The disclosure relates to a matching network. More particularly, the disclosure relates to a matching network for decoupling between polarizations of an antenna array and an electronic device comprising the same.
An electronic device using beamforming technology of a wireless communication system includes a plurality of antenna elements. In this case, a subarray technology may be used to increase a gain of a signal emitted from the electronic device.
The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above-might be applicable as prior art with related to the disclosure.
Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide a matching network for decoupling between polarizations of an antenna array and an electronic device including the same.
Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.
In accordance with an aspect of the disclosure, an electronic device is provided. The electronic device includes an antenna substrate, and an antenna array including a subarray, the subarray including a plurality of antenna elements, feeding network circuitry including a first power divider for a first polarization and a second power divider for a second polarization different from the first polarization, and network circuitry for decoupling of a first signal of the first power divider and a second signal of the second power divider, wherein the subarray is disposed on a first side of the antenna substrate, wherein the feeding network circuitry may be disposed on the first side or a second side opposite to the first side of the antenna substrate, And wherein the network circuitry for decoupling may be disposed in a region between the first power divider and the second divider in the first side or the second side of the antenna substrate.
In accordance with another aspect of the disclosure, an electronic device is provided. The electronic device includes a processor, a metal plate, a plurality of antenna substrates, and an array antenna including a plurality of subarrays, wherein, for each subarray, a subarray among the plurality of subarrays includes feeding network circuitry including a first power divider for a first polarization and a second power divider for a second polarization different from the first polarization, and network circuitry for decoupling of a first signal of the first power divider and a second signal of the second power divider, wherein the subarray among the plurality of subarrays may be disposed on a first side of the antenna substrate corresponding to the subarray, wherein the feeding network circuitry may be disposed on a second side opposite to the first side, and wherein the network circuitry for decoupling may be disposed in a region between the first power divider and the second power divider in the first side or the second side of the antenna substrate.
Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.
The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures.
The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.
The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustration purpose only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.
It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces.
In various embodiments of the disclosure described below, a hardware approach will be described as an example. However, since the various embodiments of the disclosure include technology that uses both hardware and software, the various embodiments of the disclosure do not exclude a software-based approach.
Term referring to a component of an electronic device (e.g., substrate, print circuit board (PCB), flexible PCB (FPCB), module, antenna, antenna element, circuitry, processor, chip, component, device), term referring to a shape of component (e.g., structures, structure, support part, contact part, protrusion part), term referring to connection part between structures (e.g., connection part, contact part, support part, contact structures, conductive member, assembly), term referring to circuitry (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, RF path, RF module, radio frequency (RF) circuitry, splitter, divider, coupler, combiner), and the like used in the following description are exemplified for convenience of explanation. Therefore, the disclosure is not limited to terms to be described below, and another term having an equivalent technical meaning may be used. In addition, a term such as ‘ . . . part’, ‘ . . . er’, ‘ . . . material’, and ‘ . . . body’, and the like used below may mean at least one shape structure or may mean a unit processing a function. In addition, hereinafter, ‘A’ to ‘B’ means at least one of elements from A (including A) to B (including B). Hereinafter, ‘C’ and/or ‘D’ means that at least one of ‘C’ or ‘D’, that is, {‘C’, ‘D’, ‘C’, and ‘D’}.
In addition, in the disclosure, the term ‘greater than’ or ‘less than’ may be used to determine whether a particular condition is satisfied or fulfilled, but this is only a description to express an example and does not exclude description of ‘greater than or equal to’ or ‘less than or equal to’. A condition described as ‘greater than or equal to’ may be replaced with ‘greater than’, a condition described as ‘less than or equal to’ may be replaced with ‘less than’, and a condition described as ‘greater than or equal to and less than’ may be replaced with ‘greater than and less than or equal to’.
It should be appreciated that the blocks in each flowchart and combinations of the flowcharts may be performed by one or more computer programs which include instructions. The entirety of the one or more computer programs may be stored in a single memory device or the one or more computer programs may be divided with different portions stored in different multiple memory devices.
Any of the functions or operations described herein can be processed by one processor or a combination of processors. The one processor or the combination of processors is circuitry performing processing and includes circuitry like an application processor (AP, e.g. a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a Wi-Fi chip, a Bluetooth® chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, connectivity chips, a sensor controller, a touch controller, a finger-print sensor controller, a display driver integrated circuit (IC), an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an IC, or the like.
Referring to
The terminal 120 is a device used by a user and performs communication with the base station 110 through a wireless channel. In some cases, the terminal 120 may be operated without the user involvement. That is, the terminal 120, which is a device performing machine type communication (MTC), may not be carried by the user. In addition to the terminal, the terminal 120 may be referred to as ‘user equipment (UE), ‘mobile station’, ‘subscriber station’, ‘customer premises equipment (CPE), ‘remote terminal’, ‘wireless terminal’, ‘electronic device’, or ‘terminal for vehicle’, ‘user device’ or another term having a technical meaning equivalent thereto.
Beamforming technology is being used as one of technology to mitigate radio waves path loss and increase a transmission distance of radio waves. In general, an arrival region of radio waves is concentrated by beamforming using a plurality of antennas or the directivity of reception sensitivity in a specific direction is increased by beamforming. Therefore, in order to form beamforming coverage instead of forming a signal in an isotropic pattern using a single antenna, the base station 110 may be provided with a plurality of antennas. According to an embodiment, the base station 110 may include a Massive Multiple Input Multiple Output Unit (MMU). A shape in which a plurality of antennas is assembled may be referred to as an antenna array 130, and each antenna included in the array may be referred to as an array element or an antenna element. The antenna array 130 may be configured in various form such as a linear array and a planar array. The antenna array 130 may be referred to as a passive antenna array.
Main technology for improving data capacity of 5G communication is beamforming technology using an antenna array connected to a plurality of RF paths. For higher data capacity, the number of RF paths should be increased or power per the RF path should be increased. Increasing the RF path increases a size of the product and is currently at a level that may not be increased any more due to a space constraint in installing actual base station equipment. An antenna gain may be increased by connecting a plurality of antenna elements to the RF path using a divider (or splitter) in order to increase the antenna gain through high power without increasing the number of RF paths. Herein, antenna elements corresponding to the RF path may be referred to as a subarray.
In order to improve communication performance, the number of antennas (or antenna elements) of equipment (e.g., base station 110) that perform wireless communication is increasing. In addition, since the number of an RF component (e.g., amplifier, filter) to process an RF signal received or transmitted through antenna elements and components increases, a spatial gain and cost efficiency are necessarily required while satisfying communication performance in configuring communication equipment.
Referring to
Hereinafter, the disclosure describes the antenna array configured with subarrays as an example as a structure of a plurality of antennas for communication in a Multiple Input Multiple Output (MIMO) environment, but it is of course possible to easily change for beamforming in a portion of embodiments.
Referring to
A beam width used to transmit a signal in a wireless channel is dependent on a space between antenna elements of the antenna array. The space between antenna elements in the antenna array may be determined based on price competitiveness and beamforming performance. For example, a space between antenna elements disposed in a horizontal direction in a first antenna array 210 may be 0.5λ. The first antenna array 210 may form a beam having a beam width corresponding to about 90 degrees in the horizontal direction. For example, a space between antenna elements disposed in the horizontal direction in a second antenna array 220 is 0.74λ. The second antenna array 220 may form a beam having a beam width corresponding to about 65 degrees in the horizontal direction.
If the space between antenna elements is narrowly disposed for beamforming according to the required a beam width, there may not be enough space for deployment of components for feeding the signal to the antenna elements. For example, in order to reduce production cost and reduce weight, a dielectric substrate (e.g., plastic substrate) is used. Due to a support structure of screws and the dielectric substrate when combining the dielectric substrate and a metal plate, it may be difficult to dispose a power divider (e.g., 300 megahertz (MHz) broadband distributor) of each subarray. In order to increase design flexibility of the power divider of the subarray, a structure between antenna elements may be removed. However, even if a lot of space is secured, deterioration in isolation performance may occur.
Referring to
The subarrays 320 may include two 3×1 subarrays. The 3×1 subarrays may be disposed in the horizontal direction. Isolation characteristic may include cross-pol isolation. Cross-pol isolation may be referred to as X-pol isolation. The signal of the first polarization and the signal of the second polarization perpendicular to the first polarization may be fed to antenna elements of each subarray. A solid line represents a feeding part for the signal of the first polarization and a feeding part for the signal of the second polarization in the first subarray, and a dotted line represents a feeding part for the signal of the first polarization and a feeding part for the signal of the second polarization in the second subarray. Cross-pol isolation refers to isolation characteristic between signals with a perpendicular polarization. Cross-pol isolation represents isolation between the solid lines of the first subarray. Cross-pol isolation represents isolation between the dotted lines of the second subarray. The feeding part located on the left may have a radiation effect on the feeding part located on the right. In addition, the feeding part located on the left side of the first subarray may have a radiation effect on the feeding part located on the right side of the second subarray (i.e., patch-to-patch radiation). In addition, a signal induced due to a surface current of a substrate including subarrays may affect a signal with the same polarization of another subarray.
The subarrays 320 may include two 3×1 subarrays. The 3×1 subarrays may be disposed in the horizontal direction. Isolation characteristic may include adjacent cross-pol isolation. Adjacent cross-pol isolation may be referred to as adjacent X-pol isolation. The signal of the first polarization and the signal of the second polarization perpendicular to the first polarization may be fed to antenna elements of each subarray. A solid line represents a feeding part for the signal of the second polarization in the first subarray and a feeding part for the signal of the first polarization in the second subarray. A dotted line represents a feeding part for the signal of the first polarization in the first subarray and a feeding part for the signal of the second polarization in the second subarray. Adjacent cross-pol isolation refers to isolation characteristic between signals having a perpendicular polarization among signals between adjacent subarrays. Adjacent cross-pol isolation represents isolation between the solid lines. In deployment of the subarrays 330, the polarizations of the two signals illustrated by the solid line are perpendicular to each other. Therefore, adjacent cross-pol isolation performance between the two subarrays may be higher than the above-described co-pol isolation or cross-pol isolation.
As described through
Referring to
According to an embodiment, a decoupling coupler 450 may be disposed between the first power divider 410 and the second power divider 420. As signals with different polarizations are fed within a certain distance, a signal affect another signal electrically and magnetically. This effect may be referred to as coupling. The decoupling coupler 450 may be designed for isolation between a first port into which the signal of the first polarization is inputted and a second port into which the signal of the second polarization is inputted. The decoupling coupler 450 may function as a matching network so that a signal applied to the first port less affects a signal applied to the second port. For example, the decoupling coupler 450 is implemented in the form of a microstrip or strip in which the amount of coupling is controlled by space and a length of the line.
Although
Referring to
According to an embodiment, a first decoupling coupler 551 may be disposed between the first antenna element 501 and the second antenna element 503. The first decoupling coupler 551 may provide a connection between the first power divider to which the signal 511 of the first polarization is fed and the second power divider to which the signal 521 of the second polarization is fed. Through the first decoupling coupler 551, isolation between the signal 511 of the first polarization and the signal 521 of the second polarization may increase. According to an embodiment, the first decoupling coupler 551 may include a strip-shaped transmission line.
According to an embodiment, a second decoupling coupler 552 may be disposed between the second antenna element 503 and the third antenna element 505. The second decoupling coupler 552 may provide a connection between the first power divider to which the signal 511 of the first polarization is fed and the second power divider to which the signal 521 of the second polarization is fed. Through the second decoupling coupler 552, isolation between the signal 511 of the first polarization and the signal 521 of the second polarization may increase. According to an embodiment, the second decoupling coupler 552 may include a U-shaped transmission line.
According to an embodiment, the third decoupling coupler 553 may be disposed under the third antenna element 505. The third decoupling coupler 553 may provide a connection between the first power divider to which the signal 511 of the first polarization is fed and the second power divider to which the signal 521 of the second polarization is fed. Through the third decoupling coupler 553, isolation between the signal 511 of the first polarization and the signal 521 of the second polarization may increase. According to an embodiment, the third decoupling coupler 553 may include a loop-shaped transmission line.
Although
Hereinafter, an effect according to various types and a size of the decoupling coupler according to embodiments of the disclosure will be described through
Referring to
L may be a length of the strip line, and λg may be the effective wavelength. For example, λg is determined based on the following equation.
c0 means propagation speed, f0 means an operating frequency, and εeff means an effective dielectric constant. For example, εeff is determined based on the following equation.
εr means relative permittivity, W means a width, and h means thickness of a substrate. A length of a patch may be determined based on the following equation.
Referring to
L may be the length of the patch, and λg may be the effective wavelength.
Referring to
L may be the length of the patch, and λg may be the effective wavelength.
According to an embodiment, the decoupling coupler may be formed on the antenna substrate in a plating method. According to an embodiment, the decoupling coupler may be formed on the antenna substrate in a Laser Direct Structuring (LDS) method. According to an embodiment, the power divider may be formed on the antenna substrate in the plating method. According to an embodiment, the power divider may be formed on the antenna substrate in the Laser Direct Structuring (LDS) method. According to an embodiment, the decoupling coupler may be formed in the same method as the method of forming the feeding lines of the power divider. A material of the decoupling coupler may be the same as a material of the power divider.
Referring to
According to an embodiment, a coupler (hereinafter, a decoupling coupler) for decoupling matching between polarizations may be disposed on the first side of the antenna substrate 721. In an example 731, the decoupling coupler may be directly connected to the power divider disposed on the same first side. For example, the decoupling coupler distributes power through direct coupling (or direct connection) between the line for the first polarization and the line for the second polarization. Capacitance between the two lines may be formed. As power is distributed through high capacitance, isolation characteristic between the two lines may be strengthened. In another example 732, the decoupling coupler may be indirectly connected to the power divider disposed on the same first side. For example, the decoupling coupler may distribute power by providing an indirect connection through coupling between the line for the first polarization and the line for the second polarization. Capacitance between the two lines may be formed. As power is distributed through high capacitance, isolation characteristic between the two lines may be strengthened.
Referring to
According to an embodiment, the power divider may be disposed on a second side different from a first side on which antenna elements of the antenna substrate 821 are disposed. The second side may be an opposite side to the first side. That is, the line 810 may be located on the second side of the antenna substrate 821. Referring to the front view, the antenna substrate 821 may be stacked on the metal plate 823 at intervals, and the line 810 may be disposed on a rear side of the antenna substrate 821. As the power divider is located on the rear side of the antenna substrate 821, an upper side of the antenna substrate 821 may have a relatively free space. Thus, a design of other structures such as antenna elements may be facilitated.
According to an embodiment, a coupler (hereinafter, a decoupling coupler) for decoupling matching between polarizations may be disposed on the first side of the antenna substrate 821. In an example 831, the decoupling coupler may be indirectly connected to the power divider disposed on the other second side. Power may be distributed by being provided an indirect connection through coupling between the line for the first polarization and the line for the second polarization through the decoupling coupler. Capacitance may be formed between the two lines. As power is distributed through high capacitance, isolation characteristic between the two lines may be strengthened. According to another example, the coupler (hereinafter, decoupling coupler) for decoupling matching between polarizations may be disposed on the second side of the antenna substrate 821. In this case, the decoupling coupler may be directly connected (e.g., example 832) or indirectly connected to the power divider at the rear side of the antenna substrate 821.
Decoupling is a function to reduce or eliminate a radio frequency (RF) energy flowing into an input network and to reduce a peak of a current surge induced in the substrate. The coupler may include an input port, a through port, a coupled port for extracting a portion of power passing through, and an isolated port. The two lines may be disposed close together, and the amount of coupling may be adjusted based on a space between the lines and a length of each line. According to an embodiment, a principle of the coupler may be applied to an antenna subarray according to an embodiment of the disclosure not to isolate between antenna elements, but to isolate between two ports fed to the antenna element. Through a decoupling matching network technique, a coupler may be disposed between feeding lines (e.g., the power divider for the first polarization and the second power divider for the second polarization) inputted to antenna ports. The coupler may be disposed between the power divider for the first polarization and the power divider for the second polarization in each subarray of the antenna array, so that a signal applied to the first port less affects a signal applied to the second port. The coupler may be referred to as a decoupling coupler (or a decoupling matching network (DMN) or a decoupling network (DN)).
Referring to
The decoupling coupler may function to prevent a signal of a specific polarization from being induced to another space (e.g., a radiating region of a signal of another polarization in a lateral direction), or to reduce the intensity of caused radio waves. Coupling between polarizations may reduce an influence of a signal of a specific polarization on a signal of another polarization. Although only one subarray is illustrated in
Referring to
According to an embodiment, the decoupling coupler 1060 may be indirectly connected to the power divider. The power divider may include the first power divider for N-pol and the second power divider for P-pol. An indirect connection refers to an electrical connection with two power dividers provided through a coupling feeding method without being directly connected with two power dividers. The decoupling coupler 1060 may function to offset a signal induced from N-pol to P-pol. That is, the signal coupled between two polarizations may be offset.
According to an embodiment, the decoupling coupler 1060 may re-radiate a signal induced from an antenna substrate. Through the re-radiation, the amount of a signal induced from a left subarray to a right subarray may decrease, or the amount of a signal induced from the right subarray to the left subarray may decrease. By reducing unnecessary surface waves, coupling between signals of different polarizations may be alleviated.
The loss during signal transmission is illustrated in Equation 7 below.
α refers to total loss, ac refers to loss due to metal conductivity, αD refers to loss due to dielectric loss tangent, αG refers to loss due to conductivity of dielectric, and αR refers to loss due to radiation. The decoupling coupler may be use the surface wave corresponding to αR for isolation. As an example 831 illustrated in
Referring to
A signal of a first polarization may be fed to the subarray 1130. The signal of the first polarization may be transmitted to each antenna element of the subarray 1130 through a first power divider 1120. The first power divider 1120 may include three branches. The first power divider 1120 may include three transmission lines. For example, the first power divider 1120 includes a first transmission line 1121, a second transmission line 1122, and a third transmission line 1123. The signal passing through each transmission line is applied to the corresponding antenna element. The signal of a second polarization may be fed to the subarray 1130. The signal of the second polarization may be transmitted to each antenna element of the subarray 1130 through a second power divider 1140. The second power divider 1140 may include three branches. The second power divider 1140 may include three transmission lines. For example, the second power divider 1140 includes a fourth transmission line 1141, a fifth transmission line 1142, and a sixth transmission line 1143. The signal passing through each transmission line is applied to the corresponding antenna element.
In terms of the first power divider 1120, the first power divider 1120 is an input port, and the second power divider 1140 corresponds to an output port. In terms of the second power divider 1140, the second power divider 1140 is an input port, and the first power divider 1120 corresponds to an output port. Isolation refers to a characteristic in which input of one side is not transmitted to output of another side. When the decoupling technique is applied in aspect of circuit design, each decoupling coupler located in the subarray 1130 may provide an electrical connection between both transmission lines. The decoupling coupler may reduce or prevent a signal supply from a transmission line to another transmission line.
A first decoupling coupler 1131 of the subarray 1130 may electrically connect the first transmission line 1121 and the fourth transmission line 1141. The first decoupling coupler 1131 may function to electrically and magnetically separate the first transmission line 1121 from the fourth transmission line 1141, through a matching network technique. The second decoupling coupler 1132 of the subarray 1130 may electrically connect the second transmission line 1122 to the fifth transmission line 1142. The second decoupling coupler 1132 may function to electrically and magnetically separate the second transmission line 1122 from the fifth transmission line 1142, through the matching network technique. The third decoupling coupler 1133 of the subarray 1130 may electrically connect the third transmission line 1123 and the sixth transmission line 1143. The second decoupling coupler 1132 may function to electrically and magnetically separate the third transmission line 1123 from the sixth transmission line 1143, through the matching network technique.
Graph 1100 represents reflection parameters for each frequency domain. A horizontal axis 1101 of the graph represents a frequency (unit: gigahertz (GHz)), and a vertical axis 1102 represents a size of S11 parameter (unit: decibel (dB). Graph 1150 represents pass parameters for each frequency domain. A horizontal axis 1151 of the graph represents a frequency (unit: gigahertz (GHz)), and a vertical axis 1152 represents a size of S21 parameter (unit: decibel (dB). In each of the graph 1100 and 1150, a solid line is related to the subarray 1130 in which the decoupling coupler is disposed, and a dotted line is related to the subarray in which the decoupling coupler is not disposed.
The lower is the size of the S21 parameter, the higher is the isolation performance. As the decoupling coupler providing an electrical connection between the two polarizations is disposed in the subarray 1130, it is confirmed that the S21 parameter decreases, and an effect on other radiation performance is relatively insufficient.
referring to
Hereinafter, detailed structures of an array antenna will be described in
Referring to
A second perspective view 1215 illustrates a second side (e.g., rear side) of the antenna substrate. According to an embodiment, a feeding network for a power divider may be disposed on the second side of the antenna substrate. The feeding network may include a plurality of feeding lines. An input line for a first polarization may be branched to an individual feeding line through a first power divider. An input line for a second polarization may be branched to an individual feeding line through a second power divider. Signals of two feeding lines may be applied to one antenna element. An end of each of the feeding lines on the second side of the antenna substrate may correspond to an input port of the antenna element on the first side of the antenna substrate.
A side view 1220 illustrates an example of a stacked structure of the antenna substrate. According to an embodiment, an antenna element 1221 may be disposed on the first side of an antenna substrate 1225. According to an embodiment, the antenna substrate 1225 may be a dielectric. The antenna substrate 1225 may include a support part 1223. The support part 1223 may be coupled to the antenna element 1221 so that the antenna element 1221 is spaced apart above the first side by a predetermined distance. A metal plate 1227, which is a substrate providing a ground surface, may be spaced apart from the antenna substrate 1225 by the predetermined distance. The power divider may be disposed through the spaced apart space. A feeding line 1226 may be disposed on the second side of the antenna substrate 1225. The feeding line 1226 refers to a transmission line for feeding a signal to the antenna element. The feeding line 1226 corresponds to a branch of the power divider. According to an embodiment, the feeding line 1226 may be disposed according to a shape of the support part 1223 to radiate an RF signal through the antenna element 1221. The feeding line 1226 may be disposed along the second side of the support part 1223 formed in the antenna substrate 1225.
The decoupling coupler 1250 according to embodiments of the disclosure may be disposed on the first side of the antenna substrate 1225. The decoupling coupler 1250 may function to reduce an effect where signals caused from the feeding line 1226 are coupled to another feeding line. Even if the decoupling coupler 1250 is not physically coupled to the feeding line 1226, the existing coupling may be offset through coupling of the decoupling coupler 1250. Furthermore, as the decoupling coupler 1250 re-radiates (e.g., re-radiation of the decoupling coupler 1060 of
Referring to
A second plan view 1240 illustrates a first side of an antenna substrate of an array antenna including two subarrays. For example, each subarray is a 3×1 subarray. The subarrays may include a first subarray and a second subarray. The first subarray may include an antenna element 1221a, an antenna element 1222a, and an antenna element 1223a. The second subarray may include an antenna element 1221b, an antenna element 1222b, and an antenna element 1223b. A third decoupling coupler 1241 may provide an electrical connection between power dividers of the second subarray. The power dividers may include branches of feeding lines to provide different polarizations. For example, for each element of the first subarray, a conductive pattern 1298a for the first polarization and a conductive pattern 1299a for the second polarization is disposed on one side (e.g., the first side or the second side opposite to the first side) of the antenna substrate. A fourth decoupling coupler 1243 may provide an electrical connection between power dividers of the second subarray. The power dividers may include branches of feeding lines to provide different polarizations. For example, for each element of the second subarray, a conductive pattern 1298b for the first polarization and a conductive pattern 1299b for the second polarization is disposed on one side (e.g., the first side or the second side opposite to the first side) of the antenna substrate.
Re-radiation according to the electrical connection may function to offset the existing coupling effect. According to an embodiment, the decoupling coupler may have a different shape other than a simple straight strip line or patch. For example, the shape of the decoupling coupler is the shape illustrated in
Referring to
Referring to the third line 1313 and the fourth line 1314, it is confirmed that there is little change in co-polar isolation performance. However, referring to the first line 1311 and the second line 1312, it is confirmed that the cross-pol isolation performance is improved maximally by 9 dB (about −21 dB to −30 dB). The decoupling coupler 1380 may improve cross-pol isolation performance in the subarray and between the subarrays.
Referring to
Referring to the first line 1361 and a second line 1362, it is confirmed that the cross-pol isolation performance is improved maximally by 5 dB (about −30 dB to −35.6 dB). According to an embodiment, when an operating frequency is changed, the cross-pol isolation performance is changed, and thus a shape of the decoupling coupler may be specified based on the operating frequency. Referring to the third line 1313 and the fourth line 1314, it is confirmed that the co-pol isolation performance is improved by 2 dB (about −24.3 dB to −26.4 dB) in the corresponding frequency domain.
Referring to
The first subarray 1410 may include a first antenna element 1411, a second antenna element 1412, and a third antenna element 1413. A first decoupling coupler 1417 may be disposed in the antenna substrate of the first subarray 1410. According to an embodiment, the first decoupling coupler 1417 may be disposed in a space corresponding to the second antenna element 1412 and the third antenna element 1413 above one side of the antenna substrate. The second subarray 1420 may include a first antenna element 1421, a second antenna element 1422, and a third antenna element 1423. The second decoupling coupler 1427 may be disposed in the antenna substrate of the second subarray 1420. According to an embodiment, the second decoupling coupler 1427 may be disposed in a space corresponding to the second antenna element 1422 and the third antenna element 1423 above one side of the antenna substrate. The third subarray 1430 may include a first antenna element 1431, a second antenna element 1432, and a third antenna element 1433. The third decoupling coupler 1437 may be disposed in the antenna substrate of the third subarray 1430. According to an embodiment, the third decoupling coupler 1437 may be disposed in a space corresponding to the second antenna element 1432 and the third antenna element 1433 above one side of the antenna substrate. The fourth subarray 1440 may include a first antenna element 1441, a second antenna element 1442, and a third antenna element 1443. The fourth decoupling coupler 1447 may be disposed in the antenna substrate of the fourth subarray 1440. According to an embodiment, the fourth decoupling coupler 1447 may be disposed in a space corresponding to the second antenna element 1442 and the third antenna element 1443 above one side of the antenna substrate.
The decoupling coupler according to embodiments may be disposed at a location to provide an electrical connection to power dividers of the subarray, in order to increase cross-pol isolation performance.
Hereinafter, a deployment of the power divider will be described based on the third subarray 1430 and the fourth subarray 1440. Although not illustrated for contrast, the first subarray 1410 and the second subarray 1420 include the power divider therein, respectively. For example, the power divider (or feeding lines, feeding network) for the first subarray 1410 is disposed on one side of the antenna substrate (e.g., PCB). The one side of the antenna substrate may be opposite to one side of the antenna substrate in which the first antenna element 1411, the second antenna element 1412, and the third antenna element 1413 are disposed. For example, the power divider (or feeding lines, feeding network) for the second subarray 1420 is disposed on one side of the antenna substrate (e.g., PCB). The one side of the antenna substrate may be opposite to one side of the antenna substrate in which the first antenna element 1421, the second antenna element 1422, and the third antenna element 1423 are disposed. Descriptions of the power divider for the third subarray 1430 and the fourth subarray 1440 may be applied to the first subarray 1410 and the second subarray 1420 in the same or similar manner, of course.
The third subarray 1430 may include the first antenna element 1431, the second antenna element 1432, the third antenna element 1433, and feeding network circuitry connected to each antenna element. The feeding network circuitry may include a first power divider 1435a and a second power divider 1435b. The first power divider 1435a may have three branches to feed a signal of a first polarization to each of the first antenna element 1431, the second antenna element 1432, and the third antenna element 1433. The second power divider 1435b may have three branches to feed a signal of a second polarization to each of the first antenna element 1431, the second antenna element 1432, and the third antenna element 1433.
The third decoupling coupler 1437 for the third subarray 1430 may electrically connect the first power divider 1435a to the second power divider 1435b. The third decoupling coupler 1437 may be disposed on the first side of the antenna substrate, and the first power divider 1435a and the second power divider 1435b may be disposed on the second side opposite to the first side of the antenna substrate. The third decoupling coupler 1437 may reduce an influence of coupling between signals caused by the feeding lines of the first polarization and signals caused by the feeding lines of the second polarization, by being located in a region between the first power divider 1435a and the second power divider 1435b.
Although the third decoupling coupler 1437 does not directly connect the first power divider 1435a to the second power divider 1435b, when viewed from above, a location where the third decoupling coupler 1437 is disposed may overlap the first power divider 1435a and the second power divider 1435b. Although not illustrated in
The fourth subarray 1440 may include the first antenna element 1441, the second antenna element 1442, the third antenna element 1443, and feeding network circuitry connected to each antenna element. The feeding network circuitry may include a third power divider 1445a and a second power divider 1434b. The third power divider 1445a may have three branches to feed a signal of a first polarization to each of the first antenna element 1441, the second antenna element 1442, and the third antenna element 1443. The fourth power divider 1445b may have three branches to feed a signal of a second polarization to each of the first antenna element 1441, the second antenna element 1442, and the third antenna element 1443.
The fourth decoupling coupler 1447 for the fourth subarray 1440 may electrically connect the third power divider 1445a to the fourth power divider 1445b. The fourth decoupling coupler 1447 may be disposed on the first side of the antenna substrate, and the third power divider 1445a and the fourth power divider 1445b may be disposed on the second side opposite to the first side of the antenna substrate. The fourth decoupling coupler 1447 may reduce an influence of coupling between signals caused by the feeding lines of the first polarization and signals caused by the feeding lines of the second polarization, by being located in a region between the third power divider 1445a and the fourth power divider 1445b.
Although the fourth decoupling coupler 1447 does not directly connect the third power divider 1445a to the fourth power divider 1445b, when viewed from above, a location where the fourth decoupling coupler 1447 is disposed may overlap the third power divider 1445a and the fourth power divider 1445b. Although not illustrated in
Referring to
The antenna unit 1511 may include a plurality of antennas. The antenna performs functions for transmitting and receiving a signal through a wireless channel. The antenna may include a conductor formed on a substrate (e.g., PCB) or a radiator formed of a conductive pattern. The antenna may emit the up-converted signal on the wireless channel or obtain the signal emitted by another device. Each antenna may be referred to as an antenna element or an antenna component. In some embodiments, the antenna unit 1511 may include an antenna array in which a plurality of antenna elements forms a row. The antenna unit 1511 may be electrically connected to the filter unit 1512 through RF signal lines. The antenna unit 1511 may be disposed in a PCB including a plurality of antenna elements. The PCB may include a plurality of RF signal lines connecting each antenna element to a filter of the filter unit 1512. The RF signal lines may be referred to as a feeding network.
The antenna unit 1511 may provide a received signal to the filter unit 1512 or may emit a signal provided from the filter unit 1512 into the air. The antenna unit 1511 according to embodiments of the disclosure may include the antenna element including the decoupling coupler. As described through
The filter unit 1512 may perform filtering to transmit a signal of a desired frequency. The filter unit 1512 may perform a function for selectively identifying a frequency by forming a resonance. The filter unit 1512 may include at least one of a band pass filter, a low pass filter, a high pass filter, or a band reject filter. That is, the filter unit 1512 may include RF circuitry for obtaining a signal of a frequency band for transmission or a frequency band for reception. The filter unit 1512 according to various embodiments may electrically connect the antenna unit 1511 to the RF processing unit 1513.
The RF processing unit 1513 may include a plurality of RF paths. The RF path may be a unit of a path through which a signal received through an antenna or a signal emitted through the antenna passes. At least one RF path may be referred to as an RF chain. The RF chain may include a plurality of RF elements. The RF elements may include an amplifier, a mixer, an oscillator, a digital-to-analog converter (DAC), an analog-to-digital converter (ADC), and the like. For example, the RF processing unit 1513 includes an up converter that up-converts a digital transmission signal of a base band into a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal into an analog RF transmission signal. The upconverter and the DAC form a portion of a transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or a combiner). In addition, for example, the RF processing unit 1513 includes an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts a digital reception signal into a digital reception signal of the base band. The ADC and the down converter form a portion of the reception path. The reception path may further include a low-noise amplifier (LNA) or a coupler (or a divider). RF components of the RF processor may be implemented in a PCB. The base station 110 (i.e., electronic device 1510) may include a structure in which an antenna unit 1511 to a filter unit 1512 to an RF processing unit 1513 are stacked in this order. The antennas and RF components of the RF processor may be implemented on the PCB, and filters may be repeatedly fastened between PCBs to form a plurality of layers.
The control unit 1514 may control overall operations of the electronic device 1510. The control unit 1514 may include various modules for performing communication. The control unit 1514 may include at least one processor such as a modem. The control unit 1514 may include modules for digital signal processing. For example, the control unit 1514 includes the modem. When transmitting data, the control unit 1514 generates complex symbols by encoding and modulating a transmission bit string. In addition, for example, when receiving data, the control unit 1514 restores a reception bit string by demodulating and decoding a baseband signal. The control unit 1514 may perform functions of a protocol stack required by the communication standard.
Referring to
In the disclosure, a polarization of about (+)45 degrees and a polarization of about (−)45 degrees have been described as an example to describe two polarizations (e.g., a first polarization and a second polarization) in a vertical relationship, but the description of the two polarizations may also be applied to an antenna structure using a vertical polarization and a horizontal polarization or an antenna structure using a polarization of about (+)90 degree and a polarization of about (−)0 degree.
An electronic device according to embodiments may include an antenna substrate, and an antenna array including a subarray, wherein the subarray may include a plurality of antenna elements. The electronic device may include a feeding network circuitry including a first power divider for a first polarization and a second power divider for a second polarization different from the first polarization. The electronic device may comprise a network circuitry for decoupling of a first signal of the first power divider and a second signal of the second power divider may be included. The subarray may be disposed on a first side of the antenna substrate. The feeding network circuitry may be disposed on the first side or a second side opposite to the first side of the antenna substrate. The network circuitry for decoupling may be disposed in a region between the first power divider and the second divider in the first side or the second side of the antenna substrate.
According to an embodiment, the second polarization may be perpendicular to the first polarization.
According to an embodiment, the feeding network circuitry may be disposed on the first side of the antenna substrate. The network circuitry for decoupling may be disposed on the first side of the antenna substrate. The feeding network circuitry and the network circuitry for decoupling may be electrically connected through coupling.
According to an embodiment, the feeding network circuitry may be disposed on the first side of the antenna substrate. The network circuitry for decoupling may be disposed on the first side of the antenna substrate. The feeding network circuitry and the network circuitry for decoupling may be electrically connected through direct feeding.
According to an embodiment, the feeding network circuitry may be disposed on the second side of the antenna substrate. The network circuitry for decoupling may be disposed on the first side of the antenna substrate. The feeding network circuitry and the network circuitry for decoupling may be electrically connected through coupling feeding.
According to an embodiment, each of the antenna elements may include a patch antenna. The antenna substrate may include a dielectric substrate. The dielectric substrate may include a protrusion portion for supporting each of the antenna elements on a first side of the dielectric substrate. The feeding network circuitry may be disposed on a second side opposite to the first side of the dielectric substrate.
According to an embodiment, the network circuitry for decoupling may include a detachable metal strip.
According to an embodiment, a length and a width of the metal strip may be based on a structure of the antenna substrate, physical properties of the substrate, and an operating frequency.
According to an embodiment, the network circuitry for decoupling may include a strip line type, a patch type, or a loop type coupler.
According to an embodiment, the network circuitry for decoupling may include a metal strip. A length and a width of the metal strip may be specified based on a structure of the antenna substrate, physical properties of the substrate, and an operating frequency.
According to an embodiment, the metal strip may be disposed in the region to form capacitance in accordance with an amount of coupling of the first signal and the second signal between the first power divider and the second power divider.
According to an embodiment, the metal strip may be made of a deformable material.
According to an embodiment, the antenna elements include a first antenna element, a second antenna element, and a third antenna element. The first power divider may be configured to feed a signal of the first polarization to each of the first antenna element, the second antenna element, and the third antenna element. The second power divider may be configured to feed a signal of the second polarization to each of the first antenna element, the second antenna element, and the third antenna element. The network circuitry for decoupling may be disposed in at least one of spaces between antenna elements or spaces at both ends of all antenna elements, on the same side or the opposite side with the feeding network circuitry in the antenna substrate.
According to an embodiment, the electronic device may include a processor, a metal plate, a plurality of antenna substrates, and an array antenna including a plurality of subarrays. For each subarray, a subarray among the plurality of subarrays may include a feeding network circuitry including a first power divider for a first polarization and a second power divider for a second polarization different from the first polarization, and a network circuitry for decoupling of a first signal of the first power divider and a second signal of the second power divider. The subarray among the plurality of subarrays may be disposed on a first side of the antenna substrate corresponding to the subarray. The feeding network circuitry may be disposed on a second side opposite to the first side. The feeding network circuitry may be disposed on a second side opposite to the first side. The network circuitry for decoupling may be disposed in a region between the first power divider and the second power divider in the first side or the second side.
According to embodiments, the second polarization may be perpendicular to the first polarization.
According to embodiments, the feeding network circuitry may be disposed on the first side. The network circuitry for decoupling may be disposed on the first side of the antenna substrate. The feeding network circuitry and the network circuitry for decoupling may be electrically connected through coupling.
According to embodiments, the feeding network circuitry may be disposed on the first side. The network circuitry for decoupling may be disposed on the first side of the antenna substrate. The feeding network circuitry and the network circuitry for decoupling may be electrically connected through direct feeding.
According to embodiments, the feeding network circuitry may be disposed on the second side. The network circuitry for decoupling may be disposed on the first side of the antenna substrate. The feeding network circuitry and the network circuitry for decoupling may be electrically connected through coupling feeding.
According to embodiments, each of the plurality of the antenna substrates may include a dielectric substrate. The dielectric substrate may further include a protrusion portion for supporting and antenna element. A feeding line of the feeding network circuitry may be disposed on a side opposite to the protrusion portion of the dielectric substrate.
According to an embodiment, the network circuitry for decoupling may include a detachable metal strip.
According to an embodiment, a length and a width of the metal strip may be based on a structure of the antenna substrate, physical properties of the substrate, and an operating frequency.
According to an embodiment, the matching network circuitry for decoupling may include a metal strip. A length and a width of the metal strip may be specified based on a structure of the antenna substrate, physical properties of the substrate, and an operating frequency.
According to an embodiment, the metal strip may be disposed in the region to form capacitance in accordance with an amount of coupling of the first signal and the second signal between the first power divider and the second power divider.
According to an embodiment, the metal strip may be made of a deformable material.
According to an embodiment, the network circuitry for decoupling may include a strip line type, a patch type, or a loop type of coupler.
According to an embodiment, the subarray may be a 3×1 subarray. The network circuitry for decoupling may be disposed in at least one of spaces between antenna elements or spaces at both ends of all antenna elements, on the same side or rear side with the feeding network circuitry in the antenna substrate corresponding to the subarray.
An array antenna according to embodiments of the disclosure may include a deformable structure on a dielectric substrate around a power divider. A decoupling coupler for transferring power between the power divider capable of antenna feeding and a radiator emitting energy may be disposed. The decoupling coupler according to embodiments may function as a decoupling matching network. In order to improve isolation performance between two signals with different polarizations, the decoupling coupler may provide an electrical connection between two power dividers. As the decoupling coupler is disposed, isolation performance may be secured without an additional space such as a wall. In addition, as the power divider is disposed behind an antenna substrate, the space between the antenna substrate and an antenna element may be secured to facilitate design. In addition, the decoupling coupler have the advantage of less gain loss and easier implementation than a defective ground method.
The disclosure provides an antenna structure for securing a space of a power divider in an antenna array including a plurality of subarrays and an electronic device including the same.
The disclosure provides a matching network for increasing isolation performance between subarrays in an electronic device including an array antenna and the electronic device including the same.
A matching network and an electronic device including the same according to embodiments of the disclosure may reduce a spatial constraint of a power divider and increase isolation performance between the two polarizations through a coupler disposed between power dividers that provide different polarizations.
The effects that can be obtained from the disclosure are not limited to those described above, and any other effects not mentioned herein will be clearly understood by those having ordinary knowledge in the art to which the disclosure belongs, from the following description.
Methods according to embodiments described in claims or specifications of the disclosure may be implemented as a form of hardware, software, or a combination of hardware and software.
In case of implementing as software, a computer-readable storage medium for storing one or more programs (software module) may be provided. One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors in an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to embodiments described in claims or specifications of the disclosure.
Such a program (software module, software) may be stored in random access memory, non-volatile memory including flash memory, read only memory (ROM), electrically erasable programmable read only memory (EEPROM), a magnetic disc storage device, a compact disc-ROM (CD-ROM), digital versatile discs (DVDs), another type of optical storage device, or a magnetic cassette. Alternatively, it may be stored in memory composed of a combination of some or all of them. In addition, a plurality of each configuration memory may be included.
Additionally, a program may be stored in an attachable storage device that may be accessed through a communication network such as the Internet, Intranet, local area network (LAN), wide area network (WAN), or storage area network (SAN), or a combination of them. Such a storage device may be connected to a device performing an embodiment of the disclosure through an external port. In addition, a separate storage device on the communication network may also access a device that performs embodiment of the disclosure.
In specific embodiments of the disclosure described above, an element included in the disclosure are represented in singular or plural numbers according to a specific embodiment presented. However, singular or plural expressions are selected to suit the presented situation for convenience of explanation, the disclosure is not limited to singular or plural components, and even a component represented in the plural may be composed of a singular number, or a component represented in the singular may be composed of a plural number.
While the disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.
Number | Date | Country | Kind |
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10-2022-0050450 | Apr 2022 | KR | national |
This application is a continuation application, claiming priority under 35 U.S.C. § 365(c), of an International application No. PCT/KR2023/003887, filed on Mar. 23, 2023, which is based on and claims the benefit of a Korean patent application number 10-2022-0050450, filed on Apr. 22, 2022, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety.
Number | Date | Country | |
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Parent | PCT/KR2023/003887 | Mar 2023 | WO |
Child | 18918817 | US |