1. Field of the Invention
The present invention relates to a manufacturing method of a hermetic container and a manufacturing method of an image display apparatus, and more particularly, to a manufacturing method of an image display apparatus the inside of which is vacuumized and which has an electron-emitting device and a phosphor film.
2. Description of the Related Art
Image display apparatuses of a flat panel type such as an organic LED (light-emitting diode) display (OLED), a field emission display (FED), a plasma display panel (PDP), and the like are well known. Each of these image display apparatuses is manufactured by hermetically sealing glass substrates which face each other, and has a container in which an internal space is partitioned to an external space. To manufacture such a hermetic container, a spacing distance defining member, a local adhesive, and the like are arranged between the facing glass substrates as necessary, a sealing material is arranged like frame to peripheral portions of the glass substrates, and then a heat sealing process is performed. An example of a hermetic container manufactured in this way is illustrated in
United States Patent Application Publication No. 2006/0082298 discloses a method of manufacturing a container of an OLED. In this method, a frame member and a sealing material (frit) are first arranged at a circumferential portion of first and second glass substrates arranged to face each other, and a laser beam is then irradiated along a sealing material extending direction so as to substantially maintain a certain temperature in the sealing material, thereby achieving hermetical sealing.
Japanese Patent Application Laid-Open No. 2008-059781 discloses a method of manufacturing a container of an FED or a PDP. In this method, a sealing material is arranged between respective four sides of first and second glass substrates arranged to face each other, a laser beam is irradiated to the respective sealing materials on the four sides, and the respective sealing materials on the four sides are melted together, thereby obtaining a hermetic container.
As just described, conventionally, in addition to a method of simply irradiating a laser beam respectively to four sides, various sealing methods in which a laser irradiation condition is changed, an irradiation route is changed, irradiation order is changed, and/or the like have been known. However, as illustrated in
The present invention aims to provide a manufacturing method of a high-reliable hermetic container which achieves both joining strength and airtightness.
The present invention relates to a manufacturing method of a hermetic container, which includes sealing a first glass substrate and a second glass substrate for forming at least a part of the hermetic container together with the first glass substrate, to each other.
The present invention includes: sandwiching a frame-like sealing material between a first glass substrate and a second glass substrate; irradiating first local heating light to a first region of the sealing material; and sealing the first glass substrate and the second glass substrate to each other by irradiating, on a boundary between the first region of the sealing material and a second region of the sealing material which is adjacent to the first region and on which the first local heating light is not irradiated, second local heating light to heat and melt a portion of the second region adjacent to the boundary, during a period that viscosity of the sealing material at a portion of the first region adjacent to the boundary is equal to or lower than 1018 Pa·sec.
The present invention further includes: a step of forming a sealing material, of which viscosity has a negative temperature coefficient and softening point is lower than softening points of the first and second glass substrates, like frame on the first glass substrate; a step of arranging the second glass substrate to face the first glass substrate on which the sealing material has been formed, so as to contact the sealing material; and a step of sealing the first glass substrate and the second glass substrate to each other by irradiating local heating light to the sealing material along a direction extending like frame on the sealing material, wherein, on a boundary between a first region of the sealing material to which the local heating light is irradiated and a second region of the sealing material which is adjacent to the first region and on which the local heating light is not irradiated, the local heating light is irradiated to heat and melt a portion of the second region adjacent to the boundary, during a period that viscosity of the sealing material at a portion of the first region adjacent to the boundary is equal to or lower than 1018 Pa·sec.
According to the present invention, the local heating light is irradiated to the second region (unsealed portion) adjacent to the first region (sealed portion) on which the local heating light is irradiated, during the period that the viscosity of the sealing material at the portion (sealing material boundary region) of the sealed portion adjacent to the boundary between the sealed portion and the unsealed portion is equal to or lower than 1018 Pa·sec. Thus, although the viscosity of the sealing material on the unsealed portion decreases, the local heating light is irradiated also to the boundary between the sealed portion and the unsealed portion, whereby the viscosity of the sealing material in the sealing material boundary region again decreases before a temperature returns to a room temperature. As a result, a local contraction difference of the sealing material causing occurrence of a crack decreases, whereby the high-reliable hermetic container which achieves both the joining strength and the airtightness can be obtained.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
Preferred embodiments of the present invention will now be described in detail in accordance with the accompanying drawings.
The present inventors and the like analyzed cause of crack occurrence by microscopically observing, with use of a high-speed camera, growth behavior of the crack at the history occurrence point (temporal joint) by the above-described histories of sealing at the respective sides to be sealed. As a result, it was found that a local contraction difference occurred between the sealed portion 56 and the unsealed portion 57 in the cooling process of the sealed portion 56 illustrated in
Hereinafter, embodiments of the present invention will be described in detail in accordance with the accompanying drawings. A manufacturing method of a hermetic container according to the present invention can be applied to a manufacturing method of an container to be used for an FED, an OLED, a PDP or the like having a device of which an internal space is required to be hermetically cut off from an external atmosphere. Especially, in an image display apparatus such as the FED or the like of which the inside is set as an evacuated space, a joining strength which can withstand an atmospheric pressure load generated due to a negative pressure of the internal space is required. Here, according to the manufacturing method of the hermetic container according to the present invention, both securement of the joining strength and airtightness can be highly achieved. However, the manufacturing method of the hermetic container according to the present invention is not limited to the above-described manufacturing method of the hermetic container but can be widely applied to a manufacturing method of a hermetic container having sealed portions, which are required to have airtightness, on peripheral portions of the glass substrates facing each other.
A large number of electron-emitting devices 27 for emitting electrons in response to an image signal are provided on the rear plate 13, and matrix wirings for driving (X-directional wirings 28 and Y-directional wirings 29) for operating each of the electron-emitting devices 27 in response to the image signal are formed. A phosphor film 34 composed of phosphor for emitting light and displaying an image upon receiving the irradiation of electrons emitted from the electron-emitting devices 27 is provided on the face plate 12 positioned to face the rear plate 13. A black stripe 35 is further provided on the face plate 12. The phosphor films 34 and the black stripes are provided with a state that those are mutually arranged. A metal back 36 composed of a thin Al film is formed on the phosphor film 34. The metal back 36, which has a function of serving as an electrode for attracting electrons, receives potential supplied from a high-voltage terminal Hv provided in the container 10. A non-evaporable getter 37 composed of a thin Ti film is formed on the metal back 36.
Since it is sufficient that the face plate 12, the rear plate 13 and the frame member 14 are transparent and have translucency, soda lime glass, high strain point glass, non-alkaline glass or the like can be used. It is desirable that these glass members have excellent wavelength translucency in a used wavelength of local heating light and an absorption wavelength region of a sealing material to be described later.
Next, a sealing method of a glass substrate in the manufacturing method of the hermetic container according to the present invention will be described with reference to
(Step 1)
Initially, as illustrated in
(Step 2)
Next, as illustrated in
(Step 3)
Next, as illustrated in
As described above, since the viscosity of the sealing material 1a has the negative temperature coefficient, the viscosity once decreases when the material is heated and melted, whereby the material fluidizes. However, after the end of the irradiation, the viscosity recovers and thus returns to the state in a room temperature. In a viscosity recover process of the sealing material 1a, that is, in a cooling process, there is a contraction difference between the sealed portion (first region) 50 to which the local heating light was irradiated and an unsealed portion (second region) 51 to which the local heating light is not irradiated. When the sealed portion 50 returns to the state in the room temperature, the contraction difference between the sealed portion 50 and the unsealed portion 51 increases. Thus, a residual stress at the boundary 52 between the sealed portion 50 and the unsealed portion 51 increases, whereby a crack occurs in the glass substrate in the vicinity of the boundary 52. For this reason, it is desirable that the unsealed portion 51 adjacent to the sealed portion 50 formed by the first local heating light 41 is heated and melted by the second local heating light 42 before the sealed portion 50 adjacent to the unsealed portion 51 returns to the state in the room temperature. More specifically, it is desirable that the second local heating light 42 is irradiated to a part of the unsealed portion 51 adjacent to the boundary 52 during a period that the viscosity of the sealing material at a part (sealed portion boundary region) 53 of the sealed portion 50 adjacent to the boundary of the sealed portion to the unsealed portion 51 has sealing material viscosity being equal to or lower than 1018 Pa·sec. Consequently, the second local heating light 42 is irradiated also to the sealed portion boundary region 53, whereby the viscosity of the sealed portion again decreases before the sealed portion boundary region 53 returns to the state in the room temperature. As a result, local the contraction difference of the sealing material reduces, whereby occurrence of the crack can be avoided.
As described above, the timing at which the local heating light is irradiated to the boundary between the sealed portion and the unsealed portion is important in the present invention. On another front, the irradiation start position and the moving and scanning direction of the second local heating light 42 are not limited to those exemplified in
In the processes of the
Each of the first to fourth local heating lights 41 to 44 may be irradiated to be able to locally heat the vicinity of the sealed region, and a semiconductor laser is preferably used as the local heating light. A semiconductor laser for processing which has a wavelength in an infrared region is suitable in terms of performance of locally heating the sealing material 1a, translucency of the glass substrate and the like. Further, since the first to fourth local heating lights 41 to 44 only have to heat a desired sealing-scheduled region, the local heating light may be positioned on the same side with respect to a sealing target or on the opposite sides with respect to the sealing target.
Incidentally, scanning speed, power, a spot diameter size, a wavelength, number of use and the like of the local heating light (laser) can be arbitrarily selected according to industrial productivity, and a temperature characteristic of the sealing material. In the present embodiment, for example, a glass frit having a width equal to or higher than 0.2 mm and equal to or lower than 2.0 mm, a thickness equal to or higher than 5 μm and equal to or lower than 12 μm can be used as the sealing material, and a high strain point glass substrate can be used as the material to be sealed. In this case, each of the first to fourth local heating lights can be applied within a range of the power of 80 W to 1000 W, the wavelength of 808 nm to 980 nm, the spot diameter of 0.8 mmφ to 3.9 mmφ, the scanning speed of 100 mm/sec to 2500 mm/sec. However, the irradiation condition of the local heating light is not limited to such an above-described condition. To achieve preferable sealing, it is desirable to adjust the condition in conformity with the characteristic of the sealing material so that the viscosity of the sealing material of the sealed portion boundary region 53 illustrated in
(Step 4)
Next, as illustrated in
In the present embodiment as described above, the rear plate 13 and the frame member 14 are sealed to each other, and further the face plate 12 and the frame member 14 are sealed to each other, whereby the container 10 in which the frame member 14 is sandwiched between the face plate 12 and the rear plate 13 is manufactured. However, more generally, the present invention is to provide the method of manufacturing the hermetic container in which at least a part thereof consists of the rear plate 13 and the face plate 12. Therefore, the glass substrate on which a protruded portion having the shape of the frame member 14 has previously been formed integrally can be used as one of the rear plate 13 and the face plate 12 and then sealed to the other of the plates. Moreover, the face plate 12 and the frame member 14 can be sealed to each other on ahead, and then the rear plate 13 and the frame member 14 can be sealed to each other.
Further, the above-described embodiment is directed to the image display apparatus. However, the present invention is more generally applicable to the sealing between the first glass substrate and the second glass substrate. In this case, all of the first to fourth local heating lights may be irradiated from the side of the first glass substrate, some of the local heating lights may be irradiated from the side of the first glass substrate and the remains thereof may be irradiated from the side of the second glass substrate, or all of the first to fourth local heating lights may be irradiated from the side of the second glass substrate.
Hereinafter, the present invention will be described in detail by citing concrete examples.
By applying the above-described embodiment, the frame member was hermetically sealed to the rear plate, and the frame member was hermetically sealed further to the face plate, whereby the vacuum hermetic container was manufactured.
(Step 1)
First, the face plate 14 was formed. More specifically, a high strain point glass substrate having the thickness of 1.5 mm (PD200: manufactured by Asahi Glass Co., Ltd.) was cut out to have an external shape of 980 mm×580 mm×1.5 mm. Then, a region of 970 mm×570 mm×1.5 mm at the central portion was cut out by cutting work, and the frame member 14 of which the cross sectional surface was almost rectangle having a width of 5 mm and a height of 1.5 mm was formed. Subsequently, the surface of the frame member 14 was degreased by organic solvent cleaning, pure water rinsing and UV-ozone cleaning.
Next, the sealing material 1a was formed on the frame member 14 so that the sealing material 1a was arranged at the center of the width direction of the frame member 14. In this example, a glass frit was used as the sealing material 1a (and also as the sealing material 1b). The used glass frit was such a paste characterized in that a Bi system lead-free glass frit (BAS115: manufactured by Asahi Glass Co., Ltd.) having a thermal expansion coefficient of α=79×10−7/° C., a glass transition point of 357° C. and a softening point of 420° C. was treated as a base material and organic substances were dispersed and mixed as a binder. Subsequently, the sealing material 1a having a width of 1 mm and a thickness of 7 μm was formed along the circumferential length on the frame member 14 by using a screen printing method, and then dried at 120° C. Next, to burn out the organic substances, the material was heated and baked at 460° C., thereby forming the sealing material 1a (see
(Step 2)
Next, an electron-emitting device plate previously having the electron-emitting devices 27, the X-directional wirings 28 and the Y-directional wirings 29 on the glass substrate made of the high strain point glass substrate (PD200) was prepared as the rear plate 13. Next, the frame member 14 having the sealing material 1a thereon and the rear plate 13 were arranged to face each other so that the frame member 14 and the rear plate 13 contact each other through the sealing material 1a. More specifically, the frame member 14 and the rear plate 13 were set to face each other and contacted while aligning them so that the surface of the frame member 14 having the sealing material 1a thereon and the surface of the rear plate 13 having the electron-emitting devices 27 thereon (i.e., the surface being the inner surface of the hermetic container) faced each other. To make a pressure strength to the sealing material 1a uniform, the third glass substrate 52 made of the high strain point glass substrate (PD200) and having the same size as that of the rear plate 13 was put on the frame member 14. Further, to supplement the pressure strength, the third glass substrate 52 was pressed by a not-illustrated pressurizing apparatus. As described above, the rear plate 13 and the frame member 14 were contacted each other through the sealing material 1a (see
(Step 3)
Next, the laser beam was irradiated to the temporal assembly structure made of the rear plate 13, the frame member 14, the sealing material 1a and the third glass substrate 52. Four semiconductor laser apparatuses for manufacturing were prepared as the laser beam source. As each of the first to fourth local heating lights 41 to 44, the laser beam having a wavelength of 980 nm and a laser power of 340 W was used, and the laser beam was scanned along each side of the sealing material at speed of 1000 mm/s.
First, the first local heating light 41 was scanned from the first corner portion C1 of the sealing material to the second corner portion C2 (see
Here, the state after the irradiation of the first local heating light 41 (that is, after the formation of the boundary 52 between the sealed portion 50 and the unsealed portion 51) and immediately before the irradiation of the second local heating light 42 was confirmed with respect to the first corner portion C1 of the sealing material 1a. More specifically, a temperature immediately before the irradiation of the second local heating light 42 to the sealed portion boundary region 53 (see
(Step 4)
Next, the face plate 12 having a phosphor film or the like thereon was prepared, and the face plate 12 and the frame member 14 were sealed to each other in the same procedure as that in the above steps 1 to 3. In this step, the third glass substrate 52 for pressing was not used, and the laser beam was directly irradiated to the face plate 12. The sealing material 1b was formed on the face plate 12, and irradiation conditions (an arrangement condition, a specification of a laser head, etc.) of the laser beam were set to be the same as those in the step 3 (see
As just described, the hermetic container was formed, and the formed hermetic container was applied as the container of the FED in a normal manner, thereby completing the image display apparatus. When the completed FED was operated, it was confirmed that stable electron emission and image display for a long time could be performed and such stable airtightness and joining strength as being applicable to the FED were assured.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2010-105525, filed Apr. 30, 2010, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
---|---|---|---|
2010-105525 | Apr 2010 | JP | national |