Claims
- 1. Ultrasonic temperature sensor for a gaseous medium comprising: a first buffer rod means in the gaseous medium; a plurality of discs positioned along said first rod in a spaced relation and selected to move therewith; transducer means connected to one end of said first rod for causing the rod to vibrate; a second buffer rod means in the gaseous medium; a plurality of discs positioned along said second rod in spaced relation and selected to move therewith; means connected to one end of said second rod to create an electrical signal upon vibration of said second rod, said first and second rods form a mechanical filter of highly tuned Q sections, whereby when said first rod vibrates in the gaseous medium, it will cause said second rod located in said medium to vibrate at a frequency indicative of the temperature of the gaseous medium.
STATEMENT OF GOVERNMENT INTEREST
The invention described herein may be manufactured and used by or for the Government for governmental purposes without the payment of any royalty thereon.
This invention relates generally to temperature sensing elements and more particularly to a sensing element adaptable for use with high-temperature gases.
The increased use of high temperature gases whether from rocket motors or in plasma applications has created the need for improved devices to monitor temperature variations. Two areas of concern immediately arise with this criterion, first a device that will provide accurate information and secondly a device that will shield necessary electronic components from the excessive heat to which it is necessarily exposed.
Accurate information requires the exclusion of possible interference between the hot gas and the readout unit. While much interference may be eliminated by electronic means located between the sensor and the readout, an improved system would protect the detectable data at the sensor.
While solid state electronic components are more adaptable to high temperatures than tube type devices, there is little that can effectively shield electronic components placed in, or attached to a device, in a plasma stream.
The most effective means is to remove the electronics to the greatest extent possible from the area of extreme heat.
US Referenced Citations (8)
Foreign Referenced Citations (1)
| Number |
Date |
Country |
| 598,176 |
Feb 1948 |
UK |