has a good anti-aging performance, a certain anti-corrosion performance and a high mechanical strength, and can have a supporting effect on electronic components.
It can be understood that, as shown in
The welding of the reinforcing ribs 111 effectively enhances the mechanical strength of the vapor chamber, so that the vapor chamber 100 can also be used as a support for mounting electronic components while having a heat dissipation effect, thus being multi-functional.
It can be understood that, as shown in
Specifically, the reinforcing ribs 111 are welded by laser welding, with 4 welding points 131, and connecting lines of the welding points 131 form a square, which is more conducive to uniform stress.
A middle frame vapor chamber according to an embodiment of the disclosure is described hereinafter with reference to
As shown in
The vapor chamber 100 and the middle frame 200 are connected into a whole by welding the vapor chamber 100 with the middle frame 200, which enhances a mechanical strength of the middle frame 200 vapor chamber 100, thus reducing a thickness of the middle frame 200 vapor chamber on the premise of achieving the same effect, and realizing large-area heat dissipation.
Specifically, the vapor chamber 100 and the middle frame 200 may be connected by laser welding, riveting or cementing.
The embodiments of the disclosure are described in detail with reference to the drawings above, but the disclosure is not limited to the above embodiments, and various changes may also be made within the knowledge scope of those of ordinary skills in the art without departing from the purpose of the disclosure. In addition, the embodiments of the disclosure and the features in the embodiments may be combined with each other without conflict.
Number | Date | Country | Kind |
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202110033052.9 | Jan 2021 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2021/074018 | 1/28/2021 | WO |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2022/147861 | 7/14/2022 | WO | A |
Number | Date | Country |
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102506597 | Jun 2012 | CN |
107764116 | Mar 2018 | CN |
109341393 | Feb 2019 | CN |
209643138 | Nov 2019 | CN |
110966880 | Apr 2020 | CN |
111543798 | Aug 2020 | CN |
112077547 | Dec 2020 | CN |
112087920 | Dec 2020 | CN |
201940829 | Oct 2019 | TW |
2019056506 | Mar 2019 | WO |
Entry |
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International Search Report of International Application No. PCT/CN2021/074018, mailed May 28, 2021, 5 pages,. |
Written Opinion of International Application No. PCT/CN2021/074018, mailed May 28, 2021, 5 pages. |
First Office Action of Chinese Application No. 202110033052.9, dated Aug. 31, 2021, 14 pages. |
Second Office Action of Chinese Application No. 202110033052.9, dated Nov. 25, 2021, 12 pages. |
Number | Date | Country | |
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20230366632 A1 | Nov 2023 | US |