Claims
- 1. A direct thermal linerless label comprising:a substrate having front and back sides; a silicone release layer disposed on the front side of said substrate, said release layer including a crosslinked silicone-based polymer having microparticles of a polymeric wax at least partially embedded therein; and an adhesive layer disposed on the back side of said substrate, wherein said substrate is direct thermal paper comprising a base paper on its back side, a barrier layer on its front side, and a direct thermal layer interposed therebetween.
- 2. The label of claim 1, wherein said silicone release layer ranges from about 1 to about 2 microns in thickness.
- 3. The label of claim 1, wherein said crosslinked silicone-based polymer is an epoxy-based UV-curable silicone.
- 4. The label of claim 1, wherein the polymeric wax microparticles in said silicone release layer are comprised of polytetrafluoroethylene.
- 5. The label of claim 4, wherein said adhesive is a hot melt permanent adhesive.
- 6. The label of claim 4, wherein said adhesive is a repositionable acrylic based adhesive.
- 7. The label of claim 1, wherein the polymeric wax microparticles in said silicone release layer are comprised of a polyolefin.
- 8. The label of claim 7, wherein said adhesive is a repositionable acrylic based adhesive.
- 9. The label of claim 8, wherein the polymeric wax microparticles in said silicone release layer are comprised of polypropylene.
- 10. The label of claim 1, wherein the polymeric wax microparticles in said silicone release layer are comprised of a hydrocarbon-based wax.
- 11. The label of claim 10, wherein said adhesive is a repositionable acrylic based adhesive.
- 12. The label of claim 1, wherein said barrier layer is comprised of polyvinyl alcohol.
- 13. The label of claim 1, wherein said microparticles have a mean diameter ranging from about 2.0 to about 8.0 microns.
RELATED APPLICATIONS
This application is a continuation of prior U.S. patent application Ser. No. 08/858,375 filed May 19, 1997, now U.S. Pat. No. 6,015,615, which was a continuation of application Ser. No. 08/476,868 filed Jun. 7, 1995, now U.S. Pat. No. 5,968,996. Those applications are expressly incorporated by reference herein.
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Date |
Country |
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Jul 1980 |
DE |
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EP |
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Continuations (2)
|
Number |
Date |
Country |
Parent |
08/858375 |
May 1997 |
US |
Child |
09/368522 |
|
US |
Parent |
08/476868 |
Jun 1995 |
US |
Child |
08/858375 |
|
US |