Many machines have media transport mechanisms that receive printed media into the machine and move the media through one or more sections of the machine to perform various processes on the media. For example, a financial transaction terminal such as an automated teller machine may do any or all of the following steps: (i) receive printed currency notes, checks, receipts, coupons, tickets and other printed media; (ii) align the media to an internal reference; (iii) use a camera and/or other sensors to detect what the media is and/or what is printed on the media; (iv) apply additional printed markings to the media; and/or (v) move the media to an appropriate shuttle, bin or exit port. The terminal may perform some or all of these steps, and/or additional steps. Other machines that include media transport mechanisms include coupon printers, ticket printers, ticket-taking devices and other printed media handling systems.
For another example, transaction cards, such as credit cards and debit cards, are often used by customers to pay for transactions at a point of sale (POS). For example, as shown in
. To read an EMV chip card, as illustrated in
Other types of card reading devices include that which is known as a “dip reader”, in which a chip card is inserted into and quickly retracted from the device, and does not become fully inserted into the device. As a card is inserted into this type of device, it comes in contact with a lever.
Because media transport devices carry transaction cards and other objects that can be handled by human hands, the media transport device can be exposed to various environmental conditions. For example, the insertion of a card into a card reading device can introduce dirt, oil and/or other contaminants into the media transport device. When such contaminants touch a reading device's contacts, reading head, transport rollers, belts, sensors, or other components of the device, it may cause the reader to malfunction.
Cleaning devices for media transport devices like chip card readers are known. For example, German patent application publication number DE10325217 discloses a card-shaped carrier material with a fiber flock material or a specifically contoured material for cleaning the chips of the card reading device. However, such cleaning cards can be difficult to manufacture, and often must be moved within the device in order to affect a cleaning operation.
This document describes methods and systems directed to solving some of the issues described above, and/or other issues.
In various embodiments, a cleaning tool for cleaning a media transport device includes a card comprising a substantially planar surface that extends along a machine direction and a transverse direction. The card includes a core layer comprising a plastic material, and a first cleaning surface attached to the core layer and comprising an unbroken loop material. The first cleaning surface comprises at least one raised cleaning element. The first cleaning surface is partially embedded into the core layer.
Optionally, the raised surface element may comprise a surface slit.
Optionally, a first edge slit and a second edge slit may be formed in the planar surface, wherein the raised surface element is at least partially between the first edge slit and the second edge slit. Optionally, a surface slit may be located between the first edge slit and the second edge slit. Optionally, the first edge slit and the second edge slit extend in the machine direction or the transverse direction.
Optionally, a length of the substantially planar surface in the machine direction may be longer than a width of the substantially planar surface in the transverse direction.
Optionally, the raised surface element further comprises a scraping element. When the device includes a first edge slit and a second edge slit, the scraping element may be located between the first edge slit and the second edge slit.
In another aspect, a method for manufacturing a cleaning tool include providing a plastic core layer that is at least partially molten, contacting an unbroken loop material to the plastic while it is at least partially molten, and cooling the plastic such that the unbroken loop material embeds into the plastic, The method also includes forming a raised surface element that extends from a side of the tool that includes the unbroken loop material.
Optionally, providing the plastic core layer in the method above may include heating a plastic material into a molten plastic and extruding the molten plastic into a shape of the core layer.
Optionally, the method above may include applying a second layer of unbroken loop material to a second side of the plastic while the plastic is at least partially molten.
In another aspect . . .
In any of the methods disclosed above, the method also may include forming a surface slit or a scraping element into the raised surface element.
In any of the methods disclosed above, a first edge slit may be formed on a first edge, and a second edge slit may be formed on a second edge, of the raised surface element.
a method for manufacturing a cleaning tool includes providing a core layer that comprises plastic, contacting an unbroken loop material to the plastic, and using ultrasonic welding to partially embed the unbroken loop material into the plastic. The method also includes forming a raised surface element that extends from a side of the tool that includes the unbroken loop material.
In this document, the singular forms “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise. The term “comprising” means “including, but not limited to.” Similarly, the term “comprises” means “includes, and is not limited to.” Unless defined otherwise, all technical and scientific terms used in this document have the same meanings as commonly understood by one of ordinary skill in the art.
In this document, terms that are descriptive of relative position such as “upper” and “lower”, “top” and “bottom”, “horizontal” and “vertical” and the like are intended to indicate relative positions with respect to the components for which those terms are descriptive, and are not intended to be absolute and require that the component remain in that absolute position in all configurations.
Except where specifically stated otherwise, numeric descriptors such as “first”, “second”, etc. are not intended to designate a particular order, sequence or position in an overall process or schema, but instead are simply intended to distinguish various items from each other by describing them as a first item, a second item, etc.
The terms “substantially” and “approximately”, when used in reference to a value, means a range that is within +/−10% of the value. When used in reference to a feature of an object, such as a substantially planar surface, terms such as “substantially” and “approximately” mean that the primary portion of the object exhibits the feature, although other portions may deviate. For example, a cleaning card in the form of a card from which embossments and/or other raised surface elements extend is considered to be a substantially planar surface.
The terms “media transport system” and “media transport device” refer to a set of hardware components that are configured to receive printed media (i.e., a substrate onto which text and/or graphics have been printed) or digitally encoded media (such as a chip in a credit card) and move the media through one or more modules that perform various processing steps on the media, such as position adjustment, sensing, printing and/or delivery to a final destination. Thus, a card reading device as described in the Background section in this application is a type of media transport device. A “currency transport device” or “currency transport system” is a type of media transport device that is configured to process and convey printed financial instruments such as, currency notes, checks, money orders, bank notes and the like, and digital financial instruments such as credit cards. A “currency transport device” or “currency transport system” is a type of media transport device that is configured to process and convey printed financial instruments such as, currency notes, checks, money orders, bank notes and the like, and digital financial instruments such as credit cards.
b illustrate embodiments of a cleaning device 301 (sometimes referred to in this document as a cleaning tool) for media transport devices such as chip card readers.
The cleaning tool includes a card with a first cleaning surface 303 (shown as the top layer in
The core layer 312 may be laminated onto or otherwise contacted to the support layer 311. The first cleaning surface 303 may be made of a soft fabric or other soft material such as unbroken loop (UBL) fabric that is attached to the core layer 312. For example, to manufacture the device a plastic core layer 312 may be heated until its surface becomes soft or just starts to melt, and the UBL fabric of the cleaning surface 303 may then be applied to that surface so that the UBL fabric becomes partially embedded in the plastic core layer. Alternatively, the device may be formed by heating the plastic material into it is molten and extruding the molten plastic into the shape of the card, then applying the UBL fabric to the molten plastic so that the UBL material becomes embedded in the plastic before the plastic cools. Alternatively, the UBL fabric may be partially embedded into the plastic core layer 312 by ultrasonic welding or other processes. Optionally, the cleaning surface may incorporate other materials, such as flocked material or other patterned or textured surfaces that provide a cleaning friction.
The support layer 311 may be attached to the core layer 312 opposite the first cleaning surface 303. In certain embodiments, the support layer 311 may be omitted.
Optionally, the cleaning tool also may include a second cleaning surface 304. The second cleaning surface 304 may be formed of a fabric or another texture that provides a cleaning friction. The second cleaning surface 304 may be attached to the support layer 311. Alternatively, the support layer 311 may be omitted, and the second cleaning surface 304 may be directly or indirectly attached to the core layer 312. The first cleaning surface 303 may be directly or indirectly attached to a first side of the core layer 312, and the second cleaning surface 304 may be directly or indirectly attached to a second side of a core layer 312. The second cleaning surface 304 may be made of UBL or other material as described above, and it may be adhered to the core or to the support layer using processes such as those described above for the first cleaning surface 303.
The layers of the cleaning tool may have differing thicknesses. For example, the support layer may be thicker than the first cleaning surface. Alternatively, the first cleaning surface may be thicker than the support layer. For example, the support layer 311 may have a thickness of 0.01 to 0.23 inches. The core layer 312 may have a thickness of 0.01 to 0.04 inches. In some embodiments, the overall thickness of the uncompressed cleaning tool may be from 0.010 to 0.240 inches, and when compressed the cleaning tool thickness may be not less than 0.010 inches. Other thicknesses are possible.
In certain embodiments the cleaning tool may have layers of varying stiffness. For example, the support layer 311 may be more rigid than the core layer 312. In addition, the first cleaning surface 303, when made of a material that differs from the core layer 312, may be more rigid than the core layer 312.
In certain embodiments the cleaning tool may have layers of varying compressibility. For example, the support layer 311 may be more compressible than the core layer 312. Alternatively, the core layer 312 may be more compressible than the support layer 311.
The cleaning tool 301 may be substantially planar (i.e., flat) as shown in
Raised surface elements 305 may be patterned to certain locations on the cleaning surfaces of the cleaning tool such that the raised surface elements 305 will come in contact with at least one electrical contact 204 of the chip reading head when the cleaning tool is inserted into a card reading device. The height of the raised surface element may be sufficient to reach at least one electrical contact before the contact has extended to contact the cleaning tool. Alternatively, the raised surface element may contact an electrical contact only when the electrical contact is lowered, raised, or otherwise extended into the embossment. The raised surface elements 305 may be an arcuate extension of one or more layers of the cleaning tool. The raised surface elements 305 may be sufficiently flexible such that when the card reader is activated, the electrical contact extends into and deforms the embossment. The card reader may be activated manually, where the extending of the electrical contact is initiated by a user, or the card reader may be activated automatically, where the extending of the electrical contact is initiated automatically when the card is inserted into the card reading device. In various embodiments, the raised surface element deforms laterally, creating friction between the embossment and the electrical contact. Other structures and use of cleaning cards employing raised surface elements are described in detail in U.S. Pat. No. 8,323,779, the subject matter of which already has been incorporated herein by reference.
As shown in
The cleaning device 301 may further include at least one raised surface element 340 that provides a raised cleaning area. The at least one raised surface element 340 will be at least partially raised with respect to the planar surface of the planar card. The at least one raised surface element 340 will have a forward edge, which is the side of the raised element that is nearest to the edge of the planar card 320 that first enters the machine. The at least one raised surface element 340 may also have a peak, which will be the most raised portion of the at least one raised surface element 340. The raised surface elements 340 may be compressible and resilient. The raised surface elements 340 may be configured such that at least a portion of it will become relatively flatter when inserted into the media transport device. The raised surface elements 340 may be configured to return to a relatively less flat shape when removed from a media transport device. Raised surface elements 340 may be partially or fully integrated into the planar card 320. Raised surface elements 340 may be partially elevated in a direction perpendicular to the plane of the planar card 320. In certain embodiments, raised surface elements 340 may be located on specific portions of the planar card 320 to allow the raised surface elements to contact a component of a media transport device when the cleaning device 301 is inserted into the device. Raised surface elements 340 may be elevated to a sufficient height to reach a component of a media transport device, when the cleaning device 301 is inserted into a media transport device. In certain embodiments, raised surface elements 340 may be flanked by a first and second edge slit. (For example, see slits 149 as shown in
The raised surface elements 340 of the cleaning device 301 may include one or more scraping elements 360. Each scraping element 360 may be located on the top of a corresponding raised surface element 340. Each scraping element 360 may be centered in the middle of a raised surface element. Alternatively, the scraping element 360 may be positioned off center. In one embodiment, the scraping elements 360 may be positioned off of the center of a raised surface element 340 toward the forward edge 325 of the planar card 320. Each scraping element 360 may be configured such that it contacts a component of a media transport device when the cleaning device 301 is inserted into the media transport device. The scraping elements 360 may be any shape, material, or configuration to allow the cleaning device to dislodge contaminates from a media transport device.
In certain embodiments, as illustrated in
In certain embodiments, as illustrated in
In certain embodiments, as illustrated in
In certain embodiments, as illustrated in
In certain embodiments, as illustrated in
The cleaning device 301 may include other structures that are designed to help remove dirt from other card reader receiving pathway components. Such structures may include additional slots, embossments, scarifying holes, or patterned structures such as that disclosed in: (a) U.S. Pat. No. 7,540,055, titled “Cleaning Cards for Internal Surfaces of Machine Components”; (b) U.S. Pat. No. 7,846,534, titled “Cleaning Cards with Angled Cleaning Surfaces”; (c) U.S. Pat. No. 7,732,040, titled “Patterned Cleaning Card and Method of Manufacturing Same”; (d) U.S. Pat. No. 8,323,779, titled “Cleaning Cards”; and/or (e) U.S. Pat. No. 10,189,650 “Card for Cleaning Printed Media Transport System and Method of Using Same”, the disclosures of which are each fully incorporated into this document by reference. Such structures may be on the planar card 320, raised surface element 340, or both. Optionally, some portions of the cleaning faces of the cleaning device 301 may be coated with or otherwise contain an adhesive material to help retain dirt or other particles upon contact.
As illustrated in
When a raised surface element has a surface slit positioned between the edge slits as shown in
Optionally, the raised surface elements may be formed by an embossing process, in which a die is positioned against the support layer 311 or core layer 312 and pressure is applied to each die while heat is applied to the area of the cleaning tool that the die contacts. By way of example, approximately 20 tons of pressure may be applied with a press, and/or pressure may be applied less than one second under a temperature ranging 190-260 degrees Fahrenheit, such as approximately 210, 220, 225, 230, 235 or 240 degrees. The bulges are then formed as relief areas that extend upward from the base plane of the first cleaning surface 303. The application of heat alters the structure of the core layer so that the natural (relaxed) position of each raised surface element 305 is in the extended position. The raised surface elements 305 may therefore also be referred to as “embossments” in this document. Each embossment will compress when pressure is applied to the top of the bulge. Each embossment will return to its relaxed and extended position when the pressure is removed, and thus exhibit resiliency. In embodiments having edge slits, edge slits 149 may cut along the sides of each embossment.
As an alternative to embossing with pressure and heat, the bulges may be formed into the cleaning tool via a molding process. For example, the support layer 311 may be cut and placed into a mold that includes ridges at the places where bulges will be located, and the core layer 312 may be formed over the lower support layer while positioned in the mold. The foam will then cure in the bulge formations, so that they are compressible and resilient. The first cleaning surface 303 may then be placed over the core layer.
In certain embodiments, as illustrated in
The cleaning device 301 may be made of a flexible, tear-resistant fibrous material such as a fibrous aramid or meta-aramid fabric material such as that marketed under the NOMEX® brand; a cellulosic material; or a flexible polymeric substrate provided with thin, non-woven layers made of absorbent material such as that marketed under the SONTARA® brand.
The media transport device may thus receive the cleaning device 301 through a portal. The cleaning device 301 may remain fully within the media travel pathway. Alternatively, a portion of the cleaning device may extend out from the media travel pathway, such as through a currency acceptor slot, so long as enough of the cleaning device remains within the pathway to provide a cleaning function. When the cleaning device 301 is inserted into the media transport device, features of the cleaning device 301 including raised surface elements 340, embossments 323, and scraping elements 360 may dislodge contaminants from the media transport machine. Optionally, polishing surfaces 390 may function to remove smaller contaminates from components of a media transport machine. Other features of the cleaning device 301 may function to collect contaminates that were dislodged by the cleaning device 301. For example, a second arcuate portion 347 may collect contaminates. Alternatively portions of the cleaning device 301 may be coated in an adhesive that may captures contaminants.
Optionally, At least one of the layers may be coated with a cleaning solution such as a solvent so that internal components of the media transport system may be cleaned when the components move along or across the cleaning face of the substrate. Example cleaning solutions include isopropyl alcohol, deionized water, alkaline surfactants, and other materials or combinations of these. Alternatively, a cleaning face may be textured or made of fiber that will promote friction when a movable object is moved against the cleaning face.
The cleaning device of this disclosure can be manufactured by embossing patterns into a planar card 320. Specifically, raised surface elements 340 and embossments 323 may be formed into the card by an embossing process in which edge slits 149 are cut along the sides of each raised surface element 340. Embossments may be made by applying heat, pressure or both heat and pressure to press the card into the desired shape. For example, a die may be positioned against the planar card 320 between each edge slit pair, and pressure may be applied to each die while heat is applied to the area of the tool that the die contacts. By way of example, approximately 20 tons of pressure may be applied with a press, with pressure applied less than one second under a temperature ranging 190-260 degrees Fahrenheit, such as approximately 210, 220, 225, 230, 235 or 240 degrees. The raised cleaning areas are then formed as relief areas that extend upward from the planar card. The application of heat alters the structure of the planar card 320 so that the natural (relaxed) position of each raised surface element 340 is in the extended position. Each raised surface element 340 may compress when pressure is applied to the top of the raised cleaning area. The raised surface element 340 may return to its relaxed and extended position when the pressure is removed, and thus exhibit resiliency. In embodiments that have at least one surface slit, the contour of each raised surface element 340 may be the same on each side of the surface slit when the raised surface element is in a relaxed position. The contour of each raised surface element 340 that has a surface slit may not be the same on each side of the surface slit when the raised surface element is in a compressed position.
As an alternative to embossing with pressure and heat, the raised cleaning areas may be formed into the tool via a molding process. For example, the planar card 320 may be cut and placed into a mold that includes ridges at the places where raised cleaning areas will be located, and the planar card 320 will then cure in the raised cleaning area formations, so that they are compressible and resilient. A polishing layer 390 may then be placed over the planar card 320. (See
The methods and systems described above may result in significant time savings as compared to manual cleaning. In addition, they can help ensure that cleaning occurs in small and/or hard-to-reach segments within the media transport device.
The features and functions described above, as well as alternatives, may be combined into many other different systems or applications. Various alternatives, modifications, variations or improvements may be made by those skilled in the art, each of which is also intended to be encompassed by the disclosed embodiments.
This patent document claims priority to and is a continuation-in-part of: (a) U.S. non-provisional patent application Ser. No. 17/650,781, filed Feb. 11, 2022; and (b) U.S. non-provisional patent application Ser. No. 17/650,787, each of which claims priority to: (i) U.S. provisional patent application No. 63/148,956, filed Feb. 12, 2021; (ii) U.S. provisional patent application No. 63/239,722, filed Sep. 1, 2021; and (iii) U.S. provisional patent application No. 63/239,760, filed Sep. 1, 2021. The disclosures of each priority application are fully incorporated into this document by reference.
Number | Date | Country | |
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63239722 | Sep 2021 | US | |
63239760 | Sep 2021 | US | |
63148956 | Feb 2021 | US |
Number | Date | Country | |
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Parent | 17650781 | Feb 2022 | US |
Child | 18167754 | US |