Claims
- 1. A temperature compensating member which comprises a polycrystalline body containing, as a main crystal, one of β-quartz solid solution and β-eucryptite solid solution, which has a value less than 3.52 Å as an interplanar spacing of the crystal planes giving a main peak in X-ray diffraction measurement, and which has a negative coefficient of thermal expansion.
- 2. A temperature compensating member as claimed in claim 1, wherein said polycrystalline body is a sintered powder body.
- 3. A temperature compensating member as claimed in claim 1, wherein said member has a coefficient of thermal expansion of (−25 to −120)×10−7/° C. within a temperature range between −40 and 100° C.
- 4. An optical communication device comprising a temperature compensating member claimed in claim 1 and an optical component having a positive coefficient of thermal expansion and fixed on one surface of said temperature compensating member.
- 5. An optical communication device as claimed in claim 4, further comprising a reinforcing member adhered to the other surface of said temperature compensating member by the use of an adhesive having a low elasticity.
- 6. An optical communication device as claimed in claim 5, wherein said reinforcing member is a columnar body having a through-hole, said temperature compensating member being placed in the through-hole of said reinforcing member.
- 7. An optical communication device as claimed in claim 4, wherein said optical component is fixed to said temperature compensating member by the use of an adhesive, said adhesive comprising an organic polymer and having a viscosity between 2500 and 100000 mPa·s at 25° C. prior to curing and a contracting rate of 5% or less upon curing.
Priority Claims (4)
Number |
Date |
Country |
Kind |
11-192954 |
Jul 1999 |
JP |
|
11-236201 |
Aug 1999 |
JP |
|
2000-135057 |
May 2000 |
JP |
|
2000-180101 |
Jun 2000 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
Applicants claim priority under 35 U.S.C. §119 of Japanese Application Nos. 192954/1999, 236201/1999, 135057/2000, and 180101/2000 filed Jul. 7, 1999, Aug. 23, 1999, May 8, 2000, and Jun. 15, 2000, respectively. Applicants also claim priority under 35 U.S.C. §120 of PCT/JP00/04436 filed Jul. 4, 2000. The international application under PCT article 21(2) was not published in English.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP00/04436 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO01/04672 |
1/18/2001 |
WO |
A |
US Referenced Citations (6)
Number |
Name |
Date |
Kind |
4788046 |
Barringer et al. |
Nov 1988 |
A |
5017519 |
Morimoto et al. |
May 1991 |
A |
5042898 |
Morey et al. |
Aug 1991 |
A |
5426714 |
Gadkaree et al. |
Jun 1995 |
A |
6087280 |
Beall et al. |
Jul 2000 |
A |
6209352 |
Beall et al. |
Apr 2001 |
B1 |
Foreign Referenced Citations (11)
Number |
Date |
Country |
812810 |
Dec 1997 |
EP |
828169 |
Mar 1998 |
EP |
995723 |
Apr 2000 |
EP |
2000-503415 |
Mar 2000 |
JP |
2000-119042 |
Apr 2000 |
JP |
2000-503967 |
Apr 2000 |
JP |
9726572 |
Jul 1997 |
WO |
9728480 |
Aug 1997 |
WO |
9964898 |
Dec 1999 |
WO |
0050360 |
Aug 2000 |
WO |
0055659 |
Sep 2000 |
WO |
Non-Patent Literature Citations (5)
Entry |
M.. Kato et al. C-3-54: The Package with glass ceramics of Thermal compensated Fiber Bragg. |
Gratings; Proceedings of general meeting in 1999, The Institute of Electronics, Information and Communication Engineers, Electronics 1, (Mar. 8, 1999), p. 208. |
Weidman D L et al.: “A novel negative expansion substrate material for athermalizing fiber Bragg gratings”; ECOC '96., Proceedings of European Conference on Optical Communication, Oslo, Norway, (Sep. 15-19, 1996), pp. 61-64. |
Akihiko Sakamoto et al., “C-3-95; Adhesion Properties of Negative Expansion Ceramic Substrate for Athermalization of Fiber Bragg Gratings”, Proceedings of Electronics Society Meeting (1999), The Institute of Electronics, Information and Communication Engineers, vol. 1, (Aug., 16, 1999), p. 201. |
Y. Hori et al. (1997) “Temperature-compensated Packages for Fiber Bragg Gratings”, The Institute of Electronics, Information and Communication Engineers, C-3-46. |