Metal alloy injection molding overflows

Information

  • Patent Grant
  • 9027631
  • Patent Number
    9,027,631
  • Date Filed
    Friday, December 14, 2012
    11 years ago
  • Date Issued
    Tuesday, May 12, 2015
    9 years ago
Abstract
Metal alloy injection molding techniques are described. In one or more implementations, these techniques may also include adjustment of injection pressure, configuration of runners, and/or use of vacuum pressure, and so on to encourage flow of the metal alloy through a mold. Techniques are also described that utilize protrusions to counteract thermal expansion and subsequent contraction of the metal alloy upon cooling. Further, techniques are described in which a radius of edges of a feature is configured to encourage flow and reduce voids. A variety of other techniques are also described herein.
Description
RELATED MATTERS

This application claims priority under 35 USC 119(b) to International Application No. PCT/CN2012/083085 filed Oct. 17, 2012, the disclosure of which is incorporated in its entirety.


BACKGROUND

Injection molding is a manufacturing process that is conventionally utilized to form articles from plastic. This may include use of thermoplastic and thermosetting plastic materials to form an article, such as a toy, car parts, and so on.


Techniques were subsequently developed to use injection molding for materials other than plastic, such as metal alloys. However, characteristics of the metal alloys could limit use of conventional injection molding techniques to small articles such as watch parts due to complications caused by these characteristics, such as to flow, thermal expansion, and so on.


SUMMARY

Metal alloy injection molding techniques are described. In one or more implementations, these techniques may include adjustment of injection pressure, configuration of runners, and/or use of vacuum pressure, and so on to encourage flow of the metal alloy through a mold. Techniques are also described that utilize protrusions to counteract thermal expansion and subsequent contraction of the metal alloy upon cooling. Further, techniques are described in which a radius of edges of a feature is configured to encourage flow and reduce voids. A variety of other techniques are also described herein.


This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.





BRIEF DESCRIPTION OF THE DRAWINGS

The detailed description is described with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The use of the same reference numbers in different instances in the description and the figures may indicate similar or identical items. Entities represented in the figures may be indicative of one or more entities and thus reference may be made interchangeably to single or plural forms of the entities in the discussion.



FIG. 1 is an illustration of an environment in an example implementation that is operable to employ injection molding techniques described herein.



FIG. 2 depicts an example implementation in which features of an article molded using a system of FIG. 1 is shown.



FIG. 3 depicts an example implementation in which a cavity defined by mold portions may be shaped to form a wall and features of FIG. 2.



FIG. 4 depicts a system in an example implementation in which an injection distribution device is used to physically couple an outflow of injected metal alloy from an injection device to a mold of a molding device.



FIG. 5 depicts an example implementation showing comparison of respective cross sections of the runner and the plurality of sub-runners of FIG. 4.



FIG. 6 depicts a system in an example implementation in which a vacuum device is employed to create negative pressure inside a cavity of the mold to promote flow of the metal alloy.



FIG. 7 depicts a system in an example implementation in which a mold includes one or more overflows to bias a flow of metal alloy through a mold.



FIG. 8 depicts an example implementation in which a protrusion is utilized to reduce an effect of thermal expansion caused by varying degrees of thickness of an article to be molded.



FIG. 9 depicts an example implementation in which a mold is employed that includes edges configured to reduce voids.



FIG. 10 is a flow diagram depicting a procedure in an example implementation in which an article is injected molded using a mold that employs overflows.



FIG. 11 is a flow diagram depicting a procedure in an example implementation in which a mold is formed that employs overflows.



FIG. 12 is a flow diagram depicting a procedure in an example implementation in which a protrusion is formed to at least partially counteract thermal expansion of the metal alloy and subsequent contraction caused by cooling of the metal alloy.



FIG. 13 is a flow diagram depicting a procedure in an example implementation in which a mold is formed that is configured to form a protrusion on an article to counteract an effect of thermal expansion.



FIG. 14 is a flow diagram depicting a procedure in an example implementation in which a radius is employed to limit formation of voids of the article.





DETAILED DESCRIPTION
Overview

Conventional injection molding techniques could encounter complications when utilized for a metal alloy. For example, characteristics of the metal alloy may make these conventional techniques unsuitable to make articles over a relatively short length (e.g., larger than a watch part), that are relatively thin (e.g., less than one millimeter), and so on due to such characteristics of thermal expansion, cooling in a mold, and so forth.


Metal alloy injection molding techniques are described. In one or more implementations, techniques are described that may be utilized to support injection molding of a metal alloy, such as a metal alloy that is comprised primarily of magnesium. These techniques include configuration of runners used to fill a cavity of a mold such that a rate of flow is not slowed by the runners, such as to match an overall size of branches of a runner to a runner from which they branch.


In another example, injection pressure and vacuum pressure may be arranged to encourage flow through an entirety of a cavity that is used to form an article. The vacuum pressure, for instance, may be used to bias flow toward portions of the cavity that otherwise may be difficult to fill. This biasing may also be performed using overflows to encourage flow toward these areas, such as areas of the cavity that are feature rich and thus may be difficult to fill using conventional techniques.


In a further example, protrusions may be formed to counteract effects of thermal expansion on an article to be molded. The protrusions, for instance, may be sized to counteract shrinkage caused by a thickness of a feature after the metal alloy cools in the mold. In this way, the protrusions may be used to form a substantially flat surface even though features may be disposed on an opposing side of the surface.


In yet another example, a radius may be employed by features to encourage fill and reduce voids in an article. In a relatively thin article (e.g., less than one millimeter), for instance, sharp corners may cause voids at the corners due to turbulence and other factors encountered in the injection of the metal alloy into a mold. Accordingly, a radius may be utilized that is based at least in part on a thickness of the article to encourage flow and reduce voids. A variety of other examples are also contemplated, further discussion of which may be found in relation to the following sections.


In the following discussion, an example environment is first described that may employ the techniques described herein. Example procedures are then described which may be performed in the example environment as well as other environments. Consequently, performance of the example procedures is not limited to the example environment and the example environment is not limited to performance of the example procedures. It should be readily apparent that these technique may be combined, separated, and so on.


Example Environment



FIG. 1 is an illustration of an environment in an example implementation showing a system 100 that is operable to employ injection mold techniques described herein. The illustrated environment includes a computing device 102 that is communicatively coupled to an injection device 104 and a molding device 106. Although illustrated separately, the functionality represented by these apparatus may be combined, further divided, and so on.


The computing device 102 is illustrated as including an injection molding control module 108, which is representative of functionality to control operation of the injection device 104 and molding device 106. The injection molding control module 108, for instance, may utilize one or more instructions 110 stored on a computer-readable storage media 112. The one or more instructions 110 may then be used to control operation of the injection device 104 and molding device 106 to form an article using injection molding.


The injection device 104, for instance, may include an injection control module 116 to control heating and injection of a metal alloy 118 that is to be injected into a mold 120 of the molding device 106. Injection device 104, for instance, may include a heating element to heat and liquefy the metal alloy 118, such as to melt a metal alloy comprised primarily of magnesium to approximately six hundred and fifty degrees Celsius. The injection device 104 may then employ an injector (e.g., a plunger or screw type injector) to inject the metal alloy 118 in liquid form under pressure into the mold 120 of the molding device, such as at approximately forty mPa although other pressures are also contemplated.


The molding device 106 is illustrated as including a mold control module 122, which is representative of functionality to control operation of the mold 120. The mold 120, for instance, may a plurality of mold portions 124, 126. The mold portions 124, 126 when disposed proximal to each other form a cavity 128 that defines the article 114 to be molded. The mold portions 124, 126 may then be moved apart to remove the article 114 from the mold 120.


As previously described, conventional techniques may encounter complications when used to mold an article 114 using a metal alloy 118. For example, an article 114 having walls with a thickness of less than one millimeter may make it difficult to fill an entirety of the cavity 128 to form the article 114 as the metal alloy 118 may not readily flow through the cavity 128 before cooling. This may be further complicated when the article 114 includes a variety of different features that are to be formed on part of the wall, as further described as follows and shown in a corresponding figure.



FIG. 2 depicts an example implementation 200 in which features of an article molded using the system 100 of FIG. 1 is shown. In this example, the article 114 is configured to form part of a housing for a computing device in a hand held form factor, e.g., tablet, mobile phone, game device, music device, and so on.


The article 114 in this instance includes portions that define a wall 202 of the article 114. Features 204, 206 are also included that extend away from the wall 202 and thus have a thickness that is greater than the wall. Additionally, the features 204, 206 may have a width that is considered relatively thin in comparison with this thickness. Accordingly, in form factors in which the wall is also considered thin (e.g., less than one millimeter) it may be difficult to get the metal alloy 118 to flow into these features using conventional techniques.


As shown in the example implementation 300 of FIG. 3, for instance, a cavity 128 defined by the mold portions 124, 126 may be shaped to form the wall 202 and the features 204, 206. A flow of the metal alloy 118 into the cavity 128 at relatively thin thickness may cause the metal alloy 114 to cool before filling the cavity 128 and thus may be leave voids in the cavity 128 between the metal alloy 114 and surfaces of the cavity 128. These voids may consequently have an adverse effect on the article 114 being molded. Accordingly, techniques may be employed to reduce and even eliminate formation of the voids, an example of which is described in the following discussion and corresponding figure.



FIG. 4 depicts a system 400 in an example implementation in which an injection distribution device 402 is used to physically couple an outflow of the injected metal alloy from the injection device 104 to a mold 120 of the molding device 106. Pressure used to inject the metal alloy 118 to form the article 114 may set to encourage a uniform fill of the cavity 128 of the mold 120.


For example, a pressure may be employed by the injection device 104 that is sufficient to form an alpha layer (e.g., skin) on an outer surface of the metal alloy 118 as it flows through the mold 120. The alpha layer, for instance, may have a higher density at a surface than in the “middle” of the metal alloy 118 when flowing into the mold 120. This may be formed based at least in part using relatively high pressures (such as around 40 mega Pascals) such that the skin is pressed against a surface of the mold 120 thereby reducing formation of voids. Thus, the thicker the alpha layer the less chance of forming voids in the mold 120.


Additionally, an injection distribution device 402 may be configured to encourage this flow from the injection device 104 into the mold 120. The injection device 402 in this example includes a runner 404 and a plurality of sub-runners 406, 408, 410. The sub-runners 406-410 are used to distribute the metal alloy 118 into different portions of the mold 120 to promote a generally uniform application of the metal alloy 118.


However, conventional injection distribution devices were often configured such that a flow of the metal alloy 118 or other material was hindered by the branches of the device. The branches formed by sub-runners of convention devices, for instance, may be sized such as to cause an approximate forty percent flow restriction between a runner and the sub-runners that were configured to receive the metal alloy 118. Thus, this flow restriction could cause cooling of the metal alloy 118 as well as counteract functionality supported through use of particular pressures (e.g., about 40 mega Pascals) used to form alpha layers.


Accordingly, the injection distribution device 402 may be configured such that a decrease in flow of the metal alloy 118 through the device is not experienced. For example, a size of a cross section 412 taken of the runner 404 may be approximated by an overall size of a cross section 414 taken of the plurality of sub-runners 406, 408, 410, which is described further below and shown in relation to a corresponding figure.



FIG. 5 depicts an example implementation 500 showing comparison of respect cross sections 412, 414 of the runner 404 and the plurality of sub-runners 406-410. The cross section 412 of the runner 404 is approximately equal to or less than a cross section 414 overall of the plurality of sub-runners 406-408. This may be performed by varying a diameter (e.g., including height and/or width) such that flow is not reduced as the metal alloy 118 passes through the injection distribution device 104.


For example, the runner 404 may be sized to coincide with an injection port of the injection device 104 and the plurality of sub-runners 406-410 may get progressively shorter and wider to coincide with a form factor of the cavity 128 of the mold 120. Additionally, although a single runner 404 and three sub-runners 406-410 are shown it should be readily apparent that different numbers and combinations are also contemplated without departing from the spirit and scope thereof. Additional techniques may also be employed to reduce a likelihood of voids in the article, another example of which is described as follows.



FIG. 6 depicts a system 600 in an example implementation in which a vacuum device is employed to create negative pressure inside a cavity of the mold 120 to promote flow of the metal alloy 118. As previously described, metal alloys 118 such as one primarily comprised of magnesium may be resistant to flow, especially for thickness that are less than a millimeter. This problem may be exacerbated when confronted with forming an article that is approximately two hundred millimeters long or greater and thus conventional techniques were limited to articles smaller than that.


For example, it may be difficult using conventional techniques to fill a cavity under conventional techniques to form a part of a housing of a computing device that has walls having a thickness of approximately 0.65 millimeters and width and length of greater than 100 millimeters and one hundred and fifty millimeters, respectively (e.g., approximately 190 millimeters by 240 millimeters for a tablet). This is because the metal alloy 118 may cool and harden, especially at those thicknesses and lengths due to the large amount of surface area in comparison with thicker and/or shorter articles. However, the techniques described herein may be employed to form such an article.


In the system 600 of FIG. 6, a vacuum device 602 is employed to bias a flow of the metal alloy 118 through the cavity 128 to form the article 114. For example, the vacuum device 602 may be configured to form negative pressure within the cavity 128 of the mold 120. The negative pressure (e.g., 0.4 bar) may include a partial vacuum formed to remove air from the cavity 218, thereby reducing a chance of formation of air pockets as the cavity 128 is filled with the metal alloy 118.


Further, the vacuum device 602 may be coupled to particular areas of the mold 120 to bias the flow of the metal alloy 118 in desired ways. The article 114, for instance, may include areas that are feature rich (e.g., as opposed to sections having fewer features, the wall 202, and so on) and thus may restrict flow in those areas. Additionally, particular areas might be further away from an injection port (e.g., at the corners that are located closer to the vacuum device 602 than the injection device 104).


In the illustrated instance, the vacuum device 602 is coupled to areas that are opposite areas of the mold 120 that receive the metal alloy 118, e.g., from the injection device 104. In this way, the metal alloy 118 is encouraged to flow through the mold 120 and reduce voids formed within the mold 120 due to incomplete flow, air pockets, and so on. Other techniques may also be employed to bias flow of the metal alloy 118, another example of which is described as follows and shown in an associated figure.



FIG. 7 depicts a system 700 in an example implementation in which a mold 120 includes one or more overflows 702, 704 to bias a flow of metal alloy 118 through a mold 120. As previously described, characteristics of the article 114 to be molded may cause complications, such as due to relative thinness (e.g., less than one millimeter), length of article (e.g., 100 millimeters or over), shape of article 114 (e.g., to reach corners on the opposing side of the cavity 128 from the injection device 104), features and feature density, and so on. These complications may make it difficult to get the metal alloy 118 to flow to particular portions of the mold 120, such as due to cooling and so forth.


In this example, overflows 702, 704 are utilized to bias flow of the metal alloy 118 towards the overflows 702, 704. The overflows 702, 704, for instance, may bias flow toward the corners of the cavity 128 in the illustrated example. In this way, a portion of the cavity 128 that may be otherwise difficult to fill may be formed using the metal alloy 118 without introducing voids. Other examples are also contemplated, such as to position the overflows 702, 704 based on feature density of corresponding portions of the cavity 128 of the mold 120. Once cooled, material (e.g., the metal alloy 118) disposed within the overflows 702, 704 may be removed to form the article 114, such as by a machining operation.


Thus, the overflows 702, 704 may be utilized to counteract a “cold material” condition in which the material (e.g., the metal alloy 118) does not fill the cavity 128 completely, thus forming voids such as pinholes. The colder material, for instance, may exit the overflows 702, 704 thus promoting contact of hotter material (e.g., metal alloy 118 still in substantially liquid form) to form the article 114. This may also aide a microstructure of the article 114 due to the lack of imperfections as could be encountered otherwise.



FIG. 8 depicts an example implementation 800 in which a protrusion is utilized to reduce an effect of thermal expansion caused by varying degrees of thickness of an article 114 to be molded. As previously described, injection molding was traditionally utilized to form plastic parts. Although these techniques were then expanded to metal alloys, conventional techniques were limited to relatively small sizes (e.g., watch parts) due to thermal expansion of the material, which could cause inconsistencies in articles larger than a relatively small size, e.g., watch parts. However, techniques are described herein which may utilized to counteract differences in thermal expansion, e.g., due to differences in thickness of the article, and as such may be used to support manufacture of larger articles, such as articles over 100 millimeters.


The example implementation 800 is illustrated using first and second stages 802, 804. At the first stage 802, the mold 120 is shown as forming a cavity 128 to mold an article. The cavity 128 is configured to have different thicknesses to mold different parts of the article 114, such as a wall 202 and a feature 206. As illustrated, the feature 206 has a thickness that is greater than a thickness of the wall 202. Accordingly, the feature 206 may exhibit a larger amount of contraction than the wall 202 due to thermal expansion of the metal alloy 118. Using conventional techniques, this caused a depression in a side of the article that is opposite to the feature 206. This depression made formation of a substantially flat surface on a side of the article that opposed the feature 206 difficult if not impossible using conventional injection molding techniques.


Accordingly, the cavity 126 of the mold may be configured to form a protrusion 806 on an opposing side of the feature. The protrusion 806 may be shaped and sized based at least in part on thermal expansion (and subsequent contraction) of the metal alloy 118 used to form the article. The protrusion 806 may be formed in a variety of ways, such as to have a minimum radius of 0.6 mm, use of angles of thirty degrees or less, and so on.


Therefore, once the metal alloy 118 cools and solidifies as shown in the second stage 804, the article 114 may form a substantially flat surface that includes an area proximal to an opposing side of the feature as well as the opposing side of the feature 206, e.g., the wall 202 and an opposing side of the feature 206 adjacent to the wall 202. In this way, the article 114 may be formed to have a substantially flat surface using a mold 120 having a cavity 128 that is not substantially flat at a corresponding portion of the cavity 128 of the mold 120.



FIG. 9 depicts an example implementation 900 in which a mold is employed that includes edges configured to reduce voids. This implementation 900 is also shown using first and second stage 902, 904. As previously described, injection molding was traditionally performed using plastics. However, when employed to mold a metal alloy 118, conventional techniques could be confronted with reduced flow characteristics of the metal alloy 118 in comparison with the plastics, which could cause voids.


Accordingly, techniques may be employed to reduce voids in injection molding using a metal alloy 118. For example, at the first stage 902 molding portions 124, 126 of the mold 120 are configured to form a cavity 128 as before to mold an article 114. However, the cavity 128 is configured to employ radii and angles that promote flowability between the surface of the cavity 218 and the metal alloy 118 to form the article 114 without voids.


For example, the article 114 may be configured to include portions (e.g., a wall) that have a thickness of less than one millimeter, such as approximately 0.65 millimeter. Accordingly, a radius 906 of approximately 0.6 to 1.0 millimeters may be used to form an edge of the article 114. This radius 906 is sufficient to promote flow of a metal alloy 118 comprised primarily of magnesium through the cavity 128 of the mold 120 from the injection device 104 yet still promote contact. Other radii are also contemplated, such as one millimeter, two millimeters, and three millimeters. Additionally, larger radii may be employed with articles having less thickness, such as a radius of approximately twelve millimeters for an article 114 having walls with a thickness of approximately 0.3 millimeters.


In one or more implementations, these radii may be employed to follow a likely direction of flow of the metal alloy 118 through the cavity 128 in the mold 120. A leading and/or trailing edge of a feature aligned perpendicular to the flow of the metal alloy 118, for instance, may employ the radii described above whereas other edges of the feature that run substantially parallel to the flow may employ “sharp” edges that do not employ the radii, e.g., have a radius of less than 0.6 mm for an article 114 having walls with a thickness of approximately 0.65 millimeters.


Additionally, techniques may be employed to remove part of the metal alloy 118 to form a desired feature. The metal alloy 118, for instance, may be shaped using the mold 120 as shown in the first stage 902. At the second stage, edges of the article 114 may be machined to “sharpen” the edges, e.g., stamping, grinding, cutting, and so on. Other examples are also contemplated as further described in the following discussion of the example procedures.


Example Procedures


The following discussion describes injection molding techniques that may be implemented utilizing the previously described systems and devices. Aspects of each of the procedures may be implemented in hardware, firmware, or software, or a combination thereof. The procedures are shown as a set of blocks that specify operations performed by one or more devices and are not necessarily limited to the orders shown for performing the operations by the respective blocks. In portions of the following discussion, reference will be made to FIGS. 1-9.



FIG. 10 depicts a procedure 1000 in an example implementation in which an article is injection molded using a mold that employs overflows. An article is injection molded using a metal alloy comprised primarily of magnesium using a molding device having a plurality of molding portions that form a cavity that defines an article to be molded using the metal alloy and one or more overflows that are positioned to bias flow of the metal alloy toward parts of the cavity that correspond to the overflows (block 1002). As shown in FIG. 7, for instance, the overflows 702, 704 may be positioned to bias flow towards associated regions of the mold 120. The overflows 702, 704 may also be used to remove metal alloy 118 that has cooled during flow through the mold 120 such that subsequent metal alloy that is injected into the mold 120 may remain in a liquid form sufficient to contact the surface of the cavity as opposed to the cooled metal alloy 118 that may cause pin holes and other imperfections.


The metal alloy collected in the one or more overflows is removed from the metal alloy molded using the cavity to form the article (block 1004). This may be performed using a stamping, machining, or other operation in which the metal alloy 118 disposed in the overflows is separated from the metal alloy 118 in the cavity 128 of the mold 120 that is used to form the article 114, e.g., a housing of a hand-held computing device such as a tablet, phone, and so on.



FIG. 11 depicts a procedure 1100 in an example implementation in which a mold is formed that employs overflows. A mold is formed that includes a plurality of molding portions (block 1102). The molding portions may be used to form a cavity that define an article to be molded using a metal alloy (block 1104), such as a metal alloy comprised primarily of magnesium.


One or more flows may also be formed as part of the molding portions that are positioned to bias flow of the metal alloy injected through the cavity toward parts of the cavity that correspond to the overflows (block 1106). As before, these overflows may be positioned due to feature density of the article, difficult locations of the cavity to fill, located to remove “cooled” metal alloy, and so on.



FIG. 12 depicts a procedure 1200 in an example implementation in which a protrusion is formed to at least partially counteract thermal expansion of the metal alloy and subsequent contraction caused by cooling of the metal alloy. A metal alloy is injected into a mold having a plurality of molding portions that define a cavity that corresponds to an article to be molded. The mold defines a portion of the cavity that defines a feature for the article having a thickness that is greater than a thickness of an area of the article defined by the cavity that is proximal to the feature. The mold also defines a protrusion for the article aligned as substantially opposing the feature, the protrusion being sized such that upon solidifying of the metal alloy that forms the article, the protrusion reduces an effect of thermal expansion on a portion of the article that is aligned as substantially opposing the feature (block 1202). The protrusion, for instance, may be formed as an indention in part of the cavity 128 of the mold 120.


The metal alloy is removed from the cavity of the mold after solidifying of the metal alloy within the mold (block 1204). As stated above, the protrusion may be used to offset an effect of thermal expansion and subsequent contraction of the metal alloy 118, such as to form a substantially flat surface on a side of the article opposite to the feature.



FIG. 13 depicts a procedure 1300 in an example implementation in which a mold is formed that is configured to form a protrusion on an article to counteract an effect of thermal expansion. A mold is formed having a plurality of molding portions to form an article using a metal alloy that is defined in the mold using a cavity (block 1302). This may include forming a portion of the cavity that defines a feature for the article having a thickness that is greater than a thickness of an area of the article defined by the cavity that is proximal to the feature (block 1304).


The mold may also be configured to form a protrusion for the article aligned on a side of the cavity that is opposite to a side including the feature, the protrusion being sized as being proportional to the thickness of the feature such that upon solidifying of the metal alloy that forms the article, the protrusion reduces an effect of thermal expansion on the side of the article that is opposite to the feature (block 1306). In this way, subsequent cooling of the metal alloy and corresponding contraction may be addressed to reduce the effect of the thermal expansion on the article.



FIG. 14 depicts a procedure 1400 in an example implementation in which a radius is employed to limit formation of voids of the article. A metal alloy is injected into a mold having a plurality of molding portions that define a cavity that corresponds to an article to be molded including walls with a thickness of less than one millimeter with one or more features disposed thereon having edges with a radius of at least 0.6 millimeter (block 1402). As previously described, metal alloys may introduce complications not encountered using plastics, such as quicker cooling and resistance to flow through a mold 120, especially for articles having a thickness of under one millimeter. Accordingly, the radius may be employed to reduce voids caused by sharp edges.


At least a portion of the radius of the edge is machined to define the feature of the article after removal of the metal alloy from the cavity (block 1404). In this way, a sharp edge may be provided on the device yet a likelihood of voids reduced. A variety of other examples are also contemplated as previously described in relation to FIG. 9.


CONCLUSION

Although the invention has been described in language specific to structural features and/or methodological acts, it is to be understood that the invention defined in the appended claims is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as example forms of implementing the claimed invention.

Claims
  • 1. A method comprising: injection molding an article using a metal alloy comprised primarily of magnesium using a molding device having a plurality of molding portions that form: a cavity that defines an article to be molded using the metal alloy; andone or more overflows that are positioned to bias flow of the metal alloy toward one or more features with protrusions opposite the features, the protrusions sized to counteract shrinkage of the article; andremoving the metal alloy collected in the one or more overflows from the metal alloy molded using the cavity to form the article.
  • 2. A method as described in claim 1, wherein the features have a height that is greater than a thickness of a wall of the article that does not include the features.
  • 3. A method as described in claim 2, wherein the features have a height that is less than the height of a perimeter of the article.
  • 4. A method as described in claim 2, the features comprising one or more features that taper in width.
  • 5. A method as described in claim 2, the features comprising one or more features having a circular cross section at the intersection of the feature and the wall.
  • 6. A method as described in claim 2, the features comprising one or more features having a rectangular cross section at the intersection of the feature and the wall.
  • 7. A method as described in claim 2, the features comprising a first feature having a circular cross section at the intersection of the first feature and the wall and a second feature having a rectangular cross section at the intersection of the second feature and the wall.
  • 8. A method as described in claim 1, wherein at least one of the one or more overflows is positioned at a part of the cavity that is further away from a point at which the metal alloy is injected into the cavity than another part of the cavity that is not disposed proximal to the one or more overflows.
  • 9. A method as described in claim 1, wherein at least one of the one or more overflows is positioned at a part of the cavity that defines features that cause increased turbulence to a flow of the metal alloy through the cavity than another part of the cavity that is not disposed proximal to the one or more overflows.
  • 10. A method as described in claim 1, wherein the article is configured to have a thickness of less than one millimeter.
  • 11. A method as described in claim 1, wherein the article is configured to have a length of at least 100 millimeters.
  • 12. A method as described in claim 1, the injection molding further comprising using a vacuum device to create a negative pressure within the cavity, wherein the vacuum device is coupled to the molding portions at a location corresponding to the overflows.
  • 13. A method as described in claim 1, wherein the cavity further defines one or more additional features along an edge of the article.
  • 14. A method comprising: injection molding an article using a metal alloy comprised primarily of magnesium using a molding device having a plurality of molding portions that form: a cavity that defines an article to be molded using the metal alloy, including protrusions sized to counteract shrinkage of the article; andone or more overflows that are positioned to bias flow of the metal alloy toward one or more corners of the cavity; andremoving the metal alloy collected in the one or more overflows from the metal alloy molded using the cavity to form the article.
  • 15. A method as described in claim 14, wherein the article is configured to have a length of at least 100 millimeters.
  • 16. A method as described in claim 14, wherein the article is configured to have a thickness of less than one millimeter.
  • 17. A method comprising: injection molding an article using a metal alloy comprised primarily of magnesium using a molding device having a plurality of molding portions that form: a cavity that defines an article to be molded using the metal alloy, the article comprising a wall, a perimeter having a thickness greater than the wall, two or more features having a thickness greater than the wall, and protrusions opposite the features, the protrusions sized to counteract shrinkage of the article; andone or more overflows that are positioned to bias flow of the metal alloy toward parts of the cavity that correspond to the overflows; andremoving the metal alloy collected in the one or more overflows from the metal alloy molded using the cavity to form the article.
  • 18. A method as described in claim 17, wherein the article is configured to have a length of at least 100 millimeters.
  • 19. A method as described in claim 17, wherein the article is configured to have a thickness of less than one millimeter.
  • 20. A method as described in claim 1, wherein the article is configured to have a thickness of less than one millimeter and a length of at least 100 millimeters.
US Referenced Citations (319)
Number Name Date Kind
3879586 DuRocher et al. Apr 1975 A
4046975 Seeger, Jr. Sep 1977 A
4065649 Carter et al. Dec 1977 A
4243861 Strandwitz Jan 1981 A
4302648 Sado et al. Nov 1981 A
4317013 Larson Feb 1982 A
4365130 Christensen Dec 1982 A
4492829 Rodrique Jan 1985 A
4527021 Morikawa et al. Jul 1985 A
4559426 Van Zeeland et al. Dec 1985 A
4588187 Dell May 1986 A
4607147 Ono et al. Aug 1986 A
4651133 Ganesan et al. Mar 1987 A
5021638 Nopper et al. Jun 1991 A
5220521 Kikinis Jun 1993 A
5283559 Kalendra et al. Feb 1994 A
5331443 Stanisci Jul 1994 A
5340528 Machida et al. Aug 1994 A
5363075 Fanucchi Nov 1994 A
5404133 Moriike et al. Apr 1995 A
5548477 Kumar et al. Aug 1996 A
5558577 Kato Sep 1996 A
5618232 Martin Apr 1997 A
5681220 Bertram et al. Oct 1997 A
5745376 Barker et al. Apr 1998 A
5748114 Koehn May 1998 A
5781406 Hunte Jul 1998 A
5807175 Davis et al. Sep 1998 A
5818361 Acevedo Oct 1998 A
5828770 Leis et al. Oct 1998 A
5874697 Selker et al. Feb 1999 A
5926170 Oba Jul 1999 A
5957191 Okada et al. Sep 1999 A
5971635 Wise Oct 1999 A
6002389 Kasser Dec 1999 A
6005209 Burleson et al. Dec 1999 A
6012714 Worley et al. Jan 2000 A
6040823 Seffernick et al. Mar 2000 A
6042075 Burch, Jr. Mar 2000 A
6044717 Biegelsen et al. Apr 2000 A
6061644 Leis May 2000 A
6112797 Colson et al. Sep 2000 A
6147859 Abboud Nov 2000 A
6178443 Lin Jan 2001 B1
6254105 Rinde et al. Jul 2001 B1
6279060 Luke et al. Aug 2001 B1
6329617 Burgess Dec 2001 B1
6344791 Armstrong Feb 2002 B1
6380497 Hashimoto et al. Apr 2002 B1
6437682 Vance Aug 2002 B1
6506983 Babb et al. Jan 2003 B1
6511378 Bhatt et al. Jan 2003 B1
6532147 Christ, Jr. Mar 2003 B1
6543949 Ritchey et al. Apr 2003 B1
6565439 Shinohara et al. May 2003 B2
6585435 Fang Jul 2003 B2
6600121 Olodort et al. Jul 2003 B1
6603408 Gaba Aug 2003 B1
6608664 Hasegawa Aug 2003 B1
6617536 Kawaguchi Sep 2003 B2
6675865 Yoshida Jan 2004 B1
6685369 Lien Feb 2004 B2
6704864 Philyaw Mar 2004 B1
6721019 Kono et al. Apr 2004 B2
6725318 Sherman et al. Apr 2004 B1
6774888 Genduso Aug 2004 B1
6776546 Kraus et al. Aug 2004 B2
6784869 Clark et al. Aug 2004 B1
6813143 Makela Nov 2004 B2
6819316 Schulz et al. Nov 2004 B2
6819547 Minaguchi et al. Nov 2004 B2
6856506 Doherty et al. Feb 2005 B2
6861961 Sandbach et al. Mar 2005 B2
6864573 Robertson et al. Mar 2005 B2
6898315 Guha May 2005 B2
6914197 Doherty et al. Jul 2005 B2
6950950 Sawyers et al. Sep 2005 B2
6962454 Costello Nov 2005 B1
6970957 Oshins et al. Nov 2005 B1
6976799 Kim et al. Dec 2005 B2
6979799 Centner Dec 2005 B2
7051149 Wang et al. May 2006 B2
7083295 Hanna Aug 2006 B1
7091436 Serban Aug 2006 B2
7106222 Ward et al. Sep 2006 B2
7123292 Seeger et al. Oct 2006 B1
7194662 Do et al. Mar 2007 B2
7213991 Chapman et al. May 2007 B2
7277087 Hill et al. Oct 2007 B2
7365967 Zheng Apr 2008 B2
7447934 Dasari et al. Nov 2008 B2
7469386 Bear et al. Dec 2008 B2
7499037 Lube Mar 2009 B2
7502803 Culter et al. Mar 2009 B2
7542052 Solomon et al. Jun 2009 B2
7558594 Wilson Jul 2009 B2
7559834 York Jul 2009 B1
7620244 Collier Nov 2009 B1
7636921 Louie Dec 2009 B2
7639329 Takeda et al. Dec 2009 B2
7639876 Clary et al. Dec 2009 B2
7656392 Bolender Feb 2010 B2
7686066 Hirao Mar 2010 B2
7722792 Uezaki et al. May 2010 B2
7733326 Adiseshan Jun 2010 B1
7773076 Pittel et al. Aug 2010 B2
7777972 Chen et al. Aug 2010 B1
7782342 Koh Aug 2010 B2
7813715 McKillop et al. Oct 2010 B2
7817428 Greer, Jr. et al. Oct 2010 B2
7884807 Hovden et al. Feb 2011 B2
7893921 Sato Feb 2011 B2
7907394 Richardson et al. Mar 2011 B2
D636397 Green Apr 2011 S
7928964 Kolmykov-Zotov et al. Apr 2011 B2
7932890 Onikiri et al. Apr 2011 B2
7944520 Ichioka et al. May 2011 B2
7945717 Rivalsi May 2011 B2
7973771 Geaghan Jul 2011 B2
7978281 Vergith et al. Jul 2011 B2
8018386 Qi et al. Sep 2011 B2
8026904 Westerman Sep 2011 B2
8053688 Conzola et al. Nov 2011 B2
8059384 Park et al. Nov 2011 B2
8065624 Morin et al. Nov 2011 B2
8069356 Rathi et al. Nov 2011 B2
8077160 Land et al. Dec 2011 B2
8120166 Koizumi et al. Feb 2012 B2
8130203 Westerman Mar 2012 B2
8154524 Wilson et al. Apr 2012 B2
D659139 Gengler May 2012 S
8169421 Wright et al. May 2012 B2
8229509 Paek et al. Jul 2012 B2
8229522 Kim et al. Jul 2012 B2
8403576 Merz Mar 2013 B2
8582280 Ryu Nov 2013 B2
8654030 Mercer Feb 2014 B1
8991473 Bornemann et al. Mar 2015
20020134828 Sandbach et al. Sep 2002 A1
20030173195 Federspiel Sep 2003 A1
20030197687 Shetter Oct 2003 A1
20040258924 Berger et al. Dec 2004 A1
20040268000 Barker et al. Dec 2004 A1
20050030728 Kawashima et al. Feb 2005 A1
20050057515 Bathiche Mar 2005 A1
20050059489 Kim Mar 2005 A1
20050146512 Hill et al. Jul 2005 A1
20050264653 Starkweather et al. Dec 2005 A1
20050264988 Nicolosi Dec 2005 A1
20050285703 Wheeler et al. Dec 2005 A1
20060049993 Lin et al. Mar 2006 A1
20060061555 Mullen Mar 2006 A1
20060082973 Egbert et al. Apr 2006 A1
20060085658 Allen et al. Apr 2006 A1
20060125799 Hillis et al. Jun 2006 A1
20060154725 Glaser et al. Jul 2006 A1
20060156415 Rubinstein et al. Jul 2006 A1
20060181514 Newman Aug 2006 A1
20060195522 Miyazaki Aug 2006 A1
20060254042 Chou et al. Nov 2006 A1
20070062089 Homer et al. Mar 2007 A1
20070072474 Beasley et al. Mar 2007 A1
20070182663 Biech Aug 2007 A1
20070200830 Yamamoto Aug 2007 A1
20070234420 Novotney et al. Oct 2007 A1
20070236408 Yamaguchi et al. Oct 2007 A1
20070247432 Oakley Oct 2007 A1
20070260892 Paul et al. Nov 2007 A1
20070283179 Burnett et al. Dec 2007 A1
20080005423 Jacobs et al. Jan 2008 A1
20080104437 Lee May 2008 A1
20080151478 Chern Jun 2008 A1
20080158185 Westerman Jul 2008 A1
20080167832 Soss Jul 2008 A1
20080238884 Harish Oct 2008 A1
20080253822 Matias Oct 2008 A1
20080309636 Feng et al. Dec 2008 A1
20080316002 Brunet et al. Dec 2008 A1
20080320190 Lydon et al. Dec 2008 A1
20090009476 Daley, III Jan 2009 A1
20090073060 Shimasaki et al. Mar 2009 A1
20090073957 Newland et al. Mar 2009 A1
20090079639 Hotta et al. Mar 2009 A1
20090096756 Lube Apr 2009 A1
20090127005 Zachut et al. May 2009 A1
20090140985 Liu Jun 2009 A1
20090163147 Steigerwald et al. Jun 2009 A1
20090174687 Ciesla et al. Jul 2009 A1
20090189873 Peterson et al. Jul 2009 A1
20090251008 Sugaya Oct 2009 A1
20090262492 Whitchurch et al. Oct 2009 A1
20090303137 Kusaka et al. Dec 2009 A1
20090303204 Nasiri et al. Dec 2009 A1
20090320244 Lin Dec 2009 A1
20090321490 Groene et al. Dec 2009 A1
20100001963 Doray et al. Jan 2010 A1
20100026656 Hotelling et al. Feb 2010 A1
20100038821 Jenkins et al. Feb 2010 A1
20100045540 Lai et al. Feb 2010 A1
20100045609 Do et al. Feb 2010 A1
20100045633 Gettemy et al. Feb 2010 A1
20100051356 Stern et al. Mar 2010 A1
20100051432 Lin et al. Mar 2010 A1
20100053534 Hsieh et al. Mar 2010 A1
20100077237 Sawyers Mar 2010 A1
20100081377 Chatterjee et al. Apr 2010 A1
20100085321 Pundsack Apr 2010 A1
20100103112 Yoo et al. Apr 2010 A1
20100149111 Olien Jun 2010 A1
20100149134 Westerman et al. Jun 2010 A1
20100156798 Archer Jun 2010 A1
20100161522 Tirpak et al. Jun 2010 A1
20100164857 Liu et al. Jul 2010 A1
20100171891 Kaji et al. Jul 2010 A1
20100174421 Tsai et al. Jul 2010 A1
20100180063 Ananny et al. Jul 2010 A1
20100188299 Rinehart et al. Jul 2010 A1
20100206614 Park et al. Aug 2010 A1
20100206644 Yeh Aug 2010 A1
20100214257 Wussler et al. Aug 2010 A1
20100222110 Kim et al. Sep 2010 A1
20100231556 Mines et al. Sep 2010 A1
20100238075 Pourseyed Sep 2010 A1
20100250988 Okuda et al. Sep 2010 A1
20100274932 Kose Oct 2010 A1
20100279768 Huang et al. Nov 2010 A1
20100289457 Onnerud et al. Nov 2010 A1
20100295812 Burns et al. Nov 2010 A1
20100302378 Marks et al. Dec 2010 A1
20100304793 Kim et al. Dec 2010 A1
20100306538 Thomas et al. Dec 2010 A1
20100308778 Yamazaki et al. Dec 2010 A1
20100308844 Day et al. Dec 2010 A1
20100315348 Jellicoe et al. Dec 2010 A1
20100325155 Skinner et al. Dec 2010 A1
20100331059 Apgar et al. Dec 2010 A1
20110012873 Prest et al. Jan 2011 A1
20110019123 Prest et al. Jan 2011 A1
20110031287 Le Gette et al. Feb 2011 A1
20110037721 Cranfill et al. Feb 2011 A1
20110043990 Mickey et al. Feb 2011 A1
20110060926 Brooks et al. Mar 2011 A1
20110069148 Jones et al. Mar 2011 A1
20110074688 Hull et al. Mar 2011 A1
20110102326 Casparian et al. May 2011 A1
20110102356 Kemppinen et al. May 2011 A1
20110134032 Chiu et al. Jun 2011 A1
20110157087 Kanehira et al. Jun 2011 A1
20110163955 Nasiri et al. Jul 2011 A1
20110164370 McClure et al. Jul 2011 A1
20110167181 Minoo et al. Jul 2011 A1
20110167287 Walsh et al. Jul 2011 A1
20110167391 Momeyer et al. Jul 2011 A1
20110167992 Eventoff et al. Jul 2011 A1
20110179864 Raasch et al. Jul 2011 A1
20110184646 Wong et al. Jul 2011 A1
20110193787 Morishige et al. Aug 2011 A1
20110205372 Miramontes Aug 2011 A1
20110227913 Hyndman Sep 2011 A1
20110242138 Tribble Oct 2011 A1
20110248920 Larsen Oct 2011 A1
20110261001 Liu Oct 2011 A1
20110266672 Sylvester Nov 2011 A1
20110290686 Huang Dec 2011 A1
20110297566 Gallagher et al. Dec 2011 A1
20110304577 Brown et al. Dec 2011 A1
20110305875 Sanford et al. Dec 2011 A1
20110316807 Corrion Dec 2011 A1
20120007821 Zaliva Jan 2012 A1
20120011462 Westerman et al. Jan 2012 A1
20120013519 Hakansson et al. Jan 2012 A1
20120023459 Westerman Jan 2012 A1
20120024682 Huang et al. Feb 2012 A1
20120026048 Vazquez et al. Feb 2012 A1
20120032887 Chiu et al. Feb 2012 A1
20120044179 Hudson Feb 2012 A1
20120047368 Chinn et al. Feb 2012 A1
20120050975 Garelli et al. Mar 2012 A1
20120075249 Hoch Mar 2012 A1
20120081316 Sirpal et al. Apr 2012 A1
20120092279 Martin Apr 2012 A1
20120094257 Pillischer et al. Apr 2012 A1
20120099749 Rubin et al. Apr 2012 A1
20120103778 Obata et al. May 2012 A1
20120115553 Mahe et al. May 2012 A1
20120117409 Lee et al. May 2012 A1
20120127118 Nolting et al. May 2012 A1
20120133561 Konanur et al. May 2012 A1
20120140396 Zeliff et al. Jun 2012 A1
20120145525 Ishikawa Jun 2012 A1
20120155015 Govindasamy et al. Jun 2012 A1
20120162693 Ito Jun 2012 A1
20120182242 Lindahl et al. Jul 2012 A1
20120194393 Uttermann et al. Aug 2012 A1
20120194448 Rothkopf Aug 2012 A1
20120223866 Ayala Vazquez et al. Sep 2012 A1
20120224073 Miyahara Sep 2012 A1
20120227259 Badaye et al. Sep 2012 A1
20120235635 Sato Sep 2012 A1
20120246377 Bhesania et al. Sep 2012 A1
20120256959 Ye et al. Oct 2012 A1
20120274811 Bakin Nov 2012 A1
20120298491 Ozias et al. Nov 2012 A1
20120300275 Vilardell et al. Nov 2012 A1
20130044059 Fu Feb 2013 A1
20130063873 Wodrich et al. Mar 2013 A1
20130076635 Lin Mar 2013 A1
20130227836 Whitt, III Sep 2013 A1
20130228435 Whitt, III Sep 2013 A1
20130229356 Marwah Sep 2013 A1
20130229366 Dighde Sep 2013 A1
20130229759 Whitt, III Sep 2013 A1
20130241860 Ciesla et al. Sep 2013 A1
20130335902 Campbell et al. Dec 2013 A1
20140131000 Bornemann et al. May 2014 A1
20140135060 Mercer May 2014 A1
20140148938 Zhang et al. May 2014 A1
20140154523 Bornemann et al. Jun 2014 A1
20140248506 McCormack et al. Sep 2014 A1
Foreign Referenced Citations (9)
Number Date Country
2353978 Aug 2011 EP
2378607 Oct 2011 EP
1100331 Jan 1968 GB
56159134 Dec 1981 JP
10326124 Dec 1998 JP
20060003093 Jan 2006 KR
WO-2008055039 May 2008 WO
WO-2010105272 Sep 2010 WO
WO-2011049609 Apr 2011 WO
Non-Patent Literature Citations (97)
Entry
“Corrected Notice of Allowance”, U.S. Appl. No. 13/656,520, Jan. 16, 2014, 3 pages.
“Restriction Requirement”, U.S. Appl. No. 13/715,133, Dec. 3, 2013, 6 pages.
“Notice of Allowance”, U.S. Appl. No. 13/715,133, Jan. 6, 2014, 7 pages.
“Notice of Allowance”, U.S. Appl. No. 13/656,520, (Oct. 2, 2013), 5 pages.
“Restriction Requirement”, U.S. Appl. No. 13/715,133, (Oct. 28, 2013), 6 pages.
“Accessing Device Sensors”, retrieved from <https://developer.palm.com/content/api/dev-guide/pdk/accessing-device-sensors.html> on May 25, 2012, 4 pages.
“ACPI Docking for Windows Operating Systems”, Retrieved from: <http://www.scritube.com/limba/engleza/software/ACPI-Docking-for-Windows-Opera331824193.php> on Jul. 6, 2012,10 pages.
“Cholesteric Liquid Crystal”, Retrieved from: <http://en.wikipedia.org/wiki/Cholesteric—liquid—crystal> on Aug. 6, 2012, (Jun. 10, 2012), 2 pages.
“Cirago Slim Case®—Protective case with built-in kickstand for your iPhone 5®”, Retrieved from <http://cirago.com/wordpress/wp-content/uploads/2012/10/ipc1500brochure1.pdf> on Jan. 29, 2013, 1 page.
“DR2PA”, retrieved from <http://www.architainment.co.uk/wp-content/uploads/2012/08/DR2PA-AU-US-size-Data-Sheet-Rev-H—LOGO.pdf> on Sep. 17, 2012, 4 pages.
“First One Handed Fabric Keyboard with Bluetooth Wireless Technology”, Retrieved from: <http://press.xtvworld.com/article3817.html> on May 8, 2012,(Jan. 6, 2005), 2 pages.
“Force and Position Sensing Resistors: An Emerging Technology”, Interlink Electronics, Available at <http://staff.science.uva.nl/˜vlaander/docu/FSR/An—Exploring—Technology.pdf>,(Feb. 1990), pp. 1-6.
“Frogpad Introduces Weareable Fabric Keyboard with Bluetooth Technology”, Retrieved from: <http://www.geekzone.co.nz/content.asp?contentid=3898> on May 7, 2012,(Jan. 7, 2005), 3 pages.
“How to Use the iPad's Onscreen Keyboard”, Retrieved from <http://www.dummies.com/how-to/content/how-to-use-the-ipads-onscreen-keyboard.html> on Aug. 28, 2012, 3 pages.
“i-lnteractor electronic pen”, Retrieved from: <http://www.alibaba.com/product-gs/331004878/i—Interactor—electronic—pen.html> on Jun. 19, 2012, 5 pages.
“Incipio LG G-Slate Premium Kickstand Case—Black Nylon”, Retrieved from: <http://www.amazon.com/Incipio-G-Slate-Premium-Kickstand-Case/dp/B004ZKP916> on May 8, 2012, 4 pages.
“Membrane Keyboards & Membrane Keypads”, Retrieved from: <http://www.pannam.com/> on May 9, 2012,(Mar. 4, 2009), 2 pages.
“Motion Sensors”, Android Developers, retrieved from <http://developer.android.com/guide/topics/sensors/sensors—motion.html> on May 25, 2012, 7 pages.
“MPC Fly Music Production Controller”, AKAI Professional, Retrieved from: <http://www.akaiprompc.com/mpc-fly> on Jul. 9, 2012, 4 pages.
“NI Releases New Maschine & Maschine Mikro”, Retrieved from <http://www.djbooth.net/index/dj-eduipment/entry/ni-releases-new-maschine-mikro/> on Sep. 17, 2012, 19 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/471,001, (Feb. 19, 2013),15 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/471,139, (Mar. 21, 2013),12 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/471,202, (Feb. 11, 2013),10 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/471,336, (Jan. 18, 2013),14 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/651,195, (Jan. 2, 2013),14 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/651,232, (Jan. 17, 2013),15 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/651,272, (Feb. 12, 2013),10 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/651,287, (Jan. 29, 2013),13 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/651,304, (Mar. 22, 2013), 9 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/651,327, (Mar. 22, 2013), 6 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/651,871, (Mar. 18, 2013),14 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/651,976, (Feb. 22, 2013),16 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/653,321, (Feb. 1, 2013),13 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/653,682, (Feb. 7, 2013),11 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/656,520, (Feb. 1, 2013),15 pages.
“Notice of Allowance”, U.S. Appl. No. 13/470,633, (Mar. 22, 2013), 7 pages.
“On-Screen Keyboard for Windows 7, Vista, XP with Touchscreen”, Retrieved from <www.comfort-software.com/on-screen-keyboard.html> on Aug. 28, 2012, (Feb. 2, 2011), 3 pages.
“Position Sensors”, Android Developers, retrieved from <http://developer.android.com/guide/topics/sensors/sensors—position.html> on May 25, 2012, 5 pages.
“Reflex LCD Writing Tablets”, retrieved from <http://www.kentdisplays.com/products/lcdwritingtablets.html> on Jun. 27, 2012, 3 pages.
“Restriction Requirement”, U.S. Appl. No. 13/471,139, (Jan. 17, 2013), 7 pages.
“Restriction Requirement”, U.S. Appl. No. 13/651,304, (Jan. 18, 2013), 7 pages.
“Restriction Requirement”, U.S. Appl. No. 13/651,726, (Feb. 22, 2013), 6 pages.
“Restriction Requirement”, U.S. Appl. No. 13/651,871, (Feb. 7, 2013), 6 pages.
“SMART Board™ Interactive Display Frame Pencil Pack”, Available at <http://downloads01.smarttech.com/media/sitecore/en/support/product/sbfpd/400series(interactivedisplayframes)/guides/smartboardinteractivedisplayframepencilpackv12mar09.pdf>,(2009), 2 pages.
“SolRxTM E-Series Multidirectional Phototherapy ExpandableTM 2-Bulb Full Body Panel System”, Retrieved from: <http://www.solarcsystems.com/us—multidirectional—uv—light—therapy—1—intro.html > on Jul. 25, 2012,(2011), 4 pages.
“The Microsoft Surface Tablets Comes With Impressive Design and Specs”, Retrieved from <http://microsofttabletreview.com/the-microsoft-surface-tablets-comes-with-impressive-design-and-specs> on Jan. 30, 2013, (Jun. 2012), 2 pages.
“Tilt Shift Lenses: Perspective Control”, retrieved from http://www.cambridgeincolour.com/tutorials/tilt-shift-lenses1.htm, (Mar. 28, 2008),11 Pages.
“Virtualization Getting Started Guide”, Red Hat Enterprise Linux 6, Edition 0.2, retrieved from <http://docs.redhat.com/docs/en-US/Red—Hat—Enterprise—Linux/6/html-single/Virtualization—Getting—Started—Guide/index.html> on Jun. 13, 2012, 24 pages.
“What is Active Alignment?”, http://www.kasalis.com/active—alignment.html, retrieved on Nov. 22, 2012, 2 Pages.
Block, Steve et al., “DeviceOrientation Event Specification”, W3C, Editor's Draft, retrieved from <https://developer.palm.com/content/api/dev-guide/pdk/accessing-device-sensors.html> on May 25, 2012,(Jul. 12, 2011),14 pages.
Brown, Rich “Microsoft Shows Off Pressure-Sensitive Keyboard”, retrieved from <http://news.cnet.com/8301-17938—105-10304792-1.html> on May 7, 2012, (Aug. 6, 2009) 2 pages.
Butler, Alex et al., “SideSight: Multi-“touch” Interaction around Small Devices”, In the proceedings of the 21st annual ACM symposium on User interface software and technology., retrieved from <http://research.microsoft.com/pubs/132534/sidesight—crv3.pdf> on May 29, 2012,(Oct. 19, 2008), 4 pages.
Crider, Michael “Sony Slate Concept Tablet “Grows” a Kickstand”, Retrieved from: <http://androidcommunity.com/sony-slate-concept-tablet-grows-a-kickstand-20120116/> on May 4, 2012,(Jan. 16, 2012), 9 pages.
Das, Apurba et al., “Study of Heat Transfer through Multilayer Clothing Assemblies: A Theoretical Prediction”, Retrieved from <http://www.autexrj.com/cms/zalaczone—pliki/5—013—11.pdf>, (Jun. 2011), 7 pages.
Dietz, Paul H., et al., “A Practical Pressure Sensitive Computer Keyboard”, In Proceedings of UIST 2009,(Oct. 2009), 4 pages.
Glatt, Jeff “Channel and Key Pressure (Aftertouch).”, Retrieved from: <http://home.roadrunner.com/˜jgglatt/tutr/touch.htm> on Jun. 11, 2012, 2 pages.
Hanlon, Mike “ElekTex Smart Fabric Keyboard Goes Wireless”, Retrieved from: <http://www.gizmag.com/go/5048/ > on May 7, 2012,(Jan. 15, 2006), 5 pages.
Iwase, Eiji “Multistep Sequential Batch Assembly of Three-Dimensional Ferromagnetic Microstructures with Elastic Hinges”, Retrieved at<<http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1549861>> Proceedings: Journal of Microelectromechanical Systems, (Dec. 2005), 7 pages.
Kaur, Sukhmani “Vincent Liew's redesigned laptop satisfies ergonomic needs”, Retrieved from: <http://www.designbuzz.com/entry/vincent-liew-s-redesigned-laptop-satisfies-ergonomic-needs/> on Jul. 27, 2012,(Jun. 21, 2010), 4 pages.
Khuntontong, Puttachat et al., “Fabrication of Molded Interconnection Devices by Ultrasonic Hot Embossing on Thin Polymer Films”, IEEE Transactions on Electronics Packaging Manufacturing, vol. 32, No. 3,(Jul. 2009), pp. 152-156.
Li, et al., “Characteristic Mode Based Tradeoff Analysis of Antenna-Chassis Interactions for Multiple Antenna Terminals”, In IEEE Transactions on Antennas and Propagation, Retrieved from <http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6060882>,(Feb. 2012),13 pages.
Linderholm, Owen “Logitech Shows Cloth Keyboard for PDAs”, Retrieved from: <http://www.pcworld.com/article/89084/logitech—shows—cloth—keyboard—for—pdas.html> on May 7, 2012,(Mar. 15, 2002), 5 pages.
McLellan, Charles “Eleksen Wireless Fabric Keyboard: a first look”, Retrieved from: <http://www.zdnetasia.com/eleksen-wireless-fabric-keyboard-a-first-look-40278954.htm> on May 7, 2012,(Jul. 17, 2006), 9 pages.
Piltch, Avram “ASUS Eee Pad Slider SL101 Review ”, Retrieved from <http://www.laptopmag.com/review/tablets/asus-eee-pad-slider-sl101.aspx>, (Sep. 22, 2011), 5 pages.
Post, E.R. et al., “E-Broidery: Design and Fabrication of Textile-Based Computing”, IBM Systems Journal, vol. 39, Issue 3 & 4,(Jul. 2000), pp. 840-860.
Purcher, Jack “Apple is Paving the Way for a New 3D GUI for IOS Devices”, Retrieved from: <http://www.patentlyapple.com/patently-apple/2012/01/apple-is-paving-the-way-for-a-new-3d-gui-for-ios-devices.html> on Jun. 4, 2012,(Jan. 12, 2012),15 pages.
Qin, Yongqiang et al., “pPen: Enabling Authenticated Pen and Touch Interaction on Tabletop Surfaces”, In Proceedings of ITS 2010, Available at <http://www.dfki.de/its2010/papers/pdf/po172.pdf>,(Nov. 2010), pp. 283-284.
Sumimoto, Mark “Touch & Write: Surface Computing With Touch and Pen Input”, Retrieved from: <http://www.gottabemobile.com/2009/08/07/touch-write-surface-computing-with-touch-and-pen-input/> on Jun. 19, 2012,(Aug. 7, 2009), 4 pages.
Takamatsu, Seiichi et al., “Flexible Fabric Keyboard with Conductive Polymer-Coated Fibers”, In Proceedings of Sensors 2011,(Oct. 28, 2011), 4 pages.
Valliath, G T., “Design of Hologram for Brightness Enhancement in Color LCDs”, Retrieved from <http://www.loreti.it/Download/PDF/LCD/44—05.pdf> on Sep. 17, 2012, 5 pages.
Williams, Jim “A Fourth Generation of LCD Backlight Technology”, Retrieved from <http://cds.linear.com/docs/Application%20Note/an65f.pdf>, (Nov. 1995),124 pages.
Zhang, et al., “Model-Based Development of Dynamically Adaptive Software”, In Proceedings of ICSE 2006, Available at <http://www.irisa.fr/lande/lande/icse-proceedings/icse/p371.pdf>,(May 20, 2006), pp. 371-380.
“Non-Final Office Action”, U.S. Appl. No. 13/656,520, (Jun. 5, 2013), 8 pages.
“PCT Search Report and Written Opinion”, Application No. PCT/US2013/028948, (Jun. 21, 2013),11 pages.
“Corrected Notice of Allowance”, U.S. Appl. No. 13/715,133, Apr. 2, 2014, 2 pages.
“International Search Report and Written Opinion”, Application No. PCT/US2013/065154, Feb. 5, 2014, 10 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/599,635, Feb. 25, 2014, 13 pages.
“Final Office Action”, U.S. Appl. No. 13/599,635, Aug. 8, 2014, 16 pages.
“International Search Report and Written Opinion”, Application No. PCT/US2013/041017, Jul. 17, 2014, 10 pages.
“International Search Report and Written Opinion”, Application No. PCT/US2013/028768, Jun. 24, 2014, 12 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/595,700, Jun. 18, 2014, 8 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/599,763, May 28, 2014, 6 pages.
“Restriction Requirement”, U.S. Appl. No. 13/595,700, May 28, 2014, 6 pages.
“Ex Parte Quayle Action”, U.S. Appl. No. 13/599,763, Nov. 14, 2014, 6 pages.
“Final Office Action”, U.S. Appl. No. 13/595,700, Aug. 15, 2014, 6 pages.
“Final Office Action”, U.S. Appl. No. 13/595,700, Oct. 9, 2014, 8 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/471,282, Sep. 3, 2014, 13 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/653,184, Dec. 1, 2014, 7 pages.
“Notice of Allowance”, U.S. Appl. No. 14/177,018, Nov. 21, 2014, 7 pages.
“Restriction Requirement”, U.S. Appl. No. 13/653,184, Sep. 5, 2014, 6 pages.
“Restriction Requirement”, U.S. Appl. No. 13/653,218, Nov. 7, 2014, 6 pages.
“Corrected Notice of Allowance”, U.S. Appl. No. 14/177,018, Mar. 2, 2015, 2 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/599,635, Feb. 12, 2015, 16 pages.
“Non-Final Office Action”, U.S. Appl. No. 13/653,218, Mar. 4, 2015, 16 pages.
“Notice of Allowance”, U.S. Appl. No. 13/595,700, Jan. 21, 2015, 4 pages.
“Notice of Allowance”, U.S. Appl. No. 13/599,763, Feb. 18, 2015, 4 pages.
“Notice of Allowance”, U.S. Appl. No. 13/653,184, Mar. 10, 2015, 6 pages.
Related Publications (1)
Number Date Country
20140166227 A1 Jun 2014 US
Continuations (1)
Number Date Country
Parent PCT/CN2012/083085 Oct 2012 US
Child 13715229 US