The present application is a national stage filing under 35 U.S.C. § 371 of PCT application number PCT/US2013/038830, having an international filing date of Apr. 30, 2013, the disclosure of which is hereby incorporated by reference in its entirety.
A memory device includes memory cells to store data values. An example type of memory device is a dynamic random access memory (DRAM) device. As memory manufacturing technology has advanced, the feature size of memory cells has decreased to increase the density of memory cells in a memory device. Increasing the memory cell density provides increased storage capacity in the memory device.
Processing a massive dataset may be quite burdensome on a memory of a computer system due to a large number of potential repeated accesses to the same or nearby memory locations in connection with this processing. The repeated accesses may be at rates that are large enough to potentially affect the integrity of the data stored in the memory.
More specifically, charges are selectively stored in the capacitor-based memory cells of a dynamic random access memory (DRAM) device to represent the corresponding stored data. Because leakage currents degrade the stored charges, the memory cells of the DRAM device are periodically refreshed, which involves reading the data stored in the DRAM's device memory cells and rewriting the data back to the memory cells. The rate at which the DRAM device is refreshed, however, may be insufficient to maintain the charge levels for certain activity. In this manner, for purposes of accessing a row of memory cells of a DRAM device, a command called an “activate command” may be issued to open the row for access.
Repeated activation of a given row (activations on the order of thousands of times per refresh period, for example) at a high enough rate may degrade data stored in adjacent word lines (a natural occurrence in the DRAM due to the relatively close spacing of the DRAM features), even though these word lines are periodically refreshed. In other words, the periodic refresh intervals may be insufficient to maintain the stored data when the activation rates exceed a certain threshold.
For purposes of controlling the degradation that may otherwise occur due to repeated activations of a given row during a given refresh period, systems and techniques are disclosed herein, which use analog circuitry to monitor activation or access rates and generate alerts for frequently accessed DRAM rows.
More specifically, systems and techniques are disclosed herein for monitoring the activation rates or access rates of memory rows. Upon an access rate exceeding a predetermined threshold, the memory row address may be stored in a register and an alert transmitted to a memory controller. The memory controller may then refresh selected rows including but not limited to any adjacent rows to the memory row stored in the register. In an alternate example, upon the access rate exceeding a predetermined threshold, the DRAM can institute an appropriate refresh of any impacted rows. This may occur without the use of an external memory controller.
Referring to
Memory device 100 may be any device comprising an array of word lines and bit lines. For the purposes of this disclosure, the memory devices discussed in the figures will be referred to as Dynamic Random Access Memory (DRAM), however, the disclosure is not so limited.
Analog circuit 104A-n may comprise various combinations of analog components, including but not limited to, resistors, capacitors, transistors, diodes, and others. These components may be utilized in various combinations to facilitate detection of a hammered row. As used herein a hammered row is a row that has been accessed at a rate that impacts the ability of adjacent rows to maintain data.
In the illustrated example, the memory device 100 includes as plurality of word lines. Word lines are the horizontal lines within the memory array that form junctions with the vertical bit lines. At each junction various components are disposed to store a charge which represents one or more bits of data. Each word line may be accessed at varying rates in accordance with a need to retrieve specific data. Receiving too many accesses or activations may cause degradation in adjacent rows thereby impacting the memory device 100.
While illustrated as distinct components, the memory device 100 and the analog circuits 104A-n may alternatively be combined and packaged as a single device, for example, a single DRAM device. While the remainder of the disclosure will discuss various examples in which the components may be discussed independently of each other and/or illustrated as separate components, the disclosure is not so limited.
Referring to
In the illustrated example, the row address register may receive a plurality of requests for data being stored in various rows of the memory array 200. The row address register 200 may pass the request to the row address decoder 204 may which may charge or access the requested row within the memory array 200. As multiple accesses are made to a particular row within the memory array 200, an analog circuit detector 206 coupled to the row may determine whether its respective word line or row has been accessed at least at a predetermined rate between refreshes.
Assuming, for example, that the word line or row has been accessed at least at the predetermined rate, which may be approximately 3.1e6 accesses within a period of approximately 64 milliseconds, the analog circuit detector 206 coupled to the respective word line 208 may send an alert to the memory controller 210. The alert, in various examples, may be either a high or low logic signal.
A memory register 208 may be coupled to each of the analog circuit detectors 206. In addition, to sending an alert to the memory controller 210, the analog circuit detector 206 may trigger the particular row address which was accessed at least at the predetermined rate to be stored within the memory register 208. Consequently, the memory register 208 may store the address associated with the word line that the analog circuits 206 determines has been accessed at the predetermined rate between refreshes.
Upon receipt of the alert, the memory controller 210 may command the memory array 200 to activate the word lines impacted by the hammered row. In various examples, this may include a refresh of the hammered row, and/or one or more adjacent rows. As used herein an adjacent row is any row impacted by the repeated accesses of the hammered row. Upon refresh of the rows, the memory controller 210 may reset the analog circuit detectors and flush the memory register 208.
Referring to
The analog circuit 300 includes a bandpass filter 302. The bandpass filter is further composed of a differentiator 304, a diode D1, and an integrator 306. Each of the differentiator 304 and integrator 306 further comprise additional analog components including resistors and capacitors. The values of the various analog components are selected such that an activation or access rate will trigger an alert to a memory controller when it reaches or exceeds a threshold. The analog circuit 300 also includes a first field effect transistor (FET) T2, a second FET T1 and a logic gate L1 including a NAND circuit. The bandpass filter 302 is connected to the gate of the second FET T1 at a node N4 wherein the drain of the first FET T2 is connected to the gate of the second FET T1. An input of the logic gate L1 is connected to the drain of the second FET T1. A reset voltage from the bandpass filter 302 is connected to the gate of the first FET T2 and a source voltage from the bandpass filter 302 is connected to a source of the second FET T1.
With reference to
Node N1 is coupled directly to the word line WLn, and as such receives a signal whenever WLn is accessed. As seen in
With reference to node N2, the row access signal has been processed through a high pass filter (e.g., the differentiator 304) to form a signal as seen in signal 404. The plurality of pulses from both positive and negative pulses. To filter the negative pulses, or conversely, to select the positive pulses associated with the positive transitions of the word line, diode D1 is coupled to node N2. The output of diode D1 is illustrated as signal 406.
With the negative transitions associated with the negative transitions of the word lines filtered, signal 406 is input into an integrator 306. Integrator 306 comprises components R2 and C2. An integrator 306 functions generically as a low pass filter. The integrator 306 and the components therein are selected such that if the row access signals exceed a predetermined threshold, the capacitor C2 builds up a sufficient charge to meet the gate voltage of transistor T1. In other words, the integrator 306 is to determine whether the pulses associated with the positive transitions of the word line access signals exceeds the predetermined threshold.
As seen in
Once triggered, a memory controller may refresh the memory array and rest the analog circuit 300. Resetting the analog circuit 300 may comprise use of a reset line tied to transistor T2. Once triggered, the gate voltage on transistor T2 may dissipate thereby resetting the circuit an initial state.
Referring to
Referring to
In response to determining that the access rate exceeds the predetermined threshold, the analog circuit may generate an alert to indicate possible corruption of data stored in an adjacent row to the memory row at 504. The alert may be based on high or low logic signals. Upon generation of the alert at 504, the flow diagram may end.
Referring to
In monitoring the frequency of the positive pulses, a determination is made at 608 as to whether the average access rate exceeds the threshold. In one example, determining whether the access rate exceeds threshold comprises determining whether the access rate exceeds approximately 3.1e6 accesses within a refresh period of approximately 64 milliseconds. If the average access rate does not exceed the threshold, the flow diagram may return to 602. If the average access rate does exceed the threshold, flow diagram may continue to 610, where the row address associated with the memory row may be stored within a memory register, such as the memory register 208 of
With the row address of the hammered memory row stored within the memory register at 610, a logic circuit may be utilized to combine alerts from other memory rows at 612. In one example, the alert may be combined with at least one other alert. The logic circuit utilized may be configured to indicate an error in response to one or more alert signals from one or more analog circuits. In the illustrated example of
Referring to
In the illustrated example, the memory controller 704 may be configured to read and execute instructions 710 stored on storage medium 708. While illustrated as distinct components, those of ordinary skill will readily understand that various components as illustrated may be incorporated into other components.
In accordance with
Once various word lines have been refreshed, the memory controller 704 may be configured to reset the analog circuit. Resetting the analog circuit may comprise flushing one or more memory registers and discharging various voltages, for example, those voltages tied to the transistor gates of T1 in
While a limited number of examples have been disclosed herein, those skilled in the art, having the benefit of this disclosure, will appreciate numerous modifications and variations therefrom. For example, as previous discussed it is expressly contemplated that various methodologies described herein may be implemented within individual components, for example, the DRAM itself. It is intended that the appended claims cover all such modifications and variations.
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/US2013/038830 | 4/30/2013 | WO |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2014/178839 | 11/6/2014 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
3303481 | Kessler | Feb 1967 | A |
5630097 | Orbits et al. | May 1997 | A |
5717644 | Hadderman et al. | Feb 1998 | A |
5745913 | Pattin et al. | Apr 1998 | A |
6005810 | Wu | Dec 1999 | A |
6169687 | Johnson | Jan 2001 | B1 |
6651141 | Adrangi | Nov 2003 | B2 |
6681297 | Chauvel et al. | Jan 2004 | B2 |
6836443 | Dadashey | Dec 2004 | B2 |
7193901 | Ruby et al. | Mar 2007 | B2 |
7233538 | Wu et al. | Jun 2007 | B1 |
7405964 | Philipp et al. | Jul 2008 | B2 |
7808831 | Mokhlesi et al. | Oct 2010 | B2 |
7831773 | Zedlewski et al. | Nov 2010 | B2 |
7995386 | Mizuguchi et al. | Aug 2011 | B2 |
8108596 | Aldworth et al. | Jan 2012 | B2 |
8108609 | Barth et al. | Jan 2012 | B2 |
8166248 | Provenzano et al. | Apr 2012 | B2 |
8190842 | Frost et al. | May 2012 | B2 |
8200902 | Paver et al. | Jun 2012 | B2 |
8320185 | Marquart | Nov 2012 | B2 |
8332576 | Chu et al. | Dec 2012 | B2 |
8347176 | Resnick et al. | Jan 2013 | B2 |
8406038 | Saito et al. | Mar 2013 | B2 |
8788758 | de la Iglesia | Jul 2014 | B1 |
8806137 | Rabinovitch et al. | Aug 2014 | B2 |
9804972 | Benedict et al. | Oct 2017 | B2 |
9940286 | Duluk, Jr. et al. | Apr 2018 | B2 |
20020065992 | Chauvel et al. | May 2002 | A1 |
20020087797 | Adrangi | Jul 2002 | A1 |
20040218439 | Harrand et al. | Nov 2004 | A1 |
20060083094 | Sinha et al. | Apr 2006 | A1 |
20080259708 | Tsukazaki et al. | Oct 2008 | A1 |
20090144492 | Barth et al. | Jun 2009 | A1 |
20090187713 | Zedlewski et al. | Jul 2009 | A1 |
20090319718 | Aldworth et al. | Dec 2009 | A1 |
20100091586 | Carman | Apr 2010 | A1 |
20100106901 | Higeta | Apr 2010 | A1 |
20110307664 | Paver et al. | Dec 2011 | A1 |
20120054374 | Carter et al. | Mar 2012 | A1 |
20120191900 | Kunimatsu et al. | Jul 2012 | A1 |
20120246544 | Resnick et al. | Sep 2012 | A1 |
20120272029 | Zhang et al. | Oct 2012 | A1 |
20120324172 | Rabinovitch et al. | Dec 2012 | A1 |
20140156923 | Bains | Jun 2014 | A1 |
20140281110 | Duluk, Jr. et al. | Sep 2014 | A1 |
Number | Date | Country |
---|---|---|
1613064 | May 2005 | CN |
1284086 | Nov 2006 | CN |
101796497 | Aug 2010 | CN |
102841856 | Dec 2012 | CN |
0895162 | Feb 1999 | EP |
2169558 | Mar 2010 | EP |
10-2012-0100705 | Sep 2012 | KR |
Entry |
---|
Huang, Rei-Fu. et al., “Alternate Hammering Test for Application-specific DRAMs and an Industrial Case Study”, (Research Paper), Jun. 3-7, 2012, pp. 1012-1017. |
International Search Report and Written Opinion dated Jan. 27, 2014, issued on PCT Patent Application No. PCT/US2013/038830 dated Apr. 30, 2013, Korean Patent Office. |
Extended European Search Report dated Nov. 7, 2016; EP Application No. 13883675.4; pp. 10. |
Benedict et al., “Word Line Guard Band,” May 2013, Research Disclosure, p. 614. |
Ghosh, M. et al., “Smart Refresh: An Enhanced Memory Controller Design for Reducing Energy in Conventional and 3D Die-Stacked DRAMs,” 2007, 40th IEEE/ACM Int'l Symposium on Microarchitecture, pp. 134-145. |
Yoon, H et al., “A Row Buffer Locality-Aware Caching Policy for Hybrid Memories,” Dec. 17, 2011, Research Paper, https://research.ece.cmu.edu/safari/pubs/rbla_nvmw201 2_abstract.pdf. |
Number | Date | Country | |
---|---|---|---|
20160085466 A1 | Mar 2016 | US |