This patent application describes a MEMS microphone (MEMS=Micro Electromechanical System).
U.S. Pat. No. 4,816,125 describes a MEMS microphone with a piezoelectric layer made from ZnO and several electrodes connected to this layer that are arranged concentrically.
The following publication describes a microphone module with an encapsulated MEMS microphone, in which an enclosed air volume (back volume) is in a housing underneath the microphone's diaphragm: J. J. Neumann, Jr. and K. J. Gabriel, “A fully integrated CMOS-MEMS audio microphone,” the 12th International Conference on Solid State Sensors, Actuators, and Microsystems, 2003 IEEE, pp. 230-233.
The following publication describes an electrical module with an installed MEMS piezoresistive microphone: D. P. Arnold, et al., “A directional acoustic array using silicon micromachined piezoresistive microphones,” J. Acoust. Soc. Am., Vol. 113(1), 2003, pp. 289-298.
The following publication describes a piezoelectric microphone, which has two piezoelectric layers made from ZnO and a floating electrode arranged in-between: Mang-Nian Niu and Eun Sok Kim, “Piezoelectric Bimorph Microphone Built on Micromachined Parylene Diaphragm,” Journal of Microelectromechanical Systems, Vol. 12, 2003 IEEE, pp. 892-898.
Described herein is a sensitive microphone with a high signal-to-noise ratio.
It has been found that microphones that detect sound pressure using diaphragms are usually dependent on a large diaphragm displacement as a reaction to sound intensity in order to achieve desired characteristics in terms of sensitivity and noise behavior. For small components with built-in microphones, achievable displacement is limited by small diaphragm area. When diaphragm displacement is converted into an electrical quantity, only weak electrical signals can be obtained. The elasticity of a diaphragm produced in a deposition process can be negatively affected by a bias caused by a high internal mechanical stress.
MEMS microphones described here have an air chamber connected to a sound inlet opening and also a back volume. An enclosed air volume that prevents an acoustic short circuit—an undesired pressure balance between the front and back sides of the oscillating diaphragm—is referred to as a back volume. This air volume generates a restoring force for each diaphragm displacement in addition to the restoring force caused by the elastic diaphragm characteristics. For small components, the back volume is so small that even small diaphragm displacements lead to a considerable increase in pressure in the back volume, which can be on the order of magnitude of the sound level to be detected. The additional restoring force decreases the elasticity and the displacement of the diaphragm.
A microphone is described with a first and a second diaphragm, which are each connected to one and the same closed air volume and are thus coupled to each other so that, for a displacement of the first diaphragm, a simultaneous displacement of the second diaphragm is generated.
The first diaphragm is a microphone diaphragm, i.e., a “passive” diaphragm, which detects the sound pressure or converts an acoustic signal into an electrical signal. The second diaphragm is an auxiliary diaphragm or an “active” diaphragm, whose displacement generated by electrical driving interacts with the “passive” diaphragm via the closed air volume.
Two different strategies are described for the electrically driving the active diaphragm:
1) “Holding the enclosed air volume constant”: For this purpose, a signal derived from the passive diaphragm and amplified is fed to the active diaphragm such that the active diaphragm performs an opposite but equal-magnitude motion that is similar or identical to that of the passive diaphragm. For example, if the passive diaphragm is driven to a certain volume displacement towards the interior of the cavity by the external sound pressure, then an electrical driving of the active diaphragm by the approximately equivalent volume displacement away from the interior of the cavity is realized. As a result, the fluctuation of the chamber volume is reduced or eliminated. In this way, it is possible to reduce pressure fluctuations caused by the sound pressure in the closed air volume considerably, e.g., by at least a factor of two, in one embodiment by at least a factor of five. This reduction in internal pressure fluctuations, however, also means a corresponding reduction in the diaphragm restoring force. The effective back volume thus appears significantly enlarged, in the limiting case as infinite.
2) “Compensation of the passive diaphragm displacement”: Here, the electrical driving of the active diaphragm is part of a control circuit that reduces or even eliminates the displacement of the passive diaphragm, despite the effect of the external acoustic field on the passive diaphragm. A measure for this displacement is the electrical output signal of the passive diaphragm, which is held close to zero by the control circuit. At each moment, the active diaphragm establishes, for this purpose, an internal pressure in the chamber, which is close or equal to the external pressure (sound pressure). The resulting differential pressure for the passive diaphragm is reduced or disappears completely, which also applies to its displacement. Without significant diaphragm displacement of the passive diaphragm, however, the back volume causes, in turn, no relevant restoring forces on this diaphragm. The output signal of the arrangement in this case is not that of the passive diaphragm (which is definitely driven to zero in the described way), but instead the drive signal of the active diaphragm formed in the control circuit.
In both cases, a virtual back volume is achieved that is greater than the real back volume by a multiple (in one construction by at least two times, in one embodiment construction by at least five times).
The two circuit-related strategies for reducing the effective restoring force run the risk of building up feedback oscillations in the entire system. In one embodiment, therefore, circuit-related measures are provided for recognizing and preventing such conditions.
In a first construction, a microphone is specified with a body in which two openings are provided, which open into a cavity formed in the body. A first diaphragm is arranged over a first opening and a second diaphragm (auxiliary diaphragm) is arranged over a second opening, so that an air volume is enclosed in the cavity. The second diaphragm may be decoupled acoustically from the exterior by another cavity. A space in which the source of an acoustic input signal is located is referred to as the exterior.
A chamber that is connected to the exterior and isolated from the cavity is arranged over the first diaphragm. The cavity is designated below as the back volume.
The first diaphragm is arranged in a first cavity wall over an opening formed in this wall. In one embodiment, the second diaphragm is arranged in a second cavity wall. The diaphragms may be arranged in opposite cavity walls. Because the acoustic pressure change is transmitted equally in all directions when the diaphragm is dispersed, it is also possible to arrange the two diaphragms in walls standing at right angles to each other. The two diaphragms can be arranged in the same cavity wall.
The two diaphragms may have essentially the same mass and can be formed identically. The (passive) first diaphragm acts as a microphone diaphragm, while the (driven) second diaphragm functions as a loudspeaker diaphragm. In the case of a piezoelectric MEMS microphone based on the direct piezoelectric effect, for example, the displacement of the first diaphragm is converted into an electrical signal. In a capacitive MEMS microphone, the relative position of the electrodes of the microphone changes. The associated change in capacitance is converted into an electrical signal. The respective diaphragm can be basically an electromechanical converter operating with an electric field or magnetic field.
The displacement of the second diaphragm can be generated like in a loudspeaker, e.g., by a changing electric or magnetic field. The displacement of the second diaphragm with piezoelectric properties can be generated on the basis of the inverse piezoelectric effect.
In an embodiment, both diaphragms each have at least one piezoelectric layer. Both diaphragms may be constructed identically. Alternatively, it is possible for the electromechanical conversion in the diaphragms to be based on different electromechanical effects. For example, the first diaphragm can function as a capacitive MEMS microphone and the second diaphragm can function as a piezoelectric converter.
In one embodiment, a vent opening can be provided, which connects the enclosed air volumes (back volume of the microphone) and the exterior and which is small relative to the cross-sectional size of the diaphragm and which is used for slow pressure balancing, e.g., in the range of ≧100 ms. The pressure balancing is performed slowly relative to the period of an acoustic signal with the largest wavelength in the operating range of the microphone. This opening can be arranged in the diaphragm or in a wall of the container that encloses the acoustic back volume.
By virtue of the described compensation measures according to the first and the second embodiment, it is possible to reduce the real acoustic back volume (i.e., the closed air volume) relative to known microphones without an auxiliary diaphragm, so that space savings can be achieved. Nevertheless, because the virtual back volume can be kept sufficiently large, no disadvantageous consequences (loss of sensitivity) occur due to the smaller construction.
To prevent an acoustic short circuit of a driven auxiliary diaphragm to the exterior or to the sound inlet opening, an additional cavity isolated from the exterior is provided in an advantageous variant as an acoustic back volume for the auxiliary diaphragm. The additional cavity is separated by the auxiliary diaphragm from the closed air volume. The additional cavity can be smaller than the closed air volume, because the auxiliary diaphragm is driven actively and thus its displacement is set. The space requirements of the microphone arrangement can accordingly be kept small overall.
A microphone will be explained in detail below on the basis of embodiments and the associated figures. The figures show different embodiments of the microphone on the basis of schematic representations that are not to scale. Parts that are identical or that have identical functions are labeled with the same reference symbols.
The diaphragm M1, M2 can be mounted on the walls of the body GH. Alternatively, the diaphragm M1, M2 can be replaced by a microphone chip with a carrier substrate and a diaphragm mounted thereon. The microphone chip can be connected fixedly to the body GH, e.g., by an adhesive layer.
The first diaphragm M1 separates the cavity HR2 from a chamber HR1, which is connected to the exterior via a sound inlet opening IN. The first diaphragm M1 begins to vibrate as soon as an acoustic pressure p is exerted on it. The change in pressure in the chamber HR1 and the vibration of the diaphragm M1 would lead to a change in volume or pressure in the cavity HR2 (without the auxiliary diaphragm M2) and an associated restoring force, which acts on the first diaphragm M1 and reduces the vibration amplitude. Due to an electrical coupling of the two diaphragms M1, M2, they vibrate in such a manner that the displacement of the first diaphragm M1 is towards the interior of the cavity HR2 and the displacement of the second diaphragm M2 is realized with the same amplitude towards the outside. The active diaphragm M2 is driven in a push-pull way with respect to the passive first diaphragm M1. Here, a reduced change or no change at all in the volume of the cavity HR2 occurs.
The second diaphragm M2 separates the cavity HR2 from an additional closed cavity HR3, which is isolated from a space connected to a sound source, i.e., the exterior and the chamber HR1. The additional cavity HR3 prevents feedback of the active diaphragm onto the passive diaphragm on the outer path.
The additional cavity HR3 and/or the chamber HR1 can be created, e.g., by a cap-shaped, dimensionally stable cover.
In
The drive circuit V1 may contain an amplifier for amplifying the signal tapped at the diaphragm M1.
In
The direction of the diaphragm displacement is indicated with arrows in
In a variant of the embodiment presented in
In the variants presented in
In
The microphone is not limited to the number of elements shown in the figures or to the acoustically audible range from 20 Hz to 20 kHz. The microphone can also be used in other piezoelectric acoustic sensors, e.g., distance sensors operating with ultrasound. A microphone chip with a described microphone can be used in any signal-processing module. Different embodiments can also be combined with each other.
Number | Date | Country | Kind |
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10 2005 008 511 | Feb 2005 | DE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP2006/001121 | 2/8/2006 | WO | 00 | 5/22/2008 |
Publishing Document | Publishing Date | Country | Kind |
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WO2006/089641 | 8/31/2006 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
2105010 | Sawyer | Jan 1938 | A |
3447217 | Kumada | Jun 1969 | A |
3587322 | Lobdell et al. | Jun 1971 | A |
3726002 | Greenstein et al. | Apr 1973 | A |
3735211 | Kapnias | May 1973 | A |
3980917 | Kakizaki et al. | Sep 1976 | A |
4127840 | House | Nov 1978 | A |
4222277 | Kurtz | Sep 1980 | A |
4277814 | Giachino et al. | Jul 1981 | A |
4314226 | Oguro et al. | Feb 1982 | A |
4424419 | Chaput et al. | Jan 1984 | A |
4454440 | Cullen | Jun 1984 | A |
4456796 | Nakagawa et al. | Jun 1984 | A |
4504703 | Schneiter et al. | Mar 1985 | A |
4533795 | Baumhauer | Aug 1985 | A |
4545440 | Treadway | Oct 1985 | A |
4558184 | Busch-Vishniac et al. | Dec 1985 | A |
4628740 | Ueda et al. | Dec 1986 | A |
4641054 | Takahata et al. | Feb 1987 | A |
4691363 | Khanna | Sep 1987 | A |
4737742 | Takoshima et al. | Apr 1988 | A |
4776019 | Miyatake | Oct 1988 | A |
4816125 | Muller et al. | Mar 1989 | A |
4817168 | Fidi | Mar 1989 | A |
4825335 | Wilner | Apr 1989 | A |
4866683 | Phillips | Sep 1989 | A |
4908805 | Sprenkels et al. | Mar 1990 | A |
4910840 | Sprenkels et al. | Mar 1990 | A |
4984268 | Brown et al. | Jan 1991 | A |
4985926 | Foster | Jan 1991 | A |
5059848 | Mariani | Oct 1991 | A |
5091051 | Greer | Feb 1992 | A |
5101543 | Cote et al. | Apr 1992 | A |
5146435 | Bernstein | Sep 1992 | A |
5151763 | Marek et al. | Sep 1992 | A |
5153379 | Guzuk et al. | Oct 1992 | A |
5178015 | Loeppert et al. | Jan 1993 | A |
5184107 | Maurer | Feb 1993 | A |
5216490 | Greiff et al. | Jun 1993 | A |
5257547 | Boyer | Nov 1993 | A |
5357807 | Guckel et al. | Oct 1994 | A |
5394011 | Yamamoto et al. | Feb 1995 | A |
5408731 | Berggvist et al. | Apr 1995 | A |
5449909 | Kaiser et al. | Sep 1995 | A |
5452268 | Bernstein | Sep 1995 | A |
5459368 | Onishi et al. | Oct 1995 | A |
5465008 | Goetz et al. | Nov 1995 | A |
5477008 | Pasqualoni et al. | Dec 1995 | A |
5490220 | Loeppert | Feb 1996 | A |
5506919 | Roberts | Apr 1996 | A |
5531787 | Lesinski et al. | Jul 1996 | A |
5545912 | Ristic et al. | Aug 1996 | A |
5573435 | Grabbe et al. | Nov 1996 | A |
5592391 | Muyshondt et al. | Jan 1997 | A |
5593926 | Fujihira | Jan 1997 | A |
5650685 | Kosinski et al. | Jul 1997 | A |
5659195 | Kaiser et al. | Aug 1997 | A |
5712523 | Nakashima et al. | Jan 1998 | A |
5739585 | Akram et al. | Apr 1998 | A |
5740261 | Loeppert et al. | Apr 1998 | A |
5748758 | Menasco, Jr. et al. | May 1998 | A |
5821665 | Onishi et al. | Oct 1998 | A |
5831262 | Greywall et al. | Nov 1998 | A |
5838551 | Chan | Nov 1998 | A |
5852320 | Ichihashi | Dec 1998 | A |
5870482 | Loeppert et al. | Feb 1999 | A |
5872397 | Diffenderfer et al. | Feb 1999 | A |
5886876 | Yamaguchi | Mar 1999 | A |
5889872 | Sooriakumar et al. | Mar 1999 | A |
5901046 | Ohta et al. | May 1999 | A |
5923995 | Kao et al. | Jul 1999 | A |
5939968 | Nguyen et al. | Aug 1999 | A |
5990418 | Bivona et al. | Nov 1999 | A |
5999821 | Kaschke | Dec 1999 | A |
6012335 | Bashir et al. | Jan 2000 | A |
6052464 | Harris | Apr 2000 | A |
6057222 | Pahl et al. | May 2000 | A |
6075867 | Bay et al. | Jun 2000 | A |
6078245 | Fritz et al. | Jun 2000 | A |
6108184 | Minervini et al. | Aug 2000 | A |
6118881 | Quinlan et al. | Sep 2000 | A |
6136175 | Stelzl et al. | Oct 2000 | A |
6136419 | Fasano et al. | Oct 2000 | A |
6150753 | DeCastro | Nov 2000 | A |
6157546 | Petty et al. | Dec 2000 | A |
6163071 | Yamamura | Dec 2000 | A |
6178249 | Hietanen et al. | Jan 2001 | B1 |
6182342 | Sawin | Feb 2001 | B1 |
6187249 | Lewellin | Feb 2001 | B1 |
6191928 | Rector et al. | Feb 2001 | B1 |
6236145 | Biernacki | May 2001 | B1 |
6242842 | Pahl et al. | Jun 2001 | B1 |
6282072 | Minervini et al. | Aug 2001 | B1 |
6310420 | Pahl et al. | Oct 2001 | B1 |
6324907 | Halteren et al. | Dec 2001 | B1 |
6398943 | Arens-Fischer et al. | Jun 2002 | B1 |
6400065 | Toda et al. | Jun 2002 | B1 |
6413408 | Berger et al. | Jul 2002 | B1 |
6433412 | Ando et al. | Aug 2002 | B2 |
6437449 | Foster | Aug 2002 | B1 |
6439869 | Seng et al. | Aug 2002 | B1 |
6449828 | Pahl et al. | Sep 2002 | B2 |
6492194 | Bureau et al. | Dec 2002 | B1 |
6519822 | Stelzl et al. | Feb 2003 | B1 |
6522762 | Mullenborn | Feb 2003 | B1 |
6528924 | Stelzl et al. | Mar 2003 | B1 |
6530515 | Glenn et al. | Mar 2003 | B1 |
6555758 | Stelzl et al. | Apr 2003 | B1 |
6566672 | Schlough et al. | May 2003 | B1 |
6594369 | Une | Jul 2003 | B1 |
6613605 | Pace | Sep 2003 | B2 |
6614911 | Bryson et al. | Sep 2003 | B1 |
6621392 | Volant et al. | Sep 2003 | B1 |
6625031 | Sano et al. | Sep 2003 | B2 |
6649446 | Goetz et al. | Nov 2003 | B1 |
6674159 | Peterson et al. | Jan 2004 | B1 |
6685168 | Stelzl et al. | Feb 2004 | B1 |
6710840 | Umemoto | Mar 2004 | B2 |
6722030 | Stelzl et al. | Apr 2004 | B1 |
6732588 | Mullenborn et al. | May 2004 | B1 |
6781231 | Minervini | Aug 2004 | B2 |
6800987 | Toda | Oct 2004 | B2 |
6809413 | Peterson et al. | Oct 2004 | B1 |
6829131 | Loeb et al. | Dec 2004 | B1 |
6838739 | Stelzl et al. | Jan 2005 | B2 |
6838972 | Minervini | Jan 2005 | B1 |
6871388 | Ishino et al. | Mar 2005 | B2 |
6904155 | Yonehara et al. | Jun 2005 | B2 |
6909183 | Feiertag et al. | Jun 2005 | B2 |
6924429 | Kasai et al. | Aug 2005 | B2 |
6924974 | Stark | Aug 2005 | B2 |
6930364 | Bruner | Aug 2005 | B2 |
6982380 | Hoffman et al. | Jan 2006 | B2 |
7003127 | Sjursen | Feb 2006 | B1 |
7053456 | Matsuo | May 2006 | B2 |
7072482 | Van Doorn et al. | Jul 2006 | B2 |
7080442 | Kawamura et al. | Jul 2006 | B2 |
7091651 | Kinoshita | Aug 2006 | B2 |
7092539 | Sheplak et al. | Aug 2006 | B2 |
7094626 | Stelzl et al. | Aug 2006 | B2 |
7145283 | Takeuchi et al. | Dec 2006 | B2 |
7146016 | Pedersen | Dec 2006 | B2 |
7166910 | Minervini | Jan 2007 | B2 |
7242089 | Minervini | Jul 2007 | B2 |
7259041 | Stelzl et al. | Aug 2007 | B2 |
7298856 | Tajima et al. | Nov 2007 | B2 |
7381589 | Minervini | Jun 2008 | B2 |
7388281 | Krueger et al. | Jun 2008 | B2 |
7434305 | Minervini | Oct 2008 | B2 |
7439616 | Minervini | Oct 2008 | B2 |
7492019 | Carley | Feb 2009 | B2 |
7518201 | Stelzl et al. | Apr 2009 | B2 |
7518249 | Krueger et al. | Apr 2009 | B2 |
7537964 | Minervini | May 2009 | B2 |
7544540 | Bauer et al. | Jun 2009 | B2 |
7608789 | Krueger et al. | Oct 2009 | B2 |
7692288 | Zhe et al. | Apr 2010 | B2 |
7903831 | Song | Mar 2011 | B2 |
8018049 | Minervini | Sep 2011 | B2 |
8169041 | Pahl et al. | May 2012 | B2 |
8184845 | Leidl et al. | May 2012 | B2 |
8229139 | Pahl | Jul 2012 | B2 |
20010010444 | Pahl et al. | Aug 2001 | A1 |
20020067663 | Loeppert et al. | Jun 2002 | A1 |
20020074239 | Berger et al. | Jun 2002 | A1 |
20020076910 | Pace | Jun 2002 | A1 |
20020084722 | Vaughn | Jul 2002 | A1 |
20020102004 | Minervini | Aug 2002 | A1 |
20020110256 | Watson et al. | Aug 2002 | A1 |
20030007651 | Nakashima et al. | Jan 2003 | A1 |
20030010530 | Scheel et al. | Jan 2003 | A1 |
20030034536 | Scheeper et al. | Feb 2003 | A1 |
20030035558 | Kawamura et al. | Feb 2003 | A1 |
20030047806 | Stelzl et al. | Mar 2003 | A1 |
20030124829 | Pace | Jul 2003 | A1 |
20030133588 | Pedersen | Jul 2003 | A1 |
20030151133 | Kinayman et al. | Aug 2003 | A1 |
20030153116 | Carley et al. | Aug 2003 | A1 |
20040032705 | Ma | Feb 2004 | A1 |
20040046245 | Minervini | Mar 2004 | A1 |
20040058473 | Feiertag et al. | Mar 2004 | A1 |
20040064941 | Dozier et al. | Apr 2004 | A1 |
20040118595 | Flammer et al. | Jun 2004 | A1 |
20040150939 | Huff | Aug 2004 | A1 |
20040161530 | Stark | Aug 2004 | A1 |
20040231872 | Arnold et al. | Nov 2004 | A1 |
20040237299 | Stelzl et al. | Dec 2004 | A1 |
20040239449 | Stelzl et al. | Dec 2004 | A1 |
20050018864 | Minervini | Jan 2005 | A1 |
20050034888 | Hoffman et al. | Feb 2005 | A1 |
20050040734 | Kinoshita | Feb 2005 | A1 |
20050069164 | Muthuswamy et al. | Mar 2005 | A1 |
20050121785 | Stelzl et al. | Jun 2005 | A1 |
20050124181 | Brown et al. | Jun 2005 | A1 |
20050185812 | Minervini | Aug 2005 | A1 |
20050218488 | Matsuo | Oct 2005 | A1 |
20050242420 | Matsuda et al. | Nov 2005 | A1 |
20050270135 | Chua et al. | Dec 2005 | A1 |
20060082260 | Kinoshita | Apr 2006 | A1 |
20060151203 | Krueger et al. | Jul 2006 | A1 |
20060157841 | Minervini | Jul 2006 | A1 |
20060249802 | Stelzl et al. | Nov 2006 | A1 |
20070069354 | Dangelmaier et al. | Mar 2007 | A1 |
20070082421 | Minervini | Apr 2007 | A1 |
20070099327 | Hartzell et al. | May 2007 | A1 |
20070127982 | Bohlen et al. | Jun 2007 | A1 |
20070189558 | Ogura et al. | Aug 2007 | A1 |
20070201715 | Minervini | Aug 2007 | A1 |
20070202627 | Minervini | Aug 2007 | A1 |
20070217635 | Ogura et al. | Sep 2007 | A1 |
20070222056 | Bauer et al. | Sep 2007 | A1 |
20080038577 | Kruger et al. | Feb 2008 | A1 |
20080048317 | Krueger et al. | Feb 2008 | A1 |
20080247585 | Leidl et al. | Oct 2008 | A1 |
20080279407 | Pahl | Nov 2008 | A1 |
20090001553 | Pahl et al. | Jan 2009 | A1 |
20090071710 | Stelzl et al. | Mar 2009 | A1 |
20090080682 | Ogura et al. | Mar 2009 | A1 |
20090104415 | Schmajew et al. | Apr 2009 | A1 |
20090127697 | Pahl | May 2009 | A1 |
20110186943 | Pahl et al. | Aug 2011 | A1 |
20110210409 | Minervini | Sep 2011 | A1 |
Number | Date | Country |
---|---|---|
2315417 | Feb 2001 | CA |
198 06 818 | Nov 1999 | DE |
199 61 842 | Jul 2001 | DE |
101 45 100 | May 2002 | DE |
103 03 263 | Aug 2004 | DE |
202005001559 | Jun 2005 | DE |
10 2005 008 512 | Aug 2006 | DE |
0077615 | Apr 1983 | EP |
0774888 | May 1997 | EP |
0 742 643 | Feb 2002 | EP |
2 799 883 | Apr 2001 | FR |
55-134942 | Oct 1980 | JP |
55-150575 | Oct 1980 | JP |
57-100754 | Jun 1982 | JP |
57-207500 | Dec 1982 | JP |
61-033509 | Dec 1982 | JP |
58-030394 | Feb 1983 | JP |
58-203016 | Nov 1983 | JP |
62-230297 | Oct 1987 | JP |
03-116899 | May 1991 | JP |
04-281696 | Oct 1992 | JP |
06-81133 | Nov 1994 | JP |
06-334298 | Dec 1994 | JP |
07-212180 | Aug 1995 | JP |
07-212181 | Aug 1995 | JP |
07-297667 | Nov 1995 | JP |
08-043435 | Feb 1996 | JP |
05-299963 | Nov 1996 | JP |
09-153762 | Jun 1997 | JP |
10-321666 | Dec 1998 | JP |
11-026628 | Jan 1999 | JP |
11-508101 | Jul 1999 | JP |
11-274892 | Oct 1999 | JP |
2001-157298 | Jun 2001 | JP |
2001-339796 | Dec 2001 | JP |
2002-134875 | May 2002 | JP |
2003-078981 | Mar 2003 | JP |
2003-508998 | Mar 2003 | JP |
2003-304595 | Oct 2003 | JP |
2004-079776 | Mar 2004 | JP |
2004-088566 | Mar 2004 | JP |
2004-153408 | May 2004 | JP |
2004-229200 | Aug 2004 | JP |
2004-537182 | Dec 2004 | JP |
2005-198051 | Jul 2005 | JP |
2005-241380 | Sep 2005 | JP |
2005-244642 | Sep 2005 | JP |
2005-249666 | Sep 2005 | JP |
2005-294462 | Oct 2005 | JP |
2007-060661 | Mar 2007 | JP |
2007-524514 | Aug 2007 | JP |
2008-532369 | Aug 2008 | JP |
2009-501442 | Jan 2009 | JP |
WO9701258 | Jan 1997 | WO |
WO9943084 | Aug 1999 | WO |
WO9956390 | Nov 1999 | WO |
WO0042636 | Jul 2000 | WO |
WO0070630 | Nov 2000 | WO |
WO0119134 | Mar 2001 | WO |
WO0120948 | Mar 2001 | WO |
WO0126136 | Apr 2001 | WO |
WO0141497 | Jun 2001 | WO |
WO0215636 | Feb 2002 | WO |
WO0245463 | Jun 2002 | WO |
WO03017364 | Feb 2003 | WO |
WO2004019490 | Mar 2004 | WO |
WO2004051745 | Jun 2004 | WO |
WO2005036698 | Apr 2005 | WO |
WO2005086532 | Sep 2005 | WO |
WO2005086534 | Sep 2005 | WO |
WO2005086535 | Sep 2005 | WO |
WO2005102910 | Nov 2005 | WO |
WO2006089638 | Aug 2006 | WO |
WO2006089641 | Aug 2006 | WO |
WO2007010361 | Jan 2007 | WO |
WO2007022249 | Feb 2007 | WO |
Entry |
---|
“Design of a silicon microphone with differential read-out of a sealed double parallel-plate capacitor” by Jesper Bay et al., Sensors and Actuators A 53 (1996), pp. 232-236. |
Notification of Reasons for Refusal (english translation) in Japanese Patent Application No. 2008-539238, dated Nov. 11, 2011. |
International Search Report for PCT/EP06/001121. |
Written Opinion for PCT/EP06/001121. |
Arnold D. P. et al “A Directional Acoustic Array Using Silicon Micromachined Piezoresistive Microphones” J. of Acoustic Soc. Am. vol. 113, Jan. 2003, pp. 289-298. |
Bay J. et al “Design of a Silicon Microphone with Differential Read-out of a Sealed Double Parallel-Plate Capacitor” Int. Conf. Eurosensors, Jun. 25, 1995, pp. 700-703, XP010305041. |
Van der Donk et al “Amplitude-modulated Electromechanical Feedback System for Silicon Condenser Microphones” J. Micromech. Microeng. 2 (1992) 211-214, XP020069302. |
Becker Karl-F et al “MEMS Packaging—Technological Solutions for a Si-Microphone” Fraunhofer Inst. for Reliability and Micro Integration, Berlin; p. 405-406; Mar. 2004; ISBN: 2952110514; 2952110522. |
Hsieh, W. H. et al “A Micromachined Thin-film Teflon Electret Microphone” Dept. of Electrical Engineering, California Inst. of Technology ; vol. 1 p. 2B2.02 IEEE, 1997. |
Lukes M. “Silicon Condenser Microphone: Electroacoustic Model and Simulation” Czech Tech. University in Prague, Faculty of Electrical Engineering, Sep. 26, 2001, pp. 57-66. |
Neumann J. J. et al “A Fully-integrated CMOS-MEMS Audio Microphone” 12th Intl Conf. on Solid State Sensors, Actuators and Microsystems, Boston, Jun. 8-12, 2003, pp. 230-233. |
Niu M-N. et al “Piezoeclectric Bimorph Microphone Built on Micromachined Parylene Diaphragm” J. of Microelectrochemical Systems, vol. 12, No. 6, Dec. 2003; pp. 892-898, XP001200226, ISSN 1057-7157. |
Nobuomi Imai “A New Piezoelectric Microphone with Divided Electrodes and its Applications” J. Acoust. Soc. Jpn. (E) 11,6 (1990) pp. 327-333. |
Zhao Y. et al “MEMS-Based Piezoelectric Microphone for Biomedical Applications” MEMES Sensors and Actuators Lab (MSAL), Dept. of Electrical and Computer Engineering, The Inst. for Systems Research, U. of Maryland. |
Notification of Reasons for Refusal (English translation) in Japanese Patent Application No. 2008-535876, dated Dec. 8, 2011. |
Notification of Reasons for Refusal (English translation) in Japanese Patent Application No. 2007-556516, dated Apr. 12, 2012. |
Action and Response History in U.S. Appl. No. 11/816,964. |
Action and Response History in U.S. Appl. No. 12/092,423. |
Action and Response History in U.S. Appl. No. 12/092,439. |
Office Action in U.S. Appl. No. 11/816,960, dated Mar. 12, 2013. |
Notification of Reasons for Refusal (English translation) in Japanese Patent Application No. 2008-535876, dated Jul. 11, 2012. |
Action and Response History in U.S. Appl. No. 11/816,960. |
Action and Response History in U.S. Appl. No. 12/090,529. |
Action and Response History in U.S. Appl. No. 13/075,936. |
Notice of Allowance in U.S. Appl. No. 13/075,936, dated Dec. 26, 2012. |
International Preliminary Report on Patentability in Application No. PCT/EP05/004309, dated Nov. 29, 2006. |
International Search Report and Written Opinion in Application No. PCT/EP05/004309, dated Sep. 13, 2005. |
International Preliminary Report on Patentability in Application No. PCT/DE2006/001736, dated Apr. 29, 2008. |
International Search Report and Written Opinion in Application No. PCT/DE2006/001736, dated Mar. 12, 2007. |
International Search Report and Written Opinion in Application No. PCT/DE2006/001946, dated Feb. 22, 2007. |
International Preliminary Report on Patentability in Application No. PCT/DE2006/001946, dated Jun. 11, 2008. |
International Search Report and Written Opinion in Application No. PCT/DE2006/001945, dated Mar. 28, 2007. |
International Preliminary Report on Patentability in Application No. PCT/DE2006/001945, dated Jun. 11, 2008. |
International Search Report and Written Opinion in Application No. PCT/EP03/06596, dated Jan. 20, 2004. |
International Search Report in Application No. PCT/EP2006/001116, dated Aug. 31, 2006. |
International Preliminary Report on Patentability in Application No. PCT/EP2006/001116, dated Sep. 11, 2007 (incl. Written Opinion). |
International Search Report and Written Opinion in Application No. PCT/EP2005/008373, dated Nov. 8, 2005. |
International Preliminary Report on Patentability and Written Opinion for PCT/EP2006/001120, dated Sep. 11, 2007. |
International Search Report in Application No. PCT/EP2006/001120, dated Oct. 26, 2006. |
International Search Report in Application No. PCT/EP2006/001121, dated Jul. 7, 2006. |
International Preliminary Report on Patentability and Written Opinion for PCT/EP2006/001121, dated Sep. 11, 2007. |
Machine Translation of German Publication No. DE10303263A1, published Aug. 2004. |
Notification of reasons for Refusal in Japanese Patent Application No. 2007-556514, dated Jul. 13, 2011. |
Notification of reasons for Refusal in Japanese Patent Application No. 2007-556515, dated Jun. 23, 2011. |
Notification of reasons for Refusal in Japanese Patent Application No. 2007-556516, dated Sep. 22, 2011. |
Notification of reasons for Refusal in Japanese Patent Application No. 2008-539239, dated Sep. 22, 2011. |
Action and Response History in U.S. Appl. No. 10/523,875. |
Action and Response History in U.S. Appl. No. 11/578,854. |
Action and Response History in U.S. Appl. No. 11/573,610. |
Prosecution History in Re-Exam 95/000,509 (RE of US6,781,231). |
Prosecution History in Re-Exam 95/000,513 (RE of US7,242,089). |
Prosecution History in Re-Exam 95/000,515 (RE of US7,242,089). |
Prosecution History in Re-Exam 90/009,739 (RE of US7,242,089). |
Prosecution History in Re-Exam 90/009,740 (RE of US6,781,231). |
Arnold et al., “MEMS-Based Acoustic Array Technology”, 40th AIAA Aerospace Sciences Meeting and Exhibit, (Jan. 2002). |
Arnold, David P., “A MEMS-Based Directional Acoustic Array for Aeroacoustic Measurements”, Master's Thesis, Univ. of Florida (2001). |
Barton et al., “Optimisation of the Coating of a Fiber Optical Sensor Embedded in a Corss-ply GFRP Laminate” Composites: Part A 33 (2002) pp. 27-34. |
Bergqvist et al., “A Silicon Condenser Microphone Using Bond and Etch-Back Technology”, Sensors and Actuators A, vol. 45, pp. 115-124 (1994). |
Bever et al., “BICMOS Compatible Silicon Microphone Packaged as Surface Mount Device”, Sensors Expo (1999). |
Bouchard et al., “Dynamic Times for MEMS Microphones: MEMS Microphone Market & Supplier Analysis 2006-2013”, iSuppli Corporation (2009). |
Electronic Materials handbook, p. 483 (Fig. 1), ASM Int'l., (1989). |
Foresight Institute, “Nano 50 Awards Announced”, [online] Retrieved from the Internet:<URL: http://www.foresight.org/nanodot/?p=1990>, (Jul. 2005). |
Gale, Bruce K., “MEMS Packaging”, Microsystems Priciples (Oct. 2001). |
Giasolli, Robert, “MEMS Packaging Introduction”, (Nov. 2000). |
Gilleo, “MEMS/MOEMS Packaging: Concepts, Designs, Materials & Processes”, MEMS and MOEMS Packaging Challenges and Strategies, McGraw-Hill Companies, Inc., ch. 3:84-102, (2005). |
Gilleo, Ken, ed., Excerpt from Area Array Packaging Handbook, (2002). |
Gilleo, K. Handbook of flexible circuits, Gilleo, K. (ed), Van Nostrand Reinhold, 1992, pp. 145-166 [Ch. 8—Integrated Features]. |
Hannenmann et al., eds., Semiconductor Packaging: A Multidisciplinary Approach (1994). |
Harper, Chas. et al., Electronic Packaging, Microelectronics and Interconnection Dictionary, pp. 139, 190-191 (1993). |
Harper, Chas., ed., Electronic Packaging and Interconnection Handbook, 3rd Ed., McGraw-Hill, pp. 7.34 to 7.38 (2000). |
Hayes et al., “Micro-jet printing of polymers for electronics manufacturing” IEEE; pp. 168-173, XP 002342861 (1998). |
Hayes et al., “Printing systems for MEMS packaging” vol. 4558, 2001, pp. 206-214, XP 002342860. |
Henning et al., “Microfluidic MEMS for Semiconductor Processing”, IEEE Trans. On Components, Packaging and Manufacturing Technology, Pt. B, vol. 21(4), pp. 329-337 (Nov. 1998). |
Hsu, “MEMS Packaging: Fundamentals of MEMS Packaging”, INSPEC, Inst. of Electrical Engineers, pp. 17-19 (2004). |
Jedec Standard, “Terms, Definitions and Letter Symbols for Microelectronic Devices”, JEDEC Solid State Technology Assoc., Electronic Industries Alliance, JESD99A (Rev. of Feb. 2000, Mar. 2007). |
Kress et al., “Integrated Silicon Pressure Sensor for Automotice Applications with Electronic Trimming”, SAE Document 950533 (1995). |
Lau, John H., Ed., Ball Grid Array Technology, McGraw Hill, Inc., ISBN 0-07-036608-X, (Pub. 1995). |
Luthra, Mukluk, Process challenges and solutions for embedding Chip-On-Board into mainstream SMT assembly, pp. 426-433, Proc. Of the 4th Int'l. Symposium on Electronic Materials and Packaging (Dec. 2002). |
Maluf, Nadim, “An Introduction to Microelectromechanical Systems Engineering; , The Box: Packaging for MEMS”, ch. 6:201-203 (2000). |
National Semiconductor Corp., “Acoustic Applications of Pressure Transducers”, Pressure Transducer Handbook, pp. 12-1 to 12-5, (1977). |
National Semiconductor Corp., “Configurations, Packaging and Environment”, Pressure Transducer Handbook, pp. 4-2 to 4-5, (1977). |
Oda et al., “New Nanostructured Film Making Method Using Ultra Fine Particles”; pp. 21-26 (Feb. 1997). |
O'Neal, Chad et al., Challenges in the Packaging of MEMS, IEEE Int'l Symposium on Advanced Packaging Materials (1999). |
Pecht, Michael, ed., Handbook of Electronic Package Design, pp. 1-5, Fig. 1.1 (1991). |
Petersen et al., “Silicon Accelerometer Family; Manufactured for Automotive Applications”, (1992). |
Premachandran, C. S. et al., “Si-based Microphone Testing Methodology and Noise Reduction”, Proc. Of SPIE, vol. 4018, p. 588 (2000). |
Ramesham, Rajeshuni et al., Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS), Electronic Components and Technology Conference (2000). |
Schweber & Clark, “And the statuette goes to . . . ”, [online] Retrieved from the Internet:<URL: www.tmworld.com/file/13638-509581.pdf?force=true>, Electronics Design, Strategy, News (EDN), (Mar. 2005). |
Selmeier et al., “Recent Advances in Saw Packaging”, IEEE Ultrasonics Symposium; 2001; pp. 283-292. |
“Small Times Magazine Best of Small Tech Awards Recognize Micro and Nano Technologies Affecting Today's World”, [online] Retrieved from the Internet: <URL: http://www.nanotechwire.com/news.asp?nid=539>, [Nov. 10, 2003]. |
Torkkeli et al., “Capacitive Microphone with low-stress polysilicon membrane and high-stress polysilicon back plate”, Sensors and Actuators 85, pp. 116-123 (Aug. 25, 2000). |
Torkkeli et al., “Capacitive Silicon Microphone”, Physica Scripta, vol. T79, pp. 275-278, 1999, (Published at least by May 14, 1992). |
Tummala, Rao, ed., Fundamentals of Microsystems Packaging, McGraw-Hill Companies, Inc., Ch. 14:560-561 (2001). |
van Heeren, et al., “Overview of MEMS Process Technologies for high Volume Electronics”, 17 pgs. (Pub. Date: 2005 or later). |
Wikipedia, “Flip Chip”, [online] Retrieved from the Internet: <URL: http://en.wikipedia.org/wiki/Flip—chip>, [retrieved on Nov. 15, 2011]. |
Number | Date | Country | |
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20080267431 A1 | Oct 2008 | US |