Patent Application
20240408639
The information provided in this section is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
The present disclosure relates to a material reconditioning and dispensing system.
Various manufacturing processes include adhesives and other materials that are dispensed under specific conditions. Dispensing systems transport the materials from storage containers to a deposition site, such as on an assembly line. At the dispensing site, the dispensing system deposits the material at specific locations and in specified quantities.
The present disclosure includes, in various features, a dispensing system for dispensing a material to a deposition point, the dispensing system including: a nozzle configured to dispense the material; a doser in fluid communication with the nozzle, the doser configured to control flow of the material to the nozzle; and a material conditioning assembly in fluid communication with the nozzle and configured to decrease viscosity of the material. The material conditioning assembly including: a conditioning chamber configured to receive the material therein; a drive member movable within the conditioning chamber to apply shear stress to the material within the conditioning chamber; and an actuator configured to move the drive member.
In further features, the material conditioning assembly is in fluid communication with the doser and arranged in the dispensing system such that the material flows from the material conditioning assembly to the doser. In further features, the drive member is a piston.
In further features, the conditioning chamber is a first conditioning chamber and the drive member is a first drive member; and the material conditioning assembly further includes a second conditioning chamber and a second drive member movable within the second conditioning chamber to apply shear stress to the material within the second conditioning chamber.
In further features, a primary chamber in fluid communication with both the first conditioning chamber and the second conditioning chamber to allow the material to flow between the first conditioning chamber and the second conditioning chamber by way of the primary chamber.
In further features, the primary chamber is in fluid communication with the doser and a source of the material; both the first conditioning chamber and the second conditioning chamber are in fluid communication with the doser by way of the primary chamber; and a stop valve is at an outlet of the primary chamber, the stop valve configured to stop flow of the material to the doser when the stop valve is closed.
In further features, the actuator is configured to simultaneously move both the first drive member and the second drive member in opposite directions to apply shear stress to the material.
In further features, helical grooves are defined at an inner surface of at least one of the first conditioning chamber and the second conditioning chamber.
In further features, at least one of the first conditioning chamber and the second conditioning chamber is nonlinear.
In further features, a control module is configured to determine viscosity of the material based on speed of the drive member and power consumed by the actuator to move the drive member when the conditioning chamber is full of the material.
In further features, when the determined viscosity is higher than a predetermined target viscosity, the control module is configured to increase power to the actuator to accelerate the drive member and apply additional shear stress to the material; and when the determined viscosity is lower than the predetermined target viscosity, the control module is configured to decrease power to the actuator to decelerate the drive member and apply less shear stress to the material.
In various features, the present disclosure includes a dispensing system for dispensing a material to a deposition point. The dispensing system includes: a nozzle configured to dispense the material; a doser in fluid communication with the nozzle, the doser including a displacement rod and a motor configured to move the displacement rod to control flow of the material to the nozzle; a material conditioning assembly upstream of the doser such that the material flows from the material conditioning assembly to the doser. The material conditioning assembly includes: a conditioning chamber configured to receive the material therein; a drive member movable within the conditioning chamber to apply shear stress to the material within the conditioning chamber; and an actuator configured to move the drive member. A control module is configured to determine viscosity of the material based on speed of the drive member and power consumed by the actuator to move the drive member when the conditioning chamber is full of the material. When the viscosity determined by the control module is higher than a predetermined target viscosity, the control module is configured to increase power to the actuator to accelerate the drive member to apply additional shear stress to the material.
In further features, the control module is configured to increase power to the motor to actuate the displacement rod with increased force when the viscosity of the material determined by the control module is higher than the predetermined target viscosity; and the control module is configured to decrease power to the motor to actuate the displacement rod with decreased force when the viscosity of the material determined by the control module is lower than the predetermined target viscosity.
In further features, the conditioning chamber is a first conditioning chamber and the drive member is a first drive member; the material conditioning assembly further includes a second conditioning chamber and a second drive member movable within the second conditioning chamber to apply shear stress to the material within the second conditioning chamber; and the conditioning chamber further includes a primary chamber in fluid communication with both the first conditioning chamber and the second conditioning chamber to allow the material to flow between the first conditioning chamber and the second conditioning chamber by way of the primary chamber.
In further features, the primary chamber is in fluid communication with the doser and a source of the material; both the first conditioning chamber and the second conditioning chamber are in fluid communication with the doser by way of the primary chamber; and a stop valve is at an outlet of the primary chamber, the stop valve configured to stop flow of the material to the doser when the stop valve is closed.
In further features, the actuator is configured to simultaneously move both the first drive member and the second drive member in opposite directions to apply shear stress to the material.
In further features, helical grooves are defined at an inner surface of at least one of the first conditioning chamber and the second conditioning chamber.
The present disclosure further includes, in various features, a dispensing system for dispensing a material to a deposition point. The dispensing system includes: a nozzle configured to dispense the material; a doser in fluid communication with the nozzle, the doser configured to control flow of the material to the nozzle; and a material conditioning assembly upstream of the doser such that the material flows from the material conditioning assembly to the doser. The material conditioning assembly includes: a first conditioning chamber and a first drive member movable within the first conditioning chamber to apply shear stress to the material within the first conditioning chamber; a second conditioning chamber and a second drive member movable within the second conditioning chamber to apply shear stress to the material within the second conditioning chamber; an actuator configured to simultaneously move the first drive member and the second drive member in opposite directions to apply shear stress to the material; a primary chamber in fluid communication with both the first conditioning chamber and the second conditioning chamber to allow the material to flow between the first conditioning chamber and the second conditioning chamber by way of the primary chamber, the primary chamber is in fluid communication with the doser and a source of the material; and a stop valve at an outlet of the primary chamber, the stop valve configured to stop flow of the material to the doser when the stop valve is closed.
In further features, a control module is configured to determine viscosity of the material based on speed of the first drive member, speed of the second drive member, and power consumed by the actuator to move the first drive member and the second drive member when the material conditioning assembly is full of the material; and when the determined viscosity is higher than a predetermined target viscosity, the control module is configured to increase power to the actuator to accelerate the first drive member and the second drive member to apply additional shear stress to the material.
In further features, the doser includes a displacement rod and a motor configured to move the displacement rod to control flow of the material to the nozzle; the control module is configured to increase power to the motor to actuate the displacement rod with increased force when the viscosity of the material determined by the control module is higher than the predetermined target viscosity; and the control module is configured to decrease power to the motor to actuate the displacement rod with decreased force when the viscosity of the material determined by the control module is lower than the predetermined target viscosity.
Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.
The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:
In the drawings, reference numbers may be reused to identify similar and/or identical elements.
As illustrated in
The material is pumped through the fluid lines 20 to a nozzle 30, which is configured to dispense the material at the deposition site. The nozzle 30 may be supported on a stand 32. Proximate to the nozzle 30 may be an optional flow transducer 34, which is configured to measure flow velocity of the material flowing to the nozzle 30.
The dispensing system 10 further includes a doser 40 (also known as a meter assembly). With continued reference to
The doser 40 further includes an outlet 44 through which material exits the doser 40. The doser 40 includes a displacement rod 46 and a head 48 at an end of the displacement rod 46. The displacement rod 46 is actuated by any suitable actuator, such as a servo motor 52. A gearbox 50 connects the servo motor 52 to the displacement rod 46. During operation of the dispensing system 10, the first and/or second pumps 14, 16 pump the material through the fluid lines 20, and through the inlet 42 of the doser 40. Actuation of the displacement rod 46 by the servo 52 pushes the material out of the doser 40 through the outlet 44 and to the nozzle 30, where the material is dispensed at the deposition location.
The dispensing system 10 further includes a material conditioning assembly 60, which is configured to decrease viscosity of the material to facilitate flow of the material through the dispensing system 10, and deposition of the material at the deposition site by way of the nozzle 30. In the example of
With particular reference to
The material conditioning assembly 60 further includes a first conditioning chamber 70 and a second conditioning chamber 72. The first conditioning chamber 70 is connected to the primary chamber 62 by way of a first connector 74, through which the material may flow between the primary chamber 62 and the first conditioning chamber 70. The second conditioning chamber 72 is connected to the primary chamber 62 by way of a second connector 76, through which the material may flow between the primary chamber 62 and the conditioning chamber 72. Although the illustrated configuration includes both the first and second conditioning chambers 70, 72, the material conditioning assembly 60 may be configured to only include one of the first or second conditioning chambers 70, 72, or more than two conditioning chambers 70, 72.
The first conditioning chamber 70 includes a first drive member 78 and the second conditioning chamber 72 includes a second drive member 80. The first and second drive members 78, 80 may be configured in any suitable manner such that actuation thereof creates shearing of the material in the first and second conditioning chambers 70, 72. For example, and as illustrated in the exemplary configurations, the first and second drive members 78, 80 may be configured as pistons. The first and second drive members 78, 80 are movable by any suitable actuator 90, such as any suitable servo motor. A speed sensor 92 is included to measure actuation speed of the first and second drive members 78, 80.
With additional reference to
The chambers 62, 70, and 72 may be configured in any suitable manner to apply additional shear stress to the material circulating through the chambers 62, 70, and 72. For example, and as illustrated in
The chambers 62, 70, and 72 may be configured in any other suitable additional manner to apply shear stress to the material. For example, and as illustrated in
The dispensing system 10 further includes a control module 150. The control module 150 is configured to control the first pump 14 and the second pump 16 for pumping the material out of the storage container 12. The control module 150 is configured to receive signals from the pressure transducer 22 identifying the pressure of the material within the fluid lines 20. The control module 150 controls dispensing of the material out through the nozzle 30 by controlling the doser 40. Specifically, the control module 150 is configured to control the servo 52 of the doser 40, which actuates the displacement rod 46 to dispense the material. The control module 150 receives signals from the flow transducer 34 identifying the flow rate of the material being dispensed through the nozzle 30.
The control module 150 further controls the actuator 90 of the material conditioning assembly 60. The control module 150 is in receipt of signals from the speed sensor 92 identifying the speed at which the first and second drive members 78, 80 are being actuated by the actuator 90. The control module 150 is configured to determine viscosity (or any suitable value that scales with viscosity) of the material within the material conditioning assembly 60 based on the speeds of the drive members 78, 80 and/or the power required by the actuator 90 to move the drive members 78, 80 at the speed indicated by the speed sensor 92. More specifically, the control module 150 can correlate the viscosities of one or more materials with various speeds of the drive members 78, 80 and/or power levels of the actuator 90. The control module 150 is configured to use the speed from the speed sensor 92 and/or the corresponding power consumed by the actuator 90 to estimate the viscosity of the material within the material conditioning assembly 60.
If the determined viscosity is higher than a predetermined target viscosity for the material being dispensed, which is stored in the control module 150, the control module 150 is configured to increase power to the actuator 90 to accelerate the first and second drive members 78, 80 to apply additional shear stress to the material, which will lower the viscosity. Conversely, if the determined viscosity is lower than a predetermined target viscosity stored in the control module, the control module 150 is configured to decrease power to the actuator 90 to decelerate the first and second drive members 78, 80, which will apply less shear stress to the material, which should increase the viscosity.
The control module 150 is further configured to control the servo 52, which actuates the displacement rod 46 of the doser 40. Based on the speed of the displacement rod 46 and/or the power consumed by the servo 52 to move the displacement rod 46, the control module 150 is configured to determine the viscosity of material at the doser 40. Specifically, the control module 150 includes a database of viscosities for the material at different power levels of the servo 52 and actuation speeds of the displacement rod 46. The control module 150 is configured to compare the observed speed of the displacement rod 46 and the power consumed by the servo 52 with the database of speeds and power levels, and identify a best fit match between the database and the observed speed of the displacement rod 46 and power consumed by the servo 52. The control module 150 assigns an observed viscosity corresponding to the database viscosity of the best fit match. The control module 150 is configured to increase power to the servo 52 to actuate the displacement rod 46 with increased force when viscosity of the material within the doser 40 is higher than a predetermined target viscosity in order to dispense the material at a desired speed and quantity. Conversely, the control module is configured to decrease power to the servo 52 to actuate the displacement rod 46 with decreased force when the viscosity of the material at the doser 40 is determined by the control module to be lower than a predetermined target viscosity stored in the control module 150.
The dispensing system 10 is thus configured to dispense a non-Newtonian material, such as an adhesive, at an acceptable viscosity even after the dispensing system 10 has sat idle for a period of time over which viscosity of the material may become undesirably high. The dispensing system 10 is able to self-heal (or self-correct) the rate at which the material is dispensed depending on the viscosity thereof to ensure that the material is dispensed at an acceptable rate and quantity.
The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and/or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.
Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”
In the figures, the direction of an arrow, as indicated by the arrowhead, generally demonstrates the flow of information (such as data or instructions) that is of interest to the illustration. For example, when element A and element B exchange a variety of information but information transmitted from element A to element B is relevant to the illustration, the arrow may point from element A to element B. This unidirectional arrow does not imply that no other information is transmitted from element B to element A. Further, for information sent from element A to element B, element B may send requests for, or receipt acknowledgements of, the information to element A.
In this application, including the definitions below, the term “module” or the term “controller” may be replaced with the term “circuit.” The term “module” may refer to, be part of, or include: an Application Specific Integrated Circuit (ASIC); a digital, analog, or mixed analog/digital discrete circuit; a digital, analog, or mixed analog/digital integrated circuit; a combinational logic circuit; a field programmable gate array (FPGA); a processor circuit (shared, dedicated, or group) that executes code; a memory circuit (shared, dedicated, or group) that stores code executed by the processor circuit; other suitable hardware components that provide the described functionality; or a combination of some or all of the above, such as in a system-on-chip.
The module may include one or more interface circuits. In some examples, the interface circuits may include wired or wireless interfaces that are connected to a local area network (LAN), the Internet, a wide area network (WAN), or combinations thereof. The functionality of any given module of the present disclosure may be distributed among multiple modules that are connected via interface circuits. For example, multiple modules may allow load balancing. In a further example, a server (also known as remote, or cloud) module may accomplish some functionality on behalf of a client module.
The term code, as used above, may include software, firmware, and/or microcode, and may refer to programs, routines, functions, classes, data structures, and/or objects. The term shared processor circuit encompasses a single processor circuit that executes some or all code from multiple modules. The term group processor circuit encompasses a processor circuit that, in combination with additional processor circuits, executes some or all code from one or more modules. References to multiple processor circuits encompass multiple processor circuits on discrete dies, multiple processor circuits on a single die, multiple cores of a single processor circuit, multiple threads of a single processor circuit, or a combination of the above. The term shared memory circuit encompasses a single memory circuit that stores some or all code from multiple modules. The term group memory circuit encompasses a memory circuit that, in combination with additional memories, stores some or all code from one or more modules.
The term memory circuit is a subset of the term computer-readable medium. The term computer-readable medium, as used herein, does not encompass transitory electrical or electromagnetic signals propagating through a medium (such as on a carrier wave); the term computer-readable medium may therefore be considered tangible and non-transitory. Non-limiting examples of a non-transitory, tangible computer-readable medium are nonvolatile memory circuits (such as a flash memory circuit, an erasable programmable read-only memory circuit, or a mask read-only memory circuit), volatile memory circuits (such as a static random access memory circuit or a dynamic random access memory circuit), magnetic storage media (such as an analog or digital magnetic tape or a hard disk drive), and optical storage media (such as a CD, a DVD, or a Blu-ray Disc).
The apparatuses and methods described in this application may be partially or fully implemented by a special purpose computer created by configuring a general purpose computer to execute one or more particular functions embodied in computer programs. The functional blocks, flowchart components, and other elements described above serve as software specifications, which can be translated into the computer programs by the routine work of a skilled technician or programmer.
The computer programs include processor-executable instructions that are stored on at least one non-transitory, tangible computer-readable medium. The computer programs may also include or rely on stored data. The computer programs may encompass a basic input/output system (BIOS) that interacts with hardware of the special purpose computer, device drivers that interact with particular devices of the special purpose computer, one or more operating systems, user applications, background services, background applications, etc.
The computer programs may include: (i) descriptive text to be parsed, such as HTML (hypertext markup language), XML (extensible markup language), or JSON (JavaScript Object Notation) (ii) assembly code, (iii) object code generated from source code by a compiler, (iv) source code for execution by an interpreter, (v) source code for compilation and execution by a just-in-time compiler, etc. As examples only, source code may be written using syntax from languages including C, C++, C #, Objective-C, Swift, Haskell, Go, SQL, R, Lisp, Java®, Fortran, Perl, Pascal, Curl, OCaml, Javascript®, HTML5 (Hypertext Markup Language 5th revision), Ada, ASP (Active Server Pages), PHP (PHP: Hypertext Preprocessor), Scala, Eiffel, Smalltalk, Erlang, Ruby, Flash®, Visual Basic®, Lua, MATLAB, SIMULINK, and Python®.
