The present application generally relates electrodes for delivering energy or stimulus to tissue or structure of the body. More specifically, the application relates to electrode manufacturing processes.
Co-pending U.S. application Ser. No. 13/547,031 entitled System and Method for Acute Neuromodulation, filed Jul. 11, 2012 (Attorney Docket: IAC-1260; the “'031 application”), filed by an entity engaged in research with the owner of the present application, is attached at the Appendix and incorporated herein by reference. The '031 application describes a system which may be used for hemodynamic control in the acute hospital care setting, by transvascularly directing therapeutic stimulus to parasympathetic nerves and/or sympathetic cardiac nerves using electrodes positioned in the superior vena cava (SVC). In disclosed embodiments, delivery of the parasympathetic and sympathetic therapy decreases the patient's heart rate (through the delivery of therapy to the parasympathetic nerves) and elevates or maintains the blood pressure (through the delivery of therapy to the cardiac sympathetic nerves) of the patient in treatment of heart failure.
Co-pending U.S. application Ser. No. 14/642,699 (the '699), filed Mar. 9, 2015 and U.S. Ser. No. 14/801,560 (the '560), filed Jul. 16, 2015, each incorporated by reference, describe transvascularly directing therapeutic stimulus to parasympathetic and/or sympathetic cardiac nerves using electrodes positioned in the SVC, right brachiocephalic vein, and/or left brachiocephalic vein and/or other sites. As with the system disclosed in the '031, the methods disclosed in these applications can decrease the patient's heart rate (through the delivery of therapy to the parasympathetic nerves) and elevate or maintain the blood pressure (through the delivery of therapy to the cardiac sympathetic nerves) of the patient in treatment of heart failure.
The '699 and '560 applications describe one form of catheter device that may be used to perform transvascular neuromodulation. In particular, these applications shows a support or electrode carrying member 10 of the type shown in
The present application describes electrode support assemblies in which flexible circuits (having electrodes and/or other components on them) may be mounted to an electrode support.
This application describes methods for joining a flexible circuit to a support. In the given examples, the support is a strut of an electrode array such as a basket type of array, and the flexible circuit is one having electrodes used for delivering therapy and/or sensing, but it should be understood that the types of flexible circuits and supports may be different than the types described here without departing from the scope of the invention. Additionally, the methods and assembly configurations described here are described with reference to an intravascular electrode array electrode, of the type described in the Background, that is used to deliver transvascular therapy to target nerves for acute neuromodulation. However, these concepts may be used for any other types of electrodes used to deliver therapy or sense activity in medical procedures, including without limitation chronically-implantable or acute neuromodulation systems for transvascular nerve stimulation, other types of neuromodulation systems whether or not stimulus is delivered from intravascular sites, or electrophysiology systems for mapping electrical activity of the heart or delivering therapy using stimulation energy or ablation energy using electrodes positioned in the heart, vasculature or elsewhere in the body. Finally, certain materials are named for the components used in the process, but it should be understood that alternative materials known to those skilled in the art for use in such components may be substituted for those that are named.
Referring to
The rivet is then subjected to a heating process that causes the end of the shank to expand radially and compress longitudinally, forming a secondary head 114 on the opposite end of the shank from the first head. The modified shape of the rivet is shown in
It will be observed with respect to
In alternative embodiments of the method, the rivet may initially include only a shank, in which case the heat staking process is used to form heads on opposite ends of the shank. As yet another alternative, the rivet may have a primary head during staking, but that primary head may be further deformed during the staking process.
The rivet is preferable formed of a polymeric material, such as nylon (e.g. Nylon 12). A preferred rivet is molded into the shape illustrated in
The rivet may also include features that enhance its visibility on a fluoroscopic image, allowing it to be used as a radiopaque marker. This is accomplished by doping the resin used to form the rivet with a radiopaque filler such as Tungsten prior to molding. In some embodiments, a combination of filled and un-filled rivets may be used to form a pattern visible and recognizable under fluoroscopy, to aid the practitioner in understanding the position and orientation of the electrode assembly within the patient. This is further discussed in co-pending U.S. application Ser. No. ______, filed Dec. 12, 2019 (Attorney Ref: NTK2-1510) entitled Fluoroscopic Markers for Single View Positioning, which is incorporated herein by reference.
During use of the catheter, the struts are moved to a radially compressed position and a thin-walled tube is advanced over the struts to maintain them in the compressed position for delivery into a patient's vasculature. As best understood by comparing
In one embodiment, the process is used for an intravascular catheter electrode array formed using multiple struts (e.g. four struts), two of which have flex circuits, and two rivets are used with each flex circuit.
Assembly using the methods described in this application may be performed using a resistance welder (e.g. Amada Miyachi Resistance Welder). It will be understood that given the extremely small size of the rivets and holes, the process is preferably performed under magnification. Vacuum-assisted fixturing and a thermode tailored to the shape and dimensions of the rivet and associated components are also useful for carrying out the process.
In accordance with the process using this equipment, the following steps may be performed in the assembly process:
In another alternative embodiment, a flexible circuit 302 is provided that has rivets 304 and/or radiopaque markers embedded into it during initial flexible circuit construction. For example, the rivets and/or markers could be placed between the layers 302a, 302b in the flexible circuit as shown in
The disclosed methods for applying flex circuits to supports and the resulting assemblies provide a number of advantages over prior art methods and assemblies. In particular, they allow formation of the assembly without the use of glue joints or heat shrink tubing, they improve manufacturability for higher volume production, they avoid creating of particles. Also, the riveted assemblies conform to the unique curved shape of shape memory nitinol strut, and they result in the formation of features on the assembly that can be used as radiopaque markers that can the practitioner can use as a reference using the electrodes while positioning and orienting the electrodes at the relevant anatomy while viewing the procedure on a fluoroscopic image.
All patents and patent applications referred to herein, including for purposes of priority, are incorporated herein by references for all purposes.
This application claims the benefit of U.S. Provisional Application No. 62/778,353, filed Dec. 12, 2019.
Number | Date | Country | |
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62778353 | Dec 2018 | US |