Claims
- 1. A glass mold, characterized by having an aluminum oxide film formed on a mold surface by applying a coating containing a highly reductive material composed mainly of Al powder onto the mold surface of a glass mold and heat-treating the resultant coating in an oxidizing atmosphere at a temperature higher than 700.degree. C., wherein the highly reductive material composed mainly of Al powder comprises a Cu-Al-Cr-Ni-Fe alloy and causes self-oxidation during heat treatment to form a protective oxide film that enough to sufficiently diffuse Al in the alloy, thus inhibiting the formation of Cu oxide in a low temperature region.
- 2. A glass mold, characterized by having a film comprising an aluminum oxide and a composite compound, formed on a mold surface by applying a coating comprising a highly reductive material composed mainly of Al powder and a material highly reactive with Al.sub.2 O.sub.3 at a high temperature onto the mold surface of a glass mold and heat-treating the resultant coating in an oxidizing atmosphere at a temperature higher than 700.degree. C., wherein the high reductive material composed mainly of Al powder comprises a Cu-Al-Cr-Ni-Fe alloy and causes self-oxidation during heat treatment to form a protective oxide film that keeps the surface of the alloy reductive at least until the alloy reaches a temperature high enough to sufficiently diffuse Al in the alloy, thus inhibiting the formation of Cu oxide in a low temperature region, and wherein the material highly reactive with Al.sub.2 O.sub.3 at a high temperature comprises one selected from the group consisting of a silicic acid compound, a hydroxide, and a carbonic acid compound, said selected one being a compound of at least one metallic element selected from the group consisting of Ca, Mg, Al, Ti, Cr, Fe, Zr and a composite compound thereof.
Priority Claims (3)
Number |
Date |
Country |
Kind |
6-249693 |
Oct 1994 |
JPX |
|
7-030768 |
Feb 1995 |
JPX |
|
7-070109 |
Mar 1995 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 08/479,806, filed Jun. 7, 1995, now U.S. Pat. No. 5,656,104.
US Referenced Citations (10)
Foreign Referenced Citations (7)
Number |
Date |
Country |
57-56339 |
Apr 1982 |
JPX |
63-156020 |
Jun 1988 |
JPX |
1-73034 |
Mar 1989 |
JPX |
6-10079 |
Jan 1994 |
JPX |
6-158269 |
Jun 1994 |
JPX |
06-279944 |
Oct 1994 |
JPX |
594057 |
Dec 1977 |
CHX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
479806 |
Jun 1995 |
|