Memory card pack

Abstract

A memory card pack includes an adaptor insertable in a memory slot of an application device and including a semiconductor chip having a control circuit therein and an expansion socket including a plurality of slots, each slot being configured to receive a memory card, and a plurality of contacts electrically connecting the control circuit to each memory card.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:

FIG. 1 is a perspective view illustrating a memory card used in a digital camera as an exemplary digital device;

FIG. 2 is a perspective view illustrating a memory card pack according to an exemplary disclosed embodiment;

FIG. 3 is a block diagram illustrating a control circuit illustrated in FIG. 2;

FIG. 4 is a perspective view illustrating a memory card pack according to an alternative exemplary disclosed embodiment; and

FIGS. 5A through 5C are sectional views illustrating an adaptor structure of FIGS. 2 and 4.

Claims

1. A memory card pack comprising: an adaptor insertable in a memory slot of an application device and including a semiconductor chip having a control circuit therein; andan expansion socket including a plurality of slots, each slot being configured to receive a memory card, and a plurality of contacts electrically connecting the control circuit to each memory card.

2. The memory card pack of claim 1, wherein the control circuit comprises: an interface with the application device;a central processing unit comprising a microprocessor;an internal memory which stores operational records of the central processing unit;a buffer memory which inputs/outputs data;a control logic unit which controls the buffer memory; anda memory control unit which controls the memory card.

3. The memory card pack of claim 1, wherein the memory card comprises a dedicated control unit which controls a memory array on the memory card.

4. The memory card pack of claim 3, wherein the control circuit is an emulator which recognizes and controls different kinds of memory cards inserted in the expansion socket.

5. The memory card pack of claim 3, wherein the memory card is one selected from the group consisting of a memory stick card, an SM (smart media) card, an SD (secure digital) card, a mini SD (mini secure digital) card, an MMC (multi media) card, and a combination thereof.

6. The memory card pack of claim 1, wherein the memory card includes a memory array.

7. The memory card pack of claim 6, wherein the memory card is an XD (extreme digital) card.

8. The memory card pack of claim 3, wherein the memory array comprises a non-volatile memory cell.

9. The memory card pack of claim 5, wherein the memory array comprises a non-volatile memory cell.

10. The memory card pack of claim 1, wherein the slot comprises a guide portion which allows the memory card to be slidingly inserted thereinto.

11. The memory card pack of claim 10, wherein the slot further comprises a card separation unit which fixes the memory card and elastically pushes out the memory card to eject the memory card.

12. The memory card pack of claim 1, wherein the contacts are electrically connected to the memory card by pressing a contact pad of the memory card, and are formed of an elastically deformable material.

13. The memory card pack of claim 1, wherein the adaptor comprises: a substrate including conductive lines electrically connected to the contacts and an external connection terminal;the semiconductor chip mounted on a surface of the substrate and coupled to the conductive lines; anda lid casing the substrate and the semiconductor chip.

14. The memory card pack of claim 1, wherein the adaptor comprises: a substrate including conductive lines electrically connected to the contacts and an external connection terminal;the semiconductor chip mounted on a surface of the substrate and coupled to the conductive lines; anda molding member casing the substrate and the semiconductor chip.

15. The memory card pack of claim 1, wherein the semiconductor chip is packaged in any one of a TSOP (thin small outline package), a BGA (ball grid array) package, a DIP (dual inline package), a QFP (quad flat package), and a CSP (chip scale package).

16. The memory card pack of claim 13, wherein the adaptor further comprises a lid frame coupled to the conductive lines on the substrate, and the semiconductor chip is disposed on the lid frame and is encapsulated by a molding member.

17. The memory card pack of claim 14, wherein the molding member is an EMC (epoxy mold compound).

18. The memory card pack of claim 16, wherein the molding member is an EMC (epoxy mold compound).

19. The memory card pack of claim 1, wherein the adaptor and the expansion socket are fixed to each other.

20. The memory card pack of claim 1, wherein the adaptor and the socket are separated from each other.