Information
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Patent Grant
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T106201
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Patent Number
T106,201
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Date Filed
Thursday, January 13, 198341 years ago
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Date Issued
Tuesday, March 4, 198638 years ago
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US Classifications
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International Classifications
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Abstract
A method for forming an improved integrated circuit chip structure having a surface from which regions of different conductivity type are arranged in a plurality of electrically isolated macro circuits, each macro circuit including interconnected components, a first X pattern of equally spaced parallel conductors overlying and electrically insulated from said chip structure surface, said first X pattern of conductors being selectively connected to at least certain ones of said plurality of macro circuits, a second Y pattern of equally spaced parallel conductors overlying and electrically insulated from said first pattern of parallel conductors, said second Y pattern of conductors being selectively connected to at least selected certain ones of said first pattern of electrical conductors, said spacing one from another of said first X pattern of conductors being equal to said spacing one from another of said second Y pattern of conductors, said first pattern of conductors being orthogonal of said second pattern of conductors, and each of said connections occurring exclusively at points in space corresponding to X-Y intersections of an X-Y coordinate system, where said X-Y coordinate system geometrically corresponds identically to said X-Y pattern of conductors.
Divisions (1)
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Number |
Date |
Country |
Parent |
974576 |
Dec 1978 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
224240 |
Jan 1981 |
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