The present invention relates to a logic gate, or to multiple logic gates, in which at least one memristor is used in the logic gate architecture.
Memristors (short for ‘memory-resistors’) are emerging as highly promising nanoscale programmable resistive memory devices, which have already found applications in areas such as very high density nonvolatile memory, physically uncloneable functions (PUFs), neuromorphic systems, and logic design. However, many of the existing memristor based logic architectures are designed to work over multiple clock cycles and require complex control logic for operation. As a result, these are not easy to integrate with existing CMOS technology and require complex control circuitries, which are incompatible with existing architectures. In addition, the capacitance in CMOS can be a limiting factor which sets a poor upper bound on CMOS based systems especially at higher frequencies. There are also the problems of reducing power consumption of logic gate circuits, and improving the chip area utilization.
The present invention has been devised in view of the above problems.
Accordingly, the present invention provides a logic gate comprising:
Embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which:
Memristors are known in the art as devices whose electrical resistance is changed by the electrical current that flows through the device. The resistance has a minimum value RON and a maximum value ROFF. The resistance can be switched and is nonvolatile (the resistance value is ‘remembered’), so that a memristor can be used as a memory element.
Memristors can be made of various materials, such as: TiO2 (for example with doped and undoped regions and with Pt electrodes); Ag/Ag5In5Sb60Te30/Ta; Ag-a-LSMO-Pt (Ag nano-filaments in amorphous manganite thin films); and other ferroelectric and doped polymeric materials. Embodiments of the present invention are not limited to any specific material, provided the memristive property is present. However, in preferred embodiments, the materials and voltages required are compatible with CMOS electronics.
A first embodiment of the invention is the purely memristive XOR architecture 10 as shown in
As summarized in Table I, the voltage difference between VL1 and VL2, i.e. the voltage across a hypothetical load resistance RL, behaves like the XOR operation with respect to input voltages applied to inputs A and B, which input voltages are either 0V for the low or OFF logic state, and +V1 for the high or ON logic state. In this table V1>VM and is assumed to be equivalent to VDD in CMOS logic, and represents the ON-state voltage. This is summarized in Lemma 1.
Lemma 1:
The pure memristor circuit in
Proof:
We show that the architecture in
Row-1: Follows trivially because no current flows in the circuit.
Row-2: In this case memristors M2=M3=ROFF because 0V appears at the positive terminal of M2 through A, and V1V appears at the negative terminal of M3 through B. In contrast, memristors M4=M1=RON because their positive terminals are closer to V1V and negative terminals closer to 0V. Because of voltage division the voltage at PR rises towards V1V, and that at PL falls towards 0V. Hence the current flows from B→PB→PR→*VL1→*VL2→PL→PT→A. Hence this is logic 1.
Row-3: This is similar to Row-2. Here M1=M4=ROFF, while M2=M3=RON. Again the voltage at PR rises towards V1V, and that at PL falls towards 0V. The current flows from A→PT→PR→VL1→VL2→PL→PB→B. Hence this is logic 1.
Row-4: In this case both PL(VL2) and PR(VL1) are at the same voltage level and no current flows through RL. Hence this is logic 0.
These operations can take place in the same clock cycle as the inputs. Hence the circuit in
VL1=A∨B (1)
VL2=A∧B (2)
VL1≥VL2. (3)
Further embodiments are shown in
These circuits are well suited for seamless integration with the existing CMOS technology without requiring any additional control input/logic, which most existing techniques require. Here the NMOS transistor (NMOST) and the PMOS transistor (PMOST) are assumed to operate in the saturation and cut off regions. The following analysis demonstrates the correctness of operation of these logic gates.
Lemma 2:
The NMOST in
VXOR=VL1∧
VXNOR=
Proof:
The proof follows by firstly noting Eq. (3). The only time VXOR in
Theorem 1:
The circuit in
Proof:
According to Eq. (2) and Eq. (1), the circuits in
The circuits in
The Design Rule for the logic gate circuits is now considered. Let ID,sat be the drain saturation current for the NMOST and PMOST. The design rule for the circuit in
(1) The NMOST is in saturation when A=B=VL1=VL2≈V1V. In this case M2=M4=RON, while M1=M3=ROFF. Also as far as VL1 is concerned, M2∥M4=RON∥RON. Hence, ID,sat=(VDD−VDS,sat)/(RD+RON∥RON)⇒(RD+RON/2)=(VDD−VDS,sat)/ID,sat.
(2) The NMOST is in its cutoff region when VL1≈V1V and VL2≈0V, i.e. when A=V1V and B=0V or A=0V and B=V1V. In the first case M1=ROFF and M3=RON, and in the second case M1=RON and M3=ROFF. In both the cases M1 and M3 form a voltage divider with respect to VL2. Hence, it needs to be ensured that ((V1×RON)/(RON+ROFF))<the threshold voltage of the NMOST.
Embodiments of the invention have been tested with several memristor models, and the designs work correctly for a range of RON and ROFF. For low RON a higher value of the resistance RD maybe necessary, while for higher RON, RD maybe eliminated altogether. The resistor RD can be a discrete resistor component, or can be a nanowire, or can be intrinsic resistance in the microcircuitry connection.
Full Adder Embodiment
The multifunctionality of the architecture (i.e. more than one logic operation output in a single gate) offers compact design of more complex circuits. This is demonstrated in a full adder circuit design.
A selection of buffered and unbuffered full adders has been designed. To simplify explanation of these designs, reference is made to
The designs are presented in Table II. The column ‘Architecture’ shows all possible ways of using the architectures of
In Table II, the column ‘Buffered’ represents the designs with CMOS inverters to achieve full voltage swing at the outputs (circuits shown in
Performance
The memristors were coded in Verilog-A based on the VTEAM model (Kvatinsky, S., Ramadan, M., Friedman, E. G., Kolodny, A.: ‘VTEAM: A General Model for Voltage-Controlled Memristors’, IEEE Trans. Circuits Syst. II: Express briefs, 2015, 62, (8), PP. 786-790) and the circuits were designed and simulated in Cadence Virtuoso (trade mark). The 32 nm technology node was used for the experiments with V1=VDD=1.2V, and ID,sat≈46.63 μA for the NMOST and ID,sat≈47.6 μA for the PMOST at 27 C operating temperature. As an example of RON and ROFF selection, if one sets RON=500Ω and ROFF=2KΩ, then based on Design Rule-(1) RD≈24KΩ. Also this ensures about 0.24V drop across RON to satisfy Design Rule-(2). A higher ROFF, e.g. ROFF=80KΩ, ensures better power performance.
The performance of 3T−4M embodiments of the invention has been compared with CMOS based designs from Mishra et al. (Mishra, S. S., Agrawal, A. K., Nagaria, R. K.: ‘A comparative performance analysis of various CMOS design techniques for XOR and XNOR circuits’, International Journal on Emerging Technologies, 2010, 1, (1), pp. 1-10). The first two rows of Table III present the performance of 3T−4M XOR and XNOR gates (corresponding to
The buffered full adder designs in Table II have also been tested at various frequencies. The 10T−12M design from the first row (XOR-XOR architecture) operated correctly at 8 GHz and required 63.53 μW power. This is lower than the power consumed by a single CMOS XOR gate (Table III).
Further Variants
Referring to
It is also possible to reverse the memristor polarities as shown in the circuit 60 in
A high performance multifunction logic architecture has been presented, which can be seamlessly integrated with the existing CMOS technology. One embodiment is a design comprising one transistor and four memristors (1T−4M) that requires considerably fewer transistors and memristors compared to existing techniques. The designs embodying the invention are capable of significantly outperforming existing CMOS as well as hybrid CMOS-memristor designs in terms of chip area, power consumption, and reliable performance, especially at high frequencies.
In particular, the 1T−4M design realizes multiple functions (XOR/AND or XNOR/OR) in a single cycle, i.e. during the same cycle the input is applied, and can be seamlessly integrated with the existing CMOS technology with the least overhead compared to any existing technique. One advantage of memristors is that it is possible to fabricate memristors in 3D whereas with CMOS only 2D fabrication is possible. This allows memristors to be fabricated along the Z-axis, layered over the X-Y axis of CMOS layout. In addition, the capacitance in CMOS can be a limiting factor which sets a rather poor upper bound on CMOS based systems especially at higher frequencies. These short comings of CMOS based designs are addressed by reducing the number of CMOS transistors in embodiments of the invention. This not only significantly improves the reliability of embodiments at high frequencies, it also enables very low power consumptions and much better chip area utilization. The latter is possible because space is freed up in the CMOS layer, where more CMOS functionality can be incorporated by units which solely depend on the CMOS technology. The proposed embodiments also enable reduced memristor count.
Additionally, the multifunctionality feature of the architecture embodying the invention allows highly compact and efficient design of systems, as demonstrated by the highly optimized, low complexity, full adder circuits defined herein.
Number | Date | Country | Kind |
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1603089.2 | Feb 2016 | GB | national |
Filing Document | Filing Date | Country | Kind |
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PCT/GB2017/050431 | 2/20/2017 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
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WO2017/144862 | 8/31/2017 | WO | A |
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