Mechanically integrated and closely coupled print head and mist source

Information

  • Patent Grant
  • 9114409
  • Patent Number
    9,114,409
  • Date Filed
    Tuesday, September 25, 2012
    12 years ago
  • Date Issued
    Tuesday, August 25, 2015
    9 years ago
Abstract
A deposition apparatus comprising one or more atomizers structurally integrated with a deposition head. The entire head may be replaceable, and prefilled with material. The deposition head may comprise multiple nozzles. Also an apparatus for three dimensional materials deposition comprising a tiltable deposition head attached to a non-tiltable atomizer. Also methods and apparatuses for depositing different materials either simultaneously or sequentially.
Description
BACKGROUND OF THE INVENTION
Field of the Invention (Technical Field)

The present invention is an apparatus comprising an atomizer located within or adjacent to a deposition head used to directly deposit material onto planar or non-planar targets.


BRIEF SUMMARY OF THE INVENTION

The present invention is a deposition head for depositing a material, the deposition head comprising one or more carrier gas inlets, one or more atomizers, an aerosol manifold structurally integrated with the one or more atomizers, one or more aerosol delivery conduits in fluid connection with the aerosol manifold, a sheath gas inlet and one or more material deposition outlets. The deposition head preferably further comprises a virtual impactor and an exhaust gas outlet, the virtual impactor disposed between at least one of the one or more atomizers and the aerosol manifold. The deposition head preferably further comprises a reservoir of material, and optionally a drain for transporting unused material from the aerosol manifold back into the reservoir. The deposition head optionally further comprises an external reservoir of material useful for a purpose selected from the group consisting of enabling a longer period of operation without refilling, maintaining the material at a desired temperature, maintaining the material at a desired viscosity, maintaining the material at a desired composition, and preventing agglomeration of particulates. The deposition head preferably further comprises a sheath gas manifold concentrically surrounding at least a middle portion of the one or more aerosol delivery conduits. The deposition head optionally further comprises a sheath gas chamber surrounding a portion of each aerosol delivery conduit comprising a conduit outlet, the aerosol delivery conduit preferably being sufficiently long so the sheath gas flow is substantially parallel to the aerosol flow before the flows combine at or near an outlet of the sheath gas chamber after the aerosol flow exits the conduit outlet. The deposition head is optionally replaceable and comprises a material reservoir prefilled with material before installation. Such a deposition head is optionally disposable or refillable. Each of the one or more atomizers optionally atomizes different materials, which preferably do not mix and/or react until just before or during deposition. The ratio of the different materials to be deposited is preferably controllable. The atomizers are optionally operated simultaneously, or at least two of the atomizers are optionally operated at different times.


The present invention is also an apparatus for three-dimensional material deposition, the apparatus comprising a deposition head and an atomizer, wherein the deposition head and atomizer travel together in three linear dimensions, and wherein the deposition head is tiltable but the atomizer is not tiltable. The apparatus is preferably useful for depositing the material on the exterior, interior, and/or underside of a structure and is preferably configured so that the deposition head is extendible into a narrow passage.


The present invention is also a method for depositing materials comprising the steps of atomizing a first material to form a first aerosol, atomizing a second material to form a second aerosol, combining the first aerosol and second aerosol, surrounding the combined aerosols with an annular flow of a sheath gas, focusing the combined aerosols, and depositing the aerosols. The atomizing steps are optionally performed simultaneously or sequentially. The method optionally further comprises the step of varying the amount of material in at least one of the aerosols. The atomizing steps optionally comprise using atomizers of a different design. The method optionally further comprises the step of depositing a composite structure.


An advantage of the present invention is improved deposition due to reduced droplet evaporation and reduced overspray.


Another advantage to the present invention is a reduction in the delay between the initiation of gas flow and deposition of material onto a target.


Objects, other advantages and novel features, and further scope of applicability of the present invention will be set forth in part in the detailed description to follow, taken in conjunction with the accompanying drawing, and in part will become apparent to those skilled in the art upon examination of the following, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.





BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The accompanying drawings, which are incorporated into and form a part of the specification, illustrate one or more embodiments of the present invention and, together with the description, serve to explain the principles of the invention. The drawings are only for the purpose of illustrating one or more preferred embodiments of the invention and are not to be construed as limiting the invention. In the drawings:



FIG. 1 is a schematic of an apparatus of the present invention for gradient material fabrication;



FIG. 2 is a schematic of a monolithic multi-nozzle deposition head with an atomizer;



FIG. 3 is a schematic of an integrated atomizer with a single aerosol jet;



FIG. 4 is a cross-sectional schematic of a single apparatus integrating an atomizer, a deposition head, and a virtual impactor;



FIG. 5 is a schematic of an alternative embodiment of an integrated atomizing system with a deposition head and virtual impactor;



FIG. 6 is a schematic of another alternative embodiment of a multi-nozzle integrated atomizing system with a deposition head and a flow reduction device; and



FIG. 7 is a schematic of multiple atomizers (one a pneumatic atomizer contained within one chamber and the other an ultrasonic atomizer contained within another chamber) integrated with the deposition head.





DETAILED DESCRIPTION OF THE INVENTION

The present invention generally relates to apparatuses and methods for high-resolution, maskless deposition of liquids, solutions, and liquid-particle suspensions using aerodynamic focusing. In one embodiment, an aerosol stream is focused and deposited onto a planar or non-planar target, forming a pattern that is thermally or photochemically processed to achieve physical, optical, and/or electrical properties near that of the corresponding bulk material. The process is called M3D® (Maskless Mesoscale Material Deposition) technology, and is used to deposit, preferably directly and without the use of masks, aerosolized materials with linewidths that are orders of magnitude smaller than lines deposited with conventional thick film processes, even smaller than one micron.


The M3D® apparatus preferably comprises an aerosol jet deposition head to form an annularly propagating jet composed of an outer sheath flow and an inner aerosol-laden carrier flow. In the annular aerosol jetting process, the aerosol stream typically enters the deposition head, preferably either directly after the aerosolization process or after passing through a heater assembly, and is directed along the axis of the device towards the deposition head orifice. The mass throughput is preferably controlled by an aerosol carrier gas mass flow controller. Inside the deposition head, the aerosol stream is preferably initially collimated by passing through an orifice, typically millimeter-sized. The emergent particle stream is then preferably combined with an annular sheath gas, which functions to eliminate clogging of the nozzle and to focus the aerosol stream. The carrier gas and the sheath gas most commonly comprise compressed air or an inert gas, where one or both may contain a modified solvent vapor content. For example, when the aerosol is formed from an aqueous solution, water vapor may be added to the carrier gas or the sheath gas to prevent droplet evaporation.


The sheath gas preferably enters through a sheath air inlet below the aerosol inlet and forms an annular flow with the aerosol stream. As with the aerosol carrier gas, the sheath gas flowrate is preferably controlled by a mass flow controller. The combined streams exit the nozzle at a high velocity (˜50 m/s) through an orifice directed at a target, and subsequently impinge upon it. This annular flow focuses the aerosol stream onto the target and allows for deposition of features with dimensions smaller than approximately 1 micron. Patterns are formed by moving the deposition head relative to the target.


Atomizer Located Adjacent to the Deposition Head


The atomizer is typically connected to the deposition head through the mist delivery means, but is not mechanically coupled to the deposition head. In one embodiment of the present invention, the atomizer and deposition head are fully integrated, sharing common structural elements.


As used throughout the specification and claims, the term “atomizer” means atomizer, nebulizer, transducer, plunger, or any other device, activated in any way including but not limited to pneumatically, ultrasonically, mechanically, or via a spray process, which is used to form smaller droplets or particles from a liquid or other material, or condense particles from a vapor, typically for suspension into an aerosol.


If the atomizer is adjacent to or integrated with the deposition head, the length of tubing required to transport the mist between the atomizer and the head is reduced or eliminated. Correspondingly, the transit time of mist in the tube is substantially reduced, minimizing solvent loss from the droplets during transport. This in turn reduces overspray and allows the use of more volatile liquids than could ordinarily be used. Further, particle losses inside the delivery tube are minimized or eliminated, improving the overall efficiency of the deposition system and reducing the incidence of clogging. The response time of the system is also significantly improved.


Further advantages relate to the use of the closely coupled head in constructing systems for manufacturing. For small substrates, automation is simplified by fixing the atomizer and deposition head and moving the substrate. In this case there are many placement options for the atomizer relative to the deposition head. However, for large substrates, such as those encountered in the manufacturing of flat panel displays, the situation is reversed and it is simpler to move the deposition head. In this case the placement options for the atomizer are more limited. Long lengths of tubing are typically required to deliver mist from a stationary atomizer to a head mounted on a moving gantry. Mist losses due to coalescence can be severe and solvent loss due to the long residence time can dry the mist to the point where it is no longer usable.


Another advantage arises in the construction of a cartridge-style atomizer and deposition head. In this configuration, the atomizer and deposition head are coupled in such a way that they may be installed onto and removed from the print system as a single unit. In this configuration the atomizer and head may be easily and rapidly replaced. Replacement may take place during normal maintenance or as a result of a catastrophic failure event such as a clogged nozzle. In this embodiment, the atomizer reservoir is preferably preloaded with feedstock such that the replacement unit is ready for use immediately upon installation. In a related embodiment, a cartridge-style unit allows rapid retooling of a print system. For example, a print head containing material A may quickly be exchanged for a print head containing material B. In these embodiments, the atomizer/head unit or cartridge are preferably engineered to be low cost, enabling them to be sold as consumables, which can be either disposable or refillable.


In one embodiment, the atomizer and deposition head are fully integrated into a single unit that shares structural elements, as shown in FIG. 4. This configuration is preferably the most compact and most closely represents the cartridge style-unit.


A virtual impactor is often used to remove the excess gas necessary for a pneumatic atomizer to operate, and thus is also integrated with the deposition head in the embodiments in which the atomizer is integrated. A heater, whose purpose is to heat the mist and drive off solvent, may also be incorporated into the apparatus. Elements necessary for maintenance of the feedstock in the atomizer, but not necessarily required for atomization, such as feedstock level control or low ink level warning, stirring and temperature controls, may optionally also be incorporated into the atomizer.


Other examples of elements that may be integrated with the apparatus generally relate to sensing and diagnostics. The motivation behind incorporating sensing elements directly into the apparatus is to improve response and accuracy. For example, pressure sensing may be incorporated into the deposition head. Pressure sensing provides important feedback about overall deposition head status; pressure that is higher than normal indicates that a nozzle has become clogged, while pressure that is lower than normal indicates that there is a leak in the system. By placing one or more pressure sensors directly in the deposition head, feedback is more rapid and more accurate. Mist sensing to determine the deposition rate of material might also be incorporated into the apparatus.


A typical aerosol jet system utilizes electronic mass flow controllers to meter gas at specific rates. Sheath gas and atomizer gas flow rates are typically different and may vary depending on the material feedstock and application. For a deposition head built for a specific purpose where adjustability is not needed, electronic mass flow controllers might be replaced by static restrictions. A static restriction of a certain size will only allow a certain amount of gas to pass through it for a given upstream pressure. By accurately controlling the upstream pressure to a predetermined level, static restrictions can be sized appropriately to replace the electronic mass flow controllers used for the sheath and atomizer gas. The mass flow controller for the virtual impactor exhaust can most easily be removed, provided that a vacuum pump is used, preferably capable of generating approximately 16 in Hg of vacuum. In this case, the restriction functions as a critical orifice. Integrating the static restrictions and other control elements in the deposition head reduces the number of gas lines that must run to the head. This is particularly useful for situations in which the head is moved rather than the substrate.


In any of the embodiments presented herein, whether or not the atomizer is integrated with the deposition head, the deposition head may comprise a single-nozzle or a multiple nozzle design, with any number of nozzles. A multi-jet array is comprised of one or more nozzles configured in any geometry.



FIG. 1 shows an embodiment of an ultrasonic atomizer integrated with an aerosol jet in a deposition head. Ink 12 is located in a reservoir adjacent to extended nozzle 25. Ultrasonic transducer 10 atomizes ink 12. Atomized ink 18 is then carried out of the reservoir by mist air or carrier gas entering through mist air inlet 14 and is directed around a shield 24 to an adjacent mist manifold, where it enters the mist delivery tube 30. Sheath gas enters sheath gas manifold 28 through sheath gas inlet 22. As the atomized ink travels through mist delivery tube 30, it is focused by the sheath air as it enters extended nozzle 25.



FIG. 2 is an embodiment of an integrated pneumatic atomizing system with a single nozzle deposition head and virtual impactor. Atomization gas 36 enters ink reservoir 34 where it atomizes the ink and carries atomized ink 118 into virtual impactor 38. Atomization gas 36 is at least partially stripped and exits through the virtual impactor gas exhaust 32. Atomized ink 118 continues down through optional heater 42 and into deposition head 44. Sheath gas 122 enters the deposition head and focuses the atomized ink 118.



FIG. 3 is a cross-sectional schematic of an alternative embodiment of an integrated pneumatic atomizer, virtual impactor, and single nozzle deposition head. Plunger 19 that allows for adjustable flow rates is used to atomize ink entering from ink suspension inlet 17. Atomized ink 218 then travels to the adjacent virtual impactor 138. Exhaust gas exits the virtual impactor through exhaust gas outlet 132. Atomized ink 218 then travels to adjacent deposition head 144 where sheath gas 122 focuses the ink.



FIG. 4 shows an embodiment of a monolithic multi-nozzle aerosol jet deposition head with an integrated ultrasonic atomizer. Ink 312 is located in a reservoir preferably adjacent to nozzle array 326. Ultrasonic transducer 310 atomizes the ink. Atomized ink 318 is then carried out of the reservoir by mist air entering through the mist air inlet 314 and is directed around shield 324 to adjacent aerosol manifold 320, where it enters individual aerosol delivery tubes 330. Atomized ink 318 that does not enter into any of mist delivery tubes 330 is preferably recycled through drain tube 316 that empties back into the adjacent ink reservoir. Sheath gas enters sheath gas manifold 328 through sheath gas inlet 322. As atomized ink 318 travels through mist delivery tubes 330, it is focused by the sheath gas as it enters the nozzle array 326.



FIG. 5 is an embodiment of a multi-nozzle integrated pneumatic atomizing system with a deposition head that uses a manifold and a flow reduction device. Mist air enters the integrated system through mist air inlet 414 into pneumatic atomizer 452. The atomized material, which is entrained in the mist air to form an aerosol, then travels to adjacent virtual impactor 438. Exhaust gas exits the virtual impactor through exhaust gas outlet 432. The aerosol then travels to manifold inlet 447 and enters one or more sheath gas chambers 448 through one or more mist delivery tubes 430. Sheath gas enters the deposition head through gas inlet port 422, which is optionally oriented perpendicularly to mist delivery tubes 430, and combines with the aerosol flow at the bottom of mist delivery tubes 430. Mist delivery tubes 430 extend partially or fully to the bottom of sheath gas chambers 448, preferably forming a straight geometry. The length of sheath gas chambers 448 is preferably sufficiently long to ensure that the flow of the sheath gas is substantially parallel to the aerosol flow before the two combine, thereby generating a preferably cylindrically symmetric sheath gas pressure distribution. The sheath gas is then combined with the aerosol at or near the bottom of sheath gas chambers 448. Advantages to maintaining this straight region for combining the aerosol carrier gas with the sheath gas is that the sheath flow is fully developed and more evenly distributed around mist tubes 430 prior to combining with the mist, thus minimizing turbulence during the combining process, minimizing the sheath/mist mixing, reducing overspray, and resulting in tighter focusing. Further, “cross talk” between the nozzles in the array is minimized due to the individual sheath gas chambers 448.


The manifold may optionally be remotely located, or located on or within the deposition head. In either configuration, the manifold can be fed by one or more atomizers. In the pictured configuration, a single flow reduction device (virtual impactor) is used for a multi-jet array deposition head. In the event that a single stage of flow reduction is insufficient to remove enough excess carrier gas, multiple stages of reduction may be employed.


Multiple Atomizers


The apparatus may comprise one or more atomizers. Multiple atomizers of substantially the same design may be used to generate a greater quantity of mist for delivery from the deposition head, thereby increasing throughput for high-speed manufacturing. In this case, material of substantially the same composition preferably serves as feedstock for the multiple atomizers. Multiple atomizers may share a common feedstock chamber or optionally may utilize separate chambers. Separate chambers may be used to contain materials of differing composition, preventing the materials from mixing. In the case of multiple materials, the atomizers may run simultaneously, delivering the materials at a desired ratio. Any material may be used, such as an electronic material, an adhesive, a material precursor, or a biological material or biomaterial. The materials may differ in material composition, viscosity, solvent composition, suspending fluid, and many other physical, chemical, and material properties. The samples may also be miscible or non-miscible and may be reactive. In one example, materials such as a monomer and a catalyst may be kept separate until use to avoid reaction in the atomizer chamber. The materials are then preferably mixed at a specific ratio during deposition. In another example, materials with differing atomization characteristics may be atomized separately to optimize the atomization rate of the individual materials. For example, a suspension of glass particles may be atomized by one atomizer while a suspension of silver particles is atomized by a second atomizer. The ratio of glass to silver can be controlled in the final deposited trace.


The atomizers may alternatively run sequentially to deliver the materials individually, either in the same location or in differing locations. Deposition in the same location enables composite structures to be formed, whereas deposition in different areas enables multiple structures to be formed on the same layer of a substrate.


Optionally the atomizers may comprise different designs. For example, a pneumatic atomizer might be contained within one chamber and an ultrasonic atomizer might be contained in another chamber, as shown in FIG. 7. This allows the choice of atomizer to be optimized to match the atomization characteristics of the materials.



FIG. 6 depicts the M3D® process used to simultaneously deposit multiple materials through a single deposition head. Each atomizer unit 4a-c creates droplets of its respective sample, and the droplets are preferably directed to combining chamber 6 by a carrier gas. The droplet streams merge in combining chamber 6 and are then directed to deposition head 2. The multiple types of sample droplets are then simultaneously deposited. The relative rates of deposition are preferably controlled by the carrier gas rate entering each atomizer 4a-c. The carrier gas rates can be continuously or intermittently varied.


Such gradient material fabrication allows continuum mixing ratios to be controlled by the carrier gas flow rates. This method also allows multiple atomizers and samples to be used at the same time. In addition, mixing occurs on the target and not in the sample vial or aerosol lines. This process can deposit various types of samples, including but not limited to: UV, thermosetting, or thermoplastic polymers; adhesives; solvents; etching compounds; metal inks; resistor, dielectric, and metal thick film pastes; proteins, enzymes, and other biomaterials; and oligonucleotides. Applications of gradient material fabrication include, but are not limited to: gradient optics, such as 3D grading of a refractive index; gradient fiber optics; alloy deposition; ceramic to metal junctions; blending resistor inks on-the-fly; combinatorial drug discovery; fabrication of continuum grey scale photographs; fabrication of continuum color photographs; gradient junctions for impedance matching in RF (radio frequency) circuits; chemical reactions on a target, such as selective etching of electronic features; DNA fabrication on a chip; and extending the shelf life of adhesive materials.



FIG. 7 shows the integration of multiple atomizers with the deposition head. On one side of the deposition head 544 is ultrasonic atomizer section 550 with mist air inlet 514. On the other side of deposition head 544 is pneumatic atomizer 552 with mist air inlet 516 and virtual impactor 538, with exhaust gas outlet 532. Sheath gas inlet 522 does not show the sheath gas path in the figure. While this embodiment is optimized to match the atomization characteristics of the materials, other combinations of multiple atomizers are possible, such as two or more ultrasonic atomizers; two or more pneumatic atomizers; or any combination thereof.


Non-integrated Atomizers or Components


There are situations in which it is not preferable to integrate the atomizer, or certain components, as a single unit with the deposition head. For example, the deposition head typically has the ability to print when oriented at an arbitrary angle to vertical. However, an atomizer may include a reservoir of fluid that must be maintained in a level position in order to function properly. Thus, in the case where the head is to be articulated, such an atomizer and head must not be connected rigidly, thereby enabling the atomizer to remain level during such articulation. One example of such a configuration is the case of such an atomizer and deposition head mounted onto the end of a robotic arm. In this example, the atomizer and deposition head assembly move together in x, y and z. However, the apparatus is configured such that only the deposition head is free to tilt to an arbitrary angle. Such a configuration is useful for printing in three dimensional space, such as onto the exterior, interior, or underside of structures, including but not limited to large structures such as airframes.


In another example of a closely coupled but not fully integrated atomizer and print head, the combined unit is arranged such that the deposition head can extend into a narrow passage.


While in certain configurations the mist-generating portion of the atomizer is located adjacent to the deposition head, non mist-generating portions of the atomizer may optionally be located remotely. For example, the driver circuit for an ultrasonic atomizer might be located remotely and not integrated into the apparatus. A reservoir for the material feedstock might also be remotely located. A remotely located reservoir might be used to refill the local reservoir associated with the deposition head to enable a longer period of operation without user maintenance. A remotely located reservoir can also be used to maintain the feedstock at a particular condition, for example to refrigerate a temperature-sensitive fluid until use. Other forms of maintenance may be performed remotely, such as viscosity adjustment, composition adjustment or sonication to prevent agglomeration of particulates. The feedstock may flow in only one direction, e.g. to resupply the local ink reservoir from the remotely located reservoir, or may alternatively be returned from the local ink reservoir to the remote reservoir for maintenance or storage purposes.


Materials


The present invention is able to deposit liquids, solutions, and liquid-particle suspensions. Combinations of these, such as a liquid-particle suspension that also contains one or more solutes, may also be deposited. Liquid materials are preferred, but dry material may also be deposited in the case where a liquid carrier is used to facilitate atomization but is subsequently removed through a drying step.


Reference to both ultrasonic and pneumatic atomization methods has been made herein While either of these two methods may be applicable for atomizing fluids having only a specific range of properties, the materials that may be utilized by the present invention are not restricted by these two atomization methods. In the case where one of the aforementioned atomization methods is inappropriate for a particular material, a different atomization method may be selected and incorporated into the invention. Also, practice of the present invention does not depend on a specific liquid vehicle or formulation; a wide variety of material sources may be employed.


Although the invention has been described in detail with particular reference to these preferred embodiments, other embodiments can achieve the same results. Variations and modifications of the present invention will be obvious to those skilled in the art and it is intended to cover in the appended claims all such modifications and equivalents. The entire disclosures of all references, applications, patents, and publications cited above are hereby incorporated by reference.

Claims
  • 1. A method for depositing multiple materials on a target, the method comprising the steps of: atomizing a first material to form a first aerosol comprising first droplets, the first droplets comprising the first material;atomizing a second material different from the first material to form a second aerosol comprising second droplets, the second droplets comprising the second material;merging a first droplet stream comprising the first aerosol and a second droplet stream comprising the second aerosol to form a merged droplet stream, the merged droplet stream comprising the first droplets and the second droplets such that the first droplets and the second droplets are transported together without reacting the first material with the second material;surrounding the merged droplet stream with an annular flow of a sheath gas in a generally conical region, thereby forming a combined stream;focusing the combined stream;transporting the combined stream through a nozzle; anddepositing the first and second droplets on a target;wherein the first and second materials do not react until they are deposited on the target; andwherein the conical region is oriented to converge the combined stream toward a central axis of the apparatus prior to the depositing step.
  • 2. The method of claim 1, wherein the atomizing steps are performed simultaneously, thereby delivering the materials to the target at a desired ratio.
  • 3. The method of claim 1, further comprising combining the first aerosol and second aerosol in a combining chamber prior to the surrounding step, wherein the first aerosol and the second aerosol enter the combining chamber from different directions.
  • 4. The method of claim 1, further comprising separately atomizing each material.
  • 5. The method of claim 4, further comprising optimizing the atomization rate of each material.
  • 6. The method of claim 1, further comprising the step of varying the amount of material in at least one of the aerosols.
  • 7. The method of claim 1, wherein the atomizing steps comprise using atomizers of a different design for each material or using atomizers of a same design for each material.
  • 8. The method of claim 7, further comprising controlling the relative rates of deposition of the materials by varying a carrier gas flow rate entering each atomizer.
  • 9. The method of claim 8, further comprising continuously or intermittently varying the carrier gas flow rates.
  • 10. The method of claim 8, further comprising controlling continuum mixing ratios by varying the carrier gas flow rates.
  • 11. The method of claim 1, wherein at least one of the materials is selected from the group consisting of UV, thermosetting, or thermoplastic polymers, adhesives, solvents, etching compounds, metal inks, resistor, dielectric, and metal thick film pastes, proteins, enzymes, and other biomaterials, and oligonucleotides.
  • 12. The method of claim 1, wherein the depositing step comprises forming a gradient material structure.
  • 13. The method of claim 12, wherein the gradient structure is used for an application selected from the group consisting of gradient optics, 3D grading of a refractive index, gradient fiber optics, alloy deposition, ceramic to metal junctions, blending resistor inks on-the-fly, combinatorial drug discovery, fabrication of continuum grey scale photographs, fabrication of continuum color photographs, gradient junctions for impedance matching in RF (radio frequency) circuits, chemical reactions on a target, selective etching of electronic features, DNA fabrication on a chip, and extending the shelf life of adhesive materials.
  • 14. An apparatus for depositing multiple materials, the apparatus comprising: a first chamber for containing a first material;a second chamber for containing a second material;a first atomizer for atomizing the first material to form a first aerosol;a second atomizer for atomizing the second material to form a second aerosol;a combining chamber for combining a first droplet stream comprising the first aerosol and a second droplet stream comprising the second aerosol to form a merged droplet stream without reacting the first material with the second material;a generally conical region for surrounding and focusing the merged droplet stream with a sheath gas, thereby forming a combined stream;a nozzle for transporting said combined stream; anda material deposition outlet;said conical region oriented to converge said combined stream toward a central axis of the apparatus prior to said material deposition outlet.
  • 15. The apparatus of claim 14, wherein the first and second atomizers comprise different designs.
  • 16. The apparatus of claim 14, wherein at least one of the atomizers is selected from the group consisting of ultrasonic atomizer and pneumatic atomizer.
  • 17. The apparatus of claim 14, wherein each atomizer is selected to optimally match the atomization characteristics of the corresponding material.
  • 18. The apparatus of claim 14, wherein said combining chamber is connected to said first atomizer via a first passage and said combining chamber is connected to said second atomizer via a second passage, said passages configured such that the first aerosol and the second aerosol enter said combining chamber from different directions.
  • 19. The apparatus of claim 15, wherein at least one of the aerosols enters and exits said combining chamber from the same direction.
  • 20. A method for depositing multiple materials on a target, the method comprising the steps of: atomizing a first material to form a first aerosol;surrounding and focusing the first aerosol with an annular flow of a sheath gas in a generally conical region to form a first combined stream;transporting the first combined stream through a nozzle;depositing the first aerosol on a target;atomizing a second material to form a second aerosol;surrounding and focusing the second aerosol with the annular flow of a sheath gas in a generally conical region to form a second combined stream;transporting the second combined stream through a nozzle; anddepositing the second aerosol on the target;wherein the first and second materials do not mix or react until they are deposited on the target; andwherein the conical region is oriented to converge each combined stream toward a central axis of the apparatus prior to the corresponding depositing step.
  • 21. The method of claim 20, wherein the atomizing steps are performed sequentially.
  • 22. The method of claim 20, wherein the first and second materials are deposited at the same location on the target, thereby forming a composite structure.
  • 23. The method of claim 20, wherein the first and second materials are deposited at different locations on the target, thereby forming multiple structures on a same layer of the target.
CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is a divisional application of U.S. patent application Ser. No. 12/203,037, entitled “Mechanically Integrated and Closely Coupled Print Head and Mist Source”, filed on Sep. 2, 2008 and issuing as U.S. Pat. No. 8,272,579 on Sep. 25, 2012, which application claims the benefit of the filing of U.S. Provisional Patent Application Ser. No. 60/969,068, entitled “Mechanically Integrated and Closely Coupled Print Head and Mist Source”, filed on Aug. 30, 2007, the specification of which is incorporated herein by reference.

US Referenced Citations (305)
Number Name Date Kind
3474971 Goodrich Oct 1969 A
3590477 Cheroff et al. Jul 1971 A
3642202 Angelo Feb 1972 A
3715785 Brown et al. Feb 1973 A
3777983 Hibbins Dec 1973 A
3808432 Ashkin Apr 1974 A
3808550 Ashkin Apr 1974 A
3816025 O'Neill Jun 1974 A
3846661 Brown et al. Nov 1974 A
3854321 Dahneke Dec 1974 A
3901798 Peterson Aug 1975 A
3959798 Hochberg et al. May 1976 A
3974769 Hochberg et al. Aug 1976 A
3982251 Hochberg Sep 1976 A
4004733 Law Jan 1977 A
4016417 Benton Apr 1977 A
4019188 Hochberg Apr 1977 A
4034025 Martner Jul 1977 A
4036434 Anderson et al. Jul 1977 A
4046073 Mitchell et al. Sep 1977 A
4046074 Hochberg et al. Sep 1977 A
4073436 Behr Feb 1978 A
4092535 Ashkin et al. May 1978 A
4112437 Mir et al. Sep 1978 A
4132894 Yule Jan 1979 A
4171096 Welsh et al. Oct 1979 A
4200660 Schaefer et al. Apr 1980 A
4200669 Schaefer et al. Apr 1980 A
4228440 Horike et al. Oct 1980 A
4235563 Hine et al. Nov 1980 A
4269868 Livsey May 1981 A
4323756 Brown et al. Apr 1982 A
4400408 Asano et al. Aug 1983 A
4453803 Hidaka et al. Jun 1984 A
4485387 Drumheller Nov 1984 A
4497692 Gelchinski et al. Feb 1985 A
4601921 Lee Jul 1986 A
4605574 Yonehara et al. Aug 1986 A
4670135 Marple et al. Jun 1987 A
4685563 Cohen et al. Aug 1987 A
4689052 Ogren et al. Aug 1987 A
4694136 Kasner et al. Sep 1987 A
4724299 Hammeke Feb 1988 A
4733018 Prabhu et al. Mar 1988 A
4823009 Biemann et al. Apr 1989 A
4825299 Okada et al. Apr 1989 A
4826583 Biernaux et al. May 1989 A
4893886 Ashkin et al. Jan 1990 A
4904621 Loewenstein et al. Feb 1990 A
4911365 Thiel et al. Mar 1990 A
4917830 Ortiz et al. Apr 1990 A
4920254 DeCamp et al. Apr 1990 A
4927992 Whitlow et al. May 1990 A
4947463 Matsuda et al. Aug 1990 A
4971251 Dobrick et al. Nov 1990 A
4978067 Berger et al. Dec 1990 A
4997809 Gupta Mar 1991 A
5032850 Andeen et al. Jul 1991 A
5038014 Pratt et al. Aug 1991 A
5043548 Whitney et al. Aug 1991 A
5064685 Kestenbaum et al. Nov 1991 A
5126102 Takahashi et al. Jun 1992 A
5164535 Leasure Nov 1992 A
5170890 Wilson et al. Dec 1992 A
5173220 Reiff et al. Dec 1992 A
5176328 Alexander Jan 1993 A
5176744 Muller Jan 1993 A
5182430 Lagain Jan 1993 A
5194297 Scheer et al. Mar 1993 A
5208431 Uchiyama et al. May 1993 A
5245404 Jannson et al. Sep 1993 A
5250383 Naruse Oct 1993 A
5254832 Gartner et al. Oct 1993 A
5270542 McMurry et al. Dec 1993 A
5292418 Morita et al. Mar 1994 A
5294459 Hogan et al. Mar 1994 A
5306447 Harris et al. Apr 1994 A
5322221 Anderson Jun 1994 A
5335000 Stevens Aug 1994 A
5343434 Noguchi Aug 1994 A
5344676 Kim et al. Sep 1994 A
5359172 Kozak et al. Oct 1994 A
5366559 Periasamy Nov 1994 A
5378505 Kubota et al. Jan 1995 A
5378508 Castro et al. Jan 1995 A
5393613 MacKay Feb 1995 A
5398193 deAngelis Mar 1995 A
5403617 Haaland Apr 1995 A
5405660 Psiuk et al. Apr 1995 A
5418350 Freneaux et al. May 1995 A
5449536 Funkhouser Sep 1995 A
5477026 Buongiorno Dec 1995 A
5486676 Aleshin Jan 1996 A
5491317 Pirl Feb 1996 A
5495105 Nishimura et al. Feb 1996 A
5512745 Finer et al. Apr 1996 A
5518680 Cima et al. May 1996 A
5524828 Raterman et al. Jun 1996 A
5529634 Miyata et al. Jun 1996 A
5547094 Bartels et al. Aug 1996 A
5578227 Rabinovich Nov 1996 A
5607730 Ranalli Mar 1997 A
5609921 Gitzhofer et al. Mar 1997 A
5612099 Thaler Mar 1997 A
5614252 McMillan et al. Mar 1997 A
5648127 Turchan et al. Jul 1997 A
5653925 Batchelder Aug 1997 A
5676719 Stavropoulos et al. Oct 1997 A
5697046 Conley Dec 1997 A
5705117 O'Connor et al. Jan 1998 A
5707715 deRochemont et al. Jan 1998 A
5732885 Huffman Mar 1998 A
5733609 Wang Mar 1998 A
5736195 Haaland Apr 1998 A
5742050 Amirav et al. Apr 1998 A
5746844 Sterett et al. May 1998 A
5770272 Biemann et al. Jun 1998 A
5772106 Ayers et al. Jun 1998 A
5772963 Prevost et al. Jun 1998 A
5772964 Prevost et al. Jun 1998 A
5775402 Sachs et al. Jul 1998 A
5779833 Cawley et al. Jul 1998 A
5795388 Oudard Aug 1998 A
5814152 Thaler Sep 1998 A
5837960 Lewis et al. Nov 1998 A
5844192 Wright et al. Dec 1998 A
5847357 Woodmansee et al. Dec 1998 A
5849238 Schmidt et al. Dec 1998 A
5854311 Richart Dec 1998 A
5861136 Glicksman et al. Jan 1999 A
5882722 Kydd Mar 1999 A
5894403 Shah et al. Apr 1999 A
5940099 Karlinski Aug 1999 A
5958268 Engelsberg et al. Sep 1999 A
5965212 Dobson et al. Oct 1999 A
5980998 Sharma et al. Nov 1999 A
5993549 Kindler et al. Nov 1999 A
5993554 Keicher et al. Nov 1999 A
5997956 Hunt et al. Dec 1999 A
6007631 Prentice et al. Dec 1999 A
6015083 Hayes et al. Jan 2000 A
6021776 Allred et al. Feb 2000 A
6025037 Wadman et al. Feb 2000 A
6036889 Kydd Mar 2000 A
6040016 Mitani et al. Mar 2000 A
6046426 Jeantette et al. Apr 2000 A
6056994 Paz de Araujo et al. May 2000 A
6110144 Choh et al. Aug 2000 A
6116718 Peeters et al. Sep 2000 A
6136442 Wong Oct 2000 A
6143116 Hayashi et al. Nov 2000 A
6144008 Rabinovich Nov 2000 A
6149076 Riney Nov 2000 A
6151435 Pilloff Nov 2000 A
6159749 Liu Dec 2000 A
6176647 Itoh Jan 2001 B1
6182688 Fabre Feb 2001 B1
6183690 Yoo et al. Feb 2001 B1
6197366 Takamatsu Mar 2001 B1
6251488 Miller et al. Jun 2001 B1
6258733 Solayappan et al. Jul 2001 B1
6265050 Wong et al. Jul 2001 B1
6267301 Haruch Jul 2001 B1
6268584 Keicher et al. Jul 2001 B1
6290342 Vo et al. Sep 2001 B1
6291088 Wong Sep 2001 B1
6293659 Floyd et al. Sep 2001 B1
6318642 Goenka et al. Nov 2001 B1
6328026 Wang et al. Dec 2001 B1
6340216 Peeters et al. Jan 2002 B1
6348687 Brockmann et al. Feb 2002 B1
6349668 Sun et al. Feb 2002 B1
6355533 Lee Mar 2002 B2
6379745 Kydd et al. Apr 2002 B1
6384365 Seth et al. May 2002 B1
6390115 Rohwer et al. May 2002 B1
6391251 Keicher et al. May 2002 B1
6391494 Reitz et al. May 2002 B2
6405095 Jang et al. Jun 2002 B1
6406137 Okazaki et al. Jun 2002 B1
6410105 Mazumder et al. Jun 2002 B1
6416156 Noolandi et al. Jul 2002 B1
6416157 Peeters et al. Jul 2002 B1
6416158 Floyd et al. Jul 2002 B1
6416159 Floyd et al. Jul 2002 B1
6416389 Perry et al. Jul 2002 B1
6454384 Peeters et al. Sep 2002 B1
6467862 Peeters et al. Oct 2002 B1
6471327 Jagannathan et al. Oct 2002 B2
6481074 Karlinski Nov 2002 B1
6486432 Colby et al. Nov 2002 B1
6503831 Speakman Jan 2003 B2
6513736 Skeath et al. Feb 2003 B1
6520996 Manasas et al. Feb 2003 B1
6521297 McDougall et al. Feb 2003 B2
6537501 Holl et al. Mar 2003 B1
6544599 Brown et al. Apr 2003 B1
6548122 Sharma et al. Apr 2003 B1
6564038 Bethea et al. May 2003 B1
6572033 Pullagura et al. Jun 2003 B1
6573491 Marchitto et al. Jun 2003 B1
6607597 James et al. Aug 2003 B2
6608281 Ishide et al. Aug 2003 B2
6636676 Renn Oct 2003 B1
6646253 Rohwer et al. Nov 2003 B1
6656409 Keicher et al. Dec 2003 B1
6772649 Zimmermann et al. Aug 2004 B2
6774338 Baker et al. Aug 2004 B2
6780377 Hall et al. Aug 2004 B2
6811744 Keicher et al. Nov 2004 B2
6811805 Gilliard et al. Nov 2004 B2
6823124 Renn et al. Nov 2004 B1
6855631 Kirby Feb 2005 B2
6890624 Kambe et al. May 2005 B1
6921626 Ray et al. Jul 2005 B2
6998345 Kirby Feb 2006 B2
6998785 Silfvast et al. Feb 2006 B1
7009137 Guo et al. Mar 2006 B2
7045015 Renn et al. May 2006 B2
7108894 Renn Sep 2006 B2
7178380 Shekarriz et al. Feb 2007 B2
7270844 Renn Sep 2007 B2
7294366 Renn et al. Nov 2007 B2
7485345 Renn et al. Feb 2009 B2
7658163 Renn et al. Feb 2010 B2
7674671 Renn et al. Mar 2010 B2
7836922 Poole et al. Nov 2010 B2
8012235 Takashima et al. Sep 2011 B2
20010046551 Falck et al. Nov 2001 A1
20020012743 Sampath et al. Jan 2002 A1
20020063117 Church et al. May 2002 A1
20020071934 Marutsuka Jun 2002 A1
20020082741 Mazumder et al. Jun 2002 A1
20020096647 Moors et al. Jul 2002 A1
20020100416 Sun et al. Aug 2002 A1
20020128714 Manasas et al. Sep 2002 A1
20020132051 Choy Sep 2002 A1
20020162974 Orsini et al. Nov 2002 A1
20030003241 Suzuki et al. Jan 2003 A1
20030020768 Renn Jan 2003 A1
20030048314 Renn Mar 2003 A1
20030108511 Sawhney Jun 2003 A1
20030108664 Kodas et al. Jun 2003 A1
20030117691 Bi et al. Jun 2003 A1
20030138967 Hall et al. Jul 2003 A1
20030175411 Kodas et al. Sep 2003 A1
20030180451 Kodas et al. Sep 2003 A1
20030202043 Moffat et al. Oct 2003 A1
20030219923 Nathan et al. Nov 2003 A1
20030228124 Renn et al. Dec 2003 A1
20040004209 Matsuba et al. Jan 2004 A1
20040029706 Barrera et al. Feb 2004 A1
20040038808 Hampden-Smith et al. Feb 2004 A1
20040080917 Steddom et al. Apr 2004 A1
20040151978 Huang Aug 2004 A1
20040179808 Renn Sep 2004 A1
20040185388 Hirai Sep 2004 A1
20040191695 Ray et al. Sep 2004 A1
20040197493 Renn et al. Oct 2004 A1
20040227227 Imanaka et al. Nov 2004 A1
20040247782 Hampden-Smith et al. Dec 2004 A1
20050002818 Ichikawa Jan 2005 A1
20050097987 Kodas et al. May 2005 A1
20050101129 Lirby May 2005 A1
20050110064 Duan et al. May 2005 A1
20050129383 Renn et al. Jun 2005 A1
20050133527 Dullea et al. Jun 2005 A1
20050145968 Goela et al. Jul 2005 A1
20050147749 Liu et al. Jul 2005 A1
20050156991 Renn Jul 2005 A1
20050163917 Renn Jul 2005 A1
20050184328 Uchiyama et al. Aug 2005 A1
20050205415 Belousov et al. Sep 2005 A1
20050205696 Saito et al. Sep 2005 A1
20050214480 Garbar et al. Sep 2005 A1
20050215689 Garbar et al. Sep 2005 A1
20050238804 Garbar et al. Oct 2005 A1
20050247681 Boillot et al. Nov 2005 A1
20060003095 Bullen et al. Jan 2006 A1
20060008590 King et al. Jan 2006 A1
20060035033 Tanahashi Feb 2006 A1
20060043598 Kirby et al. Mar 2006 A1
20060046347 Wood et al. Mar 2006 A1
20060046461 Benson et al. Mar 2006 A1
20060057014 Oda et al. Mar 2006 A1
20060162424 Shekarriz et al. Jul 2006 A1
20060163570 Renn et al. Jul 2006 A1
20060163744 Vanheusden et al. Jul 2006 A1
20060172073 Groza et al. Aug 2006 A1
20060175431 Renn et al. Aug 2006 A1
20060233953 Renn et al. Oct 2006 A1
20060280866 Marquez et al. Dec 2006 A1
20070019028 Renn Jan 2007 A1
20070128905 Speakman Jun 2007 A1
20070154634 Renn Jul 2007 A1
20070181060 Renn et al. Aug 2007 A1
20080013299 Renn Jan 2008 A1
20090061089 King et al. Mar 2009 A1
20090114151 Renn et al. May 2009 A1
20090229412 Takashima et al. Sep 2009 A1
20100112234 Spatz et al. May 2010 A1
20100173088 King Jul 2010 A1
20100192847 Renn et al. Aug 2010 A1
20100255209 Renn et al. Oct 2010 A1
20110129615 Renn et al. Jun 2011 A1
Foreign Referenced Citations (21)
Number Date Country
2078199 Jun 1991 CN
1452554 Oct 2003 CN
198 41 401 Apr 2000 DE
0 331 022 Sep 1989 EP
0 444 550 Sep 1991 EP
0470911 Jul 1994 EP
1 258 293 Nov 2002 EP
2001-507449 Jun 2001 JP
2002539924 Nov 2002 JP
3425522 Jul 2003 JP
2007-507114 Mar 2007 JP
20000013770 Mar 2000 KR
1002846070000 Aug 2001 KR
10-2007-0008614 Jan 2007 KR
10-2007-0008621 Jan 2007 KR
WO9633797 Oct 1996 WO
WO 0023825 Apr 2000 WO
WO 0069235 Nov 2000 WO
0183101 Nov 2001 WO
WO 2006041657 Apr 2006 WO
WO 2006065978 Jun 2006 WO
Non-Patent Literature Citations (23)
Entry
Webster's Ninth New Collegiate Dictionary, Merriam-Webster, Inc., Springifled, MA. USA, 1990, 744.
Ashkin, A , “Acceleration and Trapping of Particles by Radiation Pressure”, Physical Review Letters, Jan. 26, 1970, 156-159.
Ashkin, A. , “Optical trapping and manipulation of single cells using infrared laser beams”, Nature, Dec. 1987, 769-771.
Dykhuizen, R. C. , “Impact of High Velocity Cold Spray Particles”, May 13, 2000, 1-18.
Fernandez De La Mora, J. et al., “Aerodynamic focusing of particles in a carrier gas”, J. Fluid Mech., vol. 195, printed in Great Britain, 1988, 1-21.
King, Bruce et al., “M3D TM Technology: Maskless Mesoscale TM Materials Deposition”, Optomec pamphlet, 2001.
Lewandowski, H. J. et al., “Laser Guiding of Microscopic Particles in Hollow Optical Fibers”, Announcer 27, Summer Meeting—Invited and Contributed Abstracts, Jul. 1997, 89.
Marple, V. A. et al., “Inertial, Gravitational, Centrifugal, and Thermal Collection Techniques”, Aerosol Measurement: Principles, Techniques and Applications, 2001, 229-260.
Miller, Doyle et al., “Maskless Mesoscale Materials Deposition”, HDI, vol. 4, No. 9, Sep. 2001, 1-3.
Odde, D. J. et al., “Laser-Based Guidance of Cells Through Hollow Optical Fibers”, The American Society for Cell Biology Thirty-Seventh Annual Meeting, Dec. 17, 1997.
Odde, D. J. et al., “Laser-guided direct writing for applications in biotechnology”, Trends in Biotechnology, Oct. 1999, 385-389.
Rao, N. P. et al., “Aerodynamic Focusing of Particles in Viscous Jets”, J. Aerosol Sci., vol. 24, No. 7, Pergamon Press, Ltd., Great Britain, 1993, 879-892.
Renn, M. J. et al., “Evanescent-wave guiding of atoms in hollow optical fibers”, Physical Review A, Feb. 1996, R648-R651.
Renn, M. J. et al., “Laser-Guidance and Trapping of Mesoscale Particles in Hollow-Core Optical Fibers”, Physical Review Letters, Feb. 15, 1999, 1574-1577.
Renn, M. J. et al., “Laser-Guided Atoms in Hollow-Core Optical Fibers”, Physical Review Letters, Oct. 30, 1995, 3253-3256.
Renn, M. J. et al., “Optical-dipole-force fiber guiding and heating of atoms”, Physical Review A, May 1997, 3684-3696.
Renn, M. J. et al., “Particle Manipulation and Surface Patterning by Laser Guidance”, Submitted to EIPBN '98, Session AM4, 1998.
Renn, M. J. et al., “Particle manipulation and surface patterning by laser guidance”, Journal of Vacuum Science & Technology B, Nov./Dec. 1998, 3859-3863.
Renn, Michael J. et al., “Flow- and Laser-Guided Direct Write of Electronic and Biological Components”, Direct-Write Technologies for Rapid Prototyping Applications, Academic Press, 2002, 475-492.
Sobeck, et al., “Technical Digest: 1994 Solid-State Sensor and Actuator Workshop”, 1994, 647.
TSI Incorporated, , “How A Virtual Impactor Works”, www.tsi.com, Sep. 21, 2001.
Vanheusden, K. et al., “Direct Printing of Interconnect Materials for Organic Electronics”, IMAPS ATW, Printing an Intelligent Future, Mar. 8-10, 2002, 1-5.
Zhang, Xuefeng et al., “A Numerical Characterization of Particle Beam Collimation by an Aerodynamic Lens-Nozzle System: Part I. An Individual Lens or Nozzle”, Aerosol Science and Technology, vol. 36, Taylor and Francis, 2002, 617-631.
Related Publications (1)
Number Date Country
20130029032 A1 Jan 2013 US
Provisional Applications (1)
Number Date Country
60969068 Aug 2007 US
Divisions (1)
Number Date Country
Parent 12203037 Sep 2008 US
Child 13626708 US