The invention relates to micro electromechanical optical switches applicable to optical communication industry, and especially relates to a self-assembly structure of micro electromechanical optical switch utilizing residual stress.
Micro electromechanical systems are the kind of microminiaturized mechanical, optical or electronic devices that can operate with sound, light, electricity, magnetism, taste, cooling, heating as well as motion and so on, and mainly include mechanical and electronic components. In recent years, optical systems utilize optical micro electromechanical (optical MEMS) technology of semiconductor manufacturing and other related micro machining process and technology to get various types of high accuracy, high optical quality miniature electromechanical elements, like lens, mirror, diffraction grating and so on. In accompany with built-in micro actuators, the micro electromechanical elements may directly manipulate the light, and extremely arouse people's attentions in the optical communication domain. However, the micro electromechanical elements made by semiconductor manufacturing or other micro machining processes are mostly of thin film structure. Therefore, it is a very important topic to develop a mirror actuator that can be self-assembled to provide a larger displacement.
U.S. Pat. No. 6,292,600 discloses a free-rotating hinged micro-mirror switching element operated in “open” and “close” states. The micro-mirror comprises a mirror connected to the substrate by free-rotating micro-hinges. The hinges include one or more hinge pins and one or more hinge staples. Pushrods are connected at one end to the mirror and at the opposite end to the translation stage with hinge joints. And the actuated component is the scratch-drive actuator (SDA). Through applying appropriate voltage to the SDA, the SDA can be deformed or moved to a certain extent. The deformation or movement in turn causes the pushrods to act upon the mirror and rotate it to a predetermined position or angle from the substrate. Such design is able to turn the linear movement of the pushrods into rotation of the mirror and relatively reduce the entire device dimensions. However, because the degree of freedom of the mirror rotation is extremely sensitive to the optical fiber coupling efficiency, the mirror rotation angle has to be precisely controlled and encounters much difficulty.
Besides, in U.S. Pat. Nos. 6,526,198 and 6,556,741, the micro-mirror switch includes a substrate, an electrode coupled to the substrate, and a micromachined plate rotatably coupled to the substrate about a pivot axis. The micro-mirror has an orientated reflective surface mounted to the micromachined plate. An electrical source is coupled to the electrode and the micromachined plate. When voltage is applied, the electrostatic force causes the actuator move downward. The high reflection mirror surface is assembled to the actuator and perpendicular to the substrate. In order to avoid causing electrical short when the mirror moves down, a landing electrode with a buckle beam is specially used. Though the structure may provide precise movement, but each optical switch element needs additional assembly, which consumes time and a lot of work.
In order to solve the above problems, the invention provides a micro electromechanical optical switch having a self-assembly structure. The assembly cost and error are reduced by the self-assembly mechanism.
The self-assembly structure of micro electromechanical optical switch of the invention mainly includes a substrate, a base plate, a mirror and three curved beams (respectively as first curved beam, second curved beam and third curved beam). One end of the base plate is anchored on the substrate. Another end is free. A side of the mirror is pivoted on the base plate. One end of the first curved beam is fixed on the substrate; the other end is located between the base plate and the substrate so that the residual stress of the first curved beam lifts the base plate upward and away from the substrate. On the other hand, one end of the second curved beam is anchored on the base plate; the other end is plate; the other end is located at the pivot potion of the mirror pivoted to the base plate. The residual stress of the second curved beam lifts the mirror slightly. Then, the third curved beam rotates the mirror up about vertical to the base plate, and accomplish the self-assembly.
Furthermore, the invention includes magnetic-activated elements on the mirror and the base plate. So that, an external magnetic force can be applied to control the relative position of the mirror and the base plate and achieve self-assembly.
The invention will become more fully understood from the detailed description given herein below. However, this description is for purposes of illustration only, and thus is not limitative of the invention, wherein:
One end of the first curved beam 40 is fixed to the substrate 10; the other end extends to a position between the substrate 10 and the base plate 20. One end of the second curved beam 601 is anchored on the base plate 20; the other end extends to a position under the mirror 30 and about the central portion. One end of the third curved beam 50 is anchored on the base plate 20; the other end extends to the pivot portion of the mirror 30 connecting to the base plate 20. The front end of the third curved beam 50 is formed with an opening 51 and a tenon 511.
As shown in
The design of the curved beam is shown in
The residual stresses of two materials enable a micro cantilever beam to have a stress gradient distribution and cause the micro cantilever beam bend according to the moment of force and get a displacement. By theory of material mechanics, a double-layer plate structure with known thickness, Young's modulus and uniform stress values σ1 and σ2 respectively, then its radius of curvature ρ and the displacement δ are calculated:
Table 1 shows some examples of calculation. The materials respectively are silicon rich nitride and poly-silicon. The Young's modulus of silicon rich nitride is 300 Gpa and mean residual stress value is 100 Mpa. The Young's modulus of poly-silicon is 160 Gpa and mean residual stress value is 0 Mpa. The thickness is 0.4 um for silicon rich nitride and 2 um for poly-silicon. There have been a lot of related researches of prior arts. The listed examples are just embodiments. They are certainly not limited to the two materials.
On the other hand, please refer to
The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Number | Date | Country | Kind |
---|---|---|---|
93118512 | Jun 2004 | TW | national |