MEMS microphone

Information

  • Patent Grant
  • 8582788
  • Patent Number
    8,582,788
  • Date Filed
    Wednesday, February 8, 2006
    18 years ago
  • Date Issued
    Tuesday, November 12, 2013
    11 years ago
Abstract
A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm.
Description
TECHNICAL FIELD

This patent application describes a MEMS microphone (MEMS=Micro Electromechanical System).


BACKGROUND

U.S. Pat. No. 4,816,125 describes a MEMS microphone with a piezoelectric layer made from ZnO and several electrodes connected to this layer that are arranged concentrically.


The following publication describes a microphone module with an encapsulated MEMS microphone, in which an enclosed air volume (back volume) is in a housing underneath the microphone's diaphragm: J. J. Neumann, Jr. and K. J. Gabriel, “A fully integrated CMOS-MEMS audio microphone,” the 12th International Conference on Solid State Sensors, Actuators, and Microsystems, 2003 IEEE, pp. 230-233.


The following publication describes an electrical module with an installed MEMS piezoresistive microphone: D. P. Arnold, et al., “A directional acoustic array using silicon micromachined piezoresistive microphones,” J. Acoust. Soc. Am., Vol. 113(1), 2003, pp. 289-298.


The following publication describes a piezoelectric microphone, which has two piezoelectric layers made from ZnO and a floating electrode arranged in-between: Mang-Nian Niu and Eun Sok Kim, “Piezoelectric Bimorph Microphone Built on Micromachined Parylene Diaphragm,” Journal of Microelectromechanical Systems, Vol. 12, 2003 IEEE, pp. 892-898.


SUMMARY

Described herein is a sensitive microphone with a high signal-to-noise ratio.


It has been found that microphones that detect sound pressure using diaphragms are usually dependent on a large diaphragm displacement as a reaction to sound intensity in order to achieve desired characteristics in terms of sensitivity and noise behavior. For small components with built-in microphones, achievable displacement is limited by small diaphragm area. When diaphragm displacement is converted into an electrical quantity, only weak electrical signals can be obtained. The elasticity of a diaphragm produced in a deposition process can be negatively affected by a bias caused by a high internal mechanical stress.


MEMS microphones described here have an air chamber connected to a sound inlet opening and also a back volume. An enclosed air volume that prevents an acoustic short circuit—an undesired pressure balance between the front and back sides of the oscillating diaphragm—is referred to as a back volume. This air volume generates a restoring force for each diaphragm displacement in addition to the restoring force caused by the elastic diaphragm characteristics. For small components, the back volume is so small that even small diaphragm displacements lead to a considerable increase in pressure in the back volume, which can be on the order of magnitude of the sound level to be detected. The additional restoring force decreases the elasticity and the displacement of the diaphragm.


A microphone is described with a first and a second diaphragm, which are each connected to one and the same closed air volume and are thus coupled to each other so that, for a displacement of the first diaphragm, a simultaneous displacement of the second diaphragm is generated.


The first diaphragm is a microphone diaphragm, i.e., a “passive” diaphragm, which detects the sound pressure or converts an acoustic signal into an electrical signal. The second diaphragm is an auxiliary diaphragm or an “active” diaphragm, whose displacement generated by electrical driving interacts with the “passive” diaphragm via the closed air volume.


Two different strategies are described for the electrically driving the active diaphragm:


1) “Holding the enclosed air volume constant”: For this purpose, a signal derived from the passive diaphragm and amplified is fed to the active diaphragm such that the active diaphragm performs an opposite but equal-magnitude motion that is similar or identical to that of the passive diaphragm. For example, if the passive diaphragm is driven to a certain volume displacement towards the interior of the cavity by the external sound pressure, then an electrical driving of the active diaphragm by the approximately equivalent volume displacement away from the interior of the cavity is realized. As a result, the fluctuation of the chamber volume is reduced or eliminated. In this way, it is possible to reduce pressure fluctuations caused by the sound pressure in the closed air volume considerably, e.g., by at least a factor of two, in one embodiment by at least a factor of five. This reduction in internal pressure fluctuations, however, also means a corresponding reduction in the diaphragm restoring force. The effective back volume thus appears significantly enlarged, in the limiting case as infinite.


2) “Compensation of the passive diaphragm displacement”: Here, the electrical driving of the active diaphragm is part of a control circuit that reduces or even eliminates the displacement of the passive diaphragm, despite the effect of the external acoustic field on the passive diaphragm. A measure for this displacement is the electrical output signal of the passive diaphragm, which is held close to zero by the control circuit. At each moment, the active diaphragm establishes, for this purpose, an internal pressure in the chamber, which is close or equal to the external pressure (sound pressure). The resulting differential pressure for the passive diaphragm is reduced or disappears completely, which also applies to its displacement. Without significant diaphragm displacement of the passive diaphragm, however, the back volume causes, in turn, no relevant restoring forces on this diaphragm. The output signal of the arrangement in this case is not that of the passive diaphragm (which is definitely driven to zero in the described way), but instead the drive signal of the active diaphragm formed in the control circuit.


In both cases, a virtual back volume is achieved that is greater than the real back volume by a multiple (in one construction by at least two times, in one embodiment construction by at least five times).


The two circuit-related strategies for reducing the effective restoring force run the risk of building up feedback oscillations in the entire system. In one embodiment, therefore, circuit-related measures are provided for recognizing and preventing such conditions.


In a first construction, a microphone is specified with a body in which two openings are provided, which open into a cavity formed in the body. A first diaphragm is arranged over a first opening and a second diaphragm (auxiliary diaphragm) is arranged over a second opening, so that an air volume is enclosed in the cavity. The second diaphragm may be decoupled acoustically from the exterior by another cavity. A space in which the source of an acoustic input signal is located is referred to as the exterior.


A chamber that is connected to the exterior and isolated from the cavity is arranged over the first diaphragm. The cavity is designated below as the back volume.


The first diaphragm is arranged in a first cavity wall over an opening formed in this wall. In one embodiment, the second diaphragm is arranged in a second cavity wall. The diaphragms may be arranged in opposite cavity walls. Because the acoustic pressure change is transmitted equally in all directions when the diaphragm is dispersed, it is also possible to arrange the two diaphragms in walls standing at right angles to each other. The two diaphragms can be arranged in the same cavity wall.


The two diaphragms may have essentially the same mass and can be formed identically. The (passive) first diaphragm acts as a microphone diaphragm, while the (driven) second diaphragm functions as a loudspeaker diaphragm. In the case of a piezoelectric MEMS microphone based on the direct piezoelectric effect, for example, the displacement of the first diaphragm is converted into an electrical signal. In a capacitive MEMS microphone, the relative position of the electrodes of the microphone changes. The associated change in capacitance is converted into an electrical signal. The respective diaphragm can be basically an electromechanical converter operating with an electric field or magnetic field.


The displacement of the second diaphragm can be generated like in a loudspeaker, e.g., by a changing electric or magnetic field. The displacement of the second diaphragm with piezoelectric properties can be generated on the basis of the inverse piezoelectric effect.


In an embodiment, both diaphragms each have at least one piezoelectric layer. Both diaphragms may be constructed identically. Alternatively, it is possible for the electromechanical conversion in the diaphragms to be based on different electromechanical effects. For example, the first diaphragm can function as a capacitive MEMS microphone and the second diaphragm can function as a piezoelectric converter.


In one embodiment, a vent opening can be provided, which connects the enclosed air volumes (back volume of the microphone) and the exterior and which is small relative to the cross-sectional size of the diaphragm and which is used for slow pressure balancing, e.g., in the range of ≧100 ms. The pressure balancing is performed slowly relative to the period of an acoustic signal with the largest wavelength in the operating range of the microphone. This opening can be arranged in the diaphragm or in a wall of the container that encloses the acoustic back volume.


By virtue of the described compensation measures according to the first and the second embodiment, it is possible to reduce the real acoustic back volume (i.e., the closed air volume) relative to known microphones without an auxiliary diaphragm, so that space savings can be achieved. Nevertheless, because the virtual back volume can be kept sufficiently large, no disadvantageous consequences (loss of sensitivity) occur due to the smaller construction.


To prevent an acoustic short circuit of a driven auxiliary diaphragm to the exterior or to the sound inlet opening, an additional cavity isolated from the exterior is provided in an advantageous variant as an acoustic back volume for the auxiliary diaphragm. The additional cavity is separated by the auxiliary diaphragm from the closed air volume. The additional cavity can be smaller than the closed air volume, because the auxiliary diaphragm is driven actively and thus its displacement is set. The space requirements of the microphone arrangement can accordingly be kept small overall.


A microphone will be explained in detail below on the basis of embodiments and the associated figures. The figures show different embodiments of the microphone on the basis of schematic representations that are not to scale. Parts that are identical or that have identical functions are labeled with the same reference symbols.





DESCRIPTION OF THE DRAWINGS


FIG. 1A, a part of a microphone according to a first embodiment, comprising two electrically coupled diaphragms in a schematic cross section;



FIG. 1B, equivalent circuit diagram of the microphone according to FIG. 1A;



FIGS. 2, 3, each a variant of the embodiment shown in FIG. 1;



FIG. 4A, a part of a microphone according to the second variant;



FIG. 4B, equivalent circuit diagram of the microphone according to FIG. 4A;



FIG. 5, an example microphone diaphragm in a schematic cross section;



FIG. 6, a metal layer, in which two electrodes connected electrically to external contacts are formed.





DETAILED DESCRIPTION


FIG. 1A shows a microphone with a body GH, which has openings AU1, AU2 opening into a cavity HR2 on its opposing walls HW1, HW2. A first diaphragm M1 (microphone diaphragm, passive diaphragm) is arranged over the first opening AU1 and a second diaphragm M2 (auxiliary diaphragm, driven diaphragm) is arranged over the second opening AU2.


The diaphragm M1, M2 can be mounted on the walls of the body GH. Alternatively, the diaphragm M1, M2 can be replaced by a microphone chip with a carrier substrate and a diaphragm mounted thereon. The microphone chip can be connected fixedly to the body GH, e.g., by an adhesive layer.


The first diaphragm M1 separates the cavity HR2 from a chamber HR1, which is connected to the exterior via a sound inlet opening IN. The first diaphragm M1 begins to vibrate as soon as an acoustic pressure p is exerted on it. The change in pressure in the chamber HR1 and the vibration of the diaphragm M1 would lead to a change in volume or pressure in the cavity HR2 (without the auxiliary diaphragm M2) and an associated restoring force, which acts on the first diaphragm M1 and reduces the vibration amplitude. Due to an electrical coupling of the two diaphragms M1, M2, they vibrate in such a manner that the displacement of the first diaphragm M1 is towards the interior of the cavity HR2 and the displacement of the second diaphragm M2 is realized with the same amplitude towards the outside. The active diaphragm M2 is driven in a push-pull way with respect to the passive first diaphragm M1. Here, a reduced change or no change at all in the volume of the cavity HR2 occurs.


The second diaphragm M2 separates the cavity HR2 from an additional closed cavity HR3, which is isolated from a space connected to a sound source, i.e., the exterior and the chamber HR1. The additional cavity HR3 prevents feedback of the active diaphragm onto the passive diaphragm on the outer path.


The additional cavity HR3 and/or the chamber HR1 can be created, e.g., by a cap-shaped, dimensionally stable cover.


In FIG. 1B, a simplified equivalent circuit diagram of diaphragms M1, M2 coupled by a control circuit V1 is shown. For a displacement of the passive diaphragm M1 caused by the sound pressure, an electrical signal is generated that can be tapped at the output OUT as a usable signal for further processing. A part of the electrical signal is used for generating a control signal at the output of the control circuit V1, with which the auxiliary diaphragm M2 is driven in a push-pull way (relative to the internal pressure established in the cavity HR2) with respect to the passive diaphragm.


The drive circuit V1 may contain an amplifier for amplifying the signal tapped at the diaphragm M1.



FIG. 2 shows an embodiment of the microphone presented in FIG. 1, in which both diaphragms M1, M2 are arranged in the same cavity wall HW1. In a cavity wall of the cavity HR2, a small ventilation opening VE connecting this cavity and the exterior is provided, whose cross-sectional size is clearly smaller (e.g., by at least a factor of 100) than the cross-sectional size of the diaphragm or the openings AU1 or AU2 and which is used for slow pressure balancing, e.g., in the range of ≧100 ms. In a cavity wall of the cavity HR3, a small ventilation opening VE′ connecting this cavity and the exterior is also provided.


In FIG. 3, the openings AU1, AU2 are provided in mutually perpendicular walls. The ventilation opening VE is formed here in the diaphragm M1.


The direction of the diaphragm displacement is indicated with arrows in FIGS. 1 to 4A, B.


In a variant of the embodiment presented in FIG. 4A, the active second diaphragm M2 is driven in a push-pull way (relative to the internal pressure) with the passive first diaphragm M1 in contrast to FIG. 1A. Here, the displacements of the two diaphragms are directed towards the interior of the air volume enclosed in the cavity HR2. In FIG. 4A, a dashed line shows how the passive diaphragm M1 would deform due to external sound pressure. A solid line shows the actual position of the diaphragm M1 achieved due to the compensating effect of the active diaphragm M2, wherein the diaphragm M1 remains practically in its rest position or oscillates with a very small amplitude relative to the displacement of the active diaphragm M2.



FIG. 4B shows an equivalent circuit diagram to the embodiment according to FIG. 4A. The electrical signal tapped at the diaphragm M1 is processed by the control circuit RK. On one hand, a control signal for driving the diaphragm M2 is output and, on the other, another control signal, which is superimposed on the signal tapped at the diaphragm M1 and damps the oscillation amplitude of the diaphragm M1. An output signal at the output OUT can be evaluated. The output OUT is connected here to the diaphragm M2.


In the variants presented in FIGS. 2 and 3, it is also possible to drive the active diaphragm M2 in common mode relative to the passive diaphragm M1, in order to damp the displacement amplitude of the passive diaphragm M1 in addition to the restoring force acting on this diaphragm.



FIG. 4B shows the equivalent circuit diagram of a microphone, which comprises a control circuit RK for compensating the displacement of the diaphragm M1. The output signal OUT2 is obtained here from the control circuit, while the signal of the converter M1 is held close to zero by the effect of the control. An example of a diaphragm with a piezoelectric layer PS arranged between two metal layers ML1, ML2 is shown in FIGS. 5 and 6. Electrodes E11 and E12 connected to the external contacts AE1, AE2 are arranged in the first metal layer ML1. A floating conductive area, which lies opposite the two electrodes E11, E12, is formed in the second metal layer ML2. Here, two capacitors connected to each other in series are formed.


In FIG. 6, a first metal layer ML1 of the diaphragm presented in FIG. 5 is shown. The round electrode E11 is arranged in a first high-potential region and the annular electrode E12 is arranged in a second high-potential region. The two high-potential regions have opposite polarity. The electrodes E11, E12 are each connected to external contacts AE1 and AE2, respectively. In a metal layer ML2 arranged underneath or above and shown in FIG. 5, a continuous, floating, conductive surface may be arranged, which is opposite the two electrodes E11, E12.


The microphone is not limited to the number of elements shown in the figures or to the acoustically audible range from 20 Hz to 20 kHz. The microphone can also be used in other piezoelectric acoustic sensors, e.g., distance sensors operating with ultrasound. A microphone chip with a described microphone can be used in any signal-processing module. Different embodiments can also be combined with each other.

Claims
  • 1. A microphone comprising: a first diaphragm that is passive and thus not responsive to an electrical signal;a driver to generate a signal in response to displacement of the first diaphragm; anda second diaphragm coupled to the first diaphragm by a closed air volume, the second diaphragm being active and being movable in response to the signal generated by the driver;wherein the first diaphragm and the second diaphragm each comprises a piezoelectric diaphragm.
  • 2. The microphone of claim 1, further comprising structure that defines a first cavity, the structure having a first opening and a second opening that lead to the first cavity;wherein the first diaphragm is over the first opening and the second diaphragm is over the second opening, thereby defining the closed air volume;wherein the second diaphragm is controlled by the signal so that, if the first diaphragm moves towards an interior of the first cavity, the second diaphragm moves away from the interior of the first cavity; andwherein a volume displacement resulting from movement of the second diaphragm is between 50% and 100% of a volume displacement resulting from movement of the first diaphragm.
  • 3. The microphone of claim 1, wherein movement of the first diaphragm and movement of the second diaphragm occur in a same direction relative to the closed air volume.
  • 4. The microphone of claim 3, further comprising structure that defines a first cavity, the structure having a first opening and a second opening that lead to the first cavity;wherein the first diaphragm is over the first opening and the second diaphragm is over the second opening, thereby defining the closed air volume; andwherein a volume displacement resulting from movement of the second diaphragm is between 50% and 100% of a volume displacement resulting from movement of the first diaphragm.
  • 5. The microphone of claim 1, wherein the first diaphragm and the second diaphragm are not opposite each other relative to the closed air volume.
  • 6. The microphone of claim 5, further comprising structure that defines a first cavity, the structure having a first opening and a second opening that lead to the first cavity;wherein the first diaphragm is over the first opening and the second diaphragm is over the second opening, thereby defining the closed air volume;wherein the second diaphragm is controlled by the signal so that, if the first diaphragm moves towards an interior of the first cavity, the second diaphragm moves away from the interior of the first cavity; andwherein a volume displacement resulting from movement of the second diaphragm is between 50% and 100% of a volume displacement resulting from movement of the first diaphragm.
  • 7. The microphone of claim 1, wherein the closed air volume functions as a back volume; and wherein structure that defines the closed air volume includes a ventilation opening to balance an internal pressure of the closed air volume with an external pressure outside of the microphone, where pressure balancing occurs over a time that exceeds a period of an acoustic signal applied to the first diaphragm.
  • 8. A microphone comprising: a first diaphragm coupled to a closed air volume, the first diaphragm being passive and thus movable in response to pressure but not responsive to an electrical signal;a second diaphragm being active and thus movable in response to a control signal, the second diaphragm being movable in response to the control signal to dampen an oscillation amplitude of the first diaphragm; anda driver to generate the control signal in response to movement of the first diaphragm.
  • 9. The microphone of claim 8, wherein changes in pressure on both sides of the first diaphragm are essentially equal in magnitude.
  • 10. The microphone of claim 8, wherein the control signal is for controlling the second diaphragm so that displacement of the first diaphragm results in displacement of the second diaphragm so as to produce a change in pressure in the closed air volume that substantially counteracts the pressure and thereby reduces displacement of the first diaphragm by 50%-100%.
  • 11. The microphone of claim 8, wherein the second diaphragm is coupled to the closed air volume; and wherein the first diaphragm is connected to a first wall and the second diaphragm is connected to a second wall, the first and second walls being part of a structure that houses the closed air volume.
  • 12. The microphone of claim 11, wherein the first and second walls face each other.
  • 13. The microphone of claim 11, wherein the first and second walls are substantially perpendicular.
  • 14. The microphone of 8, wherein the second diaphragm is coupled to the closed air volume; and wherein the first and second diaphragms are arranged along a same wall that is part of a structure that houses the closed air volume.
  • 15. The microphone of claim 8, wherein the second diaphragm is coupled to the closed air volume; and wherein the first and second diaphragms have substantially same masses.
  • 16. The microphone of claim 8, wherein the second diaphragm is coupled to the closed air volume; and wherein the first and second diaphragms have substantially same shapes.
  • 17. The microphone of claim 8, further comprising: a chamber that includes a sound inlet opening that leads to an exterior of the microphone, the chamber being adjacent to the first diaphragm and isolated from the closed air volume.
  • 18. The microphone of claim 8, wherein the second diaphragm is coupled to the closed air volume; and wherein the driver comprises a control circuit to tap an electrical signal from the first diaphragm and to output the control signal to the second diaphragm to produce a displacement that affects internal pressure in the closed air volume and thereby reduces displacement of the first diaphragm.
  • 19. The microphone of claim 18, wherein the control circuit comprises an amplifier.
  • 20. The microphone of claim 8, wherein the second diaphragm is coupled to the closed air volume; and wherein a structure housing the closed air volume comprises at least one ventilation opening to an exterior of the microphone, the ventilation opening being is smaller than cross-sectional areas of the first and second diaphragms.
  • 21. The microphone of claim 20, wherein the ventilation opening is in the first diaphragm or in a wall of the structure.
  • 22. The microphone of one of claims 8, wherein the second diaphragm is coupled to the closed air volume; and wherein the closed air volume is a first closed air volume, and the second diaphragm is coupled to a second closed air volume on a side of the second diaphragm that is different from a side of the second diaphragm that faces the first closed air volume.
  • 23. The microphone of claim 8, wherein the second diaphragm is coupled to the closed air volume; and wherein the driver comprises an electrical circuit connected to the first diaphragm and/or to the second diaphragm to reduce feedback oscillations.
Priority Claims (1)
Number Date Country Kind
10 2005 008 511 Feb 2005 DE national
PCT Information
Filing Document Filing Date Country Kind 371c Date
PCT/EP2006/001121 2/8/2006 WO 00 5/22/2008
Publishing Document Publishing Date Country Kind
WO2006/089641 8/31/2006 WO A
US Referenced Citations (222)
Number Name Date Kind
2105010 Sawyer Jan 1938 A
3447217 Kumada Jun 1969 A
3587322 Lobdell et al. Jun 1971 A
3726002 Greenstein et al. Apr 1973 A
3735211 Kapnias May 1973 A
3980917 Kakizaki et al. Sep 1976 A
4127840 House Nov 1978 A
4222277 Kurtz Sep 1980 A
4277814 Giachino et al. Jul 1981 A
4314226 Oguro et al. Feb 1982 A
4424419 Chaput et al. Jan 1984 A
4454440 Cullen Jun 1984 A
4456796 Nakagawa et al. Jun 1984 A
4504703 Schneiter et al. Mar 1985 A
4533795 Baumhauer Aug 1985 A
4545440 Treadway Oct 1985 A
4558184 Busch-Vishniac et al. Dec 1985 A
4628740 Ueda et al. Dec 1986 A
4641054 Takahata et al. Feb 1987 A
4691363 Khanna Sep 1987 A
4737742 Takoshima et al. Apr 1988 A
4776019 Miyatake Oct 1988 A
4816125 Muller et al. Mar 1989 A
4817168 Fidi Mar 1989 A
4825335 Wilner Apr 1989 A
4866683 Phillips Sep 1989 A
4908805 Sprenkels et al. Mar 1990 A
4910840 Sprenkels et al. Mar 1990 A
4984268 Brown et al. Jan 1991 A
4985926 Foster Jan 1991 A
5059848 Mariani Oct 1991 A
5091051 Greer Feb 1992 A
5101543 Cote et al. Apr 1992 A
5146435 Bernstein Sep 1992 A
5151763 Marek et al. Sep 1992 A
5153379 Guzuk et al. Oct 1992 A
5178015 Loeppert et al. Jan 1993 A
5184107 Maurer Feb 1993 A
5216490 Greiff et al. Jun 1993 A
5257547 Boyer Nov 1993 A
5357807 Guckel et al. Oct 1994 A
5394011 Yamamoto et al. Feb 1995 A
5408731 Berggvist et al. Apr 1995 A
5449909 Kaiser et al. Sep 1995 A
5452268 Bernstein Sep 1995 A
5459368 Onishi et al. Oct 1995 A
5465008 Goetz et al. Nov 1995 A
5477008 Pasqualoni et al. Dec 1995 A
5490220 Loeppert Feb 1996 A
5506919 Roberts Apr 1996 A
5531787 Lesinski et al. Jul 1996 A
5545912 Ristic et al. Aug 1996 A
5573435 Grabbe et al. Nov 1996 A
5592391 Muyshondt et al. Jan 1997 A
5593926 Fujihira Jan 1997 A
5650685 Kosinski et al. Jul 1997 A
5659195 Kaiser et al. Aug 1997 A
5712523 Nakashima et al. Jan 1998 A
5739585 Akram et al. Apr 1998 A
5740261 Loeppert et al. Apr 1998 A
5748758 Menasco, Jr. et al. May 1998 A
5821665 Onishi et al. Oct 1998 A
5831262 Greywall et al. Nov 1998 A
5838551 Chan Nov 1998 A
5852320 Ichihashi Dec 1998 A
5870482 Loeppert et al. Feb 1999 A
5872397 Diffenderfer et al. Feb 1999 A
5886876 Yamaguchi Mar 1999 A
5889872 Sooriakumar et al. Mar 1999 A
5901046 Ohta et al. May 1999 A
5923995 Kao et al. Jul 1999 A
5939968 Nguyen et al. Aug 1999 A
5990418 Bivona et al. Nov 1999 A
5999821 Kaschke Dec 1999 A
6012335 Bashir et al. Jan 2000 A
6052464 Harris Apr 2000 A
6057222 Pahl et al. May 2000 A
6075867 Bay et al. Jun 2000 A
6078245 Fritz et al. Jun 2000 A
6108184 Minervini et al. Aug 2000 A
6118881 Quinlan et al. Sep 2000 A
6136175 Stelzl et al. Oct 2000 A
6136419 Fasano et al. Oct 2000 A
6150753 DeCastro Nov 2000 A
6157546 Petty et al. Dec 2000 A
6163071 Yamamura Dec 2000 A
6178249 Hietanen et al. Jan 2001 B1
6182342 Sawin Feb 2001 B1
6187249 Lewellin Feb 2001 B1
6191928 Rector et al. Feb 2001 B1
6236145 Biernacki May 2001 B1
6242842 Pahl et al. Jun 2001 B1
6282072 Minervini et al. Aug 2001 B1
6310420 Pahl et al. Oct 2001 B1
6324907 Halteren et al. Dec 2001 B1
6398943 Arens-Fischer et al. Jun 2002 B1
6400065 Toda et al. Jun 2002 B1
6413408 Berger et al. Jul 2002 B1
6433412 Ando et al. Aug 2002 B2
6437449 Foster Aug 2002 B1
6439869 Seng et al. Aug 2002 B1
6449828 Pahl et al. Sep 2002 B2
6492194 Bureau et al. Dec 2002 B1
6519822 Stelzl et al. Feb 2003 B1
6522762 Mullenborn Feb 2003 B1
6528924 Stelzl et al. Mar 2003 B1
6530515 Glenn et al. Mar 2003 B1
6555758 Stelzl et al. Apr 2003 B1
6566672 Schlough et al. May 2003 B1
6594369 Une Jul 2003 B1
6613605 Pace Sep 2003 B2
6614911 Bryson et al. Sep 2003 B1
6621392 Volant et al. Sep 2003 B1
6625031 Sano et al. Sep 2003 B2
6649446 Goetz et al. Nov 2003 B1
6674159 Peterson et al. Jan 2004 B1
6685168 Stelzl et al. Feb 2004 B1
6710840 Umemoto Mar 2004 B2
6722030 Stelzl et al. Apr 2004 B1
6732588 Mullenborn et al. May 2004 B1
6781231 Minervini Aug 2004 B2
6800987 Toda Oct 2004 B2
6809413 Peterson et al. Oct 2004 B1
6829131 Loeb et al. Dec 2004 B1
6838739 Stelzl et al. Jan 2005 B2
6838972 Minervini Jan 2005 B1
6871388 Ishino et al. Mar 2005 B2
6904155 Yonehara et al. Jun 2005 B2
6909183 Feiertag et al. Jun 2005 B2
6924429 Kasai et al. Aug 2005 B2
6924974 Stark Aug 2005 B2
6930364 Bruner Aug 2005 B2
6982380 Hoffman et al. Jan 2006 B2
7003127 Sjursen Feb 2006 B1
7053456 Matsuo May 2006 B2
7072482 Van Doorn et al. Jul 2006 B2
7080442 Kawamura et al. Jul 2006 B2
7091651 Kinoshita Aug 2006 B2
7092539 Sheplak et al. Aug 2006 B2
7094626 Stelzl et al. Aug 2006 B2
7145283 Takeuchi et al. Dec 2006 B2
7146016 Pedersen Dec 2006 B2
7166910 Minervini Jan 2007 B2
7242089 Minervini Jul 2007 B2
7259041 Stelzl et al. Aug 2007 B2
7298856 Tajima et al. Nov 2007 B2
7381589 Minervini Jun 2008 B2
7388281 Krueger et al. Jun 2008 B2
7434305 Minervini Oct 2008 B2
7439616 Minervini Oct 2008 B2
7492019 Carley Feb 2009 B2
7518201 Stelzl et al. Apr 2009 B2
7518249 Krueger et al. Apr 2009 B2
7537964 Minervini May 2009 B2
7544540 Bauer et al. Jun 2009 B2
7608789 Krueger et al. Oct 2009 B2
7692288 Zhe et al. Apr 2010 B2
7903831 Song Mar 2011 B2
8018049 Minervini Sep 2011 B2
8169041 Pahl et al. May 2012 B2
8184845 Leidl et al. May 2012 B2
8229139 Pahl Jul 2012 B2
20010010444 Pahl et al. Aug 2001 A1
20020067663 Loeppert et al. Jun 2002 A1
20020074239 Berger et al. Jun 2002 A1
20020076910 Pace Jun 2002 A1
20020084722 Vaughn Jul 2002 A1
20020102004 Minervini Aug 2002 A1
20020110256 Watson et al. Aug 2002 A1
20030007651 Nakashima et al. Jan 2003 A1
20030010530 Scheel et al. Jan 2003 A1
20030034536 Scheeper et al. Feb 2003 A1
20030035558 Kawamura et al. Feb 2003 A1
20030047806 Stelzl et al. Mar 2003 A1
20030124829 Pace Jul 2003 A1
20030133588 Pedersen Jul 2003 A1
20030151133 Kinayman et al. Aug 2003 A1
20030153116 Carley et al. Aug 2003 A1
20040032705 Ma Feb 2004 A1
20040046245 Minervini Mar 2004 A1
20040058473 Feiertag et al. Mar 2004 A1
20040064941 Dozier et al. Apr 2004 A1
20040118595 Flammer et al. Jun 2004 A1
20040150939 Huff Aug 2004 A1
20040161530 Stark Aug 2004 A1
20040231872 Arnold et al. Nov 2004 A1
20040237299 Stelzl et al. Dec 2004 A1
20040239449 Stelzl et al. Dec 2004 A1
20050018864 Minervini Jan 2005 A1
20050034888 Hoffman et al. Feb 2005 A1
20050040734 Kinoshita Feb 2005 A1
20050069164 Muthuswamy et al. Mar 2005 A1
20050121785 Stelzl et al. Jun 2005 A1
20050124181 Brown et al. Jun 2005 A1
20050185812 Minervini Aug 2005 A1
20050218488 Matsuo Oct 2005 A1
20050242420 Matsuda et al. Nov 2005 A1
20050270135 Chua et al. Dec 2005 A1
20060082260 Kinoshita Apr 2006 A1
20060151203 Krueger et al. Jul 2006 A1
20060157841 Minervini Jul 2006 A1
20060249802 Stelzl et al. Nov 2006 A1
20070069354 Dangelmaier et al. Mar 2007 A1
20070082421 Minervini Apr 2007 A1
20070099327 Hartzell et al. May 2007 A1
20070127982 Bohlen et al. Jun 2007 A1
20070189558 Ogura et al. Aug 2007 A1
20070201715 Minervini Aug 2007 A1
20070202627 Minervini Aug 2007 A1
20070217635 Ogura et al. Sep 2007 A1
20070222056 Bauer et al. Sep 2007 A1
20080038577 Kruger et al. Feb 2008 A1
20080048317 Krueger et al. Feb 2008 A1
20080247585 Leidl et al. Oct 2008 A1
20080279407 Pahl Nov 2008 A1
20090001553 Pahl et al. Jan 2009 A1
20090071710 Stelzl et al. Mar 2009 A1
20090080682 Ogura et al. Mar 2009 A1
20090104415 Schmajew et al. Apr 2009 A1
20090127697 Pahl May 2009 A1
20110186943 Pahl et al. Aug 2011 A1
20110210409 Minervini Sep 2011 A1
Foreign Referenced Citations (76)
Number Date Country
2315417 Feb 2001 CA
198 06 818 Nov 1999 DE
199 61 842 Jul 2001 DE
101 45 100 May 2002 DE
103 03 263 Aug 2004 DE
202005001559 Jun 2005 DE
10 2005 008 512 Aug 2006 DE
0077615 Apr 1983 EP
0774888 May 1997 EP
0 742 643 Feb 2002 EP
2 799 883 Apr 2001 FR
55-134942 Oct 1980 JP
55-150575 Oct 1980 JP
57-100754 Jun 1982 JP
57-207500 Dec 1982 JP
61-033509 Dec 1982 JP
58-030394 Feb 1983 JP
58-203016 Nov 1983 JP
62-230297 Oct 1987 JP
03-116899 May 1991 JP
04-281696 Oct 1992 JP
06-81133 Nov 1994 JP
06-334298 Dec 1994 JP
07-212180 Aug 1995 JP
07-212181 Aug 1995 JP
07-297667 Nov 1995 JP
08-043435 Feb 1996 JP
05-299963 Nov 1996 JP
09-153762 Jun 1997 JP
10-321666 Dec 1998 JP
11-026628 Jan 1999 JP
11-508101 Jul 1999 JP
11-274892 Oct 1999 JP
2001-157298 Jun 2001 JP
2001-339796 Dec 2001 JP
2002-134875 May 2002 JP
2003-078981 Mar 2003 JP
2003-508998 Mar 2003 JP
2003-304595 Oct 2003 JP
2004-079776 Mar 2004 JP
2004-088566 Mar 2004 JP
2004-153408 May 2004 JP
2004-229200 Aug 2004 JP
2004-537182 Dec 2004 JP
2005-198051 Jul 2005 JP
2005-241380 Sep 2005 JP
2005-244642 Sep 2005 JP
2005-249666 Sep 2005 JP
2005-294462 Oct 2005 JP
2007-060661 Mar 2007 JP
2007-524514 Aug 2007 JP
2008-532369 Aug 2008 JP
2009-501442 Jan 2009 JP
WO9701258 Jan 1997 WO
WO9943084 Aug 1999 WO
WO9956390 Nov 1999 WO
WO0042636 Jul 2000 WO
WO0070630 Nov 2000 WO
WO0119134 Mar 2001 WO
WO0120948 Mar 2001 WO
WO0126136 Apr 2001 WO
WO0141497 Jun 2001 WO
WO0215636 Feb 2002 WO
WO0245463 Jun 2002 WO
WO03017364 Feb 2003 WO
WO2004019490 Mar 2004 WO
WO2004051745 Jun 2004 WO
WO2005036698 Apr 2005 WO
WO2005086532 Sep 2005 WO
WO2005086534 Sep 2005 WO
WO2005086535 Sep 2005 WO
WO2005102910 Nov 2005 WO
WO2006089638 Aug 2006 WO
WO2006089641 Aug 2006 WO
WO2007010361 Jan 2007 WO
WO2007022249 Feb 2007 WO
Non-Patent Literature Citations (95)
Entry
“Design of a silicon microphone with differential read-out of a sealed double parallel-plate capacitor” by Jesper Bay et al., Sensors and Actuators A 53 (1996), pp. 232-236.
Notification of Reasons for Refusal (english translation) in Japanese Patent Application No. 2008-539238, dated Nov. 11, 2011.
International Search Report for PCT/EP06/001121.
Written Opinion for PCT/EP06/001121.
Arnold D. P. et al “A Directional Acoustic Array Using Silicon Micromachined Piezoresistive Microphones” J. of Acoustic Soc. Am. vol. 113, Jan. 2003, pp. 289-298.
Bay J. et al “Design of a Silicon Microphone with Differential Read-out of a Sealed Double Parallel-Plate Capacitor” Int. Conf. Eurosensors, Jun. 25, 1995, pp. 700-703, XP010305041.
Van der Donk et al “Amplitude-modulated Electromechanical Feedback System for Silicon Condenser Microphones” J. Micromech. Microeng. 2 (1992) 211-214, XP020069302.
Becker Karl-F et al “MEMS Packaging—Technological Solutions for a Si-Microphone” Fraunhofer Inst. for Reliability and Micro Integration, Berlin; p. 405-406; Mar. 2004; ISBN: 2952110514; 2952110522.
Hsieh, W. H. et al “A Micromachined Thin-film Teflon Electret Microphone” Dept. of Electrical Engineering, California Inst. of Technology ; vol. 1 p. 2B2.02 IEEE, 1997.
Lukes M. “Silicon Condenser Microphone: Electroacoustic Model and Simulation” Czech Tech. University in Prague, Faculty of Electrical Engineering, Sep. 26, 2001, pp. 57-66.
Neumann J. J. et al “A Fully-integrated CMOS-MEMS Audio Microphone” 12th Intl Conf. on Solid State Sensors, Actuators and Microsystems, Boston, Jun. 8-12, 2003, pp. 230-233.
Niu M-N. et al “Piezoeclectric Bimorph Microphone Built on Micromachined Parylene Diaphragm” J. of Microelectrochemical Systems, vol. 12, No. 6, Dec. 2003; pp. 892-898, XP001200226, ISSN 1057-7157.
Nobuomi Imai “A New Piezoelectric Microphone with Divided Electrodes and its Applications” J. Acoust. Soc. Jpn. (E) 11,6 (1990) pp. 327-333.
Zhao Y. et al “MEMS-Based Piezoelectric Microphone for Biomedical Applications” MEMES Sensors and Actuators Lab (MSAL), Dept. of Electrical and Computer Engineering, The Inst. for Systems Research, U. of Maryland.
Notification of Reasons for Refusal (English translation) in Japanese Patent Application No. 2008-535876, dated Dec. 8, 2011.
Notification of Reasons for Refusal (English translation) in Japanese Patent Application No. 2007-556516, dated Apr. 12, 2012.
Action and Response History in U.S. Appl. No. 11/816,964.
Action and Response History in U.S. Appl. No. 12/092,423.
Action and Response History in U.S. Appl. No. 12/092,439.
Office Action in U.S. Appl. No. 11/816,960, dated Mar. 12, 2013.
Notification of Reasons for Refusal (English translation) in Japanese Patent Application No. 2008-535876, dated Jul. 11, 2012.
Action and Response History in U.S. Appl. No. 11/816,960.
Action and Response History in U.S. Appl. No. 12/090,529.
Action and Response History in U.S. Appl. No. 13/075,936.
Notice of Allowance in U.S. Appl. No. 13/075,936, dated Dec. 26, 2012.
International Preliminary Report on Patentability in Application No. PCT/EP05/004309, dated Nov. 29, 2006.
International Search Report and Written Opinion in Application No. PCT/EP05/004309, dated Sep. 13, 2005.
International Preliminary Report on Patentability in Application No. PCT/DE2006/001736, dated Apr. 29, 2008.
International Search Report and Written Opinion in Application No. PCT/DE2006/001736, dated Mar. 12, 2007.
International Search Report and Written Opinion in Application No. PCT/DE2006/001946, dated Feb. 22, 2007.
International Preliminary Report on Patentability in Application No. PCT/DE2006/001946, dated Jun. 11, 2008.
International Search Report and Written Opinion in Application No. PCT/DE2006/001945, dated Mar. 28, 2007.
International Preliminary Report on Patentability in Application No. PCT/DE2006/001945, dated Jun. 11, 2008.
International Search Report and Written Opinion in Application No. PCT/EP03/06596, dated Jan. 20, 2004.
International Search Report in Application No. PCT/EP2006/001116, dated Aug. 31, 2006.
International Preliminary Report on Patentability in Application No. PCT/EP2006/001116, dated Sep. 11, 2007 (incl. Written Opinion).
International Search Report and Written Opinion in Application No. PCT/EP2005/008373, dated Nov. 8, 2005.
International Preliminary Report on Patentability and Written Opinion for PCT/EP2006/001120, dated Sep. 11, 2007.
International Search Report in Application No. PCT/EP2006/001120, dated Oct. 26, 2006.
International Search Report in Application No. PCT/EP2006/001121, dated Jul. 7, 2006.
International Preliminary Report on Patentability and Written Opinion for PCT/EP2006/001121, dated Sep. 11, 2007.
Machine Translation of German Publication No. DE10303263A1, published Aug. 2004.
Notification of reasons for Refusal in Japanese Patent Application No. 2007-556514, dated Jul. 13, 2011.
Notification of reasons for Refusal in Japanese Patent Application No. 2007-556515, dated Jun. 23, 2011.
Notification of reasons for Refusal in Japanese Patent Application No. 2007-556516, dated Sep. 22, 2011.
Notification of reasons for Refusal in Japanese Patent Application No. 2008-539239, dated Sep. 22, 2011.
Action and Response History in U.S. Appl. No. 10/523,875.
Action and Response History in U.S. Appl. No. 11/578,854.
Action and Response History in U.S. Appl. No. 11/573,610.
Prosecution History in Re-Exam 95/000,509 (RE of US6,781,231).
Prosecution History in Re-Exam 95/000,513 (RE of US7,242,089).
Prosecution History in Re-Exam 95/000,515 (RE of US7,242,089).
Prosecution History in Re-Exam 90/009,739 (RE of US7,242,089).
Prosecution History in Re-Exam 90/009,740 (RE of US6,781,231).
Arnold et al., “MEMS-Based Acoustic Array Technology”, 40th AIAA Aerospace Sciences Meeting and Exhibit, (Jan. 2002).
Arnold, David P., “A MEMS-Based Directional Acoustic Array for Aeroacoustic Measurements”, Master's Thesis, Univ. of Florida (2001).
Barton et al., “Optimisation of the Coating of a Fiber Optical Sensor Embedded in a Corss-ply GFRP Laminate” Composites: Part A 33 (2002) pp. 27-34.
Bergqvist et al., “A Silicon Condenser Microphone Using Bond and Etch-Back Technology”, Sensors and Actuators A, vol. 45, pp. 115-124 (1994).
Bever et al., “BICMOS Compatible Silicon Microphone Packaged as Surface Mount Device”, Sensors Expo (1999).
Bouchard et al., “Dynamic Times for MEMS Microphones: MEMS Microphone Market & Supplier Analysis 2006-2013”, iSuppli Corporation (2009).
Electronic Materials handbook, p. 483 (Fig. 1), ASM Int'l., (1989).
Foresight Institute, “Nano 50 Awards Announced”, [online] Retrieved from the Internet:<URL: http://www.foresight.org/nanodot/?p=1990>, (Jul. 2005).
Gale, Bruce K., “MEMS Packaging”, Microsystems Priciples (Oct. 2001).
Giasolli, Robert, “MEMS Packaging Introduction”, (Nov. 2000).
Gilleo, “MEMS/MOEMS Packaging: Concepts, Designs, Materials & Processes”, MEMS and MOEMS Packaging Challenges and Strategies, McGraw-Hill Companies, Inc., ch. 3:84-102, (2005).
Gilleo, Ken, ed., Excerpt from Area Array Packaging Handbook, (2002).
Gilleo, K. Handbook of flexible circuits, Gilleo, K. (ed), Van Nostrand Reinhold, 1992, pp. 145-166 [Ch. 8—Integrated Features].
Hannenmann et al., eds., Semiconductor Packaging: A Multidisciplinary Approach (1994).
Harper, Chas. et al., Electronic Packaging, Microelectronics and Interconnection Dictionary, pp. 139, 190-191 (1993).
Harper, Chas., ed., Electronic Packaging and Interconnection Handbook, 3rd Ed., McGraw-Hill, pp. 7.34 to 7.38 (2000).
Hayes et al., “Micro-jet printing of polymers for electronics manufacturing” IEEE; pp. 168-173, XP 002342861 (1998).
Hayes et al., “Printing systems for MEMS packaging” vol. 4558, 2001, pp. 206-214, XP 002342860.
Henning et al., “Microfluidic MEMS for Semiconductor Processing”, IEEE Trans. On Components, Packaging and Manufacturing Technology, Pt. B, vol. 21(4), pp. 329-337 (Nov. 1998).
Hsu, “MEMS Packaging: Fundamentals of MEMS Packaging”, INSPEC, Inst. of Electrical Engineers, pp. 17-19 (2004).
Jedec Standard, “Terms, Definitions and Letter Symbols for Microelectronic Devices”, JEDEC Solid State Technology Assoc., Electronic Industries Alliance, JESD99A (Rev. of Feb. 2000, Mar. 2007).
Kress et al., “Integrated Silicon Pressure Sensor for Automotice Applications with Electronic Trimming”, SAE Document 950533 (1995).
Lau, John H., Ed., Ball Grid Array Technology, McGraw Hill, Inc., ISBN 0-07-036608-X, (Pub. 1995).
Luthra, Mukluk, Process challenges and solutions for embedding Chip-On-Board into mainstream SMT assembly, pp. 426-433, Proc. Of the 4th Int'l. Symposium on Electronic Materials and Packaging (Dec. 2002).
Maluf, Nadim, “An Introduction to Microelectromechanical Systems Engineering; , The Box: Packaging for MEMS”, ch. 6:201-203 (2000).
National Semiconductor Corp., “Acoustic Applications of Pressure Transducers”, Pressure Transducer Handbook, pp. 12-1 to 12-5, (1977).
National Semiconductor Corp., “Configurations, Packaging and Environment”, Pressure Transducer Handbook, pp. 4-2 to 4-5, (1977).
Oda et al., “New Nanostructured Film Making Method Using Ultra Fine Particles”; pp. 21-26 (Feb. 1997).
O'Neal, Chad et al., Challenges in the Packaging of MEMS, IEEE Int'l Symposium on Advanced Packaging Materials (1999).
Pecht, Michael, ed., Handbook of Electronic Package Design, pp. 1-5, Fig. 1.1 (1991).
Petersen et al., “Silicon Accelerometer Family; Manufactured for Automotive Applications”, (1992).
Premachandran, C. S. et al., “Si-based Microphone Testing Methodology and Noise Reduction”, Proc. Of SPIE, vol. 4018, p. 588 (2000).
Ramesham, Rajeshuni et al., Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS), Electronic Components and Technology Conference (2000).
Schweber & Clark, “And the statuette goes to . . . ”, [online] Retrieved from the Internet:<URL: www.tmworld.com/file/13638-509581.pdf?force=true>, Electronics Design, Strategy, News (EDN), (Mar. 2005).
Selmeier et al., “Recent Advances in Saw Packaging”, IEEE Ultrasonics Symposium; 2001; pp. 283-292.
“Small Times Magazine Best of Small Tech Awards Recognize Micro and Nano Technologies Affecting Today's World”, [online] Retrieved from the Internet: <URL: http://www.nanotechwire.com/news.asp?nid=539>, [Nov. 10, 2003].
Torkkeli et al., “Capacitive Microphone with low-stress polysilicon membrane and high-stress polysilicon back plate”, Sensors and Actuators 85, pp. 116-123 (Aug. 25, 2000).
Torkkeli et al., “Capacitive Silicon Microphone”, Physica Scripta, vol. T79, pp. 275-278, 1999, (Published at least by May 14, 1992).
Tummala, Rao, ed., Fundamentals of Microsystems Packaging, McGraw-Hill Companies, Inc., Ch. 14:560-561 (2001).
van Heeren, et al., “Overview of MEMS Process Technologies for high Volume Electronics”, 17 pgs. (Pub. Date: 2005 or later).
Wikipedia, “Flip Chip”, [online] Retrieved from the Internet: <URL: http://en.wikipedia.org/wiki/Flip—chip>, [retrieved on Nov. 15, 2011].
Related Publications (1)
Number Date Country
20080267431 A1 Oct 2008 US