Number | Name | Date | Kind |
---|---|---|---|
4672365 | Gehman et al. | Jun 1987 | |
4737770 | Brunius et al. | Apr 1988 | |
4761648 | Ellis | Aug 1988 | |
4855713 | Brunius | Aug 1989 | |
4906055 | Horiuchi | Mar 1990 | |
4947484 | Twitty et al. | Aug 1990 | |
4951029 | Severson | Aug 1990 | |
4980913 | Skret | Dec 1990 | |
5302902 | Groehl | Apr 1994 | |
5331318 | Montgomery | Jul 1994 | |
5363071 | Schwent et al. | Nov 1994 | |
5410536 | Shah et al. | Apr 1995 | |
5506572 | Hills et al. | Apr 1996 | |
5512890 | Everson, Jr. et al. | Apr 1996 | |
5559499 | Haubner | Sep 1996 | |
5586121 | Moura et al. | Dec 1996 | |
5602831 | Gaskill | Feb 1997 | |
5625622 | Johri | Apr 1997 | |
5633861 | Hanson et al. | May 1997 |
Entry |
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DiGiacomo, G. Metal Migration (Ag. Cu. Pb) in Encapsulated Modules and Time-to-Fail Model as a Function of the Environment and Package Properties, IEEE/Proc. IRPS, pp. 27-33 (1982). |