The improvements generally relate to marking metal workpieces and more specifically relate to laser marking shot-blast resistant identifiers on such metal workpieces.
Metal workpieces can be produced by a multitude of different techniques, including casting or forging to name a few examples. For instance, generally referring to
As depicted, the ejected metal casting 10 is manipulated using a robot arm 14 so as to move it away from the die-casting station 12 for further transformation along a production line 16. Such production line 16 can include a trimming station 18 where the metal castings 10 are trimmed, a shot-blasting station 20 where the metal castings 10 are shot-blasted, a machining station 22 where the metal castings 10 are machined, and an identification station 24 where the metal castings 10 are identified usually at high temperature, after which the transformed metal castings 10 can be distributed.
Identification of the metal castings 10 along the production line 16 allows, in case of a failure of one of the metal castings 10 at some point along the transformation and distribution chain, to track down the cause of the failure and to react accordingly. Although existing techniques for identifying metal castings or other metal workpieces were satisfactory to a certain degree, there remains room for improvement.
Identifying the metal castings 10 as early as possible along the production line 16 can contribute to avoid identification errors, which can happen when the metal castings 10 are manipulated between the die-casting station 12 and the identification station 24. Moreover, it appears that the probability of a given metal casting 10 being erroneously identified increases with the number of manipulations of that given metal casting 10 between the die-casting station 12 and the identification station 24. For instance, in the production line 16, once ejected from one of the steel dies, the metal casting 10 is often transformed in the following order: the metal casting is manipulated from the die-casting station 12 to the trimming station 18; the metal casting 10 is manipulated from the trimming station 18 to the shot-blasting station 20; the metal casting 10 is manipulated from the shot-blasting station 20 to the machining station 22; the metal casting 10 is manipulated from the machining station 22 to the identification station 24 where the metal casting 10 is identified with a dedicated identifier such as a data matrix.
Accordingly, in this example, a given metal casting 10 is manipulated at least three times between the die-casting station 12 and the identification station 24. During these manipulations, the given metal casting 10 may be substituted with another casting 10 in which case one or more metal castings 10 could be erroneously identified, i.e., a given metal casting 10 is identified with an identifier which belong to another, different metal casting 10 instead. In these situations, the accuracy with which the metal castings 10 can be tracked along the transformation and distribution chain can thus be compromised.
As such, to identify a metal casting as early as possible along a production line, the metal casting should preferably be identified with a dedicated identifier as the metal casting still lies in one of the steel dies of the die-casting station, as the robot arm manipulates the metal casting away from one of the steel dies of the die-casting station and/or using an identification station immediately subsequent to the die-casting station. However, proceeding accordingly was generally not advisable in production lines including a subsequent shot blasting station, which could damage and even erase the previously-marked identifier. Accordingly, the inventors describe herein methods and systems for laser-marking shot blast resistant identifiers, which can allow identification of the metal castings as soon as possible in the production line and which can still be readable even after being shot-blasted. In any case, the identifier should preferably be marked using a laser-marking system to benefit from the precision and efficiency of such systems. Metal castings bearing such shot blast resistant identifiers are also described.
There is thus a need for laser-marking shot-blast resistant identifiers on metal castings or any other metal workpieces.
In accordance with one aspect, there is provided a method of laser-marking shot blast resistant identifiers on metal workpieces along a production line, the method comprising: receiving a metal workpiece along the production line; obtaining identifier data indicative of an identifier to be laser-marked on the received metal workpiece, the identifier having a plurality of cells each having a corresponding cell size, the plurality of cells having a plurality of bright cells corresponding to a first binary value and a plurality of dark cells corresponding to a second binary value; and based on the identifier data, laser-marking the identifier on a surface of the received metal workpiece by laser-removing, for each one of the plurality of dark cells, metal from the surface of the metal workpiece only at a center portion of the corresponding dark cell thereby leaving a recess bounded by a peripheral wall in the corresponding dark cell, the recess having a depth of at least 100 microns and having an opening with a width ranging between 400 microns and 1750 microns and representing between 30 percent and below 99 percent of the corresponding cell size such that the corresponding dark cell appears dark to an optical reader, the depth, the width and the corresponding cell size of the corresponding dark cell providing a shot blast resistance to the laser-marked identifier.
In accordance with another aspect, there is provided a system for laser-marking shot blast resistant identifiers on metal workpieces along a production line, the system comprising: a laser-marking system configured to generate a laser-marking beam and being controllable using a controller configured for performing the steps of: obtaining identifier data indicative of an identifier to be laser-marked on a metal workpiece using the laser-marking beam, the identifier having a plurality of cells each having a corresponding cell size, the plurality of cells having a plurality of bright cells corresponding to a first binary value and a plurality of dark cells corresponding to a second binary value; and based on the identifier data, transmitting instructions for laser-marking the identifier on a surface of the metal workpiece by laser-removing, for each one of the plurality of dark cells, metal from the surface of the metal workpiece only at a center portion of the corresponding dark cell thereby leaving a recess bounded by a peripheral wall in the corresponding dark cell, the recess having a depth of at least 100 microns and having an opening with a width ranging between 400 microns and 1750 microns and representing between 30 percent and 99 percent of the corresponding cell size such that the corresponding dark cell appears dark to an optical reader, the depth, the width and the corresponding cell size of the corresponding dark cell providing a shot blast resistance to the laser-marked identifier.
In accordance with another aspect, there is provided a metal workpiece comprising a surface and an identifier marked on said surface, the identifier having a plurality of cells each having a corresponding cell width, the identifier having a plurality of bright cells corresponding to a first binary value and a plurality of dark cells corresponding to a second binary value different from the first binary value, wherein each one of the plurality of dark cells includes a center portion being recessed relative to the surface thereby leaving a recess bounded by a peripheral wall in the corresponding dark cell, the recess having a depth of at least 100 microns and having an opening with a width ranging between 400 microns and 1750 microns, the width and the recess representing between 30 percent and 99 percent of the corresponding cell width such that the corresponding dark cell appears dark to an optical reader. As such, the depth, the width and the cell size of the dark cells provide a shot blast resistance to the laser-marked identifier.
In accordance with another aspect, there is provided a metal workpiece comprising a surface and an identifier marked on said surface, the identifier having a plurality of cells each having a corresponding cell size, the identifier having a plurality of bright cells corresponding to a first binary value and a plurality of dark cells corresponding to a second binary value different from the first binary value, wherein each one of the plurality of dark cells includes a center portion being recessed relative to the surface thereby leaving a recess bounded by a peripheral wall in the corresponding dark cell, the depth, the width and the corresponding cell size of the corresponding dark cell providing a shot blast resistance to the laser-marked identifier. In some embodiments, the width ranges between 400 microns and 1750 microns, preferably between 600 microns and 850 microns such that the corresponding dark cell appears dark to an optical reader. In some embodiments, each recess has a depth of at least 100 microns, preferably at least 150 microns, and most preferably above 300 microns. In some other embodiments, the width of the opening of each recess ranges between 30 percent and 99 percent of the corresponding cell size, preferably between 60 and 95 percent of the corresponding cell size and most preferably between 70 and 89 percent of the corresponding cell size.
In accordance with another aspect, there is provided a method of laser-marking shot blast resistant identifiers on metal workpieces along a production line, the method comprising: receiving a metal workpiece along the production line; and based on previously obtained identifier data, laser marking an identifier on a surface of said metal workpiece, said identifier having a plurality of cells each having a corresponding cell size c, the plurality of cells having a plurality of bright cells corresponding to a first binary value and a plurality of dark cells corresponding to a second binary value; said laser marking comprising removing, for each one of the plurality of dark cells, metal from the surface of the metal workpiece only at a center portion of the corresponding dark cell thereby leaving a recess bounded by a peripheral wall in the corresponding dark cell, the recess having a bottom wall with a width w at a depth d which are such that a ratio R of a dark area of said bottom wall to a total area of said bottom wall exceeds about 50%, said dark area defining an area of said bottom wall being unreachable by a shot having a diameter D.
In accordance with another aspect, there is provided a system for laser-marking shot blast resistant identifiers on metal workpieces along a production line, the system comprising: a laser-marking system configured to generate a laser-marking beam and being controllable using a controller configured for performing the steps of: receiving a metal workpiece along the production line; and based on previously obtained identifier data, laser marking an identifier on a surface of said metal workpiece, said identifier having a plurality of cells each having a corresponding cell size c, the plurality of cells having a plurality of bright cells corresponding to a first binary value and a plurality of dark cells corresponding to a second binary value; said laser marking comprising removing, for each one of the plurality of dark cells, metal from the surface of the metal workpiece only at a center portion of the corresponding dark cell thereby leaving a recess bounded by a peripheral wall in the corresponding dark cell, the recess having a bottom wall with a width w at a depth d which are such that a ratio R of a dark area of said bottom wall to a total area of said bottom wall exceeds about 50%, said dark area defining an area of said bottom wall being unreachable by a shot having a diameter D.
In accordance with another aspect, there is provided a metal workpiece comprising a surface and an identifier marked on said surface, the identifier having a plurality of cells each having a corresponding cell size, the identifier having a plurality of bright cells corresponding to a first binary value and a plurality of dark cells corresponding to a second binary value different from the first binary value, wherein each one of the plurality of dark cells includes a center portion being recessed relative to the surface thereby leaving a recess bounded by a peripheral wall in the corresponding dark cell, the recess having a bottom wall with a width w at a depth d which are such that a ratio R of a dark area of said bottom wall to a total area of said bottom wall exceeds about 50%, said dark area defining an area of said bottom wall being unreachable by a shot having a diameter D. In some embodiments, the width ranges between 400 microns and 1750 microns, and preferably between 600 microns and 850 microns. In some embodiments, each recess has a depth of at least 100 microns, preferably at least 150 microns, and most preferably above 300 microns. In some other embodiments, the width of the opening of each recess ranges between 30 percent and 99 percent of the corresponding cell size, preferably between 60 and 95 percent of the corresponding cell size and most preferably between 70 and 89 percent of the corresponding cell size. In some embodiments, an aspect ratio of the depth relative to the width ranges between 0.2 and 2, and preferably between 0.3 and 1.5. The identifier can be provided in the form of a data matrix. The shape of the opening can have a rectangular shape.
It will be understood that the expression “computer” as used herein is not to be interpreted in a limiting manner. It is rather used in a broad sense to generally refer to the combination of some form of one or more processing units and some form of memory system accessible by the processing unit(s). Similarly, the expression “controller” as used herein is not to be interpreted in a limiting manner but rather in a general sense of a device, or of a system having more than one device, performing the function(s) of controlling one or more device such as an electronic device for instance.
It will be understood that the various functions of a computer or of a controller can be performed by hardware or by a combination of both hardware and software. For example, hardware can include logic gates included as part of a silicon chip of the processor. Software can be in the form of data such as computer-readable instructions stored in the memory system. With respect to a computer, a controller, a processing unit, or a processor chip, the expression “configured to” relates to the presence of hardware or a combination of hardware and software which is operable to perform the associated functions.
Many further features and combinations thereof concerning the present improvements will appear to those skilled in the art following a reading of the instant disclosure.
In the figures,
Referring now to
As depicted in this example, the laser-marking system 126 is part of the identification station 124 which is one of a plurality of transformation stations of the production line 116 of
Referring back to
As shown in this example, the laser-marking system 126 has a laser beam generator 128, a beam expander 130, one or more scanning heads (hereinafter “the scanning head 132”), a lens 134 and a controller 136 which is communicatively coupled to at least the laser beam generator 128 and to the scanning head 132.
In this example, the laser beam generator 128 is configured for generating a laser beam 136 along an optical path. In one specific embodiment, the laser beam generator 128 is a fiber laser. For instance, the fiber laser can be a Q-switched pulsed fiber laser providing a pulsed laser beam having an operating wavelength of 1.06 microns (i.e., μm, 10−6 m), a maximal average power of about 100 W, a pulse duration of about 100 ns, a pulse repetition rate of about 100 kHz, a pulse energy of about 1 mJ, and a beam quality factor of M2≈1.6. An example of such fiber laser includes YLP series distributed by IPG Photonics. However, any other suitable laser beam generator can be used depending on the application.
Such operating wavelength can be suitable for laser-marking metal casting 110 such as aluminum castings because aluminum allows satisfactory absorption at that operating wavelength. For different metal types, the type of laser beam generator and/or the operating wavelength of the laser beam generator can be selected based on the metal type of the metal casting 110.
As shown, the beam expander 130 is used to expand a beam diameter of the laser beam 136 to an expanded beam diameter. An example of the expanded beam diameter can include about 10 mm (at the 1/e2 width). More specifically, the beam expander 132 is configured for receiving the laser beam 136 from the laser beam generator 128, to expand its beam diameter to the expanded beam diameter, and to provide the expanded laser beam 138 towards the scanning head 132. As can be understood, the beam expander 130 is used so as to achieve a focal spot of satisfactory small dimension when a focal length 131 of the lens 134 is relatively long. However, the beam expander 130 can be omitted in other embodiments.
The scanning head 132 can be used to receive the expanded laser beam 138 incoming from the beam expander 130 and to redirect it towards the metal casting 110 as a focused laser beam 140. As such, the lens 134 is used for focusing the expanded laser beam 138 onto a surface 142 of the metal casting 110. More specifically, the scanning head 132 and the lens 134 are configured for directing a focal spot 144 of the focused laser beam 140 where desired relative to the metal casting 110.
The lens 134 can have a focal length ranging between about 100 mm and about 500 mm, preferably between about 200 mm and about 350 mm and most preferably be of about 250 mm. A lens with a focal length of 250 mm would be more permissible with respect to the positioning of the metal casting 110 to laser-mark compared to conventional laser-marking systems, which typically use lenses with focal lengths of 160 mm.
As shown in this example, the controller 136 is communicatively coupled to the laser beam generator 128 and to the scanning head 132. In embodiments where the lens 134 has a variable focal length, the controller 136 can further be communicatively coupled to the lens 134. The communication between the controller 136 and the laser beam generator 128, the scanning head 132 and the lens 134 can be wired, wireless or a combination of both. As can be understood, the controller 136 is configured for controlling operation of the laser beam generator 128, the scanning head 132 and the lens 134, depending on the embodiment.
The controller 136 can be provided as a combination of hardware and software components. The hardware components can be implemented in the form of a computing device 200, an example of which is described with reference to
Referring to
The processor 202 can be, for example, a general-purpose microprocessor or microcontroller, a digital signal processing (DSP) processor, an integrated circuit, a field programmable gate array (FPGA), a reconfigurable processor, a programmable read-only memory (PROM), or any combination thereof.
The memory 204 can include a suitable combination of any type of computer-readable memory that is located either internally or externally such as, for example, random-access memory (RAM), read-only memory (ROM), compact disc read-only memory (CDROM), electro-optical memory, magneto-optical memory, erasable programmable read-only memory (EPROM) and electrically-erasable programmable read-only memory (EEPROM), Ferroelectric RAM (FRAM) or the like.
Each I/O interface 206 enables the computing device 200 to interconnect with one or more input devices, such as a managing system of the production line 116, or with one or more output devices such as the laser beam generator 128, the scanning head 132 and/or the lens 134.
Each I/O interface 206 enables the controller 136 to communicate with other components, to exchange data with other components, to access and connect to network resources, to serve applications, and perform other computing applications by connecting to a network (or multiple networks) capable of carrying data including the Internet, Ethernet, plain old telephone service (POTS) line, public switch telephone network (PSTN), integrated services digital network (ISDN), digital subscriber line (DSL), coaxial cable, fiber optics, satellite, mobile, wireless (e.g. Wi-Fi, WiMAX), SS7 signaling network, fixed line, local area network, wide area network and others, including any combination of these.
Referring now to
The computing device 200 and the software application 300 described above are meant to be examples only. Other suitable embodiments of the controller 136 can also be provided, as it will be apparent to the skilled reader. For instance, in some embodiments, at least part of the controller comprises a USB scanner controller model USC-2 (SOAPS, Germany) and involves the use of software program SAMLight (SOAPS, Germany).
An example of the identifier data 302 is shown in
The inventors found that existing techniques for laser-marking an identifier on a metal casting typically involved laser-removing metal from a surface of the metal casting on a totality of the area of each one of the dark cells.
One theory explaining this phenomenon is based on the belief that the dark appearance of the dark cells 56 is due to a surface roughness caused by the laser-marking. It is believed that the surface roughness can trap incoming light and thus prevent light from being reflected thereon, hence the dark appearance. Indeed, as shot blasting involves forcibly propelling a stream of shots, i.e., small particles having a diameter ranging between 300 microns to 800 microns, against the surface 42 of the metal casting 10 under high pressure, it is believed that the surface roughness of the dark cells 56 can become smoother, and thus allow reflection of light hence their brighter appearance. Moreover, laser-marking the entirety of the dark cell can also increase the time required to mark such identifiers.
An example of a method for laser-marking shot blast resistant identifiers 150 on a surface 142 of a metal casting 110 is now described with reference to
In this method, the laser-marking includes laser-removing, for each one of the dark cells 156, metal from the surface 142 of the metal casting 110 only at a center portion 160 of the corresponding dark cell 156 thereby leaving a recess 162 bounded by a peripheral wall 164 in the corresponding dark cell 156. For each of the dark cells 156, the recess 162 has a depth d of at least 100 microns and has an opening 166 with a width w (also referred to as “recess opening width w”) which ranges between 450 microns and 1200 microns and which represents between 40 percent and 99 percent of the corresponding cell size c. It is intended that the depth d, the width w and the corresponding cell size c of each dark cell 156 are such that the corresponding dark cell appears dark to an optical reader. It is noted that the dimensions of the recess 162 and that of the peripheral wall 164 provide a shot blast resistance to the laser-marked identifier 150. In this disclosure, shot blast resistance is defined broadly so as to encompass any identifier 150 which, after having been shot blasted, can still be read using an optical reader (e.g. a laser reader, camera).
In this way, each one of the dark cells 156, including the isolated ones and the adjacent ones, appear dark to an optical reader after shot blasting as shown in
Referring now specifically to
Depending on the embodiment, the depth d can be of at least 100 microns, preferably of at least 150 microns, and most preferably of at least 300 microns. In some embodiments, the depth d of the recess 162 can range between 100 microns and 1000 microns, preferably between 200 microns and 800 microns, and most preferably between 300 microns and 700 microns. The width w of the opening 166 of the recess 162 can range between 400 microns and 1750 microns, preferably between 600 microns and 850 microns, and can thus represent between 30 percent and 99 percent of the corresponding cell size c, preferably between 60 percent and 95 percent of the corresponding cell size c and more preferably between 70 percent and 89 percent of the corresponding cell size c. A thickness t of the peripheral wall 164 can range between 2 microns and 360 microns, preferably between 50 microns and 300 microns, and most preferably between 100 microns and 200 microns. In some embodiments, each recess 162 has an aspect ratio r of the depth d relative to the width w, i.e. r=d/w, ranging between 0.2 and 5, preferably between 0.2 and 2 and most preferably between 0.3 and 1.5. Depending on the embodiment, an area of the recess can be below 99%, preferably below 90% and most preferably below 50% of an area of the corresponding dark cell.
As shown in
As shown in
Examples of such shot blast resistant identifiers being laser-marked on metal workpieces are shown in
The results above have been interpreted not only evaluated for the optimal laser-marking parameters but also for the analysis of outer boundaries where readability of the code would be close to null. A total of 195 markings were made on workpieces made of an aluminium alloy containing 10% Si. These markings were made using a 100 W laser marking system, the LXQ-100. The laser marking parameters were kept constant to reduce the different variables in play. The identifiers marked are 10×10 2D matrix codes containing the information “123456”. The laser-marking speed was set to 500 mm/s, at a frequency of 100 kHz and a line spacing of 0.03 mm in both the x-axis and y-axis of the plane of the workpieces. These identifiers were marked on an optional white background which was marked at 5000 m/s, a frequency 100 kHz and a line spacing of 0.05 mm.
Width w and depth d are two parameters that were varied from one giving identifier to another. The depth d was translated through a parameter called the “number of time or passes” the focal spot was directed along a predetermined raster path. This parameter, which was represented through an integer value, is indicative of a number of time the laser spot would spend laser-marking any given area. Thus, a given identifier having a number of time equal to five would have its recesses etched deeper in the workpiece than an identifier having a value of one since the laser spot would have been directed five times along the raster path on the same area instead of a single one. The number of passes was varied from 1 to 5 for every markings. A depth measurement system such as a Dektak was used to translate the value of “number of passes” to a value of depth d. These values were compared with different identifiers and extrapolated to the depth values given in the tables above.
The 195 markings were analyzed for their contrast before and after the shot blasting process using a Cognex camera DM262X. The contrast value is calculated according to ISO 29158 using the following equation:
where AW would be the average average intensity of bright cells on a gray scale of 255 whereas AD is the average intensity of dark cells on a gray scale of 255. In the above tables, the contrast CC is multiplied by 100 to achieve the desired range in the tables.
It is noted that the contrasts obtained in this experiment are provided as examples only, as these results are dependent on the specific experimental setup which used the Cognex camera DM262X. Indeed, with other experimental setups, including other types of readers, the contrasts of some given identifiers listed above could still be satisfactory even though they are listed as unsatisfactory in the above tables. For instance, identifiers A8, B66, C13, C14, C15, C16, C21, D12, D14, D15 and E47, which are characterized by a null contrast above, have been satisfactorily read using for instance a Cognex reader. Accordingly, the inventors believe it safe to assume that the range of values which can yield shot blast resistant identifiers are not limited to that listed in the above tables.
The above tables can be analyzed to provide an analysis of contrast in relation with different parameters such as width w, time required for laser-marking the identifier, depth d and aspect ratio d/w. According to ISO 29158, a contrast value above 0.300 (so 300 in the above tables) would give a grade 4 which would be the highest according to the standard.
It was noted that the dark cells having a width w being less than 50% of their corresponding cell size c often failed to achieve a grade 4 contrast (even though they may still be readable). This can be explained by the fact that the extra surface of the peripheral walls being smoothed by shot blasting can affect the readability and the evaluation of the contrast by the camera.
Three different sections were identified in the graph of
It was found that the relationship between the contrast CC and depth d can be mostly linear. It was expected that the deeper the recess of the dark cell, the darker it would appear thus giving a higher value of contrast. One important information to note is the significant increase in contrast between the first, second and third passes. Indeed, as the relationship between depth d and contrast is close to linear and the relationship between number of passes and depth d is not, a higher gain in contrast can be expected between passes 1 to 2 or 2 to 3 than compared to passes 3 to 4 or 4 to 5. A depth d between 0.3 mm and 0.4 would thus be expected to yield the satisfactorily high contrast.
The initial assumption in regards to aspect ratio was that the depth of the cell would greatly affect the final contrast in a linear fashion. It was expected that the slope characterizing the linear relationship between depth of the cell and contrast was very steep. However, since aspect ratio is defined as depth of the cell on its size and depth of the cell does not effect the contrast as much as the size of the cell, this slope, as discussed in the depth section, was pretty smooth. Thus, it can be a bit harder to give any indications in regards to aspect ratio. In fact, the higher values of contrast are concentrated in the 0.5 to 0.75 section but so is most of the data.
As can be understood, width w and time required for marking are relevant indicators of commercially satisfactory shot blast resistant identifiers. In fact, when taking into account the above tables, it is possible to get a range of satisfactory values, such as those listed above.
As described with reference to
Examples of such identifiers being laser-marked on a metal casting are shown in
Referring back to
In this embodiment, only a portion of the raster path 178 associated to the dark cell is shown. Indeed, the raster path 178 can include a first series of passes along a given orientation to laser-mark all the center portions of the dark cells and a second series of passes along an orientation perpendicular to the given orientation to complete the laser-marker of all the center portions of the dark cells. In some embodiments, the laser-marking includes repeating said directing the focal spot 144 of the laser-marking beam along the raster path 178 a given number of times. For instance, at each additional time the directing is performed, the depth d of the recesses of the dark cells can become progressively deeper. However, it is understood that by increasing the number of times the directing of the focal spot 144 along the raster path is performed, the longer it can take for the identifier to be laser-marked. In alternate embodiments, the depth of the focal spot 144 can be progressively increased at each time the directing is performed.
In the above described embodiments, the opening 166 of the recesses 162 have a square shape 180. However, in some other embodiments, the opening 166 of the recesses 162 can have any other suitable shape. For instance, the shape can be circular such as shown in
As can be understood, although the shot blast resistant identifier 150 discussed above are provided in the form of data matrixes, the identifier 150 can be provided in the form of a bar code such as shown in
As shown in
As briefly discussed above, it is know from previous studies that darkening of a metal surface under laser irradiation can be due to an increase of the local surface roughness in the dark area, such as discussed in Maltais, J., Brochu, V., Frayssinous, C., Vallee, R., Godmaire, X., Fraser, A. “Surface analysis study of laser marking of aluminum,” ICSCOBA 2016, which is hereby incorporated by reference. More specifically, it is taught therein that bright areas can be laser marked on a surface by reducing its surface roughness thus causing a high level of diffuse reflection from the light. In contrary, dark areas on a surface can be laser marked on a surface by increasing its surface roughness thus causing a high level of absorption within the surface. By adjusting the laser parameters, bright and dark areas can be laser-marked upon demand.
During shot blasting, shots having a given diameter D are projected at high velocity against the identifier laser marked on the surface of the metal workpiece. Accordingly, a dark area having a higher surface roughness can migrate towards a bright area having a lower surface roughness upon impact of such shots. This flattening of the surface roughness can justify why the contrast between bright and dark cells tends to decrease after shot blasting in at least some circumstances.
Further analysis of the metal workpieces described above has led the inventors to better understand and characterize the requirements allowing a laser-marked identifier to be shot blast resistant. As shown in
The inventors found that, for each dark cell 156 to be laser marked, the laser marking should remove metal from the surface 142 of the metal workpiece 110 only at a center portion 160 of the corresponding dark cell 156 thereby leaving a recess 162 bounded by a peripheral wall 164 in the corresponding dark cell 156. As such, the recess 162 is left with a bottom wall 188 having a width w at a depth d. Now, for shot blast resistant dark cells 156′ to be obtained, it was found that each dark cell 156 should be left with a sufficient amount of dark area Adark which is defined as being unreachable by a shot having a diameter D. Moreover, it was found that a ratio R of the dark area Adark to a total area Atot of the bottom wall 188 should exceed about 50% to provide a shot blast resistance to the laser-marked identifier. In some embodiments, the ratio R exceeds about 60%, preferably about 70% and most preferably about 80%.
More specifically, In
R=A
dark
/A
tot
=w
2
/w
2=1, (2)
satisfying the above-mentioned requirement for shot blast resistance.
Referring now to
R=A
dark
/A
tot=(w2−(w−2Ldark)2)/w2=(w2−(w−D)2)/w2, (3)
Accordingly, in this embodiment, shot blast resistant identifier can be obtained when the width w satisfies the following inequality:
In
R=A
dark
/A
tot=(w2−(w−2Ldark)2)/w2=(w2−(w−2√{square root over (Dd−d2)})2)/w2, (5)
Accordingly, in this embodiment, shot blast resistant identifier can be obtained when the width w and the depth d collectively satisfy the following inequality:
Referring now to
R=A
dark
/A
tot
=w
2
/w
2=1, (7)
satisfying the above-mentioned requirement for shot blast resistance.
Further tests have been performed and the following combinations of dimensions have been found to be satisfactory, in at least some situations. However, as can be understood, other combinations of parameters could also provide satisfactory results.
Although the embodiments presented above involve cells having a square shape, the cells could have any other suitable shape including, but not limited to, a circular shape, a triangular shape, and the like.
See Annex A attached to this disclosure for more detail. It will be appreciated that the cell size SC described in Annex A differs from the cell size c used herein. More specifically, the cell size SC described in Annex A corresponds to the width w as defined herein.
As can be understood, the examples described above and illustrated are intended to be exemplary only. For instance, although the figures have been described with reference to methods and systems for laser-marking shot-blast resistant identifiers on a metal casting, it will be understood that the methods and systems described herein can be used to laser-mark shot-blast resistant identifiers on any type of metal workpieces including, but not limited to, metal castings produced in a workpiece production station by any suitable casting technique (e.g., die-casting, sand casting, plaster mold casting, shell molding, investment casting, waste molding of plaster, evaporative-pattern casting, lost-foam casting, full-mold casting, non-expandable mold casting, permanent mold casting, semi-solid metal casting, continuous casting), metal forgings produced by any suitable forging technique (e.g., temperature forging, drop forging, open-die drop forging, impression-die forging, press forging, upset forging, automatic hot forging, roll forging, net-shape and near-net-shape forging, cold forging, induction forging, multidirectional forging, isothermal forging), a combination thereof and/or any other suitable metal workpiece production technique. Also, the expression center portion is meant to be construed in a broad manner which would encompass situations where the center portion is not located at the exact center of the corresponding cell. In view of the examples provided above, the inventors believe that although a finite number of combinations of cell sizes c, recess depths d, and opening widths w, and ratios R have been tested with satisfactory results, i.e., in a manner which provide shot blast resistant identifiers, other combinations that may appear to the person skilled in the art are meant to be encompassed by the present application. Indeed, the inventors believe that as soon as a dark cell is laser-marked in a manner which provides a sufficient amount of dark area relative to the bright area, the corresponding dark cell can be deemed to bear a shot blast resistance, as supported by the experimental results described herein. The scope is indicated by the appended claims.
Number | Date | Country | |
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62745009 | Oct 2018 | US | |
62676550 | May 2018 | US |
Number | Date | Country | |
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Parent | 17054206 | Nov 2020 | US |
Child | 18307577 | US |