Patent Application
20180037489
The present application is based on and claims benefit of priority under 35 U.S.C. §119 of Japanese Patent Applications No. 2016-154627, filed Aug. 5, 2016. The contents of the application are incorporated herein by reference in their entirety.
The disclosure herein generally relates to a manufacturing method of a glass substrate having a hole, such as a through hole or a non-through hole.
A technique has been known, so far, where a glass substrate having a hole, such as a through hole or a non-through hole, is manufactured by using a laser irradiation technique.
For example, for manufacturing a glass substrate with a through hole, typically,
(A) a step of preparing a glass substrate, which has first and second surfaces, and a first thickness;
(B) a step of irradiating with a laser from a first surface side of the glass substrate to form a through hole in the glass plate; and
(C) a step of performing wet etching to enlarge the through hole to a desired size, are performed.
When the step (C) is applied, though the through hole can be adjusted to have a size in a desired range, at the same time, the thickness of the glass substrate is decreased. Consequently, a problem arises where the final thickness of the glass substrate is deviated from a predetermined range.
Moreover, in order to avoid such a problem, when at the step (B) an attempt is made to form in advance a through hole with a size that is close to a predetermined size, a crack is likely to be generated in the glass substrate, and a yield rate of manufacturing is lowered. The present invention, in consideration of the above-described problem, aims at providing a method of manufacturing a glass substrate with a hole having a desired size and with a desired thickness at a high yield rate.
According to an aspect of the present invention there is provided a manufacturing method of a glass substrate with a hole having a diameter φf, and with a thickness θf. The method includes
(1) setting a thickness θ1 of a glass plate that is to be processed;
(2) preparing a glass plate with the thickness θ1, having a first surface and second surface opposite to each other;
(3) forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter φ1 on the first surface; and
(4) performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter φf on the first surface is formed, and a thickness of the glass plate is adjusted from θ1 to a target value of θf.
According to an aspect of the present invention, a method can be provided with which a glass substrate having a desired thickness provided with a hole having a desired size can be manufactured with a high yield rate.
Other objects, features and advantages of the present invention will become more apparent from the following detailed description when read in conjunction with the accompanying drawings, in which:
In the following, with reference to drawings, embodiments of the present invention will be described.
(Conventional Method of Manufacturing Glass Substrate Having Through Hole)
First, in order to gain a better sense of the feature of the present invention, with reference to
The conventional method of manufacturing a glass substrate having a through hole (in the following, referred to as the “conventional method”) includes, typically,
(A) a step of preparing a glass plate having first and second surfaces, and a first thickness (first step);
(B) a step of irradiating with a laser from a first surface side of the glass plate to form a through hole (second step); and
(C) a step of performing wet etching for the glass plate having the through hole to enlarge a size of the through hole (third step).
First, at the first step, as illustrated in
Next, in the second step, as illustrated in
Typically, an initial through hole 25 is formed in a tapered shape so that a diameter decreases toward the second surface 14 from the first surface 12 of the glass plate 10. That is, a diameter of the first aperture 26a>a diameter of the second aperture 26b.
However, in this case, for simplicity, a cross-sectional diameter of the initial through hole 25 is assumed to be constant (φ1) along an extension direction of the initial through hole 25. That is, the diameter of the first aperture 26a and the diameter of the second aperture 26b are assumed to be φ1.
Typically, by the laser processing only, the diameter φ1 of the initial through hole 25 is often insufficient for a predetermined size. Then, in a typical case, a third step (wet etching process) is subsequently performed.
According to the third step, the glass plate 10 is subjected to wet etching, and thereby the initial through hole 25 is expanded to the predetermined size. For example,
According to the above-described process, a glass substrate 30 including a through hole 35 having a desired dimension can be manufactured.
In the above-described conventional method, in order to omit the third step, it might be considered to directly form a through hole having the predetermined dimension in advance (through hole 35), in the second step, by the laser processing. However, in the case of directly forming such a through hole having a large size, a crack is likely to be generated in the glass plate 10, and a yield rate of manufacturing is lowered. Therefore, omitting the third step is not practical from the viewpoint of productivity. Accordingly, in the conventional method, omitting the third step is not widely considered.
In the conventional method, as illustrated in
Until recent, an amount of change in the thickness of the glass plate 10 by the wet etching has not been comparatively great. The amount is, for example, on an order of a few tens of micrometers. Therefore, until recent, such a problem of change in the thickness of the glass plate 10 has seldom been of attention.
However, a glass substrate having a through hole is, for example, used for a glass interposer of a semiconductor component, or the like. In this field, recently, a high dimensional accuracy has been required for the glass substrate and the through hole. The required dimensional accuracy is often on an order of a few micrometers. Therefore, it has become necessary to apply measures even for a deviation of a thickness in a level of an order of a few tens of micrometers.
Moreover, the above-described problem is not a problem specific to the method of manufacturing a glass substrate having a through hole. Such a problem can similarly occur also for a method of manufacturing a glass substrate having a non-through hole.
An embodiment of the present invention provides a method of manufacturing a glass substrate with a hole having a diameter φf, and with a thickness θf, including
(1) setting a thickness θ1 of a processed glass plate;
(2) preparing a glass plate having first and second surfaces opposite to each other, and the thickness θ1;
(3) forming one initial characteristic object or two or more initial characteristic objects on the glass plate by irradiating with a laser from a first surface side of the glass plate, the initial characteristic object having a size of a diameter φ1 on the first surface; and
(4) performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter φf on the first surface is formed, and the thickness of the glass plate is adjusted from θ1 to a target value of θf.
In the above-described manufacturing method, at the step (1), the thickness θ1 of the glass plate is set so that after the wet etching for the glass plate at the step (4), the thickness of the glass substrate is the target value θf and the diameter of the hole on the first surface is φr.
Therefore, in the embodiment of the present invention, it becomes possible to significantly remove the conventional problem that a final thickness of a glass substrate is deviated from a predetermined range after wet etching. Moreover, it becomes possible to manufacture a glass substrate having a hole of a desired size and having a desired thickness with a high yield rate.
It is necessary to pay attention that in the present application a “glass plate” and a “glass substrate” are used differently as a term. (However, this usage does not necessarily mean that both terms represent different members.)
Specifically, the “glass plate” represents a raw material (start) member that is provided for manufacturing the glass substrate, and an intermediate member in which some processes are performed for manufacturing the glass substrate.
The “glass substrate” means a glass member obtained after completing a presumed series of processes, in other words, a completed glass member. For example, in the present application, the glass plate on which a completed target hole is formed is referred to as a glass substrate. However, this member can also be directly referred to as a “glass plate”. Therefore, a “glass plate” is a term including a “glass substrate”.
(Method of Manufacturing Glass Substrate Having Hole According to Embodiment of Present Invention)
Next, with reference to
As illustrated in
(1) setting a thickness θ1 of a processed glass plate (step S110);
(2) preparing a glass plate having first and second surfaces opposite to each other, and the thickness θ1 (step S120);
(3) forming one initial characteristic object or two or more initial characteristic objects on the glass plate by irradiating with a laser from a first surface side of the glass plate, the initial characteristic object having a size of a diameter φ1 on the first surface (step S130); and
(4) performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter φf on the first surface is formed, and the thickness of the glass plate is adjusted from θ1 to a target value of θf (step S140).
In the following, with reference to
(Step S110)
First, the thickness of the processed glass plate is set.
The method of setting the thickness of the processed glass includes various methods. In the following, with reference to
As illustrated in
(i) irradiating a dummy glass plate having first and second dummy surfaces opposite to each other with a laser from a side of the first dummy surface, and forming an initial dummy characteristic object on the dummy glass plate, the initial dummy characteristic object having a dimension of diameter φ1 on the first dummy surface (step S111);
(ii) performing wet etching for the dummy glass plate, and grasping a relation between an amount of etching for the dummy glass plate, and the diameter on the first dummy surface of a hole that has been formed by performing the etching for the initial dummy characteristic object (step S113);
(iii) setting, from the relation, an etching amount Et for obtaining a hole with the diameter φf on the first dummy surface (step S115); and
(iv) setting the thickness θ1 of the processed glass plate from a relation
θ1=θf+Et. formula (1)
In the following, the respective steps will be described.
(Step S111)
First, the dummy glass plate will be prepared.
A shape of the dummy glass plate is not particularly limited. The dummy glass plate may be, for example, a rectangular shape, or a circular shape. However, the dummy glass plate has the same composition as the processed glass plate, which will be described later.
As illustrated in
The dummy glass plate 110 has a thickness θD. The value of the thickness θD is not particularly limited, as long as the thickness will not completely disappear by the wet etching process, which will be described later.
Next, the dummy glass plate 110 is irradiated with a laser from a side of the first dummy surface 112 of the dummy glass plate 110. According to this process, an initial dummy characteristic object is formed in the dummy glass plate 110.
The “initial dummy characteristic object” means any structure that can be generated in the dummy glass plate 110 by the laser irradiation.
For example, the “initial dummy characteristic object” may be a “hole”, such as a through hole or a non-through hole.
Alternatively, the “initial dummy characteristic object” may be a void array configured by a plurality of voids arranged from the first dummy surface 112 of the dummy glass plate 110 toward the second dummy surface 114.
Moreover, the “initial dummy characteristic object” may be a modified layer (also referred to as a “modified line”) formed in a line-shape from the first dummy surface 112 of the dummy glass plate 110 toward the second dummy surface 114.
Details of the initial dummy characteristic objects 130 will be better understood by referring to the explanation regarding the “initial characteristic object”, which will be described later.
A type and an irradiating condition of the laser is not limited, as long as the above-described initial dummy characteristic object can be formed in the dummy glass plate 110. For example, when the initial dummy characteristic object is a “hole”, such as a through hole or a non-through hole, the laser may be, for example, a CO2 laser, a UV laser, or the like. Moreover, for example, when the initial dummy characteristic object is a void array, the laser may be, for example, a femtosecond laser or the like. Furthermore, when the initial dummy characteristic object is a modified layer, the laser may be, for example, a picosecond laser or the like.
The number of the initial dummy characteristic objects 130 is not particularly limited. Two or more initial dummy characteristic objects 130 may be formed.
The initial dummy characteristic object 130 has a characteristic part 132 on the first dummy surface 112 of the dummy glass plate 110.
A configuration of the characteristic part 132 varies depending on a type of the initial dummy characteristic object 130. For example, the characteristic part 132 is an aperture of a hole, a void, or a modified region.
Here, a diameter of the characteristic part 132 is assumed to be φ1. Although the diameter φ1 varies depending on the configuration of the characteristic part 132, the diameter φ1 may fall within a range of 1 μm to 100 μm. However, when the initial dummy characteristic object 130 is a modified line, the diameter φ1 of the characteristic part 132 may be less than 1 μm.
(Step S113)
Next, the dummy glass plate 110 having the initial dummy characteristic object 130 is subjected to wet etching. According to the wet etching, the thickness of the dummy glass plate 110 decreases. Moreover, the initial dummy characteristic object is changed to a through hole.
At the step S113, by performing the wet etching for the dummy glass plate 110 so as to obtain various reductions of the thickness of the dummy glass plate 110, relationship between amounts of etching E (reduction amounts of thickness) for the dummy glass plate 110 and diameters φ of the holes on the first dummy surface 112 (in other words, a diameter of the characteristic part 132 after the wet etching) is grasped.
In the example illustrated in
At this step, the entirety of the dummy glass plate 110 may be subjected to the wet etching, or the wet etching may be performed in the state where the second dummy surface 114 is masked (mask process). The mask process may be performed by adhering a film, coating with a resist or the like. After the wet etching, the film or the coating layer can be removed.
(Steps S115 to S117)
Next, as illustrated in
Moreover, from the result of calculation, based on the following formula (1):
θ1=θf+Et formula (1)
the thickness θ1 of the processed glass plate is set.
According to the above-described steps, the thickness θ1 of the processed glass plate can be calculated.
Next, a glass plate to be provided for the actual process will be prepared. The glass plate to be processed (processed glass plate) has a thickness θ1 set at the step S110.
Typically, the thickness θ1 falls, for example, within a range of 50 μm to 1000 μm.
In the example illustrated in
Moreover, a manufacturing method for the glass plate 210 is not particularly limited as long as the glass plate 210 has the same composition as the above-described dummy glass plate 110. For example, the glass plate 210 may be manufactured by any conventional process, such as a float process, a fusion process, and a down-draw process.
Among the processes, the fusion process is preferable because of the feature that the thickness of the glass plate 210 can be controlled easily.
For example, in the fusion process, when a volume of glass flowed from a fusion pipe per unit time is M (mm3/sec), a drawing rate in the vertical direction is v (mm/sec), and a width of a glass plate is W (mm), a thickness of the glass plate t (mm) is expressed by
t=M/(W×v) formula (2)
where the width W and the thickness t are values on the side of the flowed port.
Therefore, by controlling the volume M, the drawing rate v, and the width W, the thickness t can be controlled relatively easily. In this way, in the fusion process, the glass plate 210 with a thickness θ1 can be manufactured relatively easily.
(Step S130)
Next, by irradiating with a laser from a side of the first surface 212 of the glass plate 210, one “initial characteristic object” or two or more “initial characteristic objects” is formed in the glass plate 210.
As described above, the “initial characteristic object” means any structure that can be generated in the glass plate 210 by the laser irradiation.
For example, the “initial characteristic object” may be a “hole”, such as a through hole or a non-through hole. Such a “hole” will be especially referred to as an “initial hole” in order to distinguish from the “hole” formed at the subsequent step S140. Moreover, according to the same reason, the through hole and the non-through hole formed at this step will be referred to as an “initial through hole” and an “initial non-through hole”, respectively.
Alternatively, the “initial characteristic object” may be a void array configured by a plurality of voids arranged from the first surface 212 of the glass plate 210 toward the second surface 214.
Moreover, the “initial characteristic object” may be a modified layer formed in a line-shape from the first surface 212 of the glass plate 210 toward the second surface 214. Such a modified layer is also referred to as a “modified line”.
Furthermore, the “initial characteristic object” may include two or more selected from the initial through hole, the initial non-through hole, the void array, and the modified line.
A type and an irradiating condition of the laser used at the step S130 are the same as the type and the irradiating condition of the laser, with which the dummy glass plate 110 is irradiated at the above-described step S110.
For example, when the initial characteristic object is an initial through hole or an initial non-through hole, the laser may be, for example, a CO2 laser, a UV laser, or the like. Moreover, for example, when the initial characteristic object is a void array, the laser may be, for example, a femtosecond laser or the like. Furthermore, when the initial characteristic object is a modified layer, the laser may be, for example, a picosecond laser or the like.
As illustrated in
For example, when the initial characteristic object 230 is a through hole or a non-through hole, the characteristic part 232 is an aperture with a diameter φ1 existing on the first surface 212. Moreover, when the initial characteristic object 230 is a modified line, the characteristic part 232 is a modified region with a diameter φ1 existing on the first surface 212. When the initial characteristic object 230 is a void array, the characteristic part 232 is an aperture with a diameter φ1 or a modified region existing on the first surface 212.
The diameter φ1 of the characteristic part 232 varies depending on the type of the initial characteristic object 230, but the diameter φ1 may fall, for example, within a range of 1 μm to 100 μm. When the initial characteristic object 230 is a modified line, the diameter φ1 of the characteristic object 232 may be less than 1 μm.
In the example illustrated in
(Step S140)
Next, the glass plate 210 having the initial characteristic object 230 is subjected to the wet etching. Then, a through hole is formed from the initial characteristic object 230.
For example, when the initial characteristic object 230 is an initial through hole, according to the wet etching, a cross section of the initial characteristic object 230 is expanded, for change to a larger through hole. Moreover, when the initial characteristic object 230 is an initial non-through hole, according to the wet etching, the non-through hole is changed to a through hole penetrating from the first surface 212 to the second surface 214. Moreover, when the initial characteristic object 230 is a void array, according to the wet etching, the respective voids configuring the void array are connected each other, and a through hole penetrating from the first surface 212 to the second surface 214 is formed. Furthermore, when the initial characteristic object 230 is a modified line, according to the wet etching, a modified part is removed, and a through hole penetrating from the first surface 212 to the second surface 214 is formed.
In any case, the diameter of the initial characteristic object 230 on the first surface 212 is increased from φ1 of the stage of the characteristic part 232 to φ2.
The condition for the wet etching is selected so that the amount of etching E for the glass plate 210 is the above-described Et. As is clear from formula (1), in this case, according to the wet etching process, the thickness θ1 of the glass plate 210 is changed to θf.
Moreover, the diameter φ2 of the through hole obtained after the wet etching process on the first surface 212 is equal to φf from the above-described E-φ relationship.
As a result, after the wet etching, a glass substrate with a desired thickness (θf) having a desired diameter (φf) of the through hole on the first surface 212 can be obtained.
In this way, in the first manufacturing method, it is possible to solve or significantly control against the problem in the conventional method that after performing a wet etching process for adjusting a size of a hole, a thickness of a glass substrate deviates from a target thickness θf.
The thickness of the glass plate (glass substrate) can be measured by a general size measuring apparatus, such as a micrometer or a laser displacement gauge.
The diameter φ1 of the initial characteristic object or the diameter φf of the formed hole can be measured by using a laser microscope or an image measuring system (for example, NEXIV by Nikon Corporation). When the shape viewed from above the initial characteristic object is not a precise circle, the maximum diameter is set to the diameter φ1.
(Another Method of Manufacturing a Glass Substrate Having a Hole According to Embodiment of Present Invention)
In the above-described first manufacturing method, the glass plate 210 prepared at the step S120 has substantially the same size (in the following, referred to as a “horizontal by vertical size”) as the glass substrate obtained after the step S140, except for the thickness (However, more precisely, a decrease in size appropriate for an amount of a decrease in thickness occurs). In other words, apparent areas of the first and second surfaces 212, 214 of the glass plate 210 do not greatly change even after the glass plate 210 is processed into the glass substrate (while a small decrease due to the wet etching is present).
Typically, the horizontal by vertical size of the glass plate often does not coincide with the horizontal by vertical size of the glass substrate. That is, typically, a step (cutting step) of cutting the glass plate into pieces having a predetermined size, and obtaining one glass piece or two or more glass pieces from the glass plate is performed, in the middle of the process.
Then, next, with reference to
As illustrated in
(1) setting a thickness θ1 of a processed glass plate (step S210);
(2) preparing a glass plate having first and second surfaces opposite to each other, and the thickness θ1 (step S220);
(3) forming one initial characteristic object or two or more initial characteristic objects on the glass plate by irradiating with a laser from a first surface side of the glass plate, the initial characteristic object having a size of a diameter φ1 on the first surface (step S230);
(4) cutting the glass plate, and obtaining a glass piece including the initial characteristic object (step S240); and
(5) performing wet etching for the glass piece having the initial characteristic object, so that from the initial characteristic object a hole having the diameter φf on the first surface is formed, and the thickness of the glass piece is adjusted from θ1 to a target value of θf (step S250).
In the following, with reference to
Moreover, in the second manufacturing method, steps S210 to S230 are the same as the steps S110 to S130 in the first manufacturing method, respectively, and the above-described explanation can be referred to.
Then, in the following, processes after step S240 or later will be described.
(Step S240)
In the second manufacturing method, by performing processes up to step S230, an initial characteristic object is formed in the glass plate.
As illustrated in
On the glass plate 310 numerous initial characteristic objects 330 are formed.
Here, on the first surface 312 of the glass plate 310, a virtual region surrounded by dashed lines and including a plurality of initial characteristic objects 330 will be referred to as a “region to be cut”. The “region to be cut” becomes a criterion to set sections of the glass substrate which will be manufactured later. In other words, the “region to be cut” is arranged so as to fit the size of the glass substrate to be finally manufactured.
In the example, illustrated in
In the first region to be cut 340a, initial characteristic objects 330 are arranged in a 5×5 matrix. In the second region to be cut 340b, initial characteristic objects 330 are arranged in a 15×5 matrix. In the third region to be cut 340c, initial characteristic objects 330 are arranged in a 5×5 matrix. In the fourth region to be cut 340d, initial characteristic objects 330 are arranged in a 15×5 matrix.
However, the above-described configuration is merely an example, a number and an arrangement mode of the initial characteristic objects 330 included in each region to be cut are not particularly limited. In a typical example, there is a case where initial characteristic objects 330, a number of which falls within a range of 10,000 to 1,000,000, exist in each region to be cut.
The numbers of initial characteristic objects 330 existing in the respective regions to be cut may be different from each other.
Next, the glass plate 310 is cut. At this time, the glass plate 310 is cut so that the respective regions to be cut 340a to 340d are separated from each other. In other words, the glass plate 310 is cut so that respective glass pieces after cutting include the regions to be cut 340a to 340d, respectively.
A method of cutting is not particularly limited as long as the glass plate 310 can be cut. For example, the glass plate 310 may be cut by a diamond wheel.
As illustrated in
(Step S250)
Afterwards, for the respective glass pieces 350a to 350d, a wet etching process, explained in the above-described step S140, is performed.
By performing the wet etching for the respective glass pieces 350a to 350d obtained as above, a cut surface is chamfered, and strength of the glass substrate is improved.
According to the above-described processes, a glass substrate with a desired thickness (θf) having a desired diameter (φf) of the through hole on the first surface 312 can be manufactured.
Also in the above-described second manufacturing method, it is possible to solve or significantly control against the problem in the conventional method that after performing a wet etching process for adjusting a size of a hole, a thickness of a glass substrate deviates from a target thickness θf.
In the case of irradiating a glass plate with a laser to form an initial characteristic object, in order to prevent the glass plate during the laser processing from moving, a suction table is often used. The suction table has a function of fixing the table through suction from its upper part. Therefore, by performing the laser processing for the glass plate on the suction table, the glass plate during processing is prevented from moving and an initial characteristic object can be formed at a predetermined position.
However, generally, the glass substrates having holes are of various sizes depending on their use. Therefore, in the case of manufacturing a glass substrate with a hole using the general conventional method, suction tables of various sizes adapted to the sizes of the glass substrates are required. In order to manufacture such suction tables appreciable time and cost are required. As a result there is a problem that manufacturing efficiency and manufacturing cost for glass substrates increase.
In the second manufacturing method, irrespective of a size of a glass substrate that is required finally, at step S230, for the glass plate that is laser processed, a glass plate with the same size can be always used. This is because the glass plate is separated into glass pieces corresponding to the sizes of the glass substrates at step S240.
Therefore, in the second manufacturing method, it becomes unnecessary to prepare various suction tables as in the related art. That is, in the second manufacturing method, when one suction table having a size that adapts to the glass plate is prepared, a glass substrate of any size can be manufactured through the suction table.
As a result, in the second manufacturing method, it becomes possible to control the manufacturing efficiency and the manufacturing cost significantly.
(Yet Another Method of Manufacturing a Glass Substrate Having Hole According to Embodiment of Present Invention)
Next, with reference to
As illustrated in
(1) setting a thickness θ1 of a processed glass plate (step S310);
(2) preparing a glass plate having first and second surfaces opposite to each other, and the thickness θ1 (step S320);
(3) forming one initial characteristic object or two or more initial characteristic objects on the glass plate by irradiating with a laser from a first surface side of the glass plate, the initial characteristic object having a size of a diameter φ1 on the first surface (step S330);
(4) performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having a desired aperture size is formed, and the thickness of the glass plate is adjusted from θ1 to a target value of θf (step S340); and
(5) cutting the glass plate, and obtaining a glass substrate including the hole (step S350).
The third manufacturing method includes almost the same processes as the second manufacturing method illustrated as above with reference to
The respective steps S310 to S350 in the third manufacturing method are obvious from the respective steps in the above-described second manufacturing method. Therefore, detailed description for the respective steps in the third manufacturing method will be omitted.
Also in the third manufacturing method, it is possible to solve or significantly control against the problem in the conventional method in which after performing a wet etching process for adjusting a size of a hole, a thickness of a glass substrate deviates from a target thickness θf.
Moreover, also in the third manufacturing method, it becomes possible to obtain the same effect as the second manufacturing method, i.e. the effect can be obtained that it becomes unnecessary to prepare various suction tables, as in the related art, and it becomes possible to control the manufacturing efficiency and the manufacturing cost significantly.
In the third manufacturing method, a process of filling a material into the hole may be performed between the step (4) and the step (5).
The material includes a conductive material.
The conductive material may be configured by, for example, gold, silver, copper, nickel, aluminum, neodymium, molybdenum, and/or tungsten, or an alloy including these. For example, the conductive material may be configured by an aluminum-neodymium alloy, or a molybdenum-tungsten alloy.
A method of filling the material into a hole is not particularly limited. For example, the material may be filled into the hole by an electroless plating process. Alternatively, the material may be filled into the hole by a screen printing process for a conductive paste or conductive fine particles.
Because by performing a process of filling a material into a hole at this stage, it becomes unnecessary to perform a process of filling a material for each glass substrate obtained after the step (5), thus the filling process can be performed efficiently. Moreover, according to the above-described configuration it becomes possible to further control the manufacturing efficiency and the manufacturing cost.
As described above, with reference to the first to third manufacturing method, an embodiment of the present invention has been described. However, the present invention is not limited to these embodiments. For example, in the above-described examples, a glass substrate having a through hole is finally manufactured.
However, in addition to this, a glass substrate having a non-through hole may be finally manufactured. In this case, the initial characteristic object may be an initial non-through hole, a void array, or a modified line.
For example, when the initial characteristic object is an initial non-through hole, by a wet etching, the initial non-through hole may change to a non-through hole having a larger aperture on the first surface. Moreover, when the initial characteristic object is a void array, by a wet etching, the respective voids configuring the void array are connected each other, and a non-through hole may be formed. Furthermore, when the initial characteristic object is a modified line, according to the wet etching, a modified part is removed, and a non-through hole may be formed.
In addition to the above-described examples, various modifications may be possible.
Next, an example of the present invention will be described.
A glass substrate having a non-through hole was manufactured according to the following method. A target value of a diameter of the non-through hole on the first surface (diameter of a larger aperture) was 40 μm (φf=40 μm). Moreover, a target value of a thickness of the glass substrate was 200 μm (θf=200 μm).
First, a dummy glass plate of 50 mm (vertical)×50 mm (horizontal)×0.3 mm (thickness) (alkali-free glass) was prepared.
The dummy glass plate was irradiated with a laser from a side of the first surface, to form an initial non-through hole. The irradiation condition for the laser was as follows:
Type of laser: YAG laser (wavelength: 355 μm); and
Laser power: 10 W.
A diameter (φ1) of an aperture of the initial non-through hole on the first main surface was about 12 μm.
Next, the dummy glass plate was subjected to a wet etching process with various conditions, and a relationship between an amount of etching (amount of reduction of thickness) E and a diameter φ of an aperture of a non-through hole, i.e. an E-φ relationship was obtained.
The dummy glass plate was provided to the wet etching process in a state where a second main surface was subjected to a mask process. Therefore, the second main surface of the glass plate was not etched.
From the graph, it was found that a first order relation was established between the amount of etching E and the diameter φ of the aperture of the non-through hole. Moreover, from the result, it was found that the amount of etching (Et) of about 16 μm was required in order to obtain the glass substrate having a hole with the diameter φf of 40 μm.
Based on the above-described result, according to the formula (1):
θ1=θf+Et formula (1)
the thickness (θ1) of the glass plate to be prepared was θ1=216 μm.
Thus, next, a glass plate of 300 mm (vertical)×300 mm (horizontal)×216 μm (thickness) (θ1) (alkali-free glass) was prepared.
Moreover, the glass plate was irradiated with a laser from a side of the first surface, to form an initial non-through hole. The irradiation condition for the laser was the same as that used for the dummy glass plate.
A diameter of an aperture of the initial non-through hole on the first surface was about 12 μm.
Next, the glass plate was subjected to a wet etching process, in a state where a second surface of the glass plate was masked. The condition for a wet etching was that the amount of etching E was Et (=16 μm).
A measured thickness of the glass plate obtained after the wet etching process was 200 μm. Moreover, a diameter of an aperture of the non-through hole on the first surface was about 40 μm.
In this way, the glass substrate having a desired thickness θf and having a non-through hole with a desired diameter φf was manufactured.
A glass plate having a through hole was manufactured. A target value of a diameter of the through hole on the first surface (diameter of a larger aperture) was 40 μm (φf=40 μm). Moreover, a target value of a thickness of the glass substrate was 200 μm (θf=200 μm).
First, a dummy glass plate of 50 mm (vertical)×50 mm (horizontal)×0.3 mm (thickness) (alkali-free glass) was prepared.
The dummy glass plate was irradiated with a laser from a side of the first surface, to form an initial through hole. The irradiation condition for the laser was as follows:
Type of laser: YAG laser (wavelength: 355 μm); and
Laser power: 10 W.
A diameter (φ1) of an aperture of the initial through hole on the first main surface was about 12 μm.
Next, the dummy glass plate was subjected to a wet etching process with various conditions, and a relationship between an amount of etching (amount of reduction of thickness) E and a diameter φ of an aperture of a through hole, i.e. an E-φ relationship was obtained.
The entirety of the dummy glass plate was subjected to the wet etching process without masking a second main surface.
From the graph, it was found that a first order relation was established between the amount of etching E and the diameter φ of the aperture of the through hole. Moreover, from the result, it was found that an amount of etching (Et) of about 32 μm was required in order to obtain the glass substrate having the hole with the diameter φf of 40 μm.
Based on the above-described result, according to the formula (1):
θ1=θf+Et formula (1)
the thickness (θ1) of the glass plate to be prepared was θ1=232 μm.
Thus, next, a glass plate of 300 mm (vertical)×300 mm (horizontal)×232 μm (thickness) (φ1) (alkali-free glass) was prepared.
Moreover, the glass plate was irradiated with a laser from a side of the first surface, to form an initial through hole. The irradiation condition for the laser was the same as that used for the dummy glass plate.
A diameter of an aperture of the initial through hole on the first surface was about 12 μm.
Next, the entirety of the glass plate was subjected to a wet etching process. The condition for a wet etching was that the amount of etching E was Et (=32 μm).
A measured thickness of the glass plate obtained after the wet etching process was 200 μm. Moreover, a diameter of an aperture of the through hole on the first surface was about 40 μm.
In this way, the glass substrate having a desired thickness θf and having a through hole with a desired diameter φf was manufactured.
The present invention can be used, for example, in a technique for forming a hole in a glass substrate. Moreover, the present invention can be used, for example, in a manufacturing method for a glass substrate for a substrate provided with a through electrode, or a glass substrate for an interposer (glass interposer). For example, when a hole formed in the glass substrate is a through hole, by forming a through electrode in the through hole of the glass substrate, a glass substrate with a through electrode, and an interposer (glass interposer) can be manufactured. For example, when a hole formed in the glass substrate is a non-through hole, by thinning the glass substrate by polishing or grinding, before or after filling a material into a hole to become a through electrode into the hole of the glass substrate, a glass substrate with a through electrode and an interposer can be manufactured.
As described above, the preferred embodiments and the like have been described in detail. However, the present invention is not limited to the above-described specific embodiments, but various variations and modifications may be made without deviating from the scope of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2016-154627 | Aug 2016 | JP | national |
