Claims
- 1. A metal leaf having a critical self-supportability consisting of
- (1) a resinous base layer having a thickness of 0.35 to 1 .mu. and made of at least one resin selected from the group consisting of acrylic resin, vinyl chloride-vinyl acetate copolymer, polyvinyl butyral, polycarbonate, rosin-modified maleic resin, resol-type or novolak-type phenolic resin, urea resin, melamine resin, nitrocellulose, cellulose acetate, alkyd resin, urethane resin, rosin and shellac,
- (2) a vacuum-metallized intermediate metal deposition layer a metal selected from the group consisting of gold, silver, aluminum and copper, having a thickness of 0.03 to 0.1 .mu., and
- (3) a resinous top layer having a thickness of 0.35 to 1 .mu. and made of at least one resin selected from the group consisting of acrylic resin, vinyl chloride-vinyl acetate copolymer, polyvinyl butyral, polycarbonate, rosin-modified maleic resin, resol-type or novolak-type phenolic resin, urea resin, melamine resin, nitrocellulose, cellulose acetate, alkyd resin, urethane resin, rosin and shellac; layers (1), (2) and (3) having a thickness of 0.73 to 2.1 .mu. and a tensile strength of 0.01 to 1.4 kg./mm.sup.2.
- 2. The metal leaf of claim 1 further containing many randomly perforated holes which are scarcely able to be noticed at one view, said holes being present in an amount of about 5 to 3,000 holes/100 cm.sup.2.
Priority Claims (1)
Number |
Date |
Country |
Kind |
45-93740 |
Oct 1970 |
JPX |
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CROSS-REFERENCE TO RELATED APPLICATION
The present invention is a continuation of Ser. No. 351,952 filed Apr. 17, 1973, now abandoned, which in turn is a continuation-in-part application of copending application Ser. No. 190,907, filed Oct. 20, 1971, now abandoned.
US Referenced Citations (13)
Non-Patent Literature Citations (1)
Entry |
Chambers et al., "Electron Beam Techniques for Ion Plating" Research & Development pp. 32-35, May 1971. |
Continuations (1)
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Number |
Date |
Country |
Parent |
351952 |
Apr 1973 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
190907 |
Oct 1971 |
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