Master image chip organization technique or method

Information

  • Patent Grant
  • T106201
  • Patent Number
    T106,201
  • Date Filed
    Thursday, January 13, 1983
    41 years ago
  • Date Issued
    Tuesday, March 4, 1986
    38 years ago
Abstract
A method for forming an improved integrated circuit chip structure having a surface from which regions of different conductivity type are arranged in a plurality of electrically isolated macro circuits, each macro circuit including interconnected components, a first X pattern of equally spaced parallel conductors overlying and electrically insulated from said chip structure surface, said first X pattern of conductors being selectively connected to at least certain ones of said plurality of macro circuits, a second Y pattern of equally spaced parallel conductors overlying and electrically insulated from said first pattern of parallel conductors, said second Y pattern of conductors being selectively connected to at least selected certain ones of said first pattern of electrical conductors, said spacing one from another of said first X pattern of conductors being equal to said spacing one from another of said second Y pattern of conductors, said first pattern of conductors being orthogonal of said second pattern of conductors, and each of said connections occurring exclusively at points in space corresponding to X-Y intersections of an X-Y coordinate system, where said X-Y coordinate system geometrically corresponds identically to said X-Y pattern of conductors.
Description
Divisions (1)
Number Date Country
Parent 974576 Dec 1978
Continuations (1)
Number Date Country
Parent 224240 Jan 1981